CN106477866B - The forming method of Incline Crack and substrate disconnect method in brittle material substrate - Google Patents
The forming method of Incline Crack and substrate disconnect method in brittle material substrate Download PDFInfo
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- CN106477866B CN106477866B CN201610556619.XA CN201610556619A CN106477866B CN 106477866 B CN106477866 B CN 106477866B CN 201610556619 A CN201610556619 A CN 201610556619A CN 106477866 B CN106477866 B CN 106477866B
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- rabbet joint
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- 239000003550 marker Substances 0.000 description 22
- 238000011144 upstream manufacturing Methods 0.000 description 9
- 238000005204 segregation Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 206010011376 Crepitations Diseases 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
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- 238000003780 insertion Methods 0.000 description 2
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- 239000000956 alloy Substances 0.000 description 1
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- 238000005336 cracking Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 238000000399 optical microscopy Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
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- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
The present invention provides the forming method of Incline Crack and substrate in brittle material substrate and disconnects method.It includes: line of rabbet joint formation process that the method for Incline Crack is formed in brittle material substrate, and the scoring tool with the point of a knife comprising crest line is made to slide or roll on an interarea of brittle material substrate and form the line of rabbet joint, wherein the line of rabbet joint is linear groove portion；And crackle formation process, it is cracked immediately below the line of rabbet joint, in line of rabbet joint formation process, make diamond icking tool in the state of being tilted from the formation direction of advance of the line of rabbet joint by defined inclination angle in horizontal plane, to form the line of rabbet joint in such a way that the underface of the line of rabbet joint maintains flawless state, in above-mentioned crackle formation process, extend the Incline Crack as the inclined crackle of interarea relative to brittle material substrate from the line of rabbet joint.
Description
Technical field
The present invention relates to the methods for disconnecting brittle material substrate, more particularly to are formed when disconnecting brittle material substrate
The method of Incline Crack.
Background technique
The manufacturing process of flat-panel display panel or solar battery panel etc. generally comprises disconnection by glass substrate, pottery
The process for the substrate (mother substrate) that the fragile materials such as porcelain substrate, semiconductor substrate are constituted.For such disconnection, it is widely used
Using the scoring tools such as diamond icking tool, break bar substrate surface formed cross, and make crackle (vertical crack) from the scribing line to
The method of substrate thickness direction extension.When foring scribing line, vertical crack often extends completely in a thickness direction and makes
Substrate disconnects, and still, vertical crack sometimes also can only local expansion in a thickness direction.In the latter case, when foring
It will do it the stress application for referred to as disconnecting process after scribing line.Keep vertical crack complete in a thickness direction by disconnecting process
Extension is gone down, to disconnect substrate along scribing line.
As above-mentioned such method for making vertical crack extension by formation scribing line, what is had been known has: being formed
Referred to as auxiliary line, the linear method for processing trace when extending vertical crack as starting point (triggering) is (referring for example to special
Sharp document 1).
Advanced technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2015-74145 bulletin
Summary of the invention
Technical problems to be solved by the inivention
In most cases, make above-mentioned various brittle material substrates disconnect in a thickness direction be perpendicular to substrate interarea into
It is capable, but sometimes also have expect will by cleaved facet relative to substrate interarea it is inclined in a manner of turn off.Such disconnection
It is to be realized by making crackle relative to the oblique extension of substrate interarea, but in patent document 1, form auxiliary line about utilizing
Method form the mode of crackle as described above (Incline Crack), both without carrying out any disclosure or not providing any open
Show.
The present invention is made in view of above-mentioned technical problem, is formed in brittle material substrate it is intended that providing
The new method of Incline Crack.
Solution for solving technical problems
In order to solve the above technical problems, the first aspect of the present invention is related to splitting for forming inclination in brittle material substrate
The method of line characterized by comprising line of rabbet joint formation process, by make the scoring tool with the point of a knife comprising crest line along
The scheduled open position of one interarea of the brittle material substrate is slided or is rolled, so that the line of rabbet joint is formed, the line of rabbet joint
It is linear groove portion；And crackle formation process, make to crack immediately below the line of rabbet joint, in the line of rabbet joint formation process,
Making the crest line of the scoring tool in the state of tilting from prescribed direction by defined inclination angle in horizontal plane, in described
The underface of the line of rabbet joint maintains the mode of flawless state to form the line of rabbet joint, in the crackle formation process, makes Incline Crack
It is extended from the line of rabbet joint, the Incline Crack is the inclined crackle of interarea relative to the brittle material substrate.
The forming method of the second aspect of the present invention Incline Crack in the brittle material substrate described in above-mentioned first aspect
On the basis of, which is characterized in that the absolute value at the inclination angle is 1.0 °~3.0 °.
The third aspect of the present invention Incline Crack in the brittle material substrate described in above-mentioned first aspect or second aspect
Forming method on the basis of, which is characterized in that the prescribed direction is the formation direction of advance of the line of rabbet joint.
The fourth aspect of the present invention Incline Crack in the brittle material substrate described in above-mentioned first aspect or second aspect
Forming method on the basis of, which is characterized in that the open position is decided to be curve-like, and the prescribed direction is the disconnection
The tangential direction of position.
The fifth aspect of the present invention is related to the method for disconnecting brittle material substrate characterized by comprising inclination is split
Line formation process, by the forming method of above-mentioned first aspect Incline Crack described in either side into above-mentioned fourth aspect,
Incline Crack is formed in the brittle material substrate；And process is disconnected, the fragile material is disconnected along the Incline Crack
Substrate.
Invention effect
According to the first aspect of aforementioned present invention to the 5th aspect, the underface for maying be used at the line of rabbet joint maintains flawless state
Method, by make cleaved facet relative to substrate interarea it is inclined in a manner of disconnect brittle material substrate.
Detailed description of the invention
Fig. 1 is to illustrate the top view of the brittle material substrate W of the situation after line of rabbet joint TL is formed.
(a) and (b) of Fig. 2 is to briefly show the figure to form the composition of scoring tool 150 used in line of rabbet joint TL.
Fig. 3 be include line of rabbet joint TL vertical cross-section zx partial cross-sectional view.
Fig. 4 is to illustrate the top view of the brittle material substrate W of situation when forming auxiliary line AL.
Fig. 5 is to briefly show the figure to form the composition of lineation device 100 used in auxiliary line AL.
Fig. 6 is to illustrate the brittle material substrate W for the situation that Incline Crack IC is extended with the formation of auxiliary line AL
Top view.
Fig. 7 is to illustrate the brittle material substrate W for the situation that Incline Crack IC is extended with the formation of auxiliary line AL
Top view.
Fig. 8 be include line of rabbet joint TL and Incline Crack IC vertical cross-section zx partial cross-sectional view.
Fig. 9 is that value identical each situation of corresponding tilt angle θ will be born when will form line of rabbet joint TL to what diamond icking tool 151 applied
Curve graph made of the relationship of lotus and the inclination angle δ for being formed by crackle are indicated.
Figure 10 is to be indicated respectively for 3 horizontal tiltangleθs for being given to diamond icking tool 151 in relation to being applied to Buddha's warrior attendant
The curve graph of the average value of the inclination angle δ of 6 kinds of different crackles of the load of stone inscription knife 151, maximum value and minimum value.
Figure 11 is set as -2.1 ° of diamond icking tool 151 and is formed with slot for the load of 1.6N is applied to tiltangleθ
The glass substrate of line TL turns off the optical microphotograph mirror image of monolithic obtained from process after forming Incline Crack IC.
Figure 12 is the schematic diagram of the forming position of the line of rabbet joint TL that open position is set in circular situation and auxiliary line AL.
(a) and (b) of Figure 13 is schematically shown form line of rabbet joint TL and auxiliary line AL according to mode shown in Figure 12 after
The figure of the situation of brittle material substrate W.
Figure 14 is in the case where opening brittle material substrate W for circular cone shape in the mode different from mode shown in Figure 12
Under line of rabbet joint TL and auxiliary line AL forming position schematic diagram.
Figure 15 is in the case where opening brittle material substrate W for circular cone shape in the mode different from mode shown in Figure 12
Under line of rabbet joint TL and auxiliary line AL forming position schematic diagram.
Specific embodiment
Method involved in embodiment of the present invention as shown below (disconnects position in the specified position of brittle material substrate W
Set) formed for disconnect brittle material substrate W, relative to the inclined crackle of substrate interarea (hereinafter referred to as Incline Crack).
Roughly speaking, this method is referred to as the processing groove of the line of rabbet joint by being formed in open position, then in a manner of intersecting with the line of rabbet joint
Auxiliary line is formed, so that Incline Crack be made to extend from the line of rabbet joint to substrate thickness direction.It should be noted that in present embodiment
In, the so-called line of rabbet joint refers to, the subtle linear groove portion for becoming formation start position of the Incline Crack in substrate thickness direction is (recessed
Portion).In addition, so-called auxiliary line refers to, be formed in a manner of intersecting with the line of rabbet joint it is on the interarea of brittle material substrate W, make
Incline Crack becomes the processing trace of starting point (triggering) when the underface of the line of rabbet joint extends.
In the following, parallel with one group of opposite side multiple linear disconnected to be preset to rectangular-shaped brittle material substrate W
It is illustrated in case where open position (striping).In addition, being suitably labeled in the figure for explanation with auxiliary line AL
Formation direction of advance be positive direction of the x-axis, using the formation direction of advance of line of rabbet joint TL as positive direction of the y-axis, using vertical top as z-axis just
The xyz coordinate of the right-handed system in direction.
The formation > of the < line of rabbet joint
Fig. 1 is to illustrate the top view (x/y plane figure) of the brittle material substrate W of the situation after line of rabbet joint TL is formed.Fig. 2 is general
The figure of the composition of scoring tool 150 used in the formation of line of rabbet joint TL is slightly shown.Fig. 3 is the vertical cross-section for including line of rabbet joint TL
Zx partial cross-sectional view.The forming position of line of rabbet joint TL shown in FIG. 1 is equivalent to an interarea (upper surface) from brittle material substrate W
Open position when the overlook view brittle material substrate W of the side SF1.
In the present embodiment, the scoring tool 150 including diamond icking tool 151 is used when forming line of rabbet joint TL.Diamond
Icking tool 151 is equipped with top surface SD1 (the first face) and surrounds the multiple of top surface SD1 for example formed as frustum of a pyramid shape as shown in Figure 2
Face.In further detail, as shown in (b) of Fig. 2, these multiple faces include side SD2 (the second face) and side SD3 (third face).
