CN107544211B - 涂覆基板的方法以及涂覆系统 - Google Patents
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Abstract
描述了用涂覆材料,具体用涂料或光刻胶,涂覆基板(12)的方法,其中所述方法中提供所述基板(12)。将所述涂覆材料施加到基板(12)的上侧(22)。产生气流,所述气流从基板(12)的下侧(18)引导到基板(12)的上侧(22),其中气流防止在基板(12)的上侧(22)的边缘(26)形成涂覆材料的珠粒或通过气流去除先前存在的珠粒。此外,还描述了涂覆系统(10)。
Description
本发明涉及用涂覆材料,尤其是涂料或光刻胶,涂覆基板的方法,以及用于将涂料施加到基板上的涂覆系统。
本发明具体涉及用于通过光刻来制造微结构化元件的方法和系统。微结构化元件尤其是集成电路、半导体芯片或微机电系统(MEMS)。基板(也称为“晶圆”)用于光刻法,所述基板涂覆有光刻胶(也称为“抗蚀剂”)。涂覆的基板随后通过掩膜曝光,其中光刻胶的物理和/或化学特性由于曝光至少部分地变化。
通常以层的形式将光刻胶施加到基板上。所施加的抗蚀剂层没有凹凸或颗粒是非常重要的。因此,从现有技术已知的是,通过旋转法(“旋涂”)将涂料施加到基板上,使得所述涂料尽可能均匀地分布在基板的表面上。
然而,已证明,旋转法会使得在基板的上侧的边缘产生涂料中的珠粒,这是因为当旋转基板时,涂料因离心力被径向向外推动。
在现有技术中,可手动去除或者通过溶剂去除这种涂覆珠粒,然而,这导致在制备涂覆的基板时增加花费,或者可能导致杂质。
此外,从KR2010/0078033A中已知一种涂覆基板的方法,其中在基板上侧的涂覆材料暴露于来自分配至上侧的流出装置的气流中。气流在涂覆材料上产生压力以防止形成珠粒并将已形成珠粒的涂覆材料推开。以这种方式产生的气流直接撞击上侧。
在上述特定应用领域中,光刻胶代表涂覆材料。在其它应用领域中,然而可以使用其它涂覆材料,例如,流体材料如气凝胶。也可以在其各自的应用领域中使用粘合剂、沥青或粘土作为涂覆材料,将所述涂覆材料通过旋转法施加到基板上。也可以在旋转法中施加干燥的材料,使得所述干燥的材料也可以用作涂覆材料。
通常,当通过旋转法施加涂覆材料时,涂覆材料可能在相应基板的边缘形成珠粒,这并非是期望的。
本发明的目的是在涂覆方法中以有限的花费来防止涂覆材料的珠粒形成或使用简单的手段有效地去除珠粒。
本发明的目的尤其是通过用涂覆材料,尤其是涂料或光刻胶,涂覆基板的方法来实现,其中初始提供基板。将涂覆材料施加到基板的上侧。此外,产生从基板的下侧引导到基板的上侧的气流,其中气流防止在基板的上侧的边缘形成涂覆材料的珠粒或通过气流去除先前存在的珠粒。
本发明的基本构思在于防止通常出现在基板的上侧的边缘的涂覆材料的珠粒。因此,随后去除珠粒并不是绝对必要的。这凭借适当的气流朝向基板的下边缘的事实以更简单的方式得以实现的。在此方面中也不需要在其它工作站中随后处理涂覆的基板。由于气流不直接朝向基板的上侧,因此不会损害涂覆有涂覆材料的基板的表面。如果在涂覆方法期间产生珠粒,则可以通过气流以简单的方式去除所述珠粒。因此,可以防止在完成涂覆方法之后,永久地形成存在于基板表面上的珠粒。
本发明的一个方面提供了当施加涂覆材料时,使基板旋转,以使得所施加的涂覆材料基本均匀地分布在基板的上侧。因此,提供了尽可能均匀涂覆的且没有凹凸的基板表面。
本发明的另一方面提供了在涂覆材料干燥之前产生气流。因此,在施加涂料时,确保其仍然潮湿,可以通过气流至少部分去除或移动刚施加的涂料,以防止在基板的上侧的边缘形成珠粒或去除先前存在的珠粒。
