TWI818009B - retainer unit with pin - Google Patents

Abstract

The present invention provides a holder unit and a pin that can improve the quality of a workpiece to be scored. The holder unit includes: a holder having a first insertion hole 114, a scoring wheel having a second insertion hole 121, and a holder inserted into the first insertion hole 114 and the second insertion hole 121 and at least with respect to the second insertion hole 121. Insert the pin 130 in the pressed state. The pin 130 includes a limiting structure 130A that limits the movement of the pin 130 relative to the scoring wheel in the scanning direction DD of the scoring wheel.

Description

retainer unit with pin

The present invention relates to a holder unit and a pin for scoring processing.

The scribing device is used to form scribed lines on workpieces such as brittle material substrates. The scoring device is provided with a holder unit. The holder unit is equipped with a scoring wheel for scoring the workpiece. During the scoring process, while the scoring wheel is pressed against the surface of the workpiece, the workpiece and the scoring wheel move relative to each other, forming a scoring line on the workpiece. In addition, Patent Document 1 can be cited as an example of a conventional scribing device. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2017-119348

[Problem to be solved by the invention]

When a conventional scoring device is used to score an object, the quality of the object may be uneven. For example, there may be cases where the formation state of vertical cracks differs at each location of the scribed line formed on the workpiece. In an optimal crack formation state, the depth of the primary crack and the depth of the secondary crack among vertical cracks are constant throughout the entire scribed line. In low-quality workpieces, for example, the depth of a primary crack may vary from part to part along the scribed line, including parts where the primary crack is shallow or deep compared to other parts. The formation state of cracks affects, for example, the fracture state of the workpiece. In terms of improving the quality of the workpiece after fracture, it is preferable that the quality of the workpiece that has been scored is higher. [Technical means to solve problems]

The holder unit of the present invention includes: a holder having a first insertion hole; a scoring wheel having a second insertion hole; and a pin inserted into the first insertion hole and the second insertion hole, and at least for The second insertion hole is inserted in a non-pressed state; and the pin includes a restricting structure that restricts the movement of the pin relative to the scribing wheel in the scanning direction of the scribing wheel.

In order to verify the cause of the uneven quality of the workpiece subjected to the scoring process, the inventor of the present application observed the state of the pin during the scoring process. In this observation, a conventional holder unit 300 is used. As shown in FIG. 14 , it is provided with a holder 310 having a circular first insertion hole 311, a scoring wheel 320 having a circular second insertion hole 321, And cylindrical pin 330. The pin 330 is inserted into the first insertion hole 311 and the second insertion hole 321 in a non-pressed state with respect to each of the holder 310 and the scoring wheel 320 . The relationship between the holder 310, the scoring wheel 320 and the pin 330 shown in FIG. 14 is the relationship during normal scoring processing in the reference cross section orthogonal to the central axis 301 of the first insertion hole 311.

As a result of the observation, in the conventional holder unit 300, it was confirmed that the first insertion hole 311 and the pin 330 have at least the following three relationships during normal scoring processing. In the first relationship, the contact point 302 between the inner peripheral surface 312 of the first insertion hole 311 and the outer peripheral surface 331 of the pin 330 is located in the scanning direction of the scoring wheel 320 relative to the central axis 301 of the first insertion hole 311 The direction D1 is behind and behind, and the height direction D2 is above. The height direction D2 is orthogonal to the scanning direction D1 in the reference section. In the second relationship, a small gap is formed between the inner peripheral surface 312 of the first insertion hole 311 and the outer peripheral surface 331 of the pin 330 located in front of the scanning direction D1 with respect to the central axis 301 of the first insertion hole 311 . gap (hereinafter referred to as "front gap 303"). In the third relationship, a slight gap (hereinafter referred to as "upper gap 304") is formed between the vertex 313 of the inner peripheral surface 312 of the first insertion hole 311 in the height direction D2 and the outer peripheral surface 331 of the pin 330. . In addition, here, the relationship on the reference cross-section is described, so the relationship between the inner peripheral surface 312 and the outer peripheral surface 331 is marked as a contact point, but the actual relationship between the inner peripheral surface 312 and the outer peripheral surface 331 is a substantial line contact. , or surface contact with a small contact area.

In addition, there are also three types of relationships between the second insertion hole 321 and the pin 330. In the first relationship, the contact point 305 between the inner peripheral surface of the second insertion hole 321 and the outer peripheral surface 331 of the pin 330 is located in the scanning direction of the scoring wheel 320 relative to the central axis 322 of the second insertion hole 321 D1 is behind and below D2 in the height direction. The height direction D2 is orthogonal to the scanning direction D1 in the reference section. In the second relationship, a slight gap is formed between the inner peripheral surface of the second insertion hole 321 and the outer peripheral surface 331 of the pin 330 located in front of the scanning direction D1 with respect to the central axis 322 of the second insertion hole 321 . Gap 306. In the third relationship, a slight gap is formed between the lower end of the inner peripheral surface of the second insertion hole 321 in the height direction D2 and the outer peripheral surface 331 of the pin 330 .

The formation state of cracks is affected by the load of the scoring wheel 320 during the scoring process. When the load on the scoring wheel 320 is unstable, the formation state of the cracks is also unstable. The relationship between the inner peripheral surface 312 of the first insertion hole 311 and the outer peripheral surface 331 of the pin 330 is presumed to affect the load state of the scoring wheel 320 . The mechanism is considered as follows, for example. During the scoring process, the reaction force that the scoring wheel 320 receives from the workpiece may decrease. It is caused by, for example, the deflection of the workpiece existing on the surface of the workpiece, or the deflection of the workpiece caused by the processing conditions of the workpiece. The processing conditions of the workpiece related to the deflection of the workpiece refer to, for example, the thickness of the workpiece being thin, the parts of the workpiece being processed in a laminated state that partially form a single layer, and the Deflections on the surface of the conveyor that transports the workpiece.

When the reaction force of the scribing wheel 320 decreases, the resistance to the pin 330 in the scanning direction D1 decreases, and the position of the pin 330 in the second insertion hole 321 easily moves forward in the scanning direction D1. In addition, since there is a forward gap 303 between the first insertion hole 311 and the pin 330, as the resistance to the pin 330 decreases, the pin 330 moves in the first insertion hole 311 in the traveling direction D1 with respect to the holder 310. Move forward. Since there is an upper gap 304 between the first insertion hole 311 and the pin 330 , the pin 330 also moves upward relative to the holder 310 in the first insertion hole 311 . As the pin 330 moves upward relative to the holder 310, the scoring wheel 320 moves in a direction away from the surface of the workpiece, and the load exerted by the scoring wheel 320 on the workpiece decreases. In a state where the position of pin 330 relative to scoring wheel 320 and retainer 310 is again stable, the lowering load increases. As a result, as the pin 330 moves relative to the holder 310, the load of the scoring wheel 320 changes, so that the formation state of the crack becomes unstable.

In the holder unit of the present invention, the restriction structure that restricts the movement of the pin in the scanning direction of the scoring wheel relative to the scoring wheel is provided on the pin. Therefore, during the scoring process, the scoring wheel receives no reaction from the workpiece. When the force decreases, the movement of the pin in the scanning direction relative to the holder is restricted by the restriction structure.

Therefore, the movement of the scoring wheel in a direction away from the surface of the workpiece is also restricted, and a decrease in the load of the scoring wheel is suppressed. Thereby, during the scoring process, the load of the scoring wheel is less likely to fluctuate, the formation state of cracks is stabilized, and the quality of the workpiece subjected to the scoring process is improved.

In one example of the above-mentioned retainer unit, the cross-sectional shape of the above-mentioned pin in the reference section orthogonal to the central axis of the above-mentioned second insertion hole is such that the inner peripheral surface of the above-mentioned second insertion hole and the above-mentioned pin are at the first contact point and The second contact point is determined by the two-point contact method and constitutes the above-mentioned restriction structure.

By supporting the scoring wheel at two points relative to the pin, the rotation of the scoring wheel is stable. In addition, the restriction structure is formed by the cross-sectional shape of the pin, so the restriction structure is simple.

In one example of the above-mentioned retainer unit, the cross-sectional shape of the above-mentioned pin in the above-mentioned reference cross-section is a polygon. Therefore, the pin including the restricting structure can be easily manufactured. Compared with the case where the cross-sectional shape of the pin is circular, the yield rate is improved. In a holder unit using a pin with a polygonal cross-sectional shape, the pin contacts the scoring wheel at a plurality of points on a cross-section orthogonal to the axial direction. During the scoring process, the pin does not substantially rotate around the central axis of the pin, but around the central axis of the pin, and the position of the contact point between the pin and the scoring wheel does not substantially change. Thereby, the rotation of the scoring wheel during the scoring process is stabilized, and the quality of the processed object after the scoring process is improved.