Top surface SD1, side SD2 and SD3 are towards mutually different direction and adjacent to each other.In diamond icking tool 151, by by side
Vertex PP formed by the crest line PS and top surface SD1, side these three faces SD2 and SD3 that face SD2 and SD3 are constituted forms point of a knife
PF2.As shown in (a) of Fig. 2, diamond icking tool 151 is to be in the one end side top surface SD1 of the handle 152 of rodlike (column) most
The mode of lower end is kept.
In addition, in the present embodiment, it, will be such as Fig. 2 using the moving direction DA of diamond icking tool 151 as benchmark direction
(b) make SD1 configuration in top surface in x/y plane shown in, in the state of the diamond icking tool 151 from the side SD1 of top surface, diamond
Icking tool 151 is defined as Buddha's warrior attendant stone inscription relative to angle, θ of moving direction DA when tilt angle theta clockwise in horizontal plane
The inclination angle of knife 151.Tiltangleθ is also the quadrature axis of vertical plane formed by the crest line PS of diamond icking tool 151 and horizontal plane
Angle formed by the moving direction DA of extending direction D1 and diamond icking tool 151.In addition, tiltangleθ can use positive and negative any value.It needs
It is noted that being counterclockwise the direction that angle, θ is positive from 152 side of handle.
Using scoring tool 150, as shown in (a) of Fig. 2, the axial AX2 for making handle 152 from vertical direction
The defined angle of (positive direction of the y-axis) inclination and the state for the defined tiltangleθ for imparting not 0 deg towards in front of moving direction DA
Under, so that diamond icking tool 151 is connected to the upper surface SF1 of brittle material substrate W.Then, such abutting state is kept on side
While, side make scoring tool 150 to mobile in front of moving direction DA, so that the point of a knife PF2 of diamond icking tool 151 be made to slide.
The plastic deformation of the moving direction DA of diamond icking tool 151 is taken place along as a result,.In the present embodiment, it will also generate in this way
Plastic deformation diamond icking tool 151 sliding action be known as diamond icking tool 151 scribing line movement.
As diamond icking tool 151, well known diamond icking tool can be used.But, when forming line of rabbet joint TL, tiltangleθ
Absolute value be set at 1.0 °~3.0 ° of range.In the case where the absolute value of tiltangleθ is set greater than 3.0 °, nothing
Method is properly formed line of rabbet joint TL.In addition, in the case where the absolute value of tiltangleθ is less than 1.0 °, crackle from line of rabbet joint TL
Propagation direction is substantially vertical with upper surface SF1, can not be properly formed Incline Crack.
As shown in figures 1 and 3, line of rabbet joint TL is formed as extending to y-axis direction on the upper surface SF1 of brittle material substrate W
Subtle linear groove portion.Make Buddha's warrior attendant stone inscription in the state of keeping the posture of scoring tool 150 symmetrical relative to moving direction DA
Knife 151 slides, to be plastically deformed on the upper surface SF1 of brittle material substrate W, as a result, forming line of rabbet joint TL.
As shown in Figure 1, line of rabbet joint TL is along arrow on the upper surface SF1 of brittle material substrate W at defined open position
Positive direction of the y-axis shown in AR1 forms T2 to terminal from starting point T1.In explanation below, also by line of rabbet joint TL relatively closer to
The range of starting point T1 is known as upstream side, and the range relatively closer to terminal T2 is known as downstream side.
It should be noted that the starting point T1 and terminal T2 of line of rabbet joint TL is located at the end with brittle material substrate W in Fig. 1
Separate some position, still, this it is not necessary to mode, can also be according to as the brittle material substrate W for disconnecting object
Type, the purposes of monolithic after disconnection etc., so that either or both is located at the end position of brittle material substrate W
It sets.But, compared with when being set as starting point T1 to separate some positions from end as the example shown in figure 1, starting point T1 is set
Mode in the end of brittle material substrate W can be such that the impact for the point of a knife PF2 for being applied to scoring tool 150 increases, it is contemplated that
To this point of the service life of point of a knife PF2 and this point of unexpected vertical crack, Incline Crack is generated, needs to be noted that.
Also, multiple open positions respectively on line of rabbet joint TL formation both can using include a scoring tool 150
Processing unit (plant) (not shown) in by the scoring tool 150 sequentially form in the way of, can also using use multiple line of rabbet joint TL
The mode that formation is formed simultaneously in parallel with processing unit (plant).
When forming line of rabbet joint TL, load that scoring tool 150 applies (is equivalent to scoring tool 150 from vertical top
Be pressed into the power of the upper surface SF1 of brittle material substrate W) be set as that line of rabbet joint TL can be reliably formed but will not be in fragile material
The degree (Fig. 3) of the extension of the vertical crack, Incline Crack from line of rabbet joint TL is generated on the thickness direction DT of substrate W.
In other words, it is maintained with the underface brittle material substrate W in line of rabbet joint TL and is connected on the direction intersected with line of rabbet joint TL
The mode of the state (flawless state) of continuous connection carries out the formation of line of rabbet joint TL.It should be noted that correspondingly landform grooving
When line TL, near the line of rabbet joint TL of brittle material substrate W (range within substantially 5 μm from line of rabbet joint TL~10 μm degree), as
Plastic deformation as a result, internal stress can be remained.
