CN105889768A - Heat dissipating assembly - Google Patents
Heat dissipating assembly Download PDFInfo
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- CN105889768A CN105889768A CN201610220371.XA CN201610220371A CN105889768A CN 105889768 A CN105889768 A CN 105889768A CN 201610220371 A CN201610220371 A CN 201610220371A CN 105889768 A CN105889768 A CN 105889768A
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- radiating
- substrate
- cavity
- heat
- conducting medium
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a heat dissipating assembly. The heat dissipating assembly comprises a first substrate and a first hook face. A closed cavity is formed by the first substrate and the first hook face. The first substrate is provided with a printed circuit used for supplying power to an LED light source, an IGBT module and the like. The cavity is internally filled with a transparent heat conducting medium, and the transparent heat conducting medium surrounds the LED light source, the IGBT module and other heat dissipating units. The cavity comprises a liquid inlet and a liquid outlet. The transparent heat conducting medium circularly flows through the liquid inlet and the liquid outlet. According to the heat dissipating assembly, the heat dissipating capability and the light intensity of an LED module are improved, the service life of the LED module is greatly prolonged, and the efficiency of the LED module is greatly improved. The heat dissipating assembly is simple in structure, convenient to manufacture and high in heat dissipating efficiency and can be widely applied to high-power beacon lamps, fish gathering lamps, exposure lamps and automobile headlamps needing high lamplight penetrating power.
Description
Technical field
The present invention relates to field of radiating, particularly relate to a kind of radiating subassembly.
Background technology
LED, as forth generation light source, has the low advantage with life-span length of energy consumption.Along with the gradually maturation of technology, to LED
The light efficiency of module, heat radiation etc. require to have had arrived at a new stage.
On upper market, the reflector opening direction of major part LED module and the light direction of light source are same side
To, to analyze according to optical principle, the reflector in this layout can only will reflect with wall of cup intersection in the luminescence of light source institute,
Remainder is followed light intensity and is inversely proportional to square distance；The light intensity distance that shot-light is sent strengthens and quickly reduces；The most more
The good light utilizing light source becomes the key problem in technology improving light efficiency.For heat radiation, the heat radiation of major part LED module at present is also
It is by traditional heat-conducting metal substrate, heat transmission to be distributed, heat radiation limited in one's ability, the cooling system how to break traditions
Become the key point of technological break-through.
Summary of the invention
For solving problems of the prior art, the invention discloses a kind of radiating subassembly, including first substrate and the
One curved surface, described first substrate and first surface form closed housing, and described first substrate has printed circuit, for LED
Light source, IGBT module are powered, and described chamber is filled with transparent heat-conducting medium, described transparent heat-conducting medium surround described LED light source,
IGBT module.Described cavity includes inlet and liquid outlet, and described transparent heat-conducting medium passes through inlet and liquid outlet recycle stream
Dynamic.Present invention improves out luminous intensity and the heat-sinking capability of LED module, substantially increase life-span and the usefulness of LED module.This
Bright simple in construction, it is simple to manufacture, radiating efficiency is high, can be widely applied to high-power, need navigation light, collection that light penetration power is strong
Fish lamp, Exposing Lamp and headlight for vehicles.
Specifically, the present invention proposes a kind of radiating subassembly, including:
First substrate and first surface, described first substrate and first surface form closed housing, and described first substrate has
There is printed circuit, for powering to heater element, it is characterised in that described chamber is filled with transparent heat-conducting medium, described transparent
Heat-conducting medium surrounds described heater element.
Preferably, described heater element includes having the LED chip of encapsulation, the LED of un-encapsulated, IGBT module, or tool
There is the inner chamber light source of caloric value.
Preferably, described transparent heat-conducting medium is liquid, and described cavity includes inlet and liquid outlet, described transparent heat conduction
Medium is circulated by inlet and liquid outlet.
Preferably, described inlet and liquid outlet are connected by heat radiation distribution channel at containment portion, and together with cavity
Constitute the heat-conducting medium peripheral passage of Guan Bi.
Preferably, described heat radiation distribution channel is provided with circulating pump.
Preferably, described heat radiation distribution channel is radiating tube, and described radiating tube has helical structure.
Preferably, described radiating tube has helicitic texture, for increasing the surface area of radiating tube.
Preferably, described heat radiation distribution channel is provided with radiating fin.
Preferably, described first substrate is transparency carrier, and described first surface is reflecting surface.
Preferably, described transparency carrier has anti-reflection antireflective film.
Preferably, described first surface is parabola, and described heater element is positioned at described paraboloidal focal position.
Preferably, the refractive index of described transparent heat-conducting medium is between described heater element and described first substrate.
Preferably, the refractive index of described refractive index transition medium is between 1.41-1.7.
Preferably, described refractive index transition medium selected from carbon number at the monocycle of 6-12 or polycyoalkane, methyl-silicone oil, benzene
Base silicone oil or molecular formula are 's
One of material.
The application also proposed another radiating subassembly, comprises first substrate, first surface, connecting portion and the second base
Plate, described first substrate and first surface form the first cavity, described first substrate, described second substrate and described connecting portion shape
Becoming the second cavity, described first substrate and/or second substrate to have printed circuit, for powering to heater element, its feature exists
In, described first cavity and the second chamber are filled with transparent heat-conducting medium, and described transparent heat-conducting medium surrounds described heater element.
Preferably, described heater element is to have the LED chip of encapsulation, the LED of un-encapsulated, IGBT module and have
The inner chamber light source of caloric value.
Preferably, described transparent heat-conducting medium is liquid, and described first cavity and/or the second cavity include inlet and go out
Liquid mouth, described transparent heat-conducting medium is circulated by inlet and liquid outlet.
Preferably, described inlet and liquid outlet are connected by heat radiation distribution channel at containment portion, and with described first
And/or second cavity constitute the heat-conducting medium peripheral passage of Guan Bi together.
Preferably, described heat radiation distribution channel is provided with circulating pump.
Preferably, described heat radiation distribution channel is radiating tube, and described radiating tube is helical structure.
Preferably, described radiating tube has helicitic texture, for increasing the surface area of radiating tube.
Preferably, described heat radiation distribution channel is provided with radiating fin.
Preferably, described first substrate and second substrate are transparency carrier, and described first surface is reflecting surface.
Preferably, the described first and/or second transparency carrier has anti-reflection antireflective film.
Preferably, described first surface is parabola, and described heater element is positioned at described paraboloidal focal position.
Preferably, the refractive index of described transparent heat-conducting medium is between described heater element and described first substrate；Institute
State the refractive index of transparent heat-conducting medium between described heater element and described second substrate.
Preferably, the refractive index of described refractive index transition medium is between 1.41-1.7.
The present invention utilizes the setting of heat dissipation cavity and heat-conducting medium, improves out luminous intensity and the heat-sinking capability of LED module, greatly
Improve greatly life-span and the usefulness of LED module.Present configuration is simple, it is simple to manufacture, and radiating efficiency is high, can be widely applied to big
Power, need navigation light, fishing lamp, Exposing Lamp and headlight for vehicles that light penetration power is strong.
Accompanying drawing explanation
The present invention is further detailed explanation with detailed description of the invention below in conjunction with the accompanying drawings.
Fig. 1 is the structure chart of the LED module with refractive index transition medium according to embodiments of the present invention.
Fig. 2 is the cross section view of the LED module with refractive index transition medium according to embodiments of the present invention.
Fig. 3 is the LED modular structure figure with heat dissipation channel according to embodiments of the present invention.
Fig. 4 is the cross section view of the LED module with heat dissipation channel according to embodiments of the present invention.
Fig. 5 is the LED modular structure figure that LED chip according to embodiments of the present invention is arranged at light-passing board.
Fig. 6 is the LED module cross section view that LED chip according to embodiments of the present invention is arranged at light-passing board.
Fig. 7 is that LED chip according to embodiments of the present invention is arranged at light-passing board and has the LED modular structure of flow cavity
View.
Fig. 8 is that LED chip according to embodiments of the present invention is arranged at light-passing board and has the LED module section of flow cavity
View.
Fig. 9 is the structure chart of the LED array module with refractive index transition medium according to embodiments of the present invention.
Figure 10 is the structure chart of the LED array module with heat radiation flow channel according to embodiments of the present invention.
Figure 11 is the structure chart of the LED array module with heat radiation flow channel according to embodiments of the present invention.
Figure 12 is reflective surface structure chart according to embodiments of the present invention.
Figure 13 is that multiple reflective surfaces according to embodiments of the present invention form array.
Detailed description of the invention
As shown in Figure 1, 2, LED module includes the transparency carrier with printed circuit.Described transparency carrier can use
The good light transmissive material of light transmission and the material of thermal conductive resin having, such as glass plate, quartz glass plate, K9 glass
The light transmissive materials such as plate, sapphire plate, crystalline ceramics plate, transparent epoxy and epoxy resin bonded fiber.Print on the transparent substrate is set
Brush circuit can select transparent circuitry, and its purpose is to block the outgoing of reflector reflection light as little as possible.Certainly, do not lose typically
Property, printed circuit can also be alternatively non-transparent.Described substrate can carry out coating film treatment, reduces reflecting rate and increases light transmittance,
Light extraction efficiency is maximized.
LED chip, is arranged on described transparency carrier and electrically connects with described printed circuit, and specifically, it can use patch
Attached mode is connected with printed circuit.LED chip can select the most encapsulated LED chip, but it is highly preferred that selects
The LED chip of un-encapsulated.LED chip is arranged on the focal position of reflector, and the light-emitting area of LED chip and reflector phase
Right, so, the transmitting light of LED chip substantially can all incide reflector, and launches at the reflecting surface of reflector,
Make the reflector can be the most reflective, the most lossless light is reflected away, improve LED spotlight and irradiate the light intensity of end and change
The uniformity of kind emergent light.Reflective surface is arranged on the position relative with LED chip, and it can use secondary parabola type, when
When LED chip is arranged on its focus, the light that LED chip sends, after reflective surface reflects, is become directional light from diverging light, and penetrates
To transparency carrier, in transparent substrate side outgoing.
In a preferred embodiment, transparency carrier and reflective surface form cavity, when in this cavity be air or
During person's vacuum, its refractive index is close to 1, and the refractive index of LED chip is 2.4, the base that the refractive index of transparency carrier is used by it
Material refractive index, for high index of refraction.So, " high (LED chip)-low (air)-height (transparency carrier) " folding is defined in the optical path
Penetrating the situation of rate, according to basic optical principle, the composition of this refractive index reflects when can cause light by interface and reflection is led
The light loss caused is greatly increased, and applicant finds in research process, injects general coolant in the cavities and can reduce this light
Damage, but the effect reduced is inconspicuous.And it is the most undesirable to use common encapsulation glue to carry out filling effect, because common envelope
Dress refractive index of watering is about 1.43, and the refractive index of so-called high folding glue the most only 1.57, this refractive index cannot great Cheng
Degree improves refractive index gradient.In research process, it is found by the applicant that the polycyoalkane of use lower molecular weight is as filled media,
Effect is more satisfactory.Such as carbon atoms cycloalkane between 6-12, its refractive index under general state is 1.65,
And there is the most higher transparency of 99%/mm.Relative to conventional light path, such medium be filled with reduction transparency carrier and
Gradient between LED chip refractive index, this can be greatly improved light emitting efficiency undoubtedly.
At one with the comparative example of above-mentioned preferred embodiment, methyl-silicone oil, phenyl silicone oil or molecular formula are Deng folding
The rate of penetrating filled media between 1.57-1.595 is used, by adjusting the base material refractive index of transparency carrier and filling Jie
Matter, can quantify the light extraction efficiency of emergent light.It will be apparent that these refractive indexes are in the medium that " transition " is interval, it is possible to significantly change
Kind light extraction efficiency, therefore, we term it " refractive index transition medium "." refractive index transition medium " can be in the normal state
Liquid, solid-state or solid-liquid admixture.
In one preferably comparative example, " refractive index transition medium " is chosen as such as dicyclo decane, and its refractive index is about
1.65, it is liquid in the normal state, this medium is filled with between transparency carrier and described reflective surface, and LED chip is by described liquid
State medium surrounds.Owing to this medium also has an excellent thermal conductivity, in the course of the work, the heat that LED chip produces can be by
The Absorption of Medium being in contact with it and conduction, thus reduce the temperature of work LED chip, serve good conductive force.Base
In the heat transfer advantage of such " refractive index transition medium ", can select directly to use the LED chip of un-encapsulated, so, can
To reduce the LED chip outer package inhibition for heat transfer, the heat making LED chip produce directly conducts in liquid around
Medium, the heat reaching more excellent passes to effect.
In a comparative example, the LED chip of un-encapsulated is arranged at transparency carrier surface, and its light-emitting area is by surrounding
Light transmission medium surround, thus form good thermal conduction mechanism.
In a comparative example, LED chip is maked somebody a mere figurehead in container, and in a liquid, its back side is straight with liquid in suspension
Contact or underlay substrate directly contact with liquid.
By the way of chip entirety is immersed in heat eliminating medium the one-way heat conduction (heat radiation) being much better than conventional method.
In a preferred embodiment, as shown in Figure 3,4, in order to strengthen radiating effect, it is being provided with the saturating of printed circuit
The outside of bright substrate is also provided with light-passing board, is arranged in parallel with described transparency carrier, forms sky between light-passing board and transparency carrier
Chamber, the periphery in this space is closed formation cavity；Described cavity is filled with cooling medium.Sky between light-passing board and transparency carrier
Chamber includes that inlet and liquid outlet, inlet and liquid outlet connect with described cavity respectively.Cooling medium can be made by pump
Flowing in described cavity, thus the circulation of accelerated heat.
In a preferred embodiment, as shown in Figure 5,6, in order to strengthen radiating effect, it is being provided with the saturating of printed circuit
The outside of bright substrate is also provided with light-passing board, is arranged in parallel with described transparency carrier, forms sky between light-passing board and transparency carrier
Chamber, the periphery in this space is closed formation cavity；Described cavity is filled with cooling medium.Sky between light-passing board and transparency carrier
Chamber includes that inlet and liquid outlet, inlet and liquid outlet connect with described cavity respectively.Cooling medium can be made by pump
Flowing in described cavity, thus the circulation of accelerated heat.With embodiment before except that, PCB circuit is arranged at
Tabula rasa, LED chip is directly arranged on this light-passing board, and such LED chip is at the cooling that light-passing board is formed with transparency carrier
In medium flow space, this be more beneficial for LED produce heat be cooled Absorption of Medium and by flowing by the way of take away.
In a preferred embodiment, as shown in Figure 7,8, relative to Fig. 1-6, in order to strengthen radiating effect, it is being provided with
The outside of the transparency carrier of printed circuit is also provided with light-passing board, and eliminates transparency carrier, former light-passing board and transparency carrier it
Between formed cavity and transparency carrier and reflector between cavity formed a cavity.This cavity still includes inlet and goes out liquid
Mouthful, inlet connects with described cavity respectively with liquid outlet.Cooling medium can be made to flow in described cavity by pump
Dynamic, thus the circulation of accelerated heat.In this embodiment, PCB circuit is arranged at light-passing board, and it is saturating that LED chip is directly arranged at this
On tabula rasa, such LED chip is in the cooling medium flowing space of light-passing board and transparency carrier formation, and this is more beneficial for
LED produce heat be cooled Absorption of Medium and by flowing by the way of take away.And owing to the volume of cavity is bigger, it is possible to hold
The flowing cooling medium received is more, it is possible to reach more preferable radiating effect.
More excellent, in order to improve the diffusing reflection of the light sent, described reflective surface is frosting.This is so that light
After this frosting reflects, the light Relative distribution projected away is uniform.
In other embodiment, LED module exists in an array manner, such as Fig. 9, shown in 10, including lamp housing, transparent
Pcb board, three concave mirrors and three LED chip.
Lamp housing includes that the cover plate of rectangular frame and the housing of rectangle, three concave mirrors are embedded in the inner chamber of housing；
Transparent pcb board is embedded in the cover plate of rectangular frame, and cover plate is connected by screw with housing.
LED chip is fixed on the inner surface of transparent pcb board, is connected with the printed circuit of transparent pcb board.Transparent pcb board
Inner surface is coated with anti-reflection film.The substrate of transparent pcb board can use glass substrate or sapphire substrate.
After reflective LED lamp installation, cover plate, one cavity of formation between transparent pcb board and housing.Transparent pcb board
It is arranged in the light path of concave mirror, anti-towards concave mirror of the inner surface of transparent pcb board and the light-emitting area of LED chip
Light face, LED chip is in the focus of concave mirror, and the reflection light of concave mirror outwards penetrates through transparent pcb board.
The corresponding a piece of LED chip of each concave mirror, certainly, each concave mirror can also be with plurality of LED chip
Combination.
Lamp housing cavity between transparent pcb board and concave mirror is inoculated with the coolant of printing opacity, forms cooling chamber.Cooling
Liquid can use methyl-silicone oil, phenyl silicone oil, preferably with the refractive index printing opacity coolant higher than 1.6, if carbon atoms is at 6-
Cycloalkane between 12.
As shown in Figure 10, the two ends of lamp housing inner chamber have the inlet and liquid outlet connected with cooling chamber respectively, and inlet is pacified
Equipped with liquid inlet joint, liquid outlet equipped with going out liquid joint, it is simple to be connected with cooling pump, carry out forced circulation heat radiation.
In order to realize the sealing of cooling chamber, equipped with sealing ring between cover plate and housing.
In further embodiments, structure reflecting LED modulated structure as shown in figure 11, the most also include light-passing board.Thoroughly
Bright pcb board directly covers on the end face of concave mirror as the cover plate of concave mirror, light-passing board cloth parallel with transparent pcb board
Putting, between light-passing board and transparent pcb board, the border seal in space forms cooling cavity；Sky between light-passing board and transparent pcb board
Chamber is inoculated with the coolant of printing opacity, LED chip and transparent pcb board are cooled down.The reflection light of concave mirror is through transparent
Pcb board, the coolant of printing opacity and light-passing board outwards penetrate.
In further embodiments, reflecting LED modulated structure as shown in figure 11, wherein, transparent pcb board is anti-as concave surface
The cover plate of light microscopic directly covers the end face at concave mirror, can also fill out in the cavity between transparent pcb board and concave mirror
Fill solid transparent material, utilize solid transparent material such as, refractive index transparent optical photoresist in the range of " transition " or heat-conducting glue,
LED chip and transparent pcb board are carried out cooling.
In further embodiments, the manufacture method of the above reflective LED lamp of the present invention, mainly comprise the steps that
Step 1) prepare transparent pcb board；
Step 2) LED chip is set on transparent pcb board makes LED lamp panel；
Step 3) LED lamp panel is fastened on above concave mirror and makes reflective LED lamp.
After step 3, alternatively, in the cavity that described concave mirror and described LED lamp panel are formed, it is filled with refraction
Rate transition medium.
Above example of the present invention utilizes transparent pcb board to make LED lamp panel, and LED chip is directly packed in transparent pcb board
On, it is connected with the printed circuit of transparent pcb board, it is not necessary to additionally make support, it is not required that individually connection line, structure letter
Single, it is simple to manufacture, LED chip radiating efficiency is high, can be widely applied to high-power, need navigation light, collection that light penetration power is strong
Fish lamp, Exposing Lamp and headlight for vehicles.
In certain embodiments, such as shown in Figure 12, the present invention proposes a kind of radiating subassembly, including: first substrate and
First surface, described first substrate and first surface form closed housing, and described first substrate has printed circuit, send out for giving
Thermal element is powered, it is characterised in that described chamber is filled with transparent heat-conducting medium, and described transparent heat-conducting medium surrounds described heating
Element.Described heater element is to have the LED chip of encapsulation, the LED of un-encapsulated, IGBT module and have the interior of caloric value
Chamber light source.Described transparent heat-conducting medium is liquid, and described cavity includes that inlet and liquid outlet, described transparent heat-conducting medium pass through
Inlet and liquid outlet circulate.Described inlet and liquid outlet are connected by heat radiation distribution channel at containment portion, and with
Cavity constitutes the heat-conducting medium peripheral passage of Guan Bi together.Described heat radiation distribution channel is provided with circulating pump, described circulating pump
The flowing of heat-conducting medium in cavity can be promoted, make system reach more preferable radiating effect.Heat radiation distribution channel is radiating tube, institute
Stating radiating tube is helical structure.Described radiating tube has helicitic texture, and this helicitic texture, for increasing the surface of radiating tube
Long-pending, thus strengthen radiating tube and extraneous contact area, and then improve radiating effect.Described heat radiation distribution channel is provided with heat radiation
Fin.Described first substrate is transparency carrier, and described first surface is reflecting surface；Described transparency carrier uses light transmission good
Light transmissive material and the material of thermal conductive resin that has.Described transparency carrier material is selected from glass plate, quartz glass plate, K9 glass
On glass plate, sapphire plate, crystalline ceramics plate, transparent epoxy and epoxy resin bonded fiber, and described transparency carrier, there is anti-reflection subtracting
Anti-film.Radiating fin can also be set outside described curved surface, to strengthen radiating effect.