根据一个方面,提供了气流至少部分地撞击基板的下侧,尤其是基板的边缘区域。因此,气流以这样的方式朝向基板,即所述气流部分地撞击基板的下侧,而上侧的边缘的珠粒将被移除。气流的其它部分流过基板的侧面。
或者,可以将整个气流引导通过基板的侧面,而不会部分地撞击基板。然而,为此目的,需要在布置的基板和气流之间进行微调,以确保整个气流以这样的方式流过基板,即所述气流防止在上侧有永久性的珠粒。
根据一个实施方案变型,气流在基板的上侧产生负压,尤其是在基板的边缘区域产生负压。因此,移除珠粒是由于产生负压。使用喷射泵的原理,根据该原理,通过气流在基板的上侧产生传送流,通过该气流可有效地防止在基板的上侧的边缘形成珠粒。因此,上侧的涂覆材料代表由气流的气体吸入的传送介质,所述气流作为驱动介质提供。如果已形成珠粒,则通过传送流去除形成珠粒的涂覆材料,从而在涂覆过程中去除在涂覆基板时产生的珠粒。
此外,气流可以至少部分地以这样的方式产生,即由于来自边缘区域向外产生的压力,可能的珠粒被吸入到气流中。因此,将在基板的上侧的边缘形成珠粒的涂覆材料被气流扫走,并从基板的上侧的边缘去除。因此,能够有效地防止在上侧的相应区域内永久地形成珠粒。
根据另一个实施方案变型,气流至少部分地以这样的方式产生,即由于产生的压力,可能的珠粒从基板的上侧的边缘区域被吸到基板的下侧。因此,转而有效地防止在基板的上侧的边缘永久地形成珠粒。人们普遍认为,可能的涂覆材料仍粘附到基板的下侧,并且可任选地随后去除所述材料。
通常,气流可以以这样的方式撞击基板,即由于产生的压力,涂覆材料从边缘区域向外被吸入气流中,并且被部分吸到基板的下侧。
可以通过气流的角度和速度来设定相应的不同情况,使得气流撞击基板或流过基板侧面。
另一方面提供了当产生气流时,使基板旋转。因此,由于基板的旋转,使整个边缘暴露于气流的作用中,确保了以均匀的方式去除基板的上侧的边缘的珠粒。因此,特别地,涂覆材料可以均匀分布到基板的上侧,并且可以有效地防止在上侧的边缘的珠粒。然而,当施加光刻胶时,基板的旋转速度可不同于如果气流撞击基板,基板旋转时的旋转速度。优选的是,当产生气流时的基板旋转慢于施加涂料时的基板旋转。特别地,当产生气流时,基板可以是不旋转的。
根据另一方面,提供了不含溶剂和/或包含氮气的气流,尤其是由氮气组成的气流。因此,以简单的方式确保了在涂覆过程中有效地防止基板的上侧的边缘的珠粒或去除先前存在的珠粒。此外,由于腔室通常充满氮气,因此不会引入其它物质。
此外,本发明的目的是通过用于将涂覆材料施加到基板的上侧的涂覆系统来实现的,所述涂覆系统具有基板支架,尤其是可旋转的基板支架,和用于气流的流出装置,其中基板支架包括用于基板的支撑表面,基板的下侧布置在基板支架的支撑表面上,其中将流出装置相对于支撑表面布置成使得流出装置产生从基板的下侧开始朝向基板的上侧的气流,其中流出装置产生气流,使得气流防止在基板的上侧的边缘形成涂覆材料的珠粒和/或去除已存在的珠粒。
这一类型的涂覆系统可以实现根据本发明的用于涂覆基板的方法,这是因为所存在的流出装置产生了相应的气流,其防止在涂覆基板时在基板的上侧的边缘形成珠粒或防止先前存在的珠粒留在该位置。
通常,以这样的方式布置流出装置,即其产生由支撑表面导向的气流。
此外,流出装置布置在支撑表面的平面的下方。
本发明的其它优点和特征在下文描述和参考的单个附图中是显而易见的。
在图中,示出了用于将涂料施加到基板12的涂覆系统10,以通过光刻法来实现制备涂覆的基板,用以制备微结构化元件,例如集成电路、半导体芯片或微机电系统(MEMS)。
因此,在下文通过参考本发明的具体应用实例,用于微结构化元件的涂覆系统,对本发明进行解释。然而,基本陈述可以以相似的方式转移到其它应用领域。
涂覆系统10包括可旋转的基板支架14,其包括支撑表面16,并且基板12通过其下侧18布置在所述支撑表面上。