In the case where tiltangleθ is positive, such remaining internal stress has segregation (tending to) in the formation of line of rabbet joint TL
The trend on the right side of direction of advance (with the direction of arrow AR1 instruction in Fig. 1), it is such residual in the case where tiltangleθ is negative
Stay internal stress that there is segregation becoming in the left side of the formation direction of advance (direction indicated in Fig. 1 with arrow AR1) of line of rabbet joint TL
Gesture.If if being illustrated based on Fig. 3, in the case where the former, there is segregation left side in the figure of the groove portion formed as line of rabbet joint TL
The trend of the lower section of half part (x-axis direction positive side) in the case where the latter, has segregation right half part (x in the figure of the groove portion
Axis direction negative side) lower section trend.
For example, being than being formed using identical scoring tool 150 with vertical by the load setting for applying scoring tool 150
Vertical crack, Incline Crack extension scribing line when small value and realize the formation of line of rabbet joint TL.
Under flawless state, even if being formed with line of rabbet joint TL, the vertical crack from line of rabbet joint TL will not occur, tilt
Therefore the extension of crackle even if assuming there is bending moment to brittle material substrate W effect, and is formed with such crackle phase
Than being also not susceptible to the disconnection along line of rabbet joint TL.
The formation of < auxiliary line and the extension > of Incline Crack
When foring line of rabbet joint TL through the above way, it is subsequently formed auxiliary line AL.
Fig. 4 is to illustrate the top view of the brittle material substrate W of situation when forming auxiliary line AL.Fig. 5 is to be schematically shown in
The figure of the composition of lineation device 100 used in the formation of auxiliary line AL.Fig. 6 and Fig. 7 is to illustrate Incline Crack IC with auxiliary
The top view of the brittle material substrate W for the situation that the formation of line AL is extended.Fig. 8 includes line of rabbet joint TL and Incline Crack IC
The zx partial cross-sectional view of vertical cross-section.
In the present embodiment, as shown in figure 4, auxiliary line AL is near the downstream side of line of rabbet joint TL along arrow AR2 institute
The positive direction of the x-axis (orthogonal with line of rabbet joint TL) shown makes the upper surface SF1 of brittle material substrate W in the range from starting point A1 A2 to terminal
The interior processing trace for generating plastic deformation and being formed.
Auxiliary line AL is formed using the scoring tool 50 for including in lineation device 100 shown in fig. 5.Lineation device 100 is main
It include the workbench 1 for placing brittle material substrate W and the scribe head 2 for keeping scoring tool 50, scoring tool
50 have stitch marker (break bar) 51, pin 52 and bracket 53.
Stitch marker 51 is (abacus pearl) in the form of annular discs, has the uniform point of a knife PF along its periphery, in cross-section observation,
The roughly triangular shape of point of a knife PF (including crest line and a pair of angled face for clipping crest line).Stitch marker 51 typically has number mm
The diameter of left and right.Pin 52 is inserted perpendicularly into the position of the axis center AX of stitch marker 51.Bracket 53 is kept by scribe head 2, and with scribing line
Wheel 51 can support the pin 52 of insertion stitch marker 51 around the mode that axis center AX rotates.I.e., bracket 53 is by pin 52 to stitch marker
51 are pivotally supported, and can be rotated around axis center AX.In more detail, horizontally supporting pin 52 of bracket 53, so that stitch marker
Face formed by 51 point of a knife PF (peripheral part) extends along the vertical direction.
Point of a knife PF is for example with the hard materials shape such as superhard alloy, sintered diamond, polycrystalline diamond or single-crystal diamond
At.From the angle for the surface roughness for reducing above-mentioned crest line and inclined surface, can also entire stitch marker 51 by monocrystalline gold
Hard rock is made.
When forming auxiliary line AL, it is horizontally arranged and consolidates with the placed side another interarea SF2 being crimped on stitch marker 51
It is scheduled in the state of the upper surface SF1 of the brittle material substrate W on the workbench 1 of lineation device 100, passes through movement (not shown)
Mechanism makes to keep the scribe head 2 of scoring tool 50 mobile to scribing line direction DP, wherein scribing line direction DP is also arrow AR2 institute
The formation direction of advance of the auxiliary line AL shown.Then, be crimped on the stitch marker 51 of the state of brittle material substrate W point of a knife PF into
The direction shown in the arrow RT is rolled around axis center AX in the state of entering 1 point of brittle material substrate W.As a result, with such stroke
The crimping of line wheel 51 rolls, and the plasticity that the moving direction along stitch marker 51 is generated on the upper surface SF1 of brittle material substrate W becomes
Shape.
In the present embodiment, the crimping scroll actions for the stitch marker 51 being plastically deformed as generating are known as stitch marker
51 scribing line movement.It should be noted that can be adjusted by Load Regulation (not shown) mechanism possessed by scribe head 2 by
Stitch marker 51 is exerted by the load on brittle material substrate when stitch marker 51 is crimped on upper surface SF1.
If carrying out the auxiliary of aforesaid way under conditions of the load that stitch marker 51 is applied is more than scheduled threshold value
The formation of line AL, then when auxiliary line AL intersects with line of rabbet joint TL, as shown in the arrow AR3 of Fig. 6, with the friendship with each line of rabbet joint TL
The position of point C is starting point, is sequentially generated towards the predetermined extended direction (being the upstream side of line of rabbet joint TL in Fig. 6) of Incline Crack IC from slot
Thickness direction DT from line TL to brittle material substrate W Incline Crack IC extension.