In one example of the above-mentioned retainer unit, the cross-sectional shape of the above-mentioned pin in the above-mentioned reference cross-section is a quadrangular shape. Therefore, the distance between the first contact point and the second contact point can be set longer. The longer the distance, the more stable the position of the scoring wheel is. In addition, the pin including the restriction structure can be easily manufactured.

In one example of the holder unit, the quadrangular shape includes a first vertex located behind and above the scanning direction with respect to the central axis of the pin, a second vertex located forward of the first vertex in the scanning direction, and a third vertex and a fourth vertex that are different from the above-mentioned first vertex and the above-mentioned second vertex, the above-mentioned first vertex forms the above-mentioned first contact point by contact with the inner peripheral surface of the above-mentioned second insertion hole, the above-mentioned second The vertex forms the second contact point by contacting the inner circumferential surface of the second insertion hole, and the third vertex and the fourth vertex do not contact the inner circumferential surface of the second insertion hole.

According to the above-mentioned holder unit, the movement of the pin in the scanning direction relative to the scoring wheel is restricted by the second contact point formed by the contact between the inner peripheral surface of the second insertion hole and the second vertex. Since the third vertex and the fourth vertex are not in contact with the inner peripheral surface of the second insertion hole, the pin can be easily inserted and extracted from the scoring wheel.

The cross-sectional shape of the pin in the above-mentioned reference cross-section is a polygon including chamfers. The part of the pin that is in contact with the scoring wheel wears slowly as the scoring wheel rotates. In the above-mentioned holder unit, since the chamfer is formed in the pin, the wear of the contact portion with the scoring wheel proceeds more slowly. This contributes, for example, to the stability of the rotation of the scoring wheel.

In one example of the holder unit, the second contact point is located forward in the scanning direction with respect to the central axis of the pin. The movement of the pin relative to the holder is therefore more strongly restricted.

The pin of the present invention is held on a holder having a first insertion hole. The pin is inserted into the second insertion hole in a non-pressed state with respect to the scoring wheel having the second insertion hole, and is aligned with the center of the pin. The shape of the cross-section in a cross-section with orthogonal axes is polygonal.

In the holder unit using the above-mentioned pin, like the above-mentioned holder unit, the load of the scoring wheel is less likely to fluctuate during the scoring process, the formation state of cracks is stabilized, and the quality of the workpiece subjected to the scoring process is improved. [Effects of the invention]

According to the present invention, the posture of the scoring wheel during rotation is stabilized, and the quality of the workpiece to be scored is improved.

(First embodiment) The scoring device presses the scoring wheel against the workpiece to move the scoring wheel and the workpiece relative to each other, thereby forming a score line on the surface of the workpiece. This action in the scoring device is called scanning of the scoring wheel. The scanning methods of the scoring wheel are mainly classified into 3 methods. In the first scanning method, the position of the scoring wheel is maintained during the scoring process, and the workpiece is transported relative to the scoring wheel. By conveying the workpiece, the scribing wheel scans the surface of the workpiece relatively in the predetermined scanning direction. In the second scanning method, the position of the object to be processed is maintained during the scribing process, and the scribing wheel scans in a predetermined scanning direction relative to the object to be processed. In the third scanning method, the first scanning method and the second scanning method are combined, and the scribing wheel scans the workpiece in a predetermined scanning direction.

An example of the workpiece is a brittle material substrate. Examples of brittle material substrates are glass substrates and ceramic substrates. An example of the glass substrate is an alkali-free glass substrate. Substrates of alkali-free glass formed from brittle material substrates are used, for example, in flat panel displays. Examples of flat panel displays are displays for television receivers and displays for smartphones. The alkali-free glass substrate used in smartphone displays is extremely thin. The thickness of a glass substrate used in a flat panel display of a smartphone is, for example, within the range of 0.15 mm to 0.30 mm. The thickness of a glass substrate used in a flat panel display of an LCD TV is, for example, within the range of 0.4 mm to 0.7 mm.

During the scoring process, the appropriate range of load exerted by the scoring wheel on the workpiece is related to the thickness of the workpiece. The appropriate range of the load is determined in such a way that the crack formation state of the workpiece subjected to the scribing process becomes a better state. In general brittle material substrates, the thinner the thickness, the narrower the appropriate load range. This means that the thinner the brittle material substrate is, the more likely it is that the quality will deteriorate as the load on the scoring wheel changes. In the manufacturing of flat panel displays for LCD TVs, for example, two brittle material substrates with a thickness of 0.5 mm are stacked on top of each other to perform the scribing process. The appropriate range of load in this case is 10 N ~ 15 N. In the manufacture of displays for smartphones, for example, two brittle material substrates with a thickness of 0.15 mm are stacked to perform the scribing process. The appropriate range of load in this case is 5 N to 6 N.

FIG. 1 shows an example of a scoring device 10 that performs scoring processing on a workpiece W so as to obtain appropriate quality even when the workpiece W is thin. The scoring device 10 forms a scoring line on the workpiece W by conveying the workpiece W to the scoring wheel 120 (see FIG. 3 ). The main components constituting the scribing device 10 are the conveying device 20 and the processing device 30 . The conveying device 20 includes a rail 21 , a platform 22 , a linear drive mechanism 23 , a rotation drive mechanism 24 , and a vacuum suction device 25 . In the following description, the direction in which the workpiece W is transported is referred to as the transport direction DA, the direction orthogonal to the transport direction DA in the plan view of the scoring device 10 is referred to as the width direction DB, and the transport direction DA and the width direction are referred to as The direction orthogonal to DB is called the height direction DC. The conveyance direction DA includes a first conveyance direction and an opposite second conveyance direction. The width direction DB includes a first width direction and an opposite second width direction. The height direction DC includes upper and lower directions.

In the example shown in the figure, a pair of rails 21 are arranged on the base (not shown) of the scoring device 10 . The shape of the rail 21 is a straight line defining the conveyance direction DA. One rail 21 and the other rail 21 are arranged at a certain distance in the width direction DB. The platform 22 is divided into a slider 22A, a support 22B and a top plate 22C. The slider 22A is connected to each rail 21 in a movable manner along the rail 21 . The support 22B is a hollow portion configured so that other components can be arranged inside, and is provided on the slider 22A. The top plate 22C is a part for arranging the workpiece W, and is provided on the support 22B.

The linear drive mechanism 23 moves the platform 22 relative to the rail 21 . The linear drive mechanism 23 is composed of, for example, a motor 23A and a feed screw 23B. The motor 23A is arranged on the base of the scoring device 10 (not shown). The output shaft of the motor 23A is connected to the feed screw 23B in such a manner that the feed screw 23B rotates around the rotation center axis of the motor 23A. The feed screw 23B is arranged between the pair of rails 21 . The longitudinal direction of the feed screw 23B is parallel to the longitudinal direction of the rail 21 . The slider 22A is connected to the feed screw 23B so as to move in the longitudinal direction of the feed screw 23B as the feed screw 23B rotates. When the motor 23A rotates, the feed screw 23B rotates, and the platform 22 moves in the first conveyance direction or the second conveyance direction relative to the rail 21 according to the rotation direction of the feed screw 23B.

The rotation drive mechanism 24 and the vacuum suction device 25 are arranged in the support column 22B. The rotation drive mechanism 24 rotates the top plate 22C relative to the pillar 22B around a central axis parallel to the height direction DC. The vacuum suction device 25 adsorbs the workpiece W arranged on the top plate 22C to the top plate 22C. The scribing process is performed in a state where the workpiece W is adsorbed by the vacuum suction device 25 .

The processing device 30 is composed of a vertical frame 31 , a horizontal frame 32 , a scoring head 33 , a holder joint 34 , a holder unit 100 , a horizontal driving mechanism 35 and a vertical driving mechanism 36 . The vertical frame 31, the horizontal frame 32, the scoring head 33 and the holder joint 34 are made of metal suitable for various functions, for example.

In the example shown in the figure, a pair of vertical frames 31 are arranged on the base (not shown) of the scoring device 10 . The longitudinal direction of the vertical frame 31 is parallel to the height direction DC. The pair of vertical frames 31 are arranged outside each rail 21 in the width direction DB so as to sandwich the pair of rails 21 . The horizontal frame 32 is provided between the pair of vertical frames 31 . The longitudinal direction of the horizontal frame 32 is parallel to the width direction DB. The horizontal frame 32 is fixed on each vertical frame 31 . Guides 32A are provided on the horizontal frame 32 . The guide 32A is, for example, a groove parallel to the longitudinal direction of the horizontal frame 32 .