The application also proposed another radiating subassembly, comprises first substrate, first surface, connecting portion and the second base
Plate, described first substrate and first surface form the first cavity, described first substrate, described second substrate and described connecting portion shape
Becoming the second cavity, described first substrate and/or second substrate to have printed circuit, for powering to heater element, its feature exists
In, described first cavity and the second chamber are filled with transparent heat-conducting medium, and described transparent heat-conducting medium surrounds described heater element.
Described heater element is to have the LED chip of encapsulation, the LED of un-encapsulated, IGBT module and have the inner chamber light of caloric value
Source.Described transparent heat-conducting medium is liquid, and described first cavity and/or the second cavity include inlet and liquid outlet, described
Bright heat-conducting medium is circulated by inlet and liquid outlet.Described inlet and liquid outlet are circulated by heat radiation at containment portion
Path connects, and constitutes the heat-conducting medium peripheral passage of Guan Bi together with the described first and/or second cavity.Described heat radiation circulation
Path is provided with circulating pump.Being provided with circulating pump in described heat radiation distribution channel, described circulating pump is led in can promoting cavity
The flowing of thermal medium, makes system reach more preferable radiating effect.Heat radiation distribution channel is radiating tube, and described radiating tube is spirality
Structure.Described radiating tube has helicitic texture, this helicitic texture, for increasing the surface area of radiating tube, thus strengthens heat radiation
Pipe and extraneous contact area, and then improve radiating effect.Described heat radiation distribution channel is provided with radiating fin.Described first base
Plate and second substrate are transparency carrier, and the light transmissive material that described transparency carrier uses light transmission good is well led with have
Hot material；Described first surface is reflecting surface.Described first and/or second transparency carrier material is selected from glass plate, quartz
On glass plate, K9 glass plate, sapphire plate, crystalline ceramics plate, transparent epoxy and epoxy resin bonded fiber, and described transparency carrier
There is anti-reflection antireflective film.Described first surface is parabola, and described heater element is positioned at described paraboloidal focal position.Described
The refractive index of transparent heat-conducting medium is between described heater element and described first substrate；The refraction of described transparent heat-conducting medium
Rate is between described heater element and described second substrate.
In other embodiment, as shown in figure 13, multiple reflective surfaces form array, and multiple reflective surfaces can be adopted
Take integral part of technique to be processed and formed at one time.In each arranges, adjacent reflective surface is the most overlapping, and not same
Reflective surface in one row is non-intersect folded.During becoming cavity by transparency carrier with reflective surface closed, in each column
Mutually overlapping curved surface between mutual UNICOM, and mutual UNICOM between the reflective surface in different lines, be situated between being filled with cooling
After matter, different lines forms different circulation passages, and cooling medium flows respectively between multiple circulation passages, forms such as Figure 11
Shown LED lamp structure, in " arranging " direction, the curved surface of mutual UNICOM forms circulation and goes the same way, and multiple " arranging " Hu Bu UNICOM.
Additionally, for the refractive index mentioned by the application, in the transmission path of light the various media of process, such as LED
The dielectric material of chip self outer surface, above-mentioned different transition medium, the application can be further in these different mediums
In the case of refractive index is mutually matched, it is achieved preferably outgoing effect, improve exitance.
The foregoing is only the preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention
Any amendment, equivalent and improvement etc. with being made within principle, should be included within the scope of the present invention.
Claims (29)
1. a radiating subassembly, comprises first substrate and first surface, described first substrate and first surface and forms closed housing,
Described first substrate has printed circuit, for powering to heater element, it is characterised in that described chamber is filled with transparent heat conduction
Medium, described transparent heat-conducting medium surrounds described heater element.