At this point, propagation direction of the Incline Crack IC on the thickness direction of brittle material substrate W, i.e. Incline Crack IC's is oblique
The tiltangleθ of diamond icking tool 151 when rate is according to formation line of rabbet joint TL.Specifically, as shown in figure 8, to be formed in θ=0 °
The propagation direction of the vertical crack VC extended when having line of rabbet joint TL, i.e. vertically below (z-axis positive direction) are benchmark direction, from when scribing line
Crest line PS is observed to the extending direction (downstream side of present embodiment sinual costa TL) of top surface, is positive in a clockwise direction to define
The inclination angle δ of Incline Crack IC, at this point, δ is also positive if tiltangleθ is positive.That is, Incline Crack IC is from line of rabbet joint TL
It rises and tilts and extend to x-axis direction positive side.On the other hand, if tiltangleθ is negative, δ is also negative.That is, Incline Crack
IC is tilted and is extended to x-axis direction negative side from line of rabbet joint TL.It should be noted that the inclined direction of such Incline Crack IC with
It is above-mentioned, remaining internal stress has the side of segregation trend consistent when forming line of rabbet joint TL.The reason is that with auxiliary line AL is formed
It is directed to immediately below the line of rabbet joint in subtle cracking, the i.e. micro-crack that the surface of brittle material substrate W generates together, remaining internal is answered
Power release, the extension of run-off the straight crackle IC.
As described above, the absolute value of the tiltangleθ of diamond icking tool 151 is set as 1.0 °~3.0 ° of range, and tilt
The absolute value of the inclination angle δ of crackle IC is also 1.0 °~3.0 °.It should be noted that diamond icking tool 151 tiltangleθ and
Linear (line style) relationship is substantially existed between the inclination angle δ of Incline Crack IC.
After forming auxiliary line AL, finally, as shown in fig. 7, generating inclining from line of rabbet joint TL at all open positions
The extension of shear crack IC.I.e., opportunity (with auxiliary line AL for triggering) is formed as with auxiliary line AL, though it is formed with before so far
Line of rabbet joint TL but the Incline Crack that extends from line of rabbet joint TL is formed at each open position of the brittle material substrate W of flawless state
IC。
It should be noted that the predetermined extended direction of Incline Crack IC is directed towards the upstream side of line of rabbet joint TL as described above
The reason of direction is, will be in line of rabbet joint TL when foring line of rabbet joint TL using the scoring tool 150 for including diamond icking tool 151
Underface generate Incline Crack IC have to there are the properties that the top surface side SD1 extends.I.e., Incline Crack IC has to spy
The property of a fixed Directional Extension.It is formed in a manner of the upstream side that the top surface SD1 by diamond icking tool is configured on line of rabbet joint TL
In the present embodiment of line of rabbet joint TL, when forming auxiliary line AL, Incline Crack IC is extended in the upstream side of line of rabbet joint TL, but is not easy anti-
Side extends up.
Be formed on open position in the manner described above Incline Crack IC brittle material substrate W be provided to it is not shown
Scheduled disconnection device.In disconnecting device, by so-called three-point bending or the method for four-point bending to fragile material
Substrate W acts on bending moment, and the disconnection work for the lower surface SF2 for making Incline Crack IC extend to brittle material substrate W is carried out with this
Sequence.Through such disconnection process, brittle material substrate W is disconnected at open position.
As explained above, according to the present embodiment, when will scheduled open position disconnect brittle material substrate when,
In forming position corresponding with the open position, while while tilting diamond icking tool, while will not be generated with underface vertical
The condition of vertical crack and Incline Crack carry out the line of rabbet joint formation, later the line of rabbet joint upstream side formed auxiliary line, thus, it is possible to
The open position extends Incline Crack.
< embodiment >
Line of rabbet joint TL is formed with the different diamond icking tool 151 of tiltangleθ, auxiliary line AL is formed later, to the crackle of extension
Inclination angle δ evaluated.Specifically, having prepared the curvature half of the crest line PS of point of a knife PF2 as diamond icking tool 151
The diamond icking tool that diameter is 9.5 μm, making tiltangleθ variation is -2.1 °, 0.0 °, 1.9 ° of this 3 kinds of different inclinations angle, and in shape
Make to be applied to when at the line of rabbet joint TL diamond icking tool 151 load variations 1.0N, 1.1N, 1.3N, 1.4N, 1.5N and 1.6N this 6
The different level of kind, to find out inclination angle δ for all 18 kinds of situations.
As brittle material substrate W, the glass substrate with a thickness of 0.2mm is prepared.Scribing line when by formation auxiliary line AL
First 2 movement speed is set as 100mm/sec, and as stitch marker 51, having used wheel footpath is 2.0mm, with a thickness of 0.65mm, pin 52
The stitch marker that the diameter of insertion hole is 0.8mm, point of a knife angle is 100 °.