The scoring head 33 is a base that supports the retainer joint 34 . The scoring head 33 is connected to the guide 32A so as to be movable in the width direction DB along the horizontal frame 32 . The retainer joint 34 is connected to the lower part of the scoring head 33 . The retainer joint 34 is configured to be detachable from the retainer unit 100 .

The horizontal driving mechanism 35 moves the scoring head 33 in the width direction DB relative to the horizontal frame 32 . The horizontal drive mechanism 35 is composed of, for example, a motor 35A and a feed screw 35B. The motor 35A is installed on one of the vertical frames 31 . The output shaft of the motor 35A is connected to the feed screw 35B in a manner that the feed screw 35B rotates around the rotation center axis of the motor 35A. The feed screw 35B is arranged in the horizontal frame 32 . The longitudinal direction of the feed screw 35B is parallel to the longitudinal direction of the horizontal frame 32 . The scribing head 33 is connected to the feed screw 35B so as to move in the longitudinal direction of the feed screw 35B as the feed screw 35B rotates. As the motor 35A rotates, the feed screw 35B rotates, and the scribing head 33 moves in the first width direction or the second width direction relative to the horizontal frame 32 according to the rotation direction of the feed screw 35B. The holder joint 34 and the holder unit 100 move in the width direction DB integrally with the scoring head 33 .

The longitudinal driving mechanism 36 is provided on the scoring head 33 . The vertical drive mechanism 36 includes a first drive mechanism 36A and a second drive mechanism 36B. The first drive mechanism 36A moves the scribing head 33 in the height direction DC. The second drive mechanism 36B applies a scoring load to the workpiece W by moving the holder joint 34 relative to the scoring head 33 . The first drive mechanism 36A is composed of, for example, a motor and a feed screw. The output shaft of the motor is connected to the feed screw in a manner that the feed screw rotates around the rotation center axis of the motor. The long side direction of the feed screw is parallel to the height direction DC. The scoring head 33 is connected to the feed screw in a manner that it moves in the longitudinal direction of the feed screw as the feed screw rotates. As the motor rotates, the feed screw rotates, and according to the rotation direction of the feed screw, the scoring head 33 moves upward or downward relative to the guide 32A. The holder unit 100 moves in the height direction DC integrally with the holder joint 34 . The second drive mechanism 36B is composed of, for example, a cylinder, a servo motor, and a linear motion mechanism. The second drive mechanism 36B is arranged in the scoring head 33 . The cylinder or servo motor moves the linear motion mechanism in the height direction DC. The retainer joint 34 is mounted on the linear motion mechanism. The linear motion mechanism and the retainer joint 34 move integrally in the height direction DC.

FIG. 2 shows the side structure of the holder unit 100 as viewed in the width direction DB. The main components constituting the holder unit 100 are the holder 110, the scoring wheel 120, the pin 130, the connecting shaft 34A, and a plurality of rolling bearings 34B. The connecting shaft 34A and the plurality of rolling bearings 34B are respectively supported on the retainer joint 34 (see FIG. 1 ) of the scoring head 33. The central axis C1 of the connecting shaft 34A is parallel to the height direction DC. The connecting shaft 34A rotates relative to the scoring head 33 and the plurality of rolling bearings 34B. In one example, a plurality of rolling bearings 34B are laminated in the height direction DC. An example of the rolling bearing 34B is a ball bearing. The holder unit 100 is connected to the connecting shaft 34A. The central axis CB (refer to FIG. 4 ) of the scoring wheel 120 is offset relative to the central axis C1 of the connecting shaft 34A in the conveyance direction DA. This relationship can be described by, for example, the relationship between the central axis C1 and the reference line C2. The reference line C2 is in the plane defined by the conveyance direction DA and the height direction DC, is parallel to the height direction DC, and passes through the central axis CB of the scoring wheel 120 . In a state where the holder unit 100 and the holder joint 34 are connected, the reference line C2 is shifted in the conveyance direction DA with respect to the central axis C1. In addition, the connecting shaft 34A and the plurality of rolling bearings 34B may be provided on the retainer joint 34 side.

FIG. 3 shows a part of the structure of the holder unit 100 in a cross section parallel to the width direction DB and the height direction DC. An anti-falling mechanism is provided on the retainer 110 . An example of the anti-falling mechanism is the housing 140 . An example of the material constituting the holder 110 and the housing 140 is magnetic metal. The materials constituting the retainer 110 and the housing 140 can be individually selected. Examples of materials constituting the scoring wheel 120 and the pin 130 are: sintered diamond (PolyCrystalline Diamond), cemented carbide, single crystal diamond and polycrystalline diamond. The materials forming the scoring wheel 120 and pin 130 can be individually selected.

The holder 110 is divided into a base 111 and a pair of arms 112 . The shape of the base 111 is a cylinder or a corner column. The base 111 is detachable from the connecting shaft 34A of the retainer joint 34 (see FIG. 2 ). A pair of arms 112 extend downward from the lower part of the base 111 . The long side direction of the arm 112 is parallel to the height direction DC. In the width direction DB, a space 113 for arranging the scoring wheel 120 is formed between the inner surface 112A of one of the arms 112 and the inner surface 112A of the other arm 112 . The distance between the inner surface 112A of one arm 112 and the inner surface 112A of the other arm 112 in the width direction DB is slightly wider than the thickness of the scoring wheel 120 . A first insertion hole 114 into which the pin 130 is inserted is formed in each arm 112 . The first insertion hole 114 is a circular hole penetrating the arm 112 in the width direction DB. The inner peripheral surface 115 formed on the arm 112 defines a first insertion hole 114 . The first insertion hole 114 has an inner opening 114A that opens on the inner surface 112A of the arm 112 and an outer opening 114B that opens on the outer surface 112B of the arm 112 .

The scoring wheel 120 is arranged in the space 113 between the pair of arms 112 . A second insertion hole 121 into which the pin 130 is inserted is formed in the scoring wheel 120 . The second insertion hole 121 is a circular hole penetrating the scoring wheel 120 in the thickness direction. The inner peripheral surface 122 formed on the scoring wheel 120 defines a second insertion hole 121 . The second insertion hole 121 has an opening 121A opened on each of one side surface 123 and the other side surface 123 of the scoring wheel 120 .

The pin 130 is inserted into the first insertion hole 114 of each arm 112 and the second insertion hole 121 of the scoring wheel 120 in a non-pressed state with respect to each of the holder 110 and the scoring wheel 120 . The thickness RC of the pin 130 (see FIG. 4 ) is smaller than the diameter RA of the first insertion hole 114 and the diameter RB of the second insertion hole 121 . The length of the pin 130 is slightly shorter than the distance between the outer opening 114B of one of the first insertion holes 114 and the outer opening 114B of the other first insertion hole 114 in the width direction DB.

The housing 140 is formed separately from the holder 110 . The housing 140 is fixed to the holder 110 by a fixing mechanism 141 (see FIG. 2 ) so that the opening 114B outside the first insertion hole 114 can be opened and closed. An example of the fixing mechanism 141 is a screw. The housing 140 closes part or all of the opening 114B outside the first insertion hole 114 so that the front end 131 of the pin 130 does not fly out of the first insertion hole 114 . In the illustrated example, the housing 140 closes a part of the opening 114B outside the first insertion hole 114 . The length of pin 130 can be chosen arbitrarily. In one example, the length of the pin 130 may be set to be slightly longer than the distance between the opening 114B outside one of the first insertion holes 114 and the opening 114B outside the other first insertion hole 114 in the width direction DB. In this situation, both ends of the pin 130 contact the housing 140 respectively. Each housing 140 limits movement of the pin 130 relative to the retainer 110 and disengagement of the pin 130 from the retainer 110 .

The scoring wheel 120 in the scoring device 10 can be replaced. Examples of the replacement method of the scoring wheel 120 include a first replacement method and a second replacement method. In the first replacement method, the housing 140 is first removed from the holder 110 . Next, the pin 130 is pulled out from the holder 110, and the scoring wheel 120 is taken out from the space 113 of the holder 110. Next, the new scoring wheel 120 is placed in the space 113 of the holder 110 , and the pin 130 is inserted into the first insertion hole 114 of the arm 112 and the second insertion hole 121 of the scoring wheel 120 . Since the thickness of the scoring wheel 120 is thinner than the distance between the arms 112, the replacement of the scoring wheel 120 can be easily performed. When the pin 130 needs to be replaced, a new pin 130 is inserted into the first insertion hole 114 and the second insertion hole 121 instead of the pin 130 being pulled out from the holder 110 . Since the pin 130 is configured so that it can be inserted into the holder 110 and the scoring wheel 120 in a non-pressed state, the pin 130 can be easily removed and inserted into the holder 110 .