Radiating subassembly the most according to claim 1, it is characterised in that described heater element includes: there is the LED core of encapsulation
Sheet, the LED of un-encapsulated, IGBT module, or there is the inner chamber light source of caloric value.
Radiating subassembly the most according to claim 2, it is characterised in that described transparent heat-conducting medium is liquid, described cavity
Including inlet and liquid outlet, described transparent heat-conducting medium is circulated by inlet and liquid outlet.
Radiating subassembly the most according to claim 3, it is characterised in that described inlet and liquid outlet pass through at containment portion
Heat radiation distribution channel connects, and constitutes the heat-conducting medium peripheral passage of Guan Bi together with cavity.
Radiating subassembly the most according to claim 4, it is characterised in that be provided with circulating pump in described heat radiation distribution channel.
Radiating subassembly the most according to claim 4, it is characterised in that described heat radiation distribution channel is radiating tube is described scattered
Heat pipe is helical structure.
Radiating subassembly the most according to claim 6, it is characterised in that described radiating tube has helicitic texture, is used for increasing
The surface area of radiating tube.
Radiating subassembly the most according to claim 4, it is characterised in that described heat radiation distribution channel is provided with radiating fin.
Radiating subassembly the most according to claim 1, it is characterised in that described first substrate is transparency carrier, described first
Curved surface is reflecting surface；Described transparency carrier uses the good light transmissive material of light transmission and the material of thermal conductive resin having.
10. the radiating subassembly described in claim 9, it is characterised in that described transparency carrier material is selected from glass plate, quartz glass
Have on plate, K9 glass plate, sapphire plate, crystalline ceramics plate, transparent epoxy and epoxy resin bonded fiber, and described transparency carrier
Anti-reflection antireflective film.
Radiating subassembly described in 11. claims 9, it is characterised in that described first surface is parabola, described heater element position
In described paraboloidal focal position.
12. radiating subassemblies according to claim 1, it is characterised in that the refractive index of described transparent heat-conducting medium is between institute
State between heater element and described first substrate.
13. radiating subassemblies according to claim 1, it is characterised in that include multiple reflecting surface, institute on described first surface
Stating multiple reflecting surface is array distribution, and in the plurality of reflecting surface, the reflecting surface in same row is the most overlapping, described the most overlapping
Reflecting surface forms the chamber of UNICOM with described transparency carrier.
14. radiating subassemblies according to claim 1, it is characterised in that include multiple reflecting surface, institute on described first surface
Stating multiple reflecting surface is array distribution, and described transparency carrier forms the cavity of Hu Bu UNICOM with each column in described array.
15. 1 kinds of radiating subassemblies, comprise first substrate, first surface, connecting portion and second substrate, described first substrate and first
Curved surface forms the first cavity, and described first substrate, described second substrate and described connecting portion form the second cavity, described first base
Plate and/or second substrate have printed circuit, for powering to heater element, it is characterised in that described first cavity and second
Chamber is filled with transparent heat-conducting medium, and described transparent heat-conducting medium surrounds described heater element.
16. radiating subassemblies according to claim 15, it is characterised in that described heater element is the LED core with encapsulation
Sheet, the LED of un-encapsulated, IGBT module and there is the inner chamber light source of caloric value.
17. radiating subassemblies according to claim 16, it is characterised in that described transparent heat-conducting medium is liquid, described
One cavity and/or the second cavity include inlet and liquid outlet, and described transparent heat-conducting medium is circulated by inlet and liquid outlet
Flowing.
18. radiating subassemblies according to claim 17, it is characterised in that described inlet and liquid outlet lead at containment portion
Cross heat radiation distribution channel to connect, and constitute the heat-conducting medium peripheral passage of Guan Bi together with the described first and/or second cavity.
19. radiating subassemblies according to claim 18, it is characterised in that be provided with circulation in described heat radiation distribution channel
Pump.
20. radiating subassemblies according to claim 19, it is characterised in that described heat radiation distribution channel is radiating tube, described
Radiating tube is helical structure.
21. radiating subassemblies according to claim 20, it is characterised in that described radiating tube has helicitic texture, are used for increasing
The surface area of big radiating tube.