Fig. 9 is the identical each situation of value according to tiltangleθ to being applied to the negative of diamond icking tool 151 when forming line of rabbet joint TL
Curve graph made of the relationship of lotus and the inclination angle δ for being formed by crackle are indicated.In addition, Figure 10 is according to Fig. 9
Related be applied to diamond icking tool as a result, indicating respectively for 3 horizontal tiltangleθs for assigning diamond icking tool 151
The curve of the average value (Ave.) of the inclination angle δ of 6 kinds of different crackles of 151 load, maximum value (Max) and minimum value (Min)
Figure.
According to Fig. 9 and Figure 10 it has been confirmed that assigning the tiltangleθ of diamond icking tool 151 when forming line of rabbet joint TL and in shape
Positive correlation is substantially existed between the inclination angle δ of the crackle of extension from line of rabbet joint TL at auxiliary line AL is formed after line of rabbet joint TL.
In addition, Figure 11 be for by the load of 1.6N be applied to tiltangleθ be set as -2.1 ° diamond icking tool 151 and shape
At the glass substrate for having line of rabbet joint TL, the optical microscopy of monolithic obtained from process is turned off after forming Incline Crack IC
Picture.In more detail, downstream side is in nearby side when Figure 11 is shown to tiltangleθ is set as -2.1 ° and attached drawing observation
Monolithic obtained from the glass substrate that mode is formed with line of rabbet joint TL turns off.According to Figure 11 it has been confirmed that disconnecting towards in Fig. 8
The case where as θ < 0 and show direction inclination.This means that being formed with Incline Crack IC to the direction.
< variation >
In above embodiment, auxiliary line AL is formed after forming line of rabbet joint TL, but it is also possible to by line of rabbet joint TL and auxiliary
The formation reversed order of line AL.
Also, in above embodiment, line of rabbet joint TL and auxiliary line AL are orthogonal on the upper surface SF1 of brittle material substrate W,
But this it is not necessary to mode, as long as can ideally realize with the formation of auxiliary line AL and make Incline Crack from line of rabbet joint TL
Extension, then line of rabbet joint TL and auxiliary line AL can also be by the way of skewed crossings.
In turn, in the above-described embodiment, it is risen using the crosspoint of line of rabbet joint TL and auxiliary line AL as what Incline Crack extended
Point, but can also be using by way of being formed about micro-crack in line of rabbet joint TL and making Incline Crack extension.For example, in brittleness material
Expect substrate W upper surface SF1 at, locally pressed near line of rabbet joint TL using defined pressing body and form impression, thus come into
The formation of row micro-crack.With the formation of the impression, the micro-crack extended from impression reaches the lower section of line of rabbet joint TL, and thus inclination is split
Line is extended in the underface of the above-mentioned line of rabbet joint.
In addition, in above embodiment, make the axial AX2 of handle 152 in the state of inclination in front of moving direction DA, i.e.
It slides diamond icking tool 151 towards the posture at the rear moving direction DA with top surface SD1,150 shape of scoring tool is passed through with this
At line of rabbet joint TL, but it is also possible to instead of aforesaid way and in the axial AX2 for making handle 152 to the shape of moving direction DA back sweep
It slides diamond icking tool 151 towards the posture in front of moving direction DA under state, i.e. with top surface SD1, the line of rabbet joint is formed with this
TL。
But, different from the embodiment described above in the case where such mode, the predetermined extended direction of Incline Crack is
The downstream side of line of rabbet joint TL.For this purpose, being formed about auxiliary line AL in the upstream side of line of rabbet joint TL in such mode.Also, it is such
In mode, with the propagation direction of the vertical crack VC extended when θ=0 ° is formed with line of rabbet joint TL, (z-axis is square i.e. vertically below
To) it is benchmark direction, from crest line PS when scribing line to from the extending direction (upstream side of present embodiment sinual costa TL) of top surface,
It is positive in a clockwise direction to define the inclination angle δ of Incline Crack IC, at this point, δ is also positive if tiltangleθ is positive.Namely
It says, Incline Crack IC is tilted and extended to x-axis direction positive side from line of rabbet joint TL.On the other hand, if tiltangleθ is negative, δ is also
It is negative.That is, Incline Crack IC is tilted and is extended to x-axis direction negative side from line of rabbet joint TL.It should be noted that such incline
The inclined direction of shear crack IC with it is above-mentioned, formed the line of rabbet joint TL when remaining internal stress have the side of segregation trend it is consistent.
In this case, it is also same as above embodiment, suitably occur on the predetermined extended direction of Incline Crack IC
The extension of Incline Crack from line of rabbet joint TL.
Optionally, in the above-described embodiment, line of rabbet joint TL is formed using diamond icking tool 151, but also can replace
It states mode and rolls using by crimping the stitch marker 51 of lineation device 100 come by the way of forming line of rabbet joint TL.In this case,
The moving direction of the extending direction of the quadrature axis of the vertical plane and horizontal plane of crest line PF comprising stitch marker and scoring tool institute at
Angle be inclination angle be counterclockwise the direction that angle, θ is positive from bracket side.
But, in this approach, also different from the embodiment described above, the predetermined extended direction of Incline Crack IC is line of rabbet joint TL
Downstream side.For this purpose, making stitch marker 51 incline in such a way that tiltangleθ is negative in the same manner as above-described embodiment 2 in these modes
Tiltedly, auxiliary line AL is formed about in the upstream side of line of rabbet joint TL in this state.It is same as above embodiment, in Incline Crack IC
Predetermined extended direction on the extension of Incline Crack from line of rabbet joint TL suitably occurs.