此外,涂覆系统10包括施加装置20,通过该施加装置20,将待施加的涂覆的涂覆材料施加到基板12的上侧22。待施加的涂覆材料通常是流体形式。
此外,涂覆系统10包括流出装置24,其在所示实施方案中独立于基板支架14和施加装置20呈现。如下文进一步解释,可通过流出装置24产生气流。
通过涂覆系统10,用涂料涂覆基板12,其中同时防止涂覆珠粒永久地在基板12的上侧22的边缘26上形成。
通过施加装置20,将涂覆材料施加到基板12的上侧22。基板支架14以预定角速度旋转,从而使布置在所述基板支架上的基板12同样进行旋转。因此,所施加的涂覆材料在上侧22上以均匀方式分布。
由于旋转基板12时产生的离心力,涂覆材料迁移到基板12的上侧22的边缘26,并在该位置形成涂覆珠粒,所述离心力作用于施加到上侧22的涂覆材料上。
为了防止这种情况,通过流出装置24产生气流,尤其是氮气流,并且所述气流从基板12的下侧18引导到基板12的上侧22。
气流至少部分地撞击基板12的下侧18,并且部分地流过基板12的侧面,所述侧面将下侧18连接到上侧22。气流在上侧22,尤其是在其边缘区域26,产生负压,由于所述负压,气流至少使仍然柔软或潮湿的涂覆材料移动。因此,有效地防止了在边缘26形成涂覆珠粒。
如果已形成涂覆珠粒,则所述珠粒因此被气流去除。
无论在涂覆过程中是否(暂时性)产生涂覆珠粒,用归功于气流的涂覆方法确保了在涂覆过程结束时不存在涂覆珠粒。
根据气流相对于基板12的上侧22的角度,可以设定涂覆材料是否至少部分地被气流扫过,和/或涂覆材料是否至少部分地由于所产生的压力而从基板12的上侧22转移到所述基板的下侧18。因此,有效地防止了涂覆珠粒永久地在上侧22的边缘26形成。
例如,可提供一部分涂覆材料被扫开,另一部分涂覆材料被转移到下侧。
可以优选地设定由流出装置24产生的气流相对于基板12的角度,用以因产生的压力而产生不同效果。
或者,气流也可以以这样的方式从流出装置24流出,即所述气流不会撞击基板12的下侧18,而仅流过基板12的侧面。然而,为了在上侧22的边缘26产生防止在边缘26形成涂覆珠粒或去除先前存在的涂覆珠粒的负压,需要微调。
通常,流出装置24布置在由支撑表面16限定的平面的下方。从流出装置24起始的气流被定向成可以以一定角度流动离开支撑表面16。
当通过流出装置24产生气流时,基板12同样可通过基板支架14进行旋转,以便确保整个边缘26以尽可能均匀的方式暴露于气流的作用中,换言之,暴露于因此在上侧22上产生的负压中。然而,当产生气流时的旋转速度明显低于通过施加装置20施加光刻胶时的速度。例如,当产生气流时,旋转速度小于每分钟10转。
产生气流时的旋转速度甚至可以为零。优选的是,气流由环形流出装置24产生,使得基本上环形的气流在各种情况下沿着基板12的周边流动。
根据本发明的方法以及根据本发明的涂覆系统10,可以使基板12的上侧22的边缘26不形成涂覆珠粒。
通常,可以使用除纯氮气以外的气体混合物以产生气流。例如,可以使用氧-氮混合物,即所谓的清洁干燥空气(CDA)或空气。
气体混合物优选是无溶剂的,这使得溶剂的残留物不能沉积于基板12的涂覆的上侧22上。
优选地,气体以数巴的压力从流出装置24流出。因此,尤其可影响气流的速度,所述速度对于在基板12的上侧22产生负压是决定性的。
此外,可通过低旋转速度或气流的长的总施加时间,均匀地去除边缘26中的涂层。因此,可以说获得了在边缘26施加的涂层的变薄。
流出装置24可以包括一个流出喷嘴、多个喷嘴、流出槽、所谓的气刀等,通过此流出装置24尤其可获得气流的另一轮廓。这对于非圆形基板,例如,方形基板尤其重要。
此外,可以通过流出装置24的具体实施方案影响气流的速度。
如果涂覆材料被气流扫开,则涂覆系统10可以包括用于被去除的涂覆材料的留存槽,使得在一方面,该涂覆材料不会污染腔室,在另一方面,可以重复使用该涂覆材料。
通常,由流出装置24产生的气流相应地不直接撞击基板12的上侧22,而是以基本上垂直的方式撞击下侧18,或者气流基本上平行于基板12上基板支架14的旋转轴流过,用以在基板12的上侧22上,尤其是在上侧22的边缘26上,产生负压或真空。
负压确保了收集在边缘26上的涂覆材料不在边缘26形成永久的在涂覆过程后仍存在的珠粒。因此,通过气流去除在涂覆过程中暂时产生的涂覆珠粒。
Claims (13)
1.用涂覆材料涂覆基板(12)的方法,所述方法具有以下步骤:
a)提供基板(12),
b)将所述涂覆材料附着到基板(12)的上侧(22),和
c)由流出装置(24)产生气流,所述气流从基板(12)的下侧(18)被引导到基板(12)的上侧(22),其中所述气流在基板(12)的上侧(22)产生负压,所述负压防止在基板(12)的上侧(22)的边缘(26)形成涂覆材料的珠粒或通过所述气流去除先前存在的珠粒,其中由所述流出装置(24)产生的气流被部分引导通过所述基板(12)的侧面,而不撞击所述基板(12)的上侧(22),使得由于产生的负压而去除在基板(12)的上侧(22)上的珠粒或防止珠粒在基板(12)的上侧(22)上。
2.如权利要求1所述的方法,其特征在于,当施加所述涂覆材料时,所述基板(12)旋转,使得所施加的涂覆材料基本均匀地分布在所述基板(12)的上侧(22)。
3.如权利要求1所述的方法,其特征在于,在所述涂覆材料干燥之前产生所述气流。
4.如权利要求1所述的方法,其特征在于,所述气流至少部分地撞击所述基板(12)的下侧(18)。
5.如权利要求1所述的方法,其特征在于,所述气流撞击所述基板(12)的边缘区域。
6.如权利要求1所述的方法,其特征在于,所述气流在所述基板(12)的边缘区域产生负压。
7.如权利要求1所述的方法,其特征在于,所述气流至少部分地以这样的方式产生,即由于产生的压力,珠粒从边缘区域向外被吸入到所述气流中。
8.如权利要求1所述的方法,其特征在于,所述气流至少部分地以这样的方式产生,即由于产生的压力,珠粒从所述基板(12)的上侧(22)的边缘区域被吸到所述基板(12)的下侧(18)。
9.如权利要求1所述的方法,其特征在于,当产生所述气流时,所述基板(12)旋转。
10.如权利要求1所述的方法,其特征在于,所述气流不含溶剂和/或包含氮气。
11.如权利要求10所述的方法,其特征在于,所述气流由氮气组成。
12.如权利要求1所述的方法,其特征在于,所述涂覆材料是涂料或光刻胶。
13.用于将涂覆材料施加到基板(12)的上侧(22)的涂覆系统(10),所述涂覆系统具有可旋转的基板支架(14)和用于气流的流出装置(24),其中所述基板支架(14)包括用于基板(12)的支撑表面(16),将所述基板(12)通过其下侧(18)布置在所述基板支架(14)的支撑表面(16)上,其中将所述流出装置(24)相对于所述支撑表面(16)布置成使得所述流出装置(24)产生从基板(12)的下侧(18)被引导到基板(12)的上侧(22)的气流,其中所述流出装置(24)产生所述气流以在基板(12)的上侧(22)产生负压,防止在所述基板(12)的上侧(22)的边缘(26)形成所述涂覆材料的珠粒和/或去除已存在的珠粒,随着所述气流被部分引导通过所述基板(12)的侧面,而不撞击所述基板(12)的上侧(22),由于产生的负压而去除在基板(12)的上侧(22)上的珠粒或防止珠粒在基板(12)的上侧(22)上。
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