The second replacement method is selected when the pin 130 is held on the holder 110 by a fall-off prevention mechanism having a different structure in place of the fall-off prevention mechanism composed of the housing 140 . For example, the anti-falling mechanism includes a claw coupled to the retainer 110 . In the state where the claw portion is coupled to the retainer 110 , the anti-falling mechanism is fixed on the retainer 110 and cannot perform opening and closing operations with respect to the retainer 110 . In the second replacement method, the scoring wheel 120 and the pin 130 are replaced as an integrated holder unit 100 while being held on the holder 110 . Specifically, in the second replacement method, first, the holder unit 100 is detached from the holder joint 34 . Next, the new retainer unit 100 is installed on the retainer joint 34 .

In the state before the scribing process step is started, the vertical drive mechanism 36 (see FIG. 1 ) holds the holder unit 100 at a predetermined position in the height direction DC so that the scribing wheel 120 does not contact the workpiece W. In such a manner that the scoring wheel 120 comes into contact with the surface of the workpiece W as the scoring process step starts, the longitudinal drive mechanism 36 moves the holder unit 100 downward from a predetermined position in the height direction DC. In a state where the scoring wheel 120 is in contact with the surface of the workpiece W, the vertical drive mechanism 36 determines the height direction DC of the holder unit 100 in such a way that a predetermined load is applied to the workpiece W by the scoring wheel 120 . location.

As the scoring wheel 120 scans, a reaction force is generated on the scoring wheel 120 . By this reaction force, a torsion force causing the retainer 110 to rotate around the central axis C1 (see FIG. 3 ) of the connecting shaft 34A acts on the retainer 110 and the connecting shaft 34A. The holder 110 and the connecting shaft 34A rotate relative to the scoring head 33 in such a manner that the rotational center plane of the scoring wheel 120 that is orthogonal to the central axis CB of the scoring wheel 120 is parallel to the scanning direction DD.

FIG. 4 shows an example of the relationship between the first insertion hole 114 of the holder 110, the second insertion hole 121 of the scoring wheel 120, and the pin 130 during the scoring process in the reference cross section. The reference cross section is orthogonal to the central axis CA of the first insertion hole 114, the central axis CB of the second insertion hole 121, and the central axis CC of the pin 130. In the figure, the solid line circle represents the first insertion hole 114, the broken line circle represents the second insertion hole 121, and the four corners of the solid line represent the pin 130. In addition, in FIGS. 4 to 12 , in order to explain the relationship between the first insertion hole 114 , the second insertion hole 121 , and the pin 130 , the difference in size is exaggerated. In the actual holder 110, the difference in size of the first insertion hole 114, the second insertion hole 121 and the pin 130, and the gap formed between the first insertion hole 114, the second insertion hole 121 and the pin 130 are small.

The pin 130 includes a limiting structure 130A that limits the movement of the pin 130 relative to the scoring wheel 120 and the holder 110 in the scanning direction DD of the scoring wheel 120 . Specifically, the restriction structure 130A moves the restriction pin 130 back and forth in the scanning direction DD relative to the scoring wheel 120 and the holder 110 when the scribing wheel 120 is scanned during the scribing process.

In one example, the cross-sectional shape of the pin 130 in the reference section orthogonal to the central axis CB of the second insertion hole 121 is such that the inner peripheral surface 122 of the second insertion hole 121 and the pin 130 are at the first contact point PA and the second contact point PA. Contact point PB is determined by the two-point contact method. This cross-sectional shape constitutes the restriction structure 130A. The first contact point PA is located behind and behind the scanning direction DD with respect to the central axis CC of the pin 130 in the reference section. The second contact point PB is located in front of the first contact point PA in the scanning direction DD in the reference section. In the illustrated example, the second contact point PB is located in front of the scanning direction DD with respect to the central axis CC of the pin 130 . In addition, since the relationship on the reference cross section is described here, the relationship between the inner peripheral surface 122 of the second insertion hole 121 and the pin 130 is marked as a contact point. However, the actual relationship between the inner peripheral surface 122 and the pin 130 is substantial. line contact, or surface contact with a small contact area. The description "contact point" shown in the following description also means a substantial line contact or a surface contact with a small contact area.

The cross-sectional shape of the pin 130 constituting the restriction structure 130A can be selected arbitrarily. In one example, the cross-sectional shape of the pin 130 in the reference cross-section is polygonal. Specifically, the cross-sectional shape of the pin 130 is a quadrangular shape. More specifically, the cross-sectional shape of the pin 130 is a regular square. Specific examples of other polygons include rectangle, hexagon, and octagon. The three-dimensional shape of the pin 130 is determined based on the cross-sectional shape constituting the restriction structure 130A. When the cross-sectional shape of the pin 130 is an arbitrary polygon, the three-dimensional shape of the pin 130 is a polygonal column corresponding to the polygon. When the cross-sectional shape of the pin 130 is a square, the three-dimensional shape of the pin 130 is a square prism corresponding to the square. When the cross-sectional shape of the pin 130 is a regular square, the three-dimensional shape of the pin 130 is a regular square prism. In the case of the pin 130 having a square cross-sectional shape, the manufacturing steps can be simplified compared to the pin 130 having a circular cross-section. When producing a cylindrical pin with a circular cross-section, a quasi-cylindrical pin is cut out from the base material by wire discharge machining, etc. In order to make the pin into a cylindrical shape, it must be precisely ground using a grinding device. processing. Materials with particularly high wear resistance are difficult to grind into a cylindrical shape. On the other hand, when manufacturing the pin 130 with a quadrangular cross-sectional shape, the pin 130 can be manufactured only by wire discharge machining or laser processing, and precise grinding processing using a grinding device can be omitted, so the pin 130 can be easily manufactured. . Therefore, the selection range of materials that can be used as the material of the pin 130 becomes wider. For example, sintered diamond (PolyCrystalline Diamond) with large particle size or single crystal diamond can be used as the material of the pin 130 . In this case, the wear resistance of the pin 130 is further improved.

The regular square of the pin 130 includes four vertices, that is, the first vertex VA, the second vertex VB, the third vertex VC, and the fourth vertex VD. The first vertex VA is a vertex located behind and below the scanning direction DD with respect to the central axis CC of the pin 130 . The first vertex VA forms a first contact point PA by contacting the inner peripheral surface 122 of the second insertion hole 121 . The first vertex VA does not contact the inner peripheral surface 115 of the first insertion hole 114 . The second vertex VB is a vertex located in front of the first vertex VA in the scanning direction DD. Specifically, the second vertex VB is located in front of and below the scanning direction DD with respect to the central axis CC of the pin 130 . The second vertex VB forms a second contact point PB by contacting the inner peripheral surface 122 of the second insertion hole 121 . The second vertex VB does not contact the inner peripheral surface 115 of the first insertion hole 114 .

The third vertex VC and the fourth vertex VD are vertices different from the first vertex VA and the second vertex VB. Specifically, the third vertex VC is located behind and above the scanning direction DD with respect to the central axis CC of the pin 130 . The third vertex VC does not contact the inner peripheral surface 122 of the second insertion hole 121 . The third vertex VC forms a third contact point PC by contact with the inner peripheral surface 115 of the first insertion hole 114 . The fourth vertex VD is located in front of and above the scanning direction DD with respect to the central axis CC of the pin 130 . The fourth vertex VD is not in contact with the inner peripheral surface 122 of the second insertion hole 121 . The fourth vertex VD forms a fourth contact point PD by contacting the inner peripheral surface 115 of the first insertion hole 114 . In the following description, each of the contact points PA and PB and each of the vertices VA to VD may be collectively referred to as a contact point or the like.

Specifically, the state in which the contact point and the like are located in front, behind, above, or below with respect to the central axis CB of the second insertion hole 121 can be described as follows. The virtual line parallel to the height direction DC passing through the central axis CB in the datum section is called the first datum line LA, and the virtual line parallel to the scanning direction DD passing through the central axis CB in the datum section is called the first datum line LA. is the second baseline LB. The state in which the contact point, etc. is located behind the central axis CB refers to a state in which the contact point, etc. is located behind the first reference line LA in the scanning direction DD in the reference cross section. The state in which the contact point, etc. is located forward with respect to the central axis CB refers to a state in which the contact point, etc. is located in front of the first reference line LA in the scanning direction DD in the reference cross section. The state in which the contact point, etc. is located above the central axis CB means that in the reference cross section, the contact point, etc. is located above the second reference line LB in the height direction DC. The state in which the contact point, etc. is located below the center axis CB in the height direction DC refers to a state in which the contact point, etc. is located below the second reference line LB in the height direction DC in the reference cross section. In addition, regarding the state in which the contact point is located in front, behind, above or below with respect to the central axis CA of the first insertion hole 114 or the central axis CC of the pin 130, virtual values passing through the central axes CA and CC can be used respectively. Lines are described in the same manner as above.

The positions of the contact points around the central axis CA of the first insertion hole 114, the central axis CB of the second insertion hole 121, or the central axis CC of the pin 130 during the scribing process in the reference section are basically determined by Determined by the position of contact points during non-engraving processing. FIG. 5 shows an example of the relationship between the first insertion hole 114, the second insertion hole 121 and the pin 130 during non-scoring processing. The so-called non-scoring process refers to a state in which the scoring wheel 120 does not contact the surface of the workpiece W and the weight of the scoring wheel 120 is supported by the pin 130 .

The first vertex VA is located behind and below the scanning direction DD with respect to the central axis CC of the pin 130 . The second vertex VB is located in front of and below the scanning direction DD with respect to the central axis CC of the pin 130 . The third vertex VC is located behind and above the scanning direction DD with respect to the central axis CC of the pin 130 . The fourth vertex VD is located in front of and above the scanning direction DD with respect to the central axis CC of the pin 130 . The first vertex VA and the second vertex VB contact the inner peripheral surface 115 of the first insertion hole 114 . The third vertex VC and the fourth vertex VD contact the inner peripheral surface 122 of the second insertion hole 121 . As the scribing process step begins, the scribing wheel 120 scans, whereby the relationship between each vertex VA to VD and the first insertion hole 114 and the second insertion hole 121 changes to the relationship shown in FIG. 4 .

According to the restriction structure 130A, the following functions and effects are obtained. When the reaction force received by the scribing wheel 120 from the workpiece W decreases during the scribing process, the resistance to the pin 130 in the scanning direction DD decreases. However, as shown in Figure 4, the first vertex VA and the second vertex VB of the pin 130 contact the inner peripheral surface 122 of the second insertion hole 121, forming two contact points, namely the first contact point PA and the second contact point PB. Therefore, the movement of the pin 130 in the scanning direction DD relative to the scoring wheel 120 is limited by the inner peripheral surface 122 . Since the scoring wheel 120 is supported at two points relative to the pin 130, the rotation of the scoring wheel 120 is stable. Similarly, the third vertex VC and the fourth vertex VD of the pin 130 contact the inner peripheral surface 115 of the first insertion hole 114, forming two contact points, namely the third contact point PC and the fourth contact point PD. Therefore, in the scanning direction DD The movement of the pin 130 relative to the retainer 110 is limited by the inner peripheral surface 115 . Therefore, the pin 130 is also restricted from moving upward with respect to the scoring wheel 120 and moving downward with respect to the holder 110 , and the movement of the scoring wheel 120 in a direction away from the surface of the workpiece W is also restricted. , suppressing the load of the scoring wheel 120 from decreasing. Thereby, during the scoring process, the load of the scoring wheel 120 is less likely to fluctuate, the formation state of cracks is stabilized, and the quality of the workpiece W subjected to the scoring process is improved. In addition, since the fluctuation range of the load of the scoring wheel 120 is reduced, it is difficult for the load of the scoring wheel 120 to deviate from the appropriate range when the workpiece W is thin. In this regard, the workpiece W is Quality has also improved.

In the reference cross section, the plurality of vertices of the polygonal pin 130 are in contact with the holder 110 and the scoring wheel 120, so the rotation of the pin 130 around the central axis CC of the pin 130 is restricted. During the scribing process, the pin 130 does not substantially rotate around the central axis CC of the pin 130. The position of the contact point between the pin 130 and the scribing wheel 120 does not substantially change around the central axis CC of the pin 130. Thereby, the rotation of the scoring wheel 120 during the scoring process is stabilized, and the quality of the workpiece W subjected to the scoring process is improved.

As shown in FIG. 4 , the scoring wheel 120 rotates in the rotation direction DR during the scoring process. This may occur when foreign matter is generated during the scribing process. The so-called foreign matter is, for example, chips generated from the workpiece W, relatively large exfoliated matter peeled off from the surface of the workpiece W, abrasion powder produced by the abrasion of the scoring wheel 120 and the pin 130, and Other foreign objects. During the scoring process, a first area Q1 divided based on the first vertex VA and a second area Q2 divided based on the second vertex VB are formed between the pin 130 and the scoring wheel 120 . The first region Q1 is a gap formed between the pin 130 and the scoring wheel 120 behind the rotation direction DR with respect to the first vertex VA, and is formed between the first vertex VA and the second vertex VB in the pin 130 The gap between the edge and the inner circumferential surface 122 of the scoring wheel 120 facing it. The second area Q2 is a gap between the pin 130 and the scoring wheel 120 formed behind the second vertex VB in the rotation direction DR, and is between the second vertex VB and the fourth vertex VD formed in the pin 130 The gap between the edge and the inner circumferential surface 122 of the scoring wheel 120 facing it.

When there is a foreign object between the contact parts of the scoring wheel 120 and the pin 130, the position of the scoring wheel 120 relative to the pin 130 becomes unstable, and there is a concern that the rotation of the scoring wheel 120 is unstable. In the holder unit 100, foreign matter generated during the scribing process may enter the first area Q1 or the second area Q2. The first contact point PA is formed by the scoring wheel 120 and the pin 130. The position of the first contact point PA does not change. Therefore, as the scoring wheel 120 rotates, the foreign matter in the first area Q1 stays relative to the first contact point. In terms of PA, the direction of rotation DR is rearward. The second contact point PB is formed by the scoring wheel 120 and the pin 130. The position of the second contact point PB does not change. Therefore, as the scoring wheel 120 rotates, the foreign matter in the second area Q2 stays relative to the second contact point. In terms of PB, the direction of rotation DR is rearward. Therefore, foreign matter is suppressed from being caught between the scoring wheel 120 and the pin 130 in the contact portion. During the scoring process, the contact portion between the scoring wheel 120 and the pin 130 is maintained in a state where there is substantially no foreign matter between them. Therefore, even when foreign matter is generated during the scoring process, the rotation of the scoring wheel 120 is stabilized, and the quality of the workpiece W subjected to the scoring process is improved.

Regarding the pin 130 during the scoring process, the pin 130 can be divided into a contact area and a non-contact area based on the relationship with the scoring wheel 120 . The contact area corresponds to the middle portion of the pin 130 in the axial direction of the pin 130 . Specifically, the contact area is the middle portion of the pin 130 that is in contact with the inner peripheral surface 122 of the scoring wheel 120 , and has a range that is approximately the same as the width of the inner peripheral surface 122 of the pin 130 in the axial direction. The non-contact area corresponds to a portion outside the contact area in the axial direction of the pin 130 . As the scoring wheel 120 rotates, the contact area of the pin 130 and the inner peripheral surface 122 of the scoring wheel 120 in contact with the contact area of the pin 130 are worn. By the wear of the pin 130, the corners of the first vertex VA and the second vertex VB of the pin 130 are shaved off, forming a curved surface. The contact area of the worn pin 130 forms a recessed portion recessed toward the central axis CC side of the pin 130 relative to the non-contact area of the pin 130 . The greater the degree of wear of the pin 130, the deeper the depth of the recess. A step difference is formed between the concave portion and the non-contact area. When the recess is formed on the pin 130 and a force is exerted to move the scribing wheel 120 relative to the pin 130 in the axial direction of the pin 130, the inner peripheral surface 122 of the scribing wheel 120 and the above-mentioned The contact of the steps limits the movement of the scoring wheel 120 relative to the pin 130 . The position of the scoring wheel 120 during the scoring process is stable, and the quality of the processed object W after the scoring process is improved.

In the holder unit 100, since the pin 130 is inserted into the first insertion hole 114 and the second insertion hole 121 in a non-pressed state, the pin 130 is centered around the central axis of the pin 130 when the scoring device 10 is stopped. By rotating CC, the position of each vertex VA to VD around the central axis CA of the first insertion hole 114 can be easily changed. This can be used, for example, in the following situations. In the scoring process step, since the scoring wheel 120 rotates relative to the pin 130, the first vertex VA and the second vertex VB of the pin 130 are worn. When the amount of wear of the vertex in contact with the inner circumferential surface 122 of the second insertion hole 121 is preferably small, by rotating the pin 130 180 degrees around the central axis CC of the pin 130, it is possible to rotate the pin 130 around the first insertion hole 121 by 180 degrees. The positions of the first vertex VA and the second vertex VB of the central axis CA of the hole 114 are replaced with the positions of the third vertex VC and the fourth vertex VD. In this case, the third vertex VC and the fourth vertex VD, which have less wear than the first vertex VA and the second vertex VB, or are not substantially worn, contact the inner periphery of the second insertion hole 121 during the scribing process. Face 122.

The thickness RC of the pin 130 is represented, for example, by the length of the diagonal line in the square shape of the pin 130 . When a plurality of diagonals with different lengths are fixed in the square shape of the pin 130, the thickness RC of the pin 130 is, for example, determined by the diagonal of the maximum length. In the example shown in the figure, the thickness RC of the pin 130 is the length of the diagonal line connecting the first vertex VA and the fourth vertex VD, or the length of the diagonal line connecting the second vertex VB and the third vertex VC. equal.

The size of each part of the holder unit 100 is determined in the following manner, for example. The outer diameter of the scoring wheel 120 is selected from the range of 1 mm to 7 mm. In one example, the outer diameter of the scoring wheel 120 is 2 mm. The thickness of the scoring wheel 120 is selected from the range of 0.4 mm to 1.2 mm. In one example, the thickness of the scoring wheel 120 is 0.64 mm. The spacing between the arms 112 in the width direction DB is selected from the range of 0.4 mm to 1.3 mm. In one example, the arms 112 are spaced 0.66 mm apart. The diameter RA of the first insertion hole 114 is selected from the range of 0.4 mm to 1.5 mm. In one example, the diameter RA of the first insertion hole 114 is 0.8 mm. The diameter RB of the second insertion hole 121 is selected from the range of 0.4 mm to 1.6 mm. In one example, the diameter RB of the second insertion hole 121 is 0.8 mm. The thickness RC of the pin 130 is selected from the range of 0.4 mm to 1.5 mm. In one example, the thickness RC of pin 130 is 0.77 mm.

(Second embodiment) The positions of the vertices and contact points around the central axis CA of the first insertion hole 114, the central axis CB of the second insertion hole 121, or the central axis CC of the pin 130 during the scribing process in the reference section can be arbitrarily positioned. change. FIG. 6 shows a structure of a second embodiment in which the positions of each vertex and contact point are determined to be different from those of the first embodiment.

The diagonal line connecting the first vertex VA and the fourth vertex VD is parallel to the first reference line LA and is located in front of the first reference line LA in the scanning direction DD. The diagonal line connecting the second vertex VB and the third vertex VC is parallel to the second reference line LB and is located below the second reference line LB. The first vertex VA forms a first contact point PA by contacting the inner peripheral surface 122 of the second insertion hole 121 . The second vertex VB forms a second contact point PB by contacting the inner peripheral surface 122 of the second insertion hole 121 . The third vertex VC forms a third contact point PC by contact with the inner peripheral surface 115 of the first insertion hole 114 . The fourth vertex VD forms a fourth contact point PD by contacting the inner peripheral surface 115 of the first insertion hole 114 .

(Third embodiment) The positions of the vertices and contact points around the central axis CA of the first insertion hole 114, the central axis CB of the second insertion hole 121, or the central axis CC of the pin 130 during the scribing process in the reference section can be arbitrarily positioned. change. FIG. 7 shows the structure of a third embodiment in which the positions of each vertex and contact point are determined to be different from those in the first embodiment.

The diagonal line connecting the first vertex VA and the fourth vertex VD is parallel to the second reference line LB and is located below the second reference line LB. The diagonal line connecting the second vertex VB and the third vertex VC is parallel to the first reference line LA and is located behind and behind the first reference line LA in the scanning direction DD. The first vertex VA forms a first contact point PA by contacting the inner peripheral surface 122 of the second insertion hole 121 . The second vertex VB forms a second contact point PB by contacting the inner peripheral surface 122 of the second insertion hole 121 . The third vertex VC forms a third contact point PC by contact with the inner peripheral surface 115 of the first insertion hole 114 . The fourth vertex VD forms a fourth contact point PD by contacting the inner peripheral surface 115 of the first insertion hole 114 .

(Fourth embodiment) The positions of the vertices and contact points around the central axis CA of the first insertion hole 114, the central axis CB of the second insertion hole 121, or the central axis CC of the pin 130 during the scribing process in the reference section can be arbitrarily positioned. change. FIG. 8 shows the structure of the fourth embodiment in which the positions of each vertex and contact point are determined to be different from those in the first embodiment.

The diagonal line connecting the first vertex VA and the fourth vertex VD coincides with the first baseline LA. The diagonal line connecting the second vertex VB and the third vertex VC is parallel to the second reference line LB and is located below the second reference line LB. The first vertex VA forms a first contact point PA by contacting the inner peripheral surface 122 of the second insertion hole 121 . The second vertex VB does not contact the inner peripheral surface 115 of the first insertion hole 114 and the inner peripheral surface 122 of the second insertion hole 121 . The third vertex VC does not contact the inner peripheral surface 115 of the first insertion hole 114 and the inner peripheral surface 122 of the second insertion hole 121 . The fourth vertex VD forms a fourth contact point PD by contacting the inner peripheral surface 115 of the first insertion hole 114 . In this example, the contact point between the scoring wheel 120 and the pin 130 is one point. Therefore, the force constraining the movement of the scoring wheel 120 caused by the contact with the pin 130 is weak, and the restriction on the movement of the scoring wheel 120 is small.

(Fifth embodiment) The cross-sectional shape of the pin 130 can be changed arbitrarily. In the first example, the cross-sectional shape of the pin 130 is a polygon other than a regular square. In the second example, the cross-sectional shape of the pin 130 is a shape in which at least one point of each vertex is chamfered. The chamfer is, for example, C chamfer or R chamfer. In the third example, the cross-sectional shape of the pin 130 is a shape represented by at least one curve defined by a predetermined radius of curvature at each vertex. The method of forming the vertices represented by the curves includes, for example, the following method: R-machining the vertices of the polygon through mechanical grinding, laser processing, or electric discharge machining. In a preferred embodiment, a forming method suitable for the material of the pin 130 is selected.

The holder unit 100 of the fifth embodiment is, as shown in FIG. 9 , provided with a pin 200 having a different cross-sectional shape from the pin 130 of the first embodiment. A regular quadrilateral contains 4 vertices VA ~ VD. The first vertex VA is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a first contact point PA. The second vertex VB is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a second contact point PB. The third vertex VC is in contact with the inner peripheral surface 115 of the retainer 110 to form a third contact point PC. The fourth vertex VD is in contact with the inner peripheral surface 115 of the retainer 110 to form a fourth contact point PD.

Chamfers are formed at each vertex VA to VD of the regular square. The structure of the pin 200 is the same as the pin 130 of the first embodiment except for the chamfering. Each vertex VA to VD includes a surface VX formed by chamfering. In one example, the chamfer is C chamfer or R chamfer. The portions forming the contact points PA to PD at the vertices VA to VD differ depending on the area of the surface VX. When the area of the surface VX is included in the first predetermined range, the entire surface VX contacts the inner peripheral surface 122 of the scoring wheel 120 or the inner peripheral surface 115 of the holder 110 . The portion forming each contact point PA to PD at each vertex VA to VD is the entire surface VX. When the area of the surface VX is included in the second predetermined range, a part of the surface VX contacts the inner peripheral surface 122 of the scoring wheel 120 or the inner peripheral surface 115 of the holder 110 . The portions forming contact points PA to PD at vertices VA to VD are part of the surface VX. The second predetermined scope is wider than the first predetermined scope. When the area of the surface VX is included in the third predetermined range, the boundary portion between the surface of the pin 200 and the surface VX contacts the inner peripheral surface 122 of the scoring wheel 120 or the inner peripheral surface 115 of the holder 110 . The portions forming contact points PA to PD at vertices VA to VD are the above-mentioned boundary portions. The third predetermined scope is wider than the second predetermined scope.

As the scoring wheel 120 rotates, the contact area of the pin 200 wears. Since each vertex of the pin 130 is chamfered, the wear of the pin 200 proceeds slowly, and the influence of the shape change of the pin 200 on the scoring wheel 120 and the like also changes slowly. This contributes to the stability of the rotation of the scoring wheel 120 .

(Sixth Embodiment) The holder unit 100 of the sixth embodiment is as shown in FIG. 10 and includes a pin 210 having a different cross-sectional shape from the pin 130 of the first embodiment. The cross-sectional shape of pin 210 is rectangular. The length of the long side 211 of the rectangle is longer than the length of the regular square side of the pin 130 of the first embodiment. The length of the short side 212 of the rectangle is shorter than the length of the square side of the pin 130 of the first embodiment. The rectangle contains 4 vertices VA ~ VD. The first vertex VA is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a first contact point PA. The second vertex VB is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a second contact point PB. The third vertex VC is in contact with the inner peripheral surface 115 of the retainer 110 to form a third contact point PC. The fourth vertex VD is in contact with the inner peripheral surface 115 of the retainer 110 to form a fourth contact point PD.

Chamfers are formed at each vertex VA to VD of the rectangle. The chamfer is, for example, C chamfer or R chamfer. The structure of the pin 210 is the same as that of the pin 130 of the first embodiment except that the cross-sectional shape is rectangular and the chamfers are formed. Each vertex VA to VD includes a surface VX formed by chamfering. The portions forming the contact points PA to PD at the vertices VA to VD differ depending on the area of the surface VX, as in the fifth embodiment. In a modification of the pin 210, the cross-sectional shape of the pin 210 is a rectangular shape without chamfering.

The pin 210 is arranged transversely with respect to the holder 110 and the scoring wheel 120 . Specifically, the long side 211 of the rectangle is parallel to the second reference line LB. The short side 212 of the rectangle is parallel to the first datum line LA. In the holder unit 100 in which the pins 210 are arranged laterally, the rotational resistance of the scribing wheel 120 during the scribing process is increased compared to the holder unit 100 in the first embodiment. The reason is considered to be that the distance between the first contact point PA and the second contact point PB in the holder unit 100 is longer than the distance between the first contact point PA and the second contact point PB in the holder unit 100 of the first embodiment. long.

When the rotational resistance of the scoring wheel 120 is large, the depth of the vertical cracks formed on the workpiece W by the scoring process becomes deeper. By adjusting the distance between the first contact point PA and the second contact point PB in the holder unit 100, the depth of the vertical crack formed on the workpiece W can be adjusted. The rotational resistance of the scoring wheel 120 also affects the life of the scoring wheel 120 . The greater the rotational resistance of the scoring wheel 120 is, the shorter the life of the scoring wheel 120 is. By adjusting the distance between the first contact point PA and the second contact point PB in the holder unit 100, the life of the scoring wheel 120 can be adjusted.

(Seventh embodiment) The holder unit 100 of the seventh embodiment is equipped with a pin 210 having a cross-sectional shape different from the pin 130 of the first embodiment as shown in FIG. 11 . The cross-sectional shape of the pin 210 is the same as that of the pin 210 of the sixth embodiment. The rectangle contains 4 vertices VA ~ VD. The first vertex VA is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a first contact point PA. The second vertex VB is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a second contact point PB. The third vertex VC is in contact with the inner peripheral surface 115 of the retainer 110 to form a third contact point PC. The fourth vertex VD is in contact with the inner peripheral surface 115 of the retainer 110 to form a fourth contact point PD. In a modification of the pin 210, the cross-sectional shape of the pin 210 is a rectangular shape without chamfering.

The pin 210 is arranged longitudinally relative to the holder 110 and the scoring wheel 120 . Specifically, the long side 211 of the rectangle is parallel to the first reference line LA. The short side 212 of the rectangle is parallel to the second baseline LB. In the holder unit 100 in which the pins 210 are arranged vertically, the rotational resistance of the scribing wheel 120 during the scribing process is reduced compared to the holder unit 100 in the first embodiment. The reason is considered to be that the distance between the first contact point PA and the second contact point PB in the holder unit 100 is longer than the distance between the first contact point PA and the second contact point PB in the holder unit 100 of the first embodiment. short.

When the rotational resistance of the scoring wheel 120 is small, the depth of the vertical cracks formed on the workpiece W by the scoring process becomes shallower. By adjusting the distance between the first contact point PA and the second contact point PB in the holder unit 100, the depth of the vertical crack formed on the workpiece W can be adjusted. The rotational resistance of the scoring wheel 120 also affects the life of the scoring wheel 120 . The smaller the rotational resistance of the scoring wheel 120 is, the longer the life of the scoring wheel 120 is. By adjusting the distance between the first contact point PA and the second contact point PB in the holder unit 100, the life of the scoring wheel 120 can be adjusted.

(8th embodiment) The holder unit 100 of the eighth embodiment is, as shown in FIG. 12 , provided with a pin 220 having a different cross-sectional shape from the pin 130 of the first embodiment. The cross-sectional shape of the pin 220 is an equilateral triangle. The length of the side 221 of the equilateral triangle is longer than the length of the side of the equilateral square of the pin 130 of the first embodiment. An equilateral triangle contains three vertices VA ~ VC. The first vertex VA is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a first contact point PA. The second vertex VB is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a second contact point PB. The third vertex VC is in contact with the inner peripheral surface 115 of the retainer 110 to form a third contact point PC.

Each vertex VA to VC of the equilateral triangle is chamfered. The chamfer is, for example, C chamfer or R chamfer. The structure of the pin 220 is the same as that of the pin 130 of the first embodiment except that the cross-sectional shape is an equilateral triangle and the chamfering is formed. Each vertex VA to VC includes a surface VX formed by chamfering. The portions forming the contact points PA to PC at the vertices VA to VC are the same as in the fifth embodiment, and differ depending on the area of the surface VX. In a modified example of the pin 220, the cross-sectional shape of the pin 220 is an equilateral triangle without chamfering.

The pin 220 is arranged so that the third vertex VC is located above the first vertex VA and the second vertex VB with respect to the holder 110 and the scoring wheel 120 . Specifically, the edge 221 between the first vertex VA and the second vertex VB is parallel to the second reference line LB. The side 221 between the first vertex VA and the third vertex VC, and the side 221 between the second vertex VB and the third vertex VC intersect the first baseline LA and the second baseline LB. In the holder unit 100 in which the pin 220 is arranged as described above, the rotational resistance of the scribing wheel 120 during the scribing process is increased compared with the holder unit 100 in the first embodiment. The reason is considered to be that the distance between the first contact point PA and the second contact point PB in the holder unit 100 is longer than the distance between the first contact point PA and the second contact point PB in the holder unit 100 of the first embodiment. long. Similar to the sixth embodiment, by adjusting the distance between the first contact point PA and the second contact point PB in the holder unit 100, the depth of the vertical crack formed on the workpiece W and the scoring wheel 120 can be adjusted. life span.

(9th embodiment) The holder unit 100 of the ninth embodiment is provided with a pin 230 having a different cross-sectional shape from the pin 130 of the first embodiment as shown in FIG. 13 . The cross-sectional shape of pin 230 is an isosceles triangle. The length of the base 231 of the isosceles triangle is longer than the length of the rectangular side of the pin 130 of the first embodiment. The length of the equilateral sides 232 of the isosceles triangle is shorter than, equal to, or longer than the sides of the regular quadrilateral of the pin 130 of the first embodiment. An isosceles triangle contains 3 vertices VA ~ VC. The first vertex VA is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a first contact point PA. The second vertex VB is in contact with the inner peripheral surface 122 of the scoring wheel 120 to form a second contact point PB. The third vertex VC is in contact with the inner peripheral surface 115 of the retainer 110 to form a third contact point PC.

Each vertex VA to VC of the isosceles triangle is chamfered. The chamfer is, for example, C chamfer or R chamfer. The structure of the pin 230 is the same as that of the pin 130 of the first embodiment except that the cross-sectional shape is an isosceles triangle and the chamfer is formed. Each vertex VA to VC includes a surface VX formed by chamfering. The portions forming the contact points PA to PC at the vertices VA to VC are the same as in the fifth embodiment, and differ depending on the area of the surface VX. In a modified example of the pin 230, the cross-sectional shape of the pin 230 is an isosceles triangle without chamfering.

The pin 230 is arranged such that the third vertex VC is located above the first vertex VA and the second vertex VB with respect to the holder 110 and the scoring wheel 120 . Specifically, the base 231 between the first vertex VA and the second vertex VB is parallel to the second reference line LB. The equilateral side 232 between the first vertex VA and the third vertex VC, and the equilateral side 232 between the second vertex VB and the third vertex VC intersect the first baseline LA and the second baseline LB. In the holder unit 100 in which the pin 220 is arranged as described above, the rotational resistance of the scribing wheel 120 during the scribing process is increased compared with the holder unit 100 in the first embodiment. The reason is considered to be that the distance between the first contact point PA and the second contact point PB in the holder unit 100 is longer than the distance between the first contact point PA and the second contact point PB in the holder unit 100 of the first embodiment. long. Similar to the sixth embodiment, by adjusting the distance between the first contact point PA and the second contact point PB in the holder unit 100, the depth of the vertical crack formed on the workpiece W and the scoring wheel 120 can be adjusted. life span.

(Example) A test was conducted to evaluate the rotational resistance of the scoring wheel 120 in the early stage of scoring during the scoring process. Describe the conditions of the test. A scribing device is used which includes the holder unit 100 of the sixth embodiment (Fig. 10) or the holder unit 100 of the seventh embodiment (Fig. 11), a platform that supports the workpiece W, and a A moving device that moves the platform relative to the holder unit 100 . The moving device is, for example, a cylinder. The test using the scribing device equipped with the holder unit 100 (FIG. 10) of the sixth embodiment is called the first test. The test using the scoring device equipped with the holder unit 100 (FIG. 11) of the seventh embodiment is called the second test. The length of the long side 211 of the pin 210 is 0.7 mm. The length of the short side 212 of the pin 210 is 0.4 mm. The outer diameter of the scoring wheel 120 is 2 mm. The scoring load of the scoring wheel 120 is 5 levels. Specifically, the scribing load system is selected from five levels: 4 N, 6 N, 8 N, 10 N, and 12 N. Conditions other than the holder unit 100 are common to the first test and the second test.

Describe the order of each test. The workpiece W is placed on the platform of the scoring device. The scribing wheel 120 is pressed against the workpiece W by applying the scribing load set in the test conditions. The position of the scoring wheel 120 relative to the workpiece W is maintained, and the platform is moved in the opposite direction to the scanning direction DD of the scoring wheel 120 by the moving device. The load measuring device is used to measure the load exerted by the mobile device on the platform at this time (hereinafter referred to as "moving load").

Describe the results of the first test. When the load is 4 N, the moving load is 0.26 N. When the load is 6 N, the moving load is 0.42 N. When the load is 8 N, the moving load is 0.56 N. When the load is 10 N, the moving load is 0.68 N. When the load is 12 N, the moving load is 0.84 N. Describe the results of the second test. When the load is 4 N, the moving load is 0.16 N. When the load is 6 N, the moving load is 0.22 N. When the load is 8 N, the moving load is 0.32 N. When the load is 10 N, the moving load is 0.38 N. When the load is 12 N, the moving load is 0.46 N. The moving load of the first test was higher than that of the second test, about 1.8 times. The moving load is affected by the rotational resistance of the scoring wheel 120. The greater the rotational resistance of the scoring wheel 120, the greater the moving load. Based on the results of the first test and the second test, it was confirmed that the rotational resistance of the scoring wheel 120 is greater when the pins 210 are arranged horizontally (Fig. 10) than when the pins 210 are arranged vertically (Fig. 11).

In the above test, the arrangement of the pin 210 with a rectangular cross-section has a significant impact on the rotational resistance of the scoring wheel 120 . In addition, other established factors associated with the pin 130 also affect the rotational resistance of the scoring wheel 120 . Examples of the given factors include: the shape of the pin 130, the positions of the vertices and contact points around the central axis CC of the pin 130, and the first contact point PA and the first contact point PA formed between the scoring wheel 120 and the pin 130. 2 Distance from contact point PB. By adjusting the predetermined factors that affect the rotational resistance of the scoring wheel 120, the quality of the workpiece W can be improved by adjusting the rotational resistance of the scoring wheel 120 during the scoring process.

Mobile devices with low rigidity and thin glass are known. This glass is called thin plate glass or ultra-thin plate glass. Mobile devices are, for example, electronic devices and mobile communication terminals. In the fracturing process of a glass substrate that becomes the material of thin plate glass or ultra-thin plate glass, the depth of the vertical cracks along the scribed line affects the quality of the fractured glass substrate. The deeper the depth of the vertical cracks, the higher the quality of the fracture-processed glass substrate. During the scribing process of the glass substrate, the quality of the glass substrate during the fracture process can be improved by forming deep vertical cracks on the glass substrate. During the scoring process, the greater the rotational resistance of the scoring wheel 120, the easier it is for deep vertical cracks to be formed on the object W to be processed. Therefore, adjustment of established factors affecting the rotational resistance of the scoring wheel 120 can be utilized.

In addition, each of the embodiments described above illustrates the form in which the retainer unit and the pin of the present invention can be obtained. The above description of each embodiment is not intended to limit the possible forms of the retainer unit and pin of the present invention. The retainer unit and the pin of the present invention may take different forms from those illustrated in each embodiment. One example is a form in which part of the components of each embodiment is replaced, changed, or omitted, or a form in which a new component is added to each embodiment.

10‧‧‧Scoring device 100‧‧‧Keeper Unit 110‧‧‧Retainer 114‧‧‧1st insertion hole 115‧‧‧Inner circumferential surface 120‧‧‧Scoring wheel 121‧‧‧2nd insertion hole 122‧‧‧Inner circumferential surface 130‧‧‧sale 130A‧‧‧Restricted structure CA, CB, CC‧‧‧Central axis DD‧‧‧Scan direction VA‧‧‧1st vertex VB‧‧‧2nd vertex VC‧‧‧3rd vertex VD‧‧‧4th vertex PA‧‧‧1st point of contact PB‧‧‧Second point of contact PC‧‧‧3rd contact point PD‧‧‧4th contact point DR‧‧‧Rotation direction LA‧‧‧1st baseline LB‧‧‧2nd baseline Q1‧‧‧Area 1 Q2‧‧‧Region 2 RC‧‧‧Coarse

Fig. 1 is a perspective view of the scoring device according to the first embodiment. Figure 2 is a side view of the retainer joint and retainer unit of Figure 1. FIG. 3 is a cross-sectional view of the holder unit of FIG. 2 . Fig. 4 is a model diagram showing the positional relationship of pins and the like during the scribing process. Fig. 5 is a model diagram showing the positional relationship of pins and the like during non-scoring processing. Fig. 6 is a model diagram showing the positional relationship of pins and the like in the second embodiment. Fig. 7 is a model diagram showing the positional relationship of pins and the like in the third embodiment. Fig. 8 is a model diagram showing the positional relationship of pins and the like in the fourth embodiment. Fig. 9 is a model diagram showing the positional relationship of pins and the like in the fifth embodiment. Fig. 10 is a model diagram showing the positional relationship of pins and the like in the sixth embodiment. Fig. 11 is a model diagram showing the positional relationship of pins and the like in the seventh embodiment. Fig. 12 is a model diagram showing the positional relationship of pins and the like in the eighth embodiment. Fig. 13 is a model diagram showing the positional relationship of pins and the like in the ninth embodiment. Fig. 14 is a model diagram showing the positional relationship of pins and the like of a conventional retainer unit.

114‧‧‧1st insertion hole

115‧‧‧Inner circumferential surface

121‧‧‧2nd insertion hole

122‧‧‧Inner circumferential surface

130‧‧‧sale

130A‧‧‧Restricted structure

CA, CB, CC‧‧‧Central axis

DR‧‧‧Rotation direction

LA‧‧‧1st baseline

LB‧‧‧2nd baseline

VA‧‧‧1st vertex

VB‧‧‧2nd vertex

VC‧‧‧3rd vertex

VD‧‧‧4th vertex

PA‧‧‧1st point of contact

PB‧‧‧Second point of contact

PC‧‧‧3rd contact point

PD‧‧‧4th contact point

Q1‧‧‧Area 1

Q2‧‧‧Region 2

RC‧‧‧Coarse

Claims (8)

A holder unit comprising: A retainer having a first insertion hole; a scoring wheel having a second insertion hole; and A pin inserted into the above-mentioned first insertion hole and the above-mentioned second insertion hole, and inserted into at least the above-mentioned second insertion hole in a non-pressed state; The above-mentioned pin includes a restriction structure that restricts the movement of the above-mentioned pin in the scanning direction of the above-mentioned scribing wheel relative to the above-mentioned scribing wheel. The holder unit as claimed in claim 1, wherein The cross-sectional shape of the pin in the reference section orthogonal to the central axis of the second insertion hole is such that the inner peripheral surface of the second insertion hole contacts the pin at two points, the first contact point and the second contact point. Determined by the method, it constitutes the above-mentioned restriction structure. The holder unit as claimed in claim 2, wherein The cross-sectional shape of the pin in the above-mentioned reference cross-section is polygonal. The holder unit as claimed in claim 3, wherein The cross-sectional shape of the pin in the above-mentioned reference cross-section is a quadrangular shape. The holder unit as claimed in claim 4, wherein The above-mentioned quadrangular shape includes: a first vertex located behind and above the above-mentioned scanning direction with respect to the central axis of the above-mentioned pin, a second vertex located in front of the above-mentioned first vertex in the above-mentioned scanning direction, and the above-mentioned first vertex and the above-mentioned The 3rd vertex and the 4th vertex are different from the 2nd vertex, The above-mentioned first vertex forms the above-mentioned first contact point by contacting the inner peripheral surface of the above-mentioned second insertion hole, The above-mentioned second vertex forms the above-mentioned second contact point by contacting the inner peripheral surface of the above-mentioned second insertion hole, The above-mentioned third vertex and the above-mentioned fourth vertex do not contact the inner peripheral surface of the above-mentioned second insertion hole. The holder unit as claimed in claim 2, wherein The cross-sectional shape of the pin in the above-mentioned reference cross-section is a polygon including chamfers. The holder unit according to any one of claims 2 to 6, wherein The second contact point is located in front of the scanning direction with respect to the central axis of the pin. A pin held by a holder having a first insertion hole and inserted into the second insertion hole in a non-pressed state with respect to a scoring wheel having a second insertion hole, and The cross-sectional shape of the cross-section orthogonal to the central axis of the pin is polygonal.