22. radiating subassemblies according to claim 20, it is characterised in that described heat radiation distribution channel is provided with heat radiating fin
Sheet.
23. radiating subassemblies according to claim 15, it is characterised in that described first substrate and second substrate are transparent base
Plate, described transparency carrier uses the good light transmissive material of light transmission and the material of thermal conductive resin having；Described first is bent
Face is reflecting surface.
Radiating subassembly described in 24. claims 15, it is characterised in that the described first and/or second transparency carrier material is selected from
Glass plate, quartz glass plate, K9 glass plate, sapphire plate, crystalline ceramics plate, transparent epoxy and epoxy resin bonded fiber, and institute
State and there is on transparency carrier anti-reflection antireflective film.
Radiating subassembly described in 25. claims 15, it is characterised in that described first surface is parabola, described heater element
It is positioned at described paraboloidal focal position.
26. radiating subassemblies according to claim 15, it is characterised in that the refractive index of described transparent heat-conducting medium is between institute
State between heater element and described first substrate；The refractive index of described transparent heat-conducting medium is between described heater element and described the
Between two substrates.
27. radiating subassemblies according to claim 26, it is characterised in that the refractive index of described refractive index transition medium exists
Between 1.41-1.7.
28. radiating subassemblies according to claim 15, it is characterised in that include multiple reflecting surface on described first surface,
The plurality of reflecting surface is array distribution, and in the plurality of reflecting surface, the reflecting surface in same row is the most overlapping, described mutual friendship
Folded reflecting surface and described transparency carrier form the chamber of UNICOM.
29. radiating subassemblies according to claim 15, it is characterised in that include multiple reflecting surface on described first surface,
The plurality of reflecting surface is array distribution, and described transparency carrier forms the cavity of Hu Bu UNICOM with each column in described array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610220371.XA CN105889768A (en) | 2016-04-10 | 2016-04-10 | Heat dissipating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610220371.XA CN105889768A (en) | 2016-04-10 | 2016-04-10 | Heat dissipating assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105889768A true CN105889768A (en) | 2016-08-24 |
Family
ID=57013158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610220371.XA Pending CN105889768A (en) | 2016-04-10 | 2016-04-10 | Heat dissipating assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105889768A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108204527A (en) * | 2018-02-02 | 2018-06-26 | 中国科学院工程热物理研究所 | LED light source with transparent microflute group |
| CN110475915A (en) * | 2017-03-30 | 2019-11-19 | 京瓷株式会社 | The manufacturing method of tubulose sapphire component, heat exchanger, semiconductor manufacturing apparatus and tubulose sapphire component |
| CN112628687A (en) * | 2020-12-14 | 2021-04-09 | 电子科技大学 | Vehicle LED lamp based on 3D printing and liquid cooling system thereof |
| TWI778090B (en) * | 2018-06-27 | 2022-09-21 | 新世紀光電股份有限公司 | Light-emitting device |
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| CN102937245A (en) * | 2012-11-08 | 2013-02-20 | 浙江阳光照明电器集团股份有限公司 | Liquid heat-transmitting light emitting diode (LED) lamp |
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| EP0848411A2 (en) * | 1996-12-12 | 1998-06-17 | Tetra Laval Holdings & Finance SA | A liquid-cooled discharge lamp |
| CN201764299U (en) * | 2010-07-08 | 2011-03-16 | 艾迪光电（杭州）有限公司 | Hollow liquid cooling light-emitting diode (LED) lamp |
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| CN110475915A (en) * | 2017-03-30 | 2019-11-19 | 京瓷株式会社 | The manufacturing method of tubulose sapphire component, heat exchanger, semiconductor manufacturing apparatus and tubulose sapphire component |
| CN110475915B (en) * | 2017-03-30 | 2021-11-02 | 京瓷株式会社 | Tubular sapphire member, heat exchanger, semiconductor manufacturing apparatus, and method for manufacturing tubular sapphire member |
| CN108204527A (en) * | 2018-02-02 | 2018-06-26 | 中国科学院工程热物理研究所 | LED light source with transparent microflute group |
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| CN112628687A (en) * | 2020-12-14 | 2021-04-09 | 电子科技大学 | Vehicle LED lamp based on 3D printing and liquid cooling system thereof |
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