In addition, in the above method, with the extension side of the vertical crack VC extended when θ=0 ° is formed with line of rabbet joint TL
To, i.e. vertically below (z-axis positive direction) be benchmark direction be positive in a clockwise direction from the downstream side of line of rabbet joint TL to determine
The inclination angle δ of adopted Incline Crack IC, at this point, δ is also positive if tiltangleθ is positive.That is, Incline Crack IC is from the line of rabbet joint
TL rises and tilts and extend to x-axis direction positive side.On the other hand, if tiltangleθ is negative, δ is also negative.That is, inclination is split
Line IC is tilted and is extended to x-axis direction negative side from line of rabbet joint TL.It should be noted that the inclined direction of such Incline Crack IC
With it is above-mentioned, formed the line of rabbet joint TL when remaining internal stress have the side of segregation trend it is consistent.
< is applied to curvilinear disconnection >
In the above-described embodiment, it is linear for being used in and disconnecting the open position of brittle material substrate W, but in above-mentioned reality
It applies in mode, the formation of Incline Crack can also apply to will be switched off position to be set to curvilinear situation.It is disconnected in the following, illustrating
Position is set to round and the case where open brittle material substrate W for circular cone shape along the open position.
Figure 12 is the figure for showing the forming position of line of rabbet joint TL and auxiliary line AL when open position is set to circle.Such situation
Under, the line of rabbet joint is initially formed from starting point T1 along scheduled circular open position on the upper surface SF1 of brittle material substrate W
TL, at this point, the tangential direction of open position corresponds to the shifting of the diamond icking tool 151 when defining tiltangleθ in above embodiment
Dynamic direction DA, assigns tiltangleθ (prescribed direction D1) on the basis of the tangential direction.
Then, line of rabbet joint TL is formed as round in the state of maintaining tiltangleθ.But, terminal T2 is set in compared with point
The position that T1 is more slightly staggered outward.If auxiliary line AL is formed in a manner of intersecting with line of rabbet joint TL near terminal T2, from it
Crosspoint takes place along the extension of the Incline Crack IC of line of rabbet joint TL towards starting point T1.
Figure 13 is the brittle material substrate W schematically shown after forming line of rabbet joint TL and auxiliary line AL in a manner of shown in Figure 12
Situation figure.Shown in (a) of Incline Crack IC such as Figure 13 that the mode shown in Figure 12 is formed, relative to brittle material substrate
The thickness direction of W is tilted to substrate outside.At this point, the region for being inclined by crackle IC encirclement is that circular cone shape (is when cross-section observation
It is trapezoidal).
In this case, when as shown in arrow AR4 from the top of brittle material substrate W to being inclined by crackle IC packet
When the region applied force enclosed, Incline Crack IC is further expanded.Finally, when Incline Crack IC reaches reverse side (lower surface SF2),
As Figure 13 (b) in arrow AR5 shown in, drill out the monolithic W1 of circular cone shape (when cross-section observation for trapezoidal).
Figure 14 and Figure 15 be show brittle material substrate W is opened as circular cone shape in the case where by with shown in Figure 12 in a manner of
The figure of the forming position of line of rabbet joint TL and auxiliary line AL under different modes.In the mode shown in Figure 14, terminal T2 is located at ratio
The position that starting point T1 is staggered more inwardly.In this case, and when the side near terminal T2 to intersect with line of rabbet joint TL
When formula forms auxiliary line AL, the extension of the Incline Crack IC of line of rabbet joint TL is taken place along from its crosspoint towards starting point T1.
Mode shown in Figure 12 is commonly available to want to obtain the case where being opened the part for circular cone shape, and shown in Figure 14
Mode be commonly available to want to obtain the case where being opened the part except part for circular cone shape.Regardless of which kind of mode, together
Sample is all using the position of not formed auxiliary line AL as acquirement object.
In addition, setting terminal T2 in such a way that line of rabbet joint TL itself is overlapped near starting point T1 in mode shown in figure 15.
In this case, even if not forming auxiliary line AL, the effect as auxiliary line AL is played by the repeating part of line of rabbet joint TL,
Also same, circular cone shape the opening for monolithic with situation shown in (b) of Figure 13 may be implemented to take.
It should be noted that will be switched off position in the above example is set to circle, but it is set to other songs will be switched off position
In the case where threadiness, also line of rabbet joint TL can be formed by way of giving tiltangleθ relative to its tangential direction and split inclination
Line is extended along open position.
Description of symbols
1 workbench
2 scribe heads
50 scoring tools
51 stitch markers
100 lineation devices
150 scoring tools
151 diamond icking tools
AL auxiliary line
IC Incline Crack
PF (stitch marker) point of a knife
PF2 (diamond icking tool) point of a knife
PP (diamond icking tool) vertex
PS (diamond icking tool) crest line
The TL line of rabbet joint
W brittle material substrate
Claims (5)
1. the forming method of Incline Crack in a kind of brittle material substrate, for forming Incline Crack in brittle material substrate,
It is characterised by comprising:
Line of rabbet joint formation process, by making the scoring tool with the point of a knife comprising crest line along one of the brittle material substrate
The scheduled open position of interarea is slided or is rolled, to form the line of rabbet joint, the line of rabbet joint is linear groove portion；And
Crackle formation process makes to crack immediately below the line of rabbet joint,
In the line of rabbet joint formation process, the crest line for making the scoring tool in horizontal plane from prescribed direction by defined
In the state of the inclination of inclination angle, to form the line of rabbet joint in such a way that the underface of the line of rabbet joint maintains flawless state,
In the crackle formation process, extend Incline Crack from the line of rabbet joint, the Incline Crack is relative to the brittleness
The inclined crackle of the interarea of material substrate,
The inclination angle be include scoring tool the point of a knife the vertical plane of the crest line and the quadrature axis of horizontal plane prolong
Stretch angle formed by the moving direction of direction and the point of a knife.
