CN106477866A - In brittle substrate, the forming method of Incline Crack and substrate disconnect method - Google Patents
In brittle substrate, the forming method of Incline Crack and substrate disconnect method Download PDFInfo
- Publication number
- CN106477866A CN106477866A CN201610556619.XA CN201610556619A CN106477866A CN 106477866 A CN106477866 A CN 106477866A CN 201610556619 A CN201610556619 A CN 201610556619A CN 106477866 A CN106477866 A CN 106477866A
- Authority
- CN
- China
- Prior art keywords
- line
- rabbet joint
- brittle substrate
- crack
- incline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 46
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 48
- 208000037656 Respiratory Sounds Diseases 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 abstract description 47
- 239000010432 diamond Substances 0.000 abstract description 47
- 239000003550 marker Substances 0.000 description 22
- 238000011144 upstream manufacturing Methods 0.000 description 9
- 238000005204 segregation Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 206010011376 Crepitations Diseases 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008844 regulatory mechanism Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
The present invention provides the forming method of Incline Crack and substrate in brittle substrate and disconnects method.The method for forming Incline Crack in brittle substrate includes：Line of rabbet joint formation process, makes the scoring tool with the point of a knife comprising crest line slide on an interarea of brittle substrate or roll and form the line of rabbet joint, and wherein, the line of rabbet joint is the groove portion of wire；And crackle formation process, crack in the underface of the line of rabbet joint, in line of rabbet joint formation process, in the state of inclination overturning angle of the diamond icking tool from the formation direction of advance of the line of rabbet joint by regulation in the horizontal plane is made, form the line of rabbet joint in the way of flawless state being maintained in the underface of the line of rabbet joint, in above-mentioned crackle formation process, the Incline Crack of the crackle inclined as the interarea with respect to brittle substrate is made to extend from the line of rabbet joint.
Description
Technical field
The present invention relates to for the method for disconnecting brittle substrate, more particularly to being formed when brittle substrate is disconnected
The method of Incline Crack.
Background technology
The manufacturing process of flat-panel display panel or solar battery panel etc. generally comprises disconnection by glass substrate, pottery
The operation of the substrate (mother substrate) that the fragile materials such as porcelain substrate, semiconductor substrate are constituted.For such disconnection, it is widely used
Using the scoring tools such as diamond icking tool, break bar substrate surface formed line, and make crackle (vertical crack) from the line to
The method of substrate thickness Directional Extension.When line is defined, vertical crack often extends completely in a thickness direction and makes
Substrate disconnects, but, vertical crack sometimes also can only local expansion in a thickness direction.In the latter case, when defining
The stress that can carry out being referred to as disconnecting operation after line applies.Make vertical crack complete in a thickness direction by disconnecting operation
Extension is gone down, so as to disconnect substrate along line.
Used as above-mentioned such method for making vertical crack extension by forming line, had been known has：Formed
It is referred to as boost line, wire processing trace becoming starting point (triggering) when extending vertical crack method (referring for example to special
Sharp document 1).
Look-ahead technique document Prior Art
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2015-74145 publication
Content of the invention
Invention technical problem to be solved
As a rule, make above-mentioned various brittle substrates disconnect in a thickness direction to be perpendicular to substrate interarea and enter
Capable, but also have sometimes and expect and will turn off in the way of cleaved facet is with respect to the inclination of substrate interarea.Such disconnection
Realized by making crackle extension oblique with respect to substrate interarea, but in patent document 1, boost line is formed with regard to utilizing
Method forming the mode of crackle as described above (Incline Crack), both do not carried out any disclosure and do not provided any opening
Show.
The present invention be in view of above-mentioned technical problem and make, it is intended that provide in brittle substrate formed
The new method of Incline Crack.
For solving the scheme of technical problem
For solving above-mentioned technical problem, a first aspect of the present invention relates to formation inclination in brittle substrate and splits
The method of line, it is characterised in that include：Line of rabbet joint formation process, by make have the point of a knife comprising crest line scoring tool along
The predetermined open position of one interarea of the brittle substrate slides or rolls, so as to form the line of rabbet joint, the line of rabbet joint
It is the groove portion of wire；And crackle formation process, crack the underface of the line of rabbet joint, in the line of rabbet joint formation process,
Make the crest line of the scoring tool in the horizontal plane from prescribed direction by the inclination overturning angle of regulation in the state of, with described
The underface of the line of rabbet joint maintains the mode of flawless state to form the line of rabbet joint, in the crackle formation process, makes Incline Crack
Extend from the line of rabbet joint, the Incline Crack is the crackle of the interarea inclination with respect to the brittle substrate.
The forming method of a second aspect of the present invention Incline Crack in the brittle substrate described in above-mentioned first aspect
On the basis of, it is characterised in that the absolute value at the inclination angle is 1.0 °～3.0 °.
A third aspect of the present invention Incline Crack in the brittle substrate described in above-mentioned first aspect or second aspect
Forming method on the basis of, it is characterised in that the prescribed direction is the formation direction of advance of the line of rabbet joint.
A fourth aspect of the present invention Incline Crack in the brittle substrate described in above-mentioned first aspect or second aspect
Forming method on the basis of, it is characterised in that the open position is decided to be curve-like, and the prescribed direction is the disconnection
The tangential direction of position.
A fifth aspect of the present invention relates to the method for disconnecting brittle substrate, it is characterised in that include：Inclination is split
Line formation process, by the forming method of the Incline Crack described in either side in above-mentioned first aspect to above-mentioned fourth aspect,
Incline Crack is formed in the brittle substrate；And operation is disconnected, the fragile material is disconnected along the Incline Crack
Substrate.
Invention effect
According to the first aspect of the invention described above to the 5th aspect, the underface for being usable in the line of rabbet joint maintains flawless state
Method, by make cleaved facet with respect to substrate interarea inclination in the way of disconnect brittle substrate.
Description of the drawings
Fig. 1 is the top view of the brittle substrate W for illustrating the situation after line of rabbet joint TL is formed.
(a) and (b) of Fig. 2 is the figure for briefly showing the composition to form the scoring tool 150 used in line of rabbet joint TL.
Fig. 3 is the zx partial section of the vertical cross-section for including line of rabbet joint TL.
Fig. 4 is the top view of the brittle substrate W for illustrating situation when forming boost line AL.
Fig. 5 is the figure for briefly showing the composition to form the chalker 100 used in boost line AL.
Fig. 6 is the brittle substrate W for illustrating the situation that Incline Crack IC is extended with the formation of boost line AL
Top view.
Fig. 7 is the brittle substrate W for illustrating the situation that Incline Crack IC is extended with the formation of boost line AL
Top view.
Fig. 8 is the zx partial section of the vertical cross-section for including line of rabbet joint TL and Incline Crack IC.
Fig. 9 is that each situation of value identical of corresponding tilt angle θ is negative by applied to diamond icking tool 151 when forming line of rabbet joint TL
The relation of the inclination angle δ of lotus and the crackle for being formed has carried out the curve map for indicating.
Figure 10 is that the tiltangleθ for being directed to 3 levels for being given to diamond icking tool 151 is indicated respectively about putting on Buddha's warrior attendant
The curve map of the mean value, maximum and minimum of a value of the inclination angle δ of 6 kinds of different crackles of the load of stone inscription knife 151.
Figure 11 is to be directed to the load of 1.6N is put on tiltangleθ to be set to -2.1 ° of diamond icking tool 151 and be formed with groove
The glass substrate of line TL, turns off the optical microphotograph mirror image of monolithic obtained from operation after Incline Crack IC is formed.
Figure 12 is the schematic diagram of the line of rabbet joint TL in the case that open position is set to circle and the forming position of boost line AL.
(a) and (b) of Figure 13 is to schematically show to be formed after line of rabbet joint TL and boost line AL according to the mode shown in Figure 12
The figure of the situation of brittle substrate W.
Figure 14 be brittle substrate W is opened as circular cone shape in the case of in the mode different from the mode shown in Figure 12
Under line of rabbet joint TL and boost line AL forming position schematic diagram.
Figure 15 be brittle substrate W is opened as circular cone shape in the case of in the mode different from the mode shown in Figure 12
Under line of rabbet joint TL and boost line AL forming position schematic diagram.
Specific embodiment
Method involved by embodiment of the present invention shown below (disconnects position in the assigned position of brittle substrate W
Put) formed for crackle (hereinafter referred to as Incline Crack) disconnecting brittle substrate W, inclining with respect to substrate interarea.
Roughly speaking, the method passes through to be referred to as the processing groove of the line of rabbet joint in open position formation, subsequently in the way of intersecting with the line of rabbet joint
Boost line is formed, so that Incline Crack is to substrate thickness Directional Extension from the line of rabbet joint.It should be noted that in present embodiment
In, the so-called line of rabbet joint is referred to, the trickle wire groove portion for becoming formation start position of the Incline Crack on substrate thickness direction is (recessed
Portion).In addition, so-called boost line is referred to, be formed in the way of intersecting with the line of rabbet joint on the interarea of brittle substrate W, make
Incline Crack becomes the processing trace of starting point (triggering) when the underface of the line of rabbet joint extends.
Below, parallel with one group of opposite side multiple linear disconnected to preset to rectangular-shaped brittle substrate W
Illustrate in case of open position (striping).In addition, being suitably labeled with the in figure for explanation with boost line AL
Formation direction of advance be x-axis positive direction, with the formation direction of advance of line of rabbet joint TL as y-axis positive direction, with vertically top as z-axis just
The xyz coordinate of the right-handed system in direction.
The formation ＞ of the ＜ line of rabbet joint
Fig. 1 is the top view (x/y plane figure) of the brittle substrate W for illustrating the situation after line of rabbet joint TL is formed.Fig. 2 is general
The figure of the composition of the scoring tool 150 being slightly shown in used in the formation of line of rabbet joint TL.Fig. 3 is the vertical cross-section for including line of rabbet joint TL
Zx partial section.The forming position of the line of rabbet joint TL shown in Fig. 1 is equivalent to an interarea (upper surface) from brittle substrate W
Open position during the top view brittle substrate W of SF1 side.
In the present embodiment, using the scoring tool 150 for including diamond icking tool 151 during formation line of rabbet joint TL.Diamond
Icking tool 151 is provided with top surface SD1 (the first face) and surrounds the multiple of top surface SD1 for example formed as frustum of a pyramid shape as shown in Figure 2
Face.In further detail, as shown in (b) of Fig. 2, these multiple faces include side SD2 (the second face) and side SD3 (the 3rd face).
Top surface SD1, side SD2 and SD3 are towards mutually different direction and adjacent one another are.In diamond icking tool 151, by by side
The crest line PS that face SD2 and SD3 is constituted and top surface SD1, summit PP formed by these three faces of side SD2 and SD3 form point of a knife
PF2.As shown in (a) of Fig. 2, diamond icking tool 151 is with the one end side top surface SD1 in the handle 152 in bar-shaped (column) most
The mode of bottom is kept.
In addition, in the present embodiment, direction on the basis of the moving direction DA of diamond icking tool 151, by as Fig. 2
Top surface SD1 is made to configure in x/y plane shown in (b), in the state of diamond icking tool 151 is observed from top surface SD1 side, diamond
Angle, θ of the icking tool 151 with respect to moving direction DA in the horizontal plane during tilt angle theta clockwise is defined as Buddha's warrior attendant stone inscription
The inclination angle of knife 151.Tiltangleθ be also diamond icking tool 151 crest line PS formed by vertical plane and horizontal plane normal axis
Angle formed by the moving direction DA of bearing of trend D1 and diamond icking tool 151.In addition, tiltangleθ can use positive and negative any value.Need
It is noted that from 152 side of handle observe in the case of, be counterclockwise angle, θ be positive direction.
In the case of using scoring tool 150, such as shown in (a) of Fig. 2, in the axial AX2 for making handle 152 from vertical direction
Towards in front of moving direction DA, (y-axis positive direction) inclines the state of the angle for specifying and the tiltangleθ of the regulation for imparting not 0 deg
Under, make diamond icking tool 151 be connected to the upper surface SF1 of brittle substrate W.Then, such abutting state is kept on side
While, side so that scoring tool 150 is moved in front of moving direction DA so that diamond icking tool 151 point of a knife PF2 slide.
Thus, the plastic deformation of the moving direction DA of diamond icking tool 151 is taken place along.In the present embodiment, will also produce so
Plastic deformation diamond icking tool 151 sliding action be referred to as diamond icking tool 151 line action.
As diamond icking tool 151, known diamond icking tool can be used.But, when line of rabbet joint TL is formed, tiltangleθ
Absolute value be set at 1.0 °～3.0 ° of scope.The absolute value of tiltangleθ is being set greater than in the case of 3.0 °, no
Method is properly formed line of rabbet joint TL.In addition, tiltangleθ absolute value less than in the case of 1.0 °, crackle from line of rabbet joint TL
Propagation direction is substantially vertical with upper surface SF1, it is impossible to be properly formed Incline Crack.
As shown in figures 1 and 3, line of rabbet joint TL is formed as on the upper surface SF1 of brittle substrate W extending to y-axis direction
Trickle wire groove portion.Buddha's warrior attendant stone inscription is made in the state of the posture that makes scoring tool 150 is symmetrical with respect to moving direction DA
Knife 151 slides, so as to be plastically deformed on the upper surface SF1 of brittle substrate W, as a result, forming line of rabbet joint TL.
As shown in figure 1, at the open position specified on the upper surface SF1 of brittle substrate W, line of rabbet joint TL is along arrow
Y-axis positive direction shown in AR1 forms T2 to terminal from starting point T1.In explanation below, also by line of rabbet joint TL relatively closer to
The scope of starting point T1 is referred to as upstream side, and the scope relatively closer to terminal T2 is referred to as downstream.
It should be noted that in FIG, starting point T1 of line of rabbet joint TL and terminal T2 are located at the end with brittle substrate W
Separate the position of some, but, this it is not necessary to mode, it is also possible to according to as disconnect object brittle substrate W
Species, disconnect after the purposes of monolithic etc., suitably make either or both be located at the end position of brittle substrate W
Put.But, with the position for being set to as the example shown in figure 1 separate some from end by starting point T1 when compared with, starting point T1 is set
Mode in the end of brittle substrate W increases can the impact of the point of a knife PF2 for putting on scoring tool 150, it is contemplated that
To point of a knife PF2 life-span this point and produce this point of unexpected vertical crack, Incline Crack, need to be noted that.
Also, the formation of the line of rabbet joint TL that multiple open positions are each gone up can both be adopted is including a scoring tool 150
Processing unit (plant) (not shown) in the mode that sequentially formed using the scoring tool 150, it would however also be possible to employ using multiple line of rabbet joint TL
The mode that formation processing unit (plant) is formed simultaneously in parallel.
When line of rabbet joint TL is formed, the load that scoring tool 150 is applied is (equivalent to from vertical top by scoring tool 150
Be pressed into the power of the upper surface SF1 of brittle substrate W) be set as being reliably formed line of rabbet joint TL but will not be in fragile material
Vertical crack from line of rabbet joint TL, the degree (Fig. 3) of the extension of Incline Crack is produced on the thickness direction DT of substrate W.
In other words, it is maintained with the underface brittle substrate W in line of rabbet joint TL and connects on the direction intersected with line of rabbet joint TL
The mode of the state (flawless state) of continuous connection carries out the formation of line of rabbet joint TL.It should be noted that correspondingly landform grooving
During line TL, near the line of rabbet joint TL of brittle substrate W (scopes within substantially 5 μm from line of rabbet joint TL～10 μm degree), as
The result of plastic deformation, can remain internal stress.
In the case of being just in tiltangleθ, such remaining internal stress has segregation (existing partially) in the formation of line of rabbet joint TL
The trend on the right side of direction of advance (direction indicated with arrow AR1 in Fig. 1), in the case that tiltangleθ is for bearing, such residual
Internal stress is stayed to have segregation becoming in the left side of the formation direction of advance (direction indicated in Fig. 1) of line of rabbet joint TL with arrow AR1
Gesture.If if being illustrated based on Fig. 3, in the case of the former, left in the in figure of the groove portion formed as line of rabbet joint TL with segregation
The trend of the lower section of half part (x-axis direction positive side), in the case of the latter, with segregation in the in figure right half part (x of the groove portion
Direction of principal axis minus side) lower section trend.
For example, the load setting by applying scoring tool 150 is that Billy is formed with vertical with identical scoring tool 150
Little value when vertical crack, the line of Incline Crack extension and realize the formation of line of rabbet joint TL.
Under flawless state, even if line of rabbet joint TL is formed with, vertical crack from line of rabbet joint TL, inclination will not also occur
The extension of crackle, therefore, even if assuming there is bending moment to brittle substrate W effect, and is formed with such crackle phase
Than being not easy to take place along the disconnection of line of rabbet joint TL.
The extension ＞ of the formation of ＜ boost line and Incline Crack
When line of rabbet joint TL is defined by the way, boost line AL is subsequently formed.
Fig. 4 is the top view of the brittle substrate W for illustrating situation when forming boost line AL.Fig. 5 is to be schematically shown in
The figure of the composition of the chalker 100 used in the formation of boost line AL.Fig. 6 and Fig. 7 are to illustrate Incline Crack IC with auxiliary
The top view of the brittle substrate W of the situation that the formation of line AL is extended.Fig. 8 is to include line of rabbet joint TL and Incline Crack IC
The zx partial section of vertical cross-section.
In the present embodiment, as shown in figure 4, boost line AL is along arrow AR2 institute near the downstream of line of rabbet joint TL
The x-axis positive direction (orthogonal with line of rabbet joint TL) that shows makes the upper surface SF1 of brittle substrate W in the scope from starting point A1 A2 to terminal
The interior processing trace for producing plastic deformation and being formed.
The scoring tool 50 included using the chalker 100 shown in Fig. 5 forms boost line AL.Chalker 100 is led
Including workbench 1 and scribe head 2 for keeping scoring tool 50 for placing brittle substrate W, scoring tool
50 with stitch marker (break bar) 51, pin 52 and support 53.
Stitch marker 51 (abacus pearl) in the form of annular discs, with the uniform point of a knife PF along its periphery, in cross-section,
The roughly triangular shape of point of a knife PF (including crest line and a pair of angled face for clipping crest line).Stitch marker 51 typically has number mm
The diameter of left and right.Pin 52 is inserted perpendicularly into the position of the axle center AX of stitch marker 51.Support 53 is kept by scribe head 2, and with line
Wheel 51 can support the pin 52 of insertion stitch marker 51 around the mode of axle center AX rotation.I.e., support 53 is by pin 52 to stitch marker
51 carry out e axle supporting so as to can rotate around axle center AX.In more detail, flatly supporting pin 52 of support 53, so that stitch marker
Face formed by 51 point of a knife PF (peripheral part) vertically extends.
Point of a knife PF for example uses the hard material shape such as superhard alloy, sintered diamond, polycrystalline diamond or single-crystal diamond
Become.Angle from the surface roughness for reducing above-mentioned crest line and inclined plane, it is also possible to which whole stitch marker 51 is by monocrystalline gold
Hard rock is made.
When forming boost line AL, and consolidate as placed side horizontal positioned making stitch marker 51 be crimped on another interarea SF2
In the state of the upper surface SF1 of the brittle substrate W being scheduled on the workbench 1 of chalker 100, by movement (not shown)
Mechanism, makes the scribe head 2 of holding scoring tool 50 to line direction DP movement, and wherein, line direction DP is also arrow AR2 institute
The formation direction of advance of boost line AL that shows.Then, the stitch marker 51 for being crimped on the state of brittle substrate W enters in point of a knife PF
Roll around axle center AX along the direction shown in arrow RT in the state of entering 1 point of brittle substrate W.Thus, with such stroke
The crimping of line wheel 51 is rolled, and the plasticity for producing the moving direction along stitch marker 51 on the upper surface SF1 of brittle substrate W becomes
Shape.
In the present embodiment, the crimping scroll actions for producing the stitch marker 51 of such plastic deformation are referred to as stitch marker
51 line action.It should be noted that the Load Regulation mechanism (not shown) that can have by scribe head 2 adjust by
When stitch marker 51 is crimped on upper surface SF1, stitch marker 51 is exerted by the load on brittle substrate.
If carrying out the auxiliary of aforesaid way under conditions of the load applied by stitch marker 51 is more than predetermined threshold value
The formation of line AL, then when boost line AL is intersected with line of rabbet joint TL, as shown in the arrow AR3 of Fig. 6, with the friendship with each line of rabbet joint TL
The position of point C is starting point, and the predetermined extended direction upstream side of line of rabbet joint TL (in Fig. 6 for) towards Incline Crack IC is sequentially generated from groove
Line TL is to the extension of the Incline Crack IC of the thickness direction DT of brittle substrate W.
Now, propagation direction of the Incline Crack IC on the thickness direction of brittle substrate W, i.e. Incline Crack IC's is oblique
Rate is according to the tiltangleθ of the diamond icking tool 151 during formation line of rabbet joint TL.Specifically, as shown in figure 8, to be formed in θ=0 °
There is propagation direction, the i.e. vertical direction on the basis of lower section (z-axis positive direction) of the vertical crack VC extended during line of rabbet joint TL, from during line
Crest line PS is observed to the bearing of trend (downstream of present embodiment sinual costa TL) of top surface, is defined for just in a clockwise direction
The inclination angle δ of Incline Crack IC, now, if tiltangleθ is for just, δ is also for just.That is, Incline Crack IC is from line of rabbet joint TL
Rise and incline and extend to x-axis direction positive side.On the other hand, if tiltangleθ is negative, δ is also negative.That is, Incline Crack
IC is inclined and extends to x-axis direction minus side from line of rabbet joint TL.It should be noted that the incline direction of such Incline Crack IC with
Above-mentioned, when forming the line of rabbet joint TL remaining internal stress have segregation trend side consistent.Its reason is, with formation boost line AL
Trickle cracking, the i.e. micro-crack for producing on the surface of brittle substrate W together is directed to immediately below the line of rabbet joint, and remaining internal should
Power discharges, the extension of run-off the straight crackle IC.
As described above, the absolute value of the tiltangleθ of diamond icking tool 151 is set as 1.0 °～3.0 ° of scope, and incline
The absolute value of the inclination angle δ of crackle IC is also 1.0 °～3.0 °.It should be noted that diamond icking tool 151 tiltangleθ and
Linear (type) relation is substantially existed between the inclination angle δ of Incline Crack IC.
After forming boost line AL, finally, as shown in fig. 7, producing inclining from line of rabbet joint TL at all of open position
The extension of shear crack IC.I.e., with boost line AL be formed as opportunity (with boost line AL as triggering), though be formed with before so far
Line of rabbet joint TL but at each open position of the brittle substrate W of flawless state formed from line of rabbet joint TL extend Incline Crack
IC.
It should be noted that the predetermined extended direction of Incline Crack IC is directed towards the upstream side of line of rabbet joint TL as described above
The reason for direction, is, when utilization includes that the scoring tool 150 of diamond icking tool 151 defines line of rabbet joint TL, will be in line of rabbet joint TL
Underface produce Incline Crack IC have to exist top surface SD1 side extension property.I.e., Incline Crack IC has to spy
The property of a fixed Directional Extension.Formed in the way of the upstream side on line of rabbet joint TL is configured at by the top surface SD1 of diamond icking tool
In the present embodiment of line of rabbet joint TL, when forming boost line AL, Incline Crack IC is extended in the upstream side of line of rabbet joint TL, but is difficult anti-
Side extends up.
Be formed with open position in the manner described above Incline Crack IC brittle substrate W be provided to not shown
Predetermined disconnection device.In device is disconnected, the method by so-called three-point bending or four-point bending is to fragile material
Substrate W acts on bending moment, enters to exercise, with this, the disconnection work that Incline Crack IC extends to the lower surface SF2 of brittle substrate W
Sequence.Through such disconnection operation, brittle substrate W is disconnected at open position.
As explained above, according to present embodiment, when brittle substrate will be disconnected in predetermined open position,
In forming position corresponding with the open position, while while inclining diamond icking tool, while will not be produced with underface vertical
The condition of vertical crack and Incline Crack carries out the formation of the line of rabbet joint, afterwards the line of rabbet joint upstream side formed boost line, thus, it is possible to
The open position extends Incline Crack.
＜ embodiment ＞
Line of rabbet joint TL is formed with the different diamond icking tool 151 of tiltangleθ, form boost line AL afterwards, to the crackle for extending
Inclination angle δ evaluated.Specifically, the curvature half of the crest line PS of point of a knife PF2 as diamond icking tool 151, has been prepared
Footpath is 9.5 μm of diamond icking tool, becomes tiltangleθ and turns to -2.1 °, 0.0 °, 1.9 ° of this 3 kinds of different inclinations angle, and in shape
The load variations for making to put on when becoming the line of rabbet joint TL diamond icking tool 151 be 1.0N, 1.1N, 1.3N, 1.4N, 1.5N and 1.6N this 6
Different levels are planted, so as to inclination angle δ be obtained for whole 18 kinds of situations.
As brittle substrate W, glass substrate of the thickness for 0.2mm is prepared.By line during formation boost line AL
2 translational speed is set to 100mm/sec, as stitch marker 51, employ wheel footpath for 2.0mm, thickness be 0.65mm, pin 52
A diameter of 0.8mm of inserting hole, point of a knife angle are 100 ° of stitch marker.
Fig. 9 be according to tiltangleθ each situation of value identical to forming the line of rabbet joint TL when put on the negative of diamond icking tool 151
The relation of the inclination angle δ of lotus and the crackle for being formed has carried out the curve map for indicating.In addition, Figure 10 is according to Fig. 9
Result, the tiltangleθ for 3 levels for giving diamond icking tool 151 indicates respectively and relevant puts on diamond icking tool
The curve of the mean value (Ave.), maximum (Max) and minimum of a value (Min) of the inclination angle δ of 6 kinds of different crackles of 151 load
Figure.
According to Fig. 9 and Figure 10 it has been confirmed that giving the tiltangleθ of diamond icking tool 151 when line of rabbet joint TL is formed and in shape
Boost line AL is formed after becoming line of rabbet joint TL and positive correlation is substantially existed between the inclination angle δ of the crackle of extension from line of rabbet joint TL.
In addition, Figure 11 is to be directed to the load of 1.6N is put on tiltangleθ to be set to -2.1 ° of diamond icking tool 151 and shape
Become to have the glass substrate of line of rabbet joint TL, the light microscope of monolithic obtained from operation is turned off after Incline Crack IC is formed
Picture.In more detail, Figure 11 is shown to so that tiltangleθ is set to nearby side when -2.1 ° and accompanying drawing are observed as downstream
Mode is formed with monolithic obtained from the glass substrate of line of rabbet joint TL is turned off.According to Figure 11 it has been confirmed that disconnecting towards in Fig. 8
The direction illustrated as the situation of θ ＜ 0 inclines.This means to be formed with Incline Crack IC to the direction.
＜ variation ＞
In above-mentioned embodiment, after line of rabbet joint TL is formed, boost line AL is formed, but it is also possible to by line of rabbet joint TL and auxiliary
The formation reversed order of line AL.
Also, in above-mentioned embodiment, line of rabbet joint TL and boost line AL are orthogonal on the upper surface SF1 of brittle substrate W,
But this it is not necessary to mode, as long as ideally can realize with the formation of boost line AL and make Incline Crack from line of rabbet joint TL
Extension, then line of rabbet joint TL and boost line AL can also be by the way of skewed crossings.
Further, in the above-described embodiment, using the crosspoint of line of rabbet joint TL and boost line AL as rising that Incline Crack extends
Point, but it is also possible to using by way of being formed about micro-crack in line of rabbet joint TL and make Incline Crack extension.For example, in fragility material
The upper surface SF1 place of material substrate W, partly presses line of rabbet joint TL nearby and formation impression using the pressing body of regulation, thus entering
The formation of row micro-crack.With the formation of the impression, the micro-crack extended from impression reaches the lower section of line of rabbet joint TL, thus inclines and splits
Line is extended in the underface of the above-mentioned line of rabbet joint.
In addition, in above-mentioned embodiment, in the state of the axial AX2 for making handle 152 is inclined in front of moving direction DA, i.e.
With top surface SD1 towards moving direction DA rear posture making diamond icking tool 151 slide, 150 shape of scoring tool is passed through with this
Become line of rabbet joint TL, but it is also possible to replace aforesaid way and make the shape of the axial AX2 of handle 152 to moving direction DA back sweep
So that diamond icking tool 151 is slided under state, i.e. with top surface SD1, the line of rabbet joint is formed with this
TL.
But, in the case of such mode, different from the embodiment described above, the predetermined extended direction of Incline Crack is
The downstream of line of rabbet joint TL.For this purpose, in such mode, being formed about boost line AL in the upstream side of line of rabbet joint TL.Also, it is such
In mode, the propagation direction of the vertical crack VC to extend when θ=0 ° is formed with line of rabbet joint TL, i.e. vertical lower section (z-axis pros
To) on the basis of direction, observe from crest line PS during line to the bearing of trend (upstream side of present embodiment sinual costa TL) of top surface,
The inclination angle δ of Incline Crack IC is defined in a clockwise direction for just, now, if tiltangleθ is for just, δ is also for just.Namely
Say, Incline Crack IC is inclined and extend to x-axis direction positive side from line of rabbet joint TL.On the other hand, if tiltangleθ is negative, δ is also
Negative.That is, Incline Crack IC is inclined and extends to x-axis direction minus side from line of rabbet joint TL.It should be noted that such incline
The incline direction of shear crack IC with above-mentioned, form the line of rabbet joint TL when remaining internal stress have segregation trend side consistent.
In this case, also same with above-mentioned embodiment, suitably occur on the predetermined extended direction of Incline Crack IC
The extension of the Incline Crack from line of rabbet joint TL.
Alternatively, in the above-described embodiment, line of rabbet joint TL is formed, but it is also possible in replacement using diamond icking tool 151
State mode and using being rolled come by the way of forming line of rabbet joint TL by making the crimping of the stitch marker 51 of chalker 100.In this case,
The vertical plane of the crest line PF comprising stitch marker is become with the bearing of trend of the normal axis of horizontal plane and the moving direction of scoring tool
Angle be inclination angle, from bracket side observe, be counterclockwise angle, θ be positive direction.
But, in this approach, also different from the embodiment described above, the predetermined extended direction of Incline Crack IC is line of rabbet joint TL
Downstream.For this purpose, in these modes, making stitch marker 51 incline in the way of tiltangleθ is negative in the same manner as above-described embodiment 2
Tiltedly, boost line AL is formed about in the upstream side of line of rabbet joint TL in this condition.Same with above-mentioned embodiment, in Incline Crack IC
Predetermined extended direction on suitably there is the extension of Incline Crack from line of rabbet joint TL.
In addition, in aforesaid way, the extension side of the vertical crack VC to extend when θ=0 ° is formed with line of rabbet joint TL
To, i.e. vertical direction on the basis of lower section (z-axis positive direction), observe from the downstream of line of rabbet joint TL, determine for just in a clockwise direction
The inclination angle δ of adopted Incline Crack IC, now, if tiltangleθ is for just, δ is also for just.That is, Incline Crack IC is from the line of rabbet joint
TL rises to x-axis direction positive side and inclines and extend.On the other hand, if tiltangleθ is negative, δ is also negative.That is, incline splitting
Line IC is inclined and extends to x-axis direction minus side from line of rabbet joint TL.It should be noted that the incline direction of such Incline Crack IC
With above-mentioned, form the line of rabbet joint TL when remaining internal stress have segregation trend side consistent.
＜ is applied to curvilinear disconnection ＞
In the above-described embodiment, it is used in that to disconnect the open position of brittle substrate W be linear, but in above-mentioned reality
Apply in mode, the formation of Incline Crack can also apply to will be switched off position be set to curvilinear situation.Below, illustrate and disconnect
Position is set to circle and brittle substrate W is opened the situation for circular cone shape along the open position.
Figure 12 is the figure of the forming position of line of rabbet joint TL and boost line AL when illustrating that open position is set to circle.Such situation
Under, the open position along predetermined circle on the upper surface SF1 of brittle substrate W initially forms the line of rabbet joint from starting point T1
TL, now, the shifting of the diamond icking tool 151 when the tangential direction of open position corresponds to tiltangleθ defined in above-mentioned embodiment
Dynamic direction DA, gives tiltangleθ (prescribed direction D1) on the basis of the tangential direction.
Then, line of rabbet joint TL is formed as circular in the state of tiltangleθ is maintained.But, terminal T2 is set in compared with point
The position that T1 more slightly staggers laterally.If forming boost line AL in the way of intersecting with line of rabbet joint TL near terminal T2, from which
Crosspoint takes place along the extension of the Incline Crack IC of line of rabbet joint TL towards starting point T1.
Figure 13 is to schematically show to form the line of rabbet joint TL and brittle substrate W after boost line AL in the way of shown in Figure 12
Situation figure.Shown in (a) of the Incline Crack IC such as Figure 13 formed with the mode shown in Figure 12, with respect to brittle substrate
The thickness direction of W, inclines on the outside of substrate.Now, the region for being inclined by crackle IC encirclement for circular cone shape (during cross-section is
Trapezoidal).
In this case, when from the top of brittle substrate W to being inclined by crackle IC bag as shown in arrow AR4
During the region applying power that encloses, Incline Crack IC is further expanded.Finally, when Incline Crack IC reaches reverse side (lower surface SF2),
As shown in the arrow AR5 in (b) of Figure 13, the monolithic W1 of circular cone shape (being trapezoidal during cross-section) is got out.
Figure 14 and Figure 15 be illustrate brittle substrate W is opened as circular cone shape in the case of by with shown in Figure 12 in the way of
The figure of the forming position of line of rabbet joint TL and boost line AL under different modes.In the mode shown in Figure 14, terminal T2 is located at ratio
The position that starting point T1 more staggers to inner side.In this case, and when the side near terminal T2 to intersect with line of rabbet joint TL
When formula forms boost line AL, the extension of the Incline Crack IC of line of rabbet joint TL is taken place along from its crosspoint towards starting point T1.
Mode shown in Figure 12 is commonly available to the situation for wanting to obtain the part that is opened as circular cone shape, and shown in Figure 14
Mode be commonly available to want obtain the situation of the part outside being opened as the part of circular cone shape.No matter which kind of mode, with
Sample be all using the position for not forming boost line AL as obtain object.
In addition, in the mode shown in Figure 15, setting terminal T2 in the way of line of rabbet joint TL itself is overlapped near starting point T1.
In this case, even if boost line AL is not formed, the effect as boost line AL is played by the repeating part of line of rabbet joint TL,
, the opening of monolithic of circular cone shape same with the situation shown in (b) of Figure 13 can also be realized take.
It should be noted that will be switched off position to be in the above example set to circle, but it is set to other songs will be switched off position
In the case of wire, also line of rabbet joint TL can be formed by way of giving tiltangleθ with respect to its tangential direction and split inclination
Line is extended along open position.
Description of reference numerals
1 workbench
2 scribe heads
50 scoring tools
51 stitch markers
100 chalkers
150 scoring tools
151 diamond icking tools
AL boost line
IC Incline Crack
PF (stitch marker) point of a knife
PF2 (diamond icking tool) point of a knife
PP (diamond icking tool) summit
PS (diamond icking tool) crest line
The TL line of rabbet joint
W brittle substrate
Claims (5)
1. in a kind of brittle substrate Incline Crack forming method, in brittle substrate formed Incline Crack,
Characterized in that, including：
Line of rabbet joint formation process, by making the scoring tool with the point of a knife comprising crest line along one of the brittle substrate
The predetermined open position of interarea slides or rolls, and so as to form the line of rabbet joint, the line of rabbet joint is the groove portion of wire；And
Crackle formation process, cracks the underface of the line of rabbet joint,
In the line of rabbet joint formation process, the crest line of the scoring tool is made from prescribed direction by regulation in horizontal plane
In the state of inclining overturning angle, form the line of rabbet joint in the way of flawless state being maintained in the underface of the line of rabbet joint,
In the crackle formation process, so that Incline Crack is extended from the line of rabbet joint, the Incline Crack be with respect to the fragility
The crