CN107538627A - The cutting-off method of brittle base - Google Patents
The cutting-off method of brittle base Download PDFInfo
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- CN107538627A CN107538627A CN201710491435.4A CN201710491435A CN107538627A CN 107538627 A CN107538627 A CN 107538627A CN 201710491435 A CN201710491435 A CN 201710491435A CN 107538627 A CN107538627 A CN 107538627A
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- brittle base
- line
- face
- cutting
- fault line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
The present invention, which provides, accurately controls cutting-off method of the section relative to the brittle base of the angle on the surface of brittle base.Prepare the brittle base (4) with the first face (SF1) and the second face (SF2).Make to be plastically deformed on the second face (SF2) by making blade tip move on the second face (SF2) of brittle base (4), so as to form the dotted line (DL) with groove shape.The process for forming dotted line (DL) is carried out in a manner of obtaining flawless state, the flawless state is the state being continuously connected in dotted line (DL) underface, brittle base (4) on the direction intersected with dotted line (DL).Fault line (CL) is formed on the first face (SF1) of brittle base (4).The process for forming fault line (CL) is carried out in the mode being disconnected that is continuously connected in fault line (CL) underface, making brittle base (4) on the direction intersected with fault line (CL).By making fault line (CL) stretching, extension form section in brittle base (4).
Description
Technical field
The present invention relates to the cutting-off method of brittle base.
Background technology
, it is necessary to repeatedly cut brittle base in the manufacture of the electrical equipment such as two-d display panel or solar battery panel
It is disconnected.As typical cutting-off method, fault line is formed on brittle base first." fault line " in this specification refers to,
The crackle locally travelled on the thickness direction of brittle base is on the surface of brittle base in the line of wire extension.Next,
Carry out so-called disconnection process.Specifically, by applying stress to brittle base, the crackle of fault line is made in a thickness direction
Fully advance.Thus, brittle base is cut off along fault line.
According to patent document 1, certain depression is produced in the upper surface of glass plate during scribing.In the patent document 1, by this
Depression is referred to as " scribe line ".In addition, being set at quarter simultaneously with the scribe line, produce and split from scribe line towards what underface direction extended
Line.The technology of such as patent document 1 is visible, and in conventional typical technology, the formation with scribe line simultaneously forms crackle
Line.
According to patent document 2, it is proposed that the dramatically different cut-out technology with above-mentioned typical cut-out technology.According to the skill
Art, first, it is plastically deformed by slip of the blade tip on brittle base, is thus formed in the patent document 2 and is referred to as
The groove shape of " scribe line ".In this manual, the groove shape is referred to as " trench line " later.At the time of trench line is formed,
Crackle is not formed thereunder.Afterwards by making crackle be stretched along trench line to form fault line.In other words, with it is typical
Technology is different, is temporarily forming the trench line for being not accompanied by crackle, forms fault line along trench line afterwards.Enter afterwards along fault line
The common disconnection process of row.
Formed used in the technology of above-mentioned patent document 2, while be not accompanied by the trench line of crackle with along with crackle
Typical scribe line compare, can be formed by slip of the blade tip in the presence of lower load.It is smaller due to loading,
Therefore the damage applied to blade tip diminishes.Thus, according to the cut-out technology, the life-span of blade tip can be extended.
In most instances, in the cut-out using the brittle base of fault line, fault line phase in brittle base it is expected
Vertically stretched for its surface.Thus, the section vertical with substrate surface is obtained.On the other hand, it is crisp according to what is cut off
Property substrate purposes or shape, it is desired to be able to formed relative to the inclined section of substrate surface.For example, incited somebody to action along closed curve
In the case that brittle base is cut off, if forming the section vertical with substrate surface by disconnecting process, after process is disconnected,
It is not easy to extract inboard portion out from the Outboard Sections of closed curve.In order that the extraction become easy, it is necessary to make section relative to
Substrate surface tilts, and in other words needs to set pattern draft.
According to patent document 3, it is intended that pattern draft is set, by the use of the circular diamond sawblade as cutter the one of glass plate
Surface side forms the inclined cutting rod of thickness direction relative to glass plate in a manner of describing closed curve.Tilted as cutting rod is made
Method, exemplify two methods.As first method, circular diamond sawblade is used in an inclined state.As second
Method, use the circular diamond sawblade with asymmetrical shape.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 9-188534 publications
Patent document 2：International Publication No. 2015/151755
Patent document 3：Japanese Unexamined Patent Publication 7-223828 publications
The invention problem to be solved
It is attached on the surface when forming fault line on a side surface of brittle base according to the method for above-mentioned patent document 3
Closely, fault line can be made to extend along desired incline direction.However, in order to cut off substrate, it is necessary to make fault line extend to base
The opposite side surfaces of plate, in this process, direction of extension it is some it is unmanageable due to and may change.Thus,
Sometimes can not obtain along the desired inclined section in direction.It should be noted that forming the situation of vertical section
Under, similarly undesirable change of the fault line outside the intention in direction of extension.
The content of the invention
The present invention completes for problem as solving the above, its object is to, there is provided one kind can be high-precision
Ground controls cutting-off method of the section relative to the brittle base of the angle on the surface of brittle base.
For solving the scheme of problem
The cutting-off method of the brittle base of the present invention possesses following process.Prepare brittle base, the brittle base has
First face and second face opposite with the first face, and there is the thickness direction vertical with the first face.By making blade tip in fragility
Move on second face of substrate and make to be plastically deformed on the second face, so as to form the dotted line with groove shape.Form dotted line
Process carried out in a manner of obtaining flawless state, the flawless state be in the underface of dotted line, brittle base with void
The state being continuously connected on the direction that line intersects.Fault line is formed on the first face of brittle base.By stretching fault line
Open up and section is formed on brittle base.
Invention effect
According to the present invention, in the first face with forming fault line, the second opposite face forms dotted line.Thereby, it is possible to crackle
The direction that line stretches relative to the first face of brittle base is micro-adjusted.Thus, it is possible to accurately control section relative
Angle in the first face of brittle base.
Brief description of the drawings
Fig. 1 is the flow chart of the composition for the cutting-off method for summarily representing the brittle base in embodiments of the present invention 1.
Fig. 2 is bowing for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 1
View.
Fig. 3 is the schematic cross sectional view splitted along Fig. 2 line III-III.
Fig. 4 is bowing for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 1
View.
Fig. 5 is the schematic cross sectional view splitted along Fig. 4 line V-V.
Fig. 6 is bowing for the 3rd process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 1
View.
Fig. 7 is the schematic cross sectional view splitted along Fig. 6 line VII-VII.
Fig. 8 is the flow chart of the composition for the cutting-off method for summarily representing the brittle base in embodiments of the present invention 2.
Fig. 9 is bowing for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 2
View.
Figure 10 is the schematic cross sectional view splitted along Fig. 9 line X-X.
Figure 11 is bowing for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 2
View.
Figure 12 is the schematic cross sectional view splitted along Figure 11 line XII-XII.
Figure 13 is the composition of the cutting-off method of the brittle base in the variation for summarily represent embodiments of the present invention 2
Flow chart.
Figure 14 is the first of the cutting-off method of the brittle base in the variation for summarily represent embodiments of the present invention 2
The top view of process.
Figure 15 is the schematic cross sectional view splitted along Figure 14 line XV-XV.
Figure 16 is the second of the cutting-off method of the brittle base in the variation for summarily represent embodiments of the present invention 2
The top view of process.
Figure 17 is the schematic cross sectional view splitted along Figure 16 line XVII-XVII.
Figure 18 is the 3 of the cutting-off method of the brittle base in the variation for summarily represent embodiments of the present invention 2
The top view of process.
Figure 19 is the 4 of the cutting-off method of the brittle base in the variation for summarily represent embodiments of the present invention 2
The top view of process.
Figure 20 is bowing for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 3
View.
Figure 21 is the schematic cross sectional view splitted along Figure 20 line XXI-XXI.
Figure 22 is bowing for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 3
View.
Figure 23 is the schematic cross sectional view splitted along Figure 22 line XXIII-XXIII.
Figure 24 is the cutting-off method of the brittle base in the first variation for summarily represent embodiments of the present invention 3
The top view of first process.
Figure 25 is the schematic cross sectional view splitted along Figure 24 line XXV-XXV.
Figure 26 is the cutting-off method of the brittle base in the first variation for summarily represent embodiments of the present invention 3
The top view of second process.
Figure 27 is the schematic cross sectional view splitted along Figure 26 line XXVII-XXVII.
Figure 28 is the cutting-off method of the brittle base in the second variation for summarily represent embodiments of the present invention 3
The top view of first process.
Figure 29 is the cutting-off method of the brittle base in the second variation for summarily represent embodiments of the present invention 3
The top view of second process.
Figure 30 is bowing for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 4
View.
Figure 31 is the schematic cross sectional view splitted along Figure 30 line XXXI-XXXI.
Figure 32 is the schematic cross sectional view splitted along Figure 30 line XXXII-XXXII.
Figure 33 is bowing for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 4
View.
Figure 34 is the schematic cross sectional view splitted along Figure 33 line XXXIV-XXXIV.
Figure 35 is the schematic cross sectional view splitted along Figure 33 line XXXV-XXXV.
Figure 36 is bowing for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 5
View.
Figure 37 is the schematic cross sectional view splitted along Figure 36 line XXXVII-XXXVII.
Figure 38 is bowing for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 5
View.
Figure 39 is the schematic cross sectional view splitted along Figure 38 line XXXIX-XXXIX.
Figure 40 is cuing open for the 3rd process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 5
View.
Figure 41 is the sectional view for representing the process corresponding with Figure 40 in comparative example.
Figure 42 is the sectional view for illustrating the effect in embodiments of the present invention 5.
Figure 43 is the sectional view of the first process of the cutting-off method for representing the brittle base in comparative example.
Figure 44 is the section view of the first case of the second process of the cutting-off method for summarily representing the brittle base in comparative example
Figure.
Figure 45 is the section view of the second case of the second process of the cutting-off method for summarily representing the brittle base in comparative example
Figure.
Figure 46 is cuing open for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 6
View.
Figure 47 is cuing open for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 6
View.
Figure 48 is the section view of a process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 7
Figure.
Figure 49 is cuing open for the first process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 8
View.
Figure 50 is cuing open for the second process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 8
View.
Figure 51 is cuing open for the 3rd process of the cutting-off method for summarily representing the brittle base in embodiments of the present invention 8
View.
Description of reference numerals
AL boost lines；
CL fault lines；
DL dotted lines；
SF1 upper surfaces (the first face)；
SF2 lower surfaces (the second face)；
TL trench lines；
XS, XSi symmetry axis；
4 glass substrates (brittle base).
Embodiment
Hereinafter, embodiments of the present invention are illustrated based on accompanying drawing.It is it should be noted that right in figures in the following
Same or equivalent part mark identical reference, its explanation are not repeated.
<Embodiment 1>
Referring to Fig. 1, the cutting-off method of the brittle base in present embodiment is illustrated.
Reference picture 2 and Fig. 3, in step S20 (Fig. 1), preparation has upper surface SF1 (the first face) and lower surface
SF2 (second face opposite with the first face) and (the fragility base of glass substrate 4 with the thickness direction vertical with upper surface SF1
Plate).The thickness of glass substrate 4 is preferably below 0.7mm, more preferably below 0.5mm.
Next, in step S40 (Fig. 1), under being made by making blade tip be moved on the lower surface SF2 of glass substrate 4
It is plastically deformed on the SF2 of surface.Thus, the dotted line DL with groove shape is formed.The formation process is to obtain flawless state
Mode carry out, the flawless state is to connect in dotted line DL underface, glass substrate 4 on the direction RD intersected with dotted line DL
The state being connected continuously.Under flawless state, although foring the dotted line DL based on plastic deformation, do not formed along the void
Line DL crackle.In order to obtain flawless state, avoid applying excessive load to blade tip.
Dotted line DL is preferably only produced by the plastic deformation of glass substrate 4, in this case, does not produce glass substrate 4
On reduction.In order to avoid cutting down, the load too high of blade tip is not made.Due in the absence of reduction, therefore it is avoided that in glass
Undesirable fine fragment is produced on substrate 4.But it usually can allow to cut down a little.
Above-mentioned movement of the blade tip on glass substrate 4 can be any one of slip and rolling.In the situation of slip
Under, use the blade tip (such as diamond pen) for being fixed on retainer.In the case of rolling, use with can be around the axle of retainer
The mode of rotation is held in the blade tip (so-called scoring wheel) of retainer.In the present embodiment, it is expected accurately to manage void
Line DL and fault line CL described later (Fig. 4 and Fig. 5) relative position, it is in this regard, preferably sliding compared with the blade tip of rolling
Dynamic blade tip.
Reference picture 4 and Fig. 5, in step S60 (Fig. 1), fault line CL is formed on the upper surface SF1 of glass substrate 4.
Fault line CL can also be formed by common scribing method.In this case, it is typical that fault line CL is with from glass base
The mode that the upper surface SF1 of plate 4 vertically extends is formed.
Reference picture 6 and Fig. 7, in step S80 (Fig. 1), by making fault line CL stretching, extensions be cut to be formed in glass substrate 4
Section PS.That is, carry out the disconnection process for glass substrate 4 being cut off along fault line CL.Disconnecting process can be by glass base
Plate 4 applies external force to carry out.For example, by stress by the fault line CL (Fig. 5) on the upper surface SF1 towards glass substrate 4
Apply component (such as being referred to as the component of " trip arm ") to press on the SF2 of lower surface, make fault line so as to apply to glass substrate 4
CL crackle splits such stress.It should be noted that the moment (at the time of Fig. 5) is formed along thickness side at it in fault line CL
In the case of fully travelling, fault line CL formation occurs simultaneously with the cut-out of glass substrate 4.
According to the experiment of the present inventor, it was found that fault line CL stretching, extension path (Fig. 7 dotted arrow) is intended to away from dotted line
DL phenomenon (solid arrow of reference picture 7).It is believed that the phenomenon is due to be produced when forming dotted line DL in glass substrate 4
Internal stress caused by.By using the phenomenon, the direction (Fig. 7 that fault line CL can be stretched relative to upper surface SF1
In direction of extension) be micro-adjusted.Thus, it is possible to accurately control angles of the section PS relative to upper surface SF1.
In the process of breaking glass substrate 4, dotted line DL from along thickness direction by the fault line CL's on the SF1 of upper surface
The position that position is projected on the lower surface SF2 of glass substrate 4 is risen, size SH (Fig. 5) of the skew more than zero.Thus, in Fig. 5
In, it is avoided that uncertain fault line CL stretching, extension by the situation of which side guiding to dotted line DL left and right.
It should be noted that dotted line DL can also be formed after fault line CL is formed, then it is stretched over fault line CL
Lower surface SF2.But in order that dotted line DL is more reliable and fully fault line CL is played a role, preferably exist as described above
Dotted line DL is formed before forming fault line CL.
<Embodiment 2>
In the present embodiment, the method for forming fault line CL (Fig. 4 and Fig. 5) is different from the method in embodiment 1.
Hereinafter, the cutting-off method of the glass substrate 4 in present embodiment is illustrated.
First, it is same with embodiment 1, prepare glass substrate 4 in step S20 and S40 (Fig. 8) and form dotted line
DL。
Reference picture 9 and Figure 10, next, in step S50 (Fig. 8), as shown in arrow (Fig. 9), make blade tip in glass
Moved on the upper surface SF1 (Figure 10) of substrate 4, thus make to be plastically deformed on the SF1 of upper surface.It is consequently formed with groove shape
Trench line TL.The formation process is carried out in a manner of obtaining flawless state, the flawless state be in trench line TL just
Lower section, the state that glass substrate 4 is continuously connected on the direction RT (Figure 10) intersected with trench line TL.In flawless state
Under, although foring the trench line TL based on plastic deformation, the crackle along trench line TL is not formed.Split to obtain nothing
Line state, avoid applying excessive load to blade tip.
Trench line TL is preferably only produced by the plastic deformation of glass substrate 4, in this case, does not produce glass substrate
Reduction on 4.In order to avoid cutting down, the load too high of blade tip is not made.Due in the absence of reduction, therefore it is avoided that in glass
Undesirable fine fragment is produced on substrate 4.But it usually can allow to cut down a little.
Above-mentioned movement of the blade tip on glass substrate 4 can be any one of slip and rolling.In the situation of slip
Under, use the blade tip (such as diamond pen) for being fixed on retainer.In the case of rolling, use with can be around the axle of retainer
The mode of rotation is held in the blade tip (so-called scoring wheel) of retainer.In the present embodiment, it is expected accurately to manage ditch
Line of rabbet joint TL and dotted line DL relative position, in this regard, compared with the blade tip of rolling, the blade tip that preferably slides.
Reference picture 11 and Figure 12, next, in step S60 (Fig. 8), form fault line CL.The formation process passes through
Crackle is set to be stretched from trench line TL to carry out.In the present embodiment, as shown in figure 9, to be cut away by blade tip at the NP of position
The edge of glass substrate 4 and caused fine destruction is starting point, fault line CL is initially formed as shown in Figure 11 arrow.
Next, in step S80 (Fig. 8), section is identically formed with embodiment 1.That is, breaking glass substrate 4.
According to present embodiment, the effect same with embodiment 1 can be also obtained.In addition, in the present embodiment, such as
After forming trench line TL as shown in Figure 10 with flawless state, as shown in figure 12, split in being formed immediately below for trench line TL
Streakline CL.According to the research of the present inventor, using this method, the section and embodiment 1 along fault line CL can be made
Section is compared to more smooth.
It should be noted that it is believed that the release that is formed to of the fault line CL in present embodiment is forming trench line
Internal stress caused by TL and it is caused.The opportunity of the stress release is not limited to the edge of glass substrate 4 as described above
Cut away (Fig. 9).Hereinafter, the variation (Figure 13) of the viewpoint is illustrated.
Reference picture 14 and Figure 15, in step S30 (Figure 13), form trench line TL.With foregoing present embodiment not
Together, in this variation, blade tip does not cut away the edge of glass substrate 4.Reference picture 16 and Figure 17, in step S40 (Figure 13),
Form dotted line DL.It should be noted that trench line TL and dotted line DL formation order are arbitrary.
Reference picture 18, in step S60 (Figure 13), formed on the upper surface SF1 of glass substrate 4 and intersected with trench line TL
Boost line AL.Taking this as an opportunity, as shown by arrows in FIG., initially forms fault line CL.
Reference picture 19, in step S80 (Figure 13), section PS is identically formed with embodiment 1.That is, glass is cut off
Substrate 4.
<Embodiment 3>
Reference picture 20 and Figure 21, in the present embodiment, fault line CL process are formed so that fault line CL is in glass
The mode with curve part is carried out on the upper surface SF1 of substrate 4.More specifically, fault line CL process is formed so that crackle
Line CL is carried out on the upper surface SF1 of glass substrate 4 as the mode of closed curve.
In the present embodiment, in the case where overlooking (Figure 20), void is formed in the position of the closed curve than fault line CL in the inner part
Line DL.Dotted line DL can have the shape for reducing fault line CL closed curve.It should be noted that such as in embodiment 1
As middle explanation, dotted line DL and fault line CL formation order are arbitrary.
Reference picture 22 and Figure 23, by making fault line CL stretching, extensions form section PS in glass substrate 4.That is, carry out
The disconnection process for cutting off glass substrate 4 along fault line CL.As shown in figure 23, works of the section PS formed in dotted line DL
Under, there is cone-shaped from lower surface SF2 towards upper surface SF1.
It should be noted that on structure other than the above, it is substantially the same with the structure of above-mentioned embodiment 1 or 2, because
This, marks identical reference for identical or corresponding key element, its explanation is not repeated.
According to present embodiment, played a role by making above-mentioned cone-shaped be used as pattern draft, can be easily from glass
The fault line CL of glass substrate 4 Outboard Sections 4o takes out inboard portion 4i.
In addition, the full-size (the horizontal full-size in Figure 23) on the width of section PS Outboard Sections
As below the width dimensions LO of the Outboard Sections of the fault line CL on the SF1 of upper surface.Thus, by section PS outside portion
Divide in the case of being used as product, can be the outer of the fault line CL on the SF1 of upper surface by the full-size management of its width
Below the width dimensions LO of side part.
Next, the first variation is illustrated below.
Reference picture 24 and Figure 25, in this variation, in the case where overlooking (Figure 24), more outer than fault line CL closed curve
The position of side forms dotted line DL.Dotted line DL can have the shape for expanding fault line CL closed curve.
Reference picture 26 and Figure 27, by making fault line CL stretching, extensions form section PS in glass substrate 4.Such as Figure 27 institutes
Show, the section PS formed has cone-shaped in the presence of dotted line DL, from upper surface SF1 towards lower surface SF2.
According to this variation, played a role by making above-mentioned cone-shaped be used as pattern draft, can be easily from glass
The fault line CL of substrate 4 Outboard Sections 4o takes out inboard portion 4i.
In addition, the full-size (the horizontal full-size in Figure 27) on the width of section PS inboard portion
As below the width dimensions LI of the inboard portion of the fault line CL on the SF1 of upper surface.Thus, by section PS inside portion
Divide in the case of being used as product, can be in the fault line CL on the SF1 of upper surface by the full-size management of its width
Below the width dimensions LI of side part.
Next, the second variation is illustrated below.
Reference picture 28, in this variation, fault line CL includes some respectively with rectilinear form.By by this
A little parts are connected, to be arranged on the part surrounded under vertical view by fault line CL.Dotted line DL includes more with rectilinear form respectively
Individual part.By the way that these parts are connected, to be arranged on the part surrounded under vertical view by dotted line DL.The part surrounded by dotted line DL
It is arranged to comprising the part surrounded by fault line CL.
Reference picture 29, by making fault line CL stretching, extensions form section PS in glass substrate 4.The section PS formed
In the same manner as above-mentioned first variation (Figure 27), there is taper from upper surface SF1 towards lower surface SF2 in the presence of dotted line DL
Shape.Thus, can be by the full-size management of its width in the case where section PS inboard portion is used as into product
Below width dimensions for the inboard portion of the fault line CL on the SF1 of upper surface.
<Embodiment 4>
In embodiment 1 (Fig. 5), fault line CL is projected under glass substrate 4 by dotted line DL from along thickness direction
Position on the SF2 of surface is risen, and size SH (Fig. 5) of the skew more than zero, all positions of the size SH on the SF2 of lower surface can
With constant.On the other hand, in the present embodiment, size SH size is according to position and different.On this method, in detail below
Illustrate.
30~Figure 32 of reference picture, dotted line DL are from the lower surface that fault line CL is projected on to glass substrate 4 along thickness direction
Position on SF2 is risen, size of the skew more than zero.The size changes on the lower surface SF2 of glass substrate 4.
Specifically, fault line CL is by mutually different two point on a side (being the right in figure) for glass substrate 4
As one square end and another square end.Fault line CL changes 180 ° of side from a square end towards another square end with its bearing of trend
Formula extends.Nearby portion is nearby parallel to each other in portion a fault line CL square end with another square end on the SF1 of upper surface.Thus, in glass
Near the right of glass substrate 4, part, parallel with the right width dimensions on the SF1 of upper surface between fault line CL
(longitudinal size in Figure 30) is constant.In the case where overlooking (Figure 30), surrounded than the right by glass substrate 4 and fault line CL
Region position in the outer part form dotted line DL.Dotted line DL has on the SF2 of lower surface to be got over the right closer to glass substrate 4
The part that mode away from fault line CL is formed.
33~Figure 35 of reference picture, by making fault line CL stretching, extensions form section PS in glass substrate 4.Here, as above
Described, dotted line DL has what is formed in a manner of the right of closer glass substrate 4 is further away from fault line CL on the SF2 of lower surface
Part.Thus, closer to the right of glass substrate 4, then dotted line DL is weaker to the influence that fault line CL direction of extension is brought.Change
Yan Zhi, further away from the right of glass substrate 4, then dotted line DL is stronger to the influence that fault line CL direction of extension is brought.Its result
It is that part, parallel with the right width dimensions on the SF2 of lower surface between fault line CL are (longitudinal in Figure 33
Size) it is then smaller further away from the right of glass substrate 4.Specifically, the part between fault line CL along line
XXXIV-XXXIV width dimensions LP is less than the width dimensions LQ along line XXXV-XXXV.Thereby, it is possible to easily make by glass
The part 4a that the section PS of glass substrate 4 and the right surround is from the part 4b around it as shown in Figure 33 dotted arrow
Right is moved towards in figure.Thus, it is possible to part 4a and part 4b is set to can be easily separated each other.If it should be noted that assume
Width dimensions LP is more than width dimensions LQ, then can not carry out such movement.
<Embodiment 5>
Reference picture 36 and Figure 37, dotted line DL is formed on the lower surface SF2 of glass substrate 4.In the present embodiment, shape
Carried out into dotted line DL process in a manner of making dotted line DL that there is Part I DL1 and Part II DL2.
Reference picture 38 and Figure 39, fault line CL is formed on the upper surface SF1 of glass substrate 4.Will along thickness direction
The position that fault line CL is projected on the lower surface SF2 of glass substrate 4 is in dotted line DL Part I DL1 and Part II
Between DL2.It should be noted that as illustrated in embodiment 1, dotted line DL and fault line CL formation order are to appoint
Meaning.
Reference picture 40, as indicated by a dashed arrow in the figure, by making fault line CL stretching, extensions form section in glass substrate 4
PS.Fault line CL is empty in a manner of being reached on the SF2 of lower surface between dotted line DL Part I DL1 and Part II DL2
Line DL is guided.
Reference picture 41, if assuming to be not provided with dotted line DL, the direction of extension of the fault line CL shown in dotted arrow is possible to
Deviate like that from desired direction of extension for some reason and as depicted by the solid-line arrows larger and under reaching in this condition
Surface SF2.Reference picture 42, on the other hand, according to present embodiment, when fault line CL is intended to the Part II DL2 compared with dotted line DL
During closer to Part I DL1, application is intended to stretch fault line CL to from Part I DL1 towards Part II DL2 direction
The effect that exhibition direction is modified.Thereby, it is possible to prevent fault line CL lower surface SF2 reach with desired position deviate compared with
Big position.
<Embodiment 6>
In above-mentioned embodiment 1~5, illustrate to form fault line CL process (Fig. 5) so that fault line CL is in glass
The situation that the upper surface SF1 of substrate 4 is nearby carried out from the upper surface SF1 modes vertically extended.In contrast, in this embodiment party
In formula, the process for forming fault line CL is entered in a manner of fault line CL is obliquely extended from the upper surface SF1 of glass substrate 4
OK.Generally, with along from the direction vertical with the upper surface SF1 of glass substrate 4 (also referred to as direction XP below) inclined direction
The fault line CL (Figure 43) that the mode of extension is formed further in the case of stretching, extension, according to the research of the present inventor, not only has
The situation (Figure 44) point-blank stretched, also have a case that direction of extension is intended to other places in midway and changed (Figure 45).According to
Present embodiment, this change can be suppressed.Hereinafter, the method for suppressing this change is specifically illustrated.
Reference picture 46, form dotted line DL and fault line CL.As described above, fault line CL so that fault line CL from glass base
The mode that the upper surface SF1 of plate 4 obliquely extends is formed.It should be noted that as illustrated by embodiment 1, it is empty
Line DL and fault line CL formation order are arbitrary.In addition, in figures 4-6 can, fault line CL is projected on along thickness direction
Position on the lower surface SF2 of glass substrate 4 is different from dotted line DL position, but these positions can also be identical.
Reference picture 47, cut by making fault line CL stretch as indicated by a dashed arrow in the figure to be formed in glass substrate 4
Section.In fault line CL direction of extension (dotted arrow in figure) for some reason and in the case of direction of closing XP, by void
Line DL, which is produced, makes direction of extension return to the such effect (solid arrow in figure) of initial incline direction.Thus, fault line CL
Inclination on the SF1 of upper surface is easily maintained on the SF2 of lower surface.
It should be noted that on the big body phase of any composition in composition other than the above, with above-mentioned embodiment 1~5
Together, therefore, identical reference is marked to identical or corresponding key element, its explanation is not repeated.
<Embodiment 7>
Reference picture 48, shown as dotted line in figure by forming dotted line DL and internal caused by glass substrate 4
The distribution of stress.In above-mentioned embodiment 1~6, the process for forming dotted line DL can be with so that glass around dotted line DL
Mode of the internal stress of substrate 4 with the symmetry axis XS vertical with the lower surface SF2 of glass substrate 4 is carried out.Such dotted line
DL can be readily formed using common scribing instrument.
<Embodiment 8>
Reference picture 49, the process that forms dotted line DLi of present embodiment different from the dotted line DL (Figure 48) of embodiment 7
So that the internal stress of the glass substrate 4 around dotted line DL is inclined symmetrical with the lower surface SF2 relative to glass substrate 4
Axle XSi mode is carried out.Dotted line DLi can be formed by the blade tip with inclined symmetry axis XSi.Specifically, will be usual
Blade tip along symmetry axis Xsi tilt in the state of use, or replace set it is this inclination and prepare there is symmetry axis XSi
Special blade tip.The dotted line DL of above-mentioned embodiment 1~6 can be substituted and apply dotted line DLi.Hereinafter, especially to by dotted line
DLi is applied to illustrate with the situation of the similar mode of embodiment 1.
Reference picture 50, form dotted line DLi and fault line CL.Here, because dotted line DLi has inclined symmetry axis XSi, because
This size SH (Fig. 5) can also be zero.In other words, dotted line DLi can also be formed along thickness direction and project fault line CL
Position on the lower surface SF2 of glass substrate 4.
Reference picture 51, in the same manner as embodiment 1, by fault line CL is stretched as indicated by a dashed arrow in the figure and
Section is formed in glass substrate 4.
According to present embodiment, the position of the dotted line DLi on the SF2 of lower surface can not only be utilized, it is also possible to utilize dotted line
DLi symmetry axis XSi angle, the direction of fault line CL stretching, extensions is micro-adjusted.
It should be noted that in the respective embodiments described above, illustrate the feelings for using glass substrate 4 as brittle base
Condition, but brittle base can also by beyond glass fragile material make, for example, can by ceramics, silicon, compound semiconductor,
Sapphire or quartz make.
Claims (11)
1. a kind of cutting-off method of brittle base, it possesses following process：
Prepare the process of brittle base, the brittle base has the first face and second face opposite with first face, and has
There is the thickness direction vertical with first face；And
Make to be plastically deformed on second face by making blade tip move on second face of the brittle base, from
And the process for forming the dotted line with groove shape,
The process for forming the dotted line is carried out in a manner of obtaining flawless state, the flawless state be in the dotted line just
Lower section, the state that the brittle base is continuously connected on the direction intersected with the dotted line,
The cutting-off method of the brittle base is also equipped with：
The process that fault line is formed on first face of the brittle base；And
By making the fault line stretching, extension form the process of section on the brittle base.
2. the cutting-off method of brittle base according to claim 1, wherein,
Before the process of the fault line is formed, possess following processes：By making blade tip described the of the brittle base
Simultaneously go up movement and make to be plastically deformed on first face, so as to form the trench line with groove shape,
The process for forming the trench line is carried out in a manner of obtaining flawless state, and the flawless state is in the trench line
Underface, the state that the brittle base is continuously connected on the direction intersected with the trench line,
The process for forming the fault line is carried out in a manner of crackle is stretched from the trench line.
3. the cutting-off method of brittle base according to claim 1 or 2, wherein,
The process of the fault line is formed so that the fault line has curve part on first face of the brittle base
Mode carry out.
4. the cutting-off method of brittle base according to claim 1 or 2, wherein,
The process of the fault line is formed so that the fault line turns into closed curve on first face of the brittle base
Mode carry out.
5. the cutting-off method of brittle base according to claim 1 or 2, wherein,
In the process for cutting off the brittle base, the fault line is projected on institute by the dotted line from along the thickness direction
The position stated on second face of brittle base is risen, size of the skew more than zero.
6. the cutting-off method of brittle base according to claim 5, wherein,
The size changes on second face of the brittle base.
7. the cutting-off method of brittle base according to claim 1 or 2, wherein,
The process for forming the dotted line is carried out in a manner of the dotted line is had Part I and Part II,
The position that the fault line is projected on second face of the brittle base along the thickness direction is in institute
State between Part I and the Part II.
8. the cutting-off method of brittle base according to claim 1 or 2, wherein,
The process of the fault line is formed so that what the fault line vertically extended from first face of the brittle base
Mode is carried out.
9. the cutting-off method of brittle base according to claim 1 or 2, wherein,
The process of the fault line is formed so that what the fault line obliquely extended from first face of the brittle base
Mode is carried out.
10. the cutting-off method of brittle base according to claim 1 or 2, wherein,
Form the process of the dotted line so that the internal stress of the brittle base around the dotted line have with it is described crisp
The mode of the vertical symmetry axis in second face of property substrate is carried out.
11. the cutting-off method of brittle base according to claim 1 or 2, wherein,
The process of the dotted line is formed so that the internal stress of the brittle base around the dotted line has relative to institute
The mode for stating the inclined symmetry axis in the second face of brittle base is carried out.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-128426 | 2016-06-29 | ||
| JP2016128426A JP6760641B2 (en) | 2016-06-29 | 2016-06-29 | Method of dividing a brittle substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107538627A true CN107538627A (en) | 2018-01-05 |
Family
ID=60945736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710491435.4A Pending CN107538627A (en) | 2016-06-29 | 2017-06-23 | The cutting-off method of brittle base |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6760641B2 (en) |
| KR (1) | KR20180002495A (en) |
| CN (1) | CN107538627A (en) |
| TW (1) | TW201803817A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11116261A (en) * | 1997-10-09 | 1999-04-27 | Ishizuka Glass Co Ltd | Machining method of glass |
| CN102001822A (en) * | 2009-08-28 | 2011-04-06 | 精工电子有限公司 | Glass assembly cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
| TW201425243A (en) * | 2012-12-25 | 2014-07-01 | Luminous Optical Technology Co Ltd | Cutting method for large-area reinforced glass substrate |
| JP2015067500A (en) * | 2013-09-30 | 2015-04-13 | Hoya株式会社 | Method for producing glass substrate for magnetic disk |
| WO2015182298A1 (en) * | 2014-05-30 | 2015-12-03 | 三星ダイヤモンド工業株式会社 | Method for splitting brittle substrate |
| WO2016047317A1 (en) * | 2014-09-25 | 2016-03-31 | 三星ダイヤモンド工業株式会社 | Method for cutting brittle substrate |
| CN105461202A (en) * | 2014-09-26 | 2016-04-06 | 三星钻石工业股份有限公司 | Manufacturing method for liquid display panel |
-
2016
- 2016-06-29 JP JP2016128426A patent/JP6760641B2/en not_active Expired - Fee Related
-
2017
- 2017-05-30 KR KR1020170066703A patent/KR20180002495A/en not_active Application Discontinuation
- 2017-06-02 TW TW106118267A patent/TW201803817A/en unknown
- 2017-06-23 CN CN201710491435.4A patent/CN107538627A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11116261A (en) * | 1997-10-09 | 1999-04-27 | Ishizuka Glass Co Ltd | Machining method of glass |
| CN102001822A (en) * | 2009-08-28 | 2011-04-06 | 精工电子有限公司 | Glass assembly cutting method, package manufacturing method, package, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece |
| TW201425243A (en) * | 2012-12-25 | 2014-07-01 | Luminous Optical Technology Co Ltd | Cutting method for large-area reinforced glass substrate |
| JP2015067500A (en) * | 2013-09-30 | 2015-04-13 | Hoya株式会社 | Method for producing glass substrate for magnetic disk |
| WO2015182298A1 (en) * | 2014-05-30 | 2015-12-03 | 三星ダイヤモンド工業株式会社 | Method for splitting brittle substrate |
| WO2016047317A1 (en) * | 2014-09-25 | 2016-03-31 | 三星ダイヤモンド工業株式会社 | Method for cutting brittle substrate |
| CN105461202A (en) * | 2014-09-26 | 2016-04-06 | 三星钻石工业股份有限公司 | Manufacturing method for liquid display panel |
| JP2016069195A (en) * | 2014-09-26 | 2016-05-09 | 三星ダイヤモンド工業株式会社 | Substrate segmentation method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180002495A (en) | 2018-01-08 |
| JP6760641B2 (en) | 2020-09-23 |
| JP2018001474A (en) | 2018-01-11 |
| TW201803817A (en) | 2018-02-01 |
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