2. the forming method of Incline Crack in brittle material substrate according to claim 1, which is characterized in that
The absolute value at the inclination angle is 1.0 °~3.0 °.
3. the forming method of Incline Crack in brittle material substrate according to claim 1 or 2, which is characterized in that
The prescribed direction is the formation direction of advance of the line of rabbet joint.
4. the forming method of Incline Crack in brittle material substrate according to claim 1 or 2, which is characterized in that
The open position is decided to be curve-like,
The prescribed direction is the tangential direction of the open position.
5. a kind of brittle material substrate disconnects method, for disconnecting brittle material substrate characterized by comprising
Incline Crack formation process passes through the shape of Incline Crack in brittle material substrate described in any one of Claims 1-4
At method, Incline Crack is formed in the brittle material substrate；And
Process is disconnected, disconnects the brittle material substrate along the Incline Crack.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015170437A JP6544149B2 (en) | 2015-08-31 | 2015-08-31 | Method of forming inclined cracks in brittle material substrate and method of dividing brittle material substrate |
| JP2015-170437 | 2015-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106477866A CN106477866A (en) | 2017-03-08 |
| CN106477866B true CN106477866B (en) | 2019-08-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556619.XA Expired - Fee Related CN106477866B (en) | 2015-08-31 | 2016-07-14 | The forming method of Incline Crack and substrate disconnect method in brittle material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6544149B2 (en) |
| KR (1) | KR101851453B1 (en) |
| CN (1) | CN106477866B (en) |
| TW (1) | TWI625211B (en) |
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|---|---|---|---|---|
| JP6955754B2 (en) * | 2017-07-25 | 2021-10-27 | 三星ダイヤモンド工業株式会社 | Diamond cutting edge and substrate cutting method |
| WO2020040482A2 (en) | 2018-08-24 | 2020-02-27 | 김보언 | Method, device and program for controlling expert platform |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102046346A (en) * | 2008-05-30 | 2011-05-04 | 三星钻石工业股份有限公司 | Method for chamfering brittle material substrate |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4962075A (en) * | 1972-09-21 | 1974-06-15 | ||
| US4498451A (en) * | 1983-08-05 | 1985-02-12 | At&T Technologies, Inc. | Cutting articles along known planes |
| JP2785906B2 (en) * | 1994-02-14 | 1998-08-13 | 日本板硝子株式会社 | Glass plate cutting method |
| JP4342039B2 (en) * | 1999-06-15 | 2009-10-14 | 三星ダイヤモンド工業株式会社 | Glass scriber and scribing method |
| SG156607A1 (en) * | 2004-07-30 | 2009-11-26 | Mitsuboshi Diamond Ind Co Ltd | Method for forming median crack in substrate and apparatus for forming median crack in substrate |
| TWI409231B (en) * | 2005-07-06 | 2013-09-21 | Mitsuboshi Diamond Ind Co Ltd | Method for manufacturing scratches for brittle materials |
| JP5832064B2 (en) * | 2009-01-30 | 2015-12-16 | 三星ダイヤモンド工業株式会社 | Cutter and method for dividing brittle material substrate using the same |
| JP5244202B2 (en) * | 2011-01-27 | 2013-07-24 | 三星ダイヤモンド工業株式会社 | Method for scribing a brittle material substrate |
| TWI483911B (en) * | 2011-09-28 | 2015-05-11 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus |
| KR101421353B1 (en) * | 2012-11-30 | 2014-07-18 | (주)제일로닉 | Brittle material plate cutting apparatus |
| JP6201608B2 (en) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | Scribing method |
| WO2015063960A1 (en) * | 2013-10-30 | 2015-05-07 | 坂東機工株式会社 | Glass plate scribing device |
-
2015
- 2015-08-31 JP JP2015170437A patent/JP6544149B2/en not_active Expired - Fee Related
-
2016
- 2016-07-12 TW TW105121922A patent/TWI625211B/en not_active IP Right Cessation
- 2016-07-14 CN CN201610556619.XA patent/CN106477866B/en not_active Expired - Fee Related
- 2016-07-19 KR KR1020160091188A patent/KR101851453B1/en active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102046346A (en) * | 2008-05-30 | 2011-05-04 | 三星钻石工业股份有限公司 | Method for chamfering brittle material substrate |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170026118A (en) | 2017-03-08 |
| TWI625211B (en) | 2018-06-01 |
| KR101851453B1 (en) | 2018-04-23 |
| CN106477866A (en) | 2017-03-08 |
| JP2017047546A (en) | 2017-03-09 |
| JP6544149B2 (en) | 2019-07-17 |
| TW201707914A (en) | 2017-03-01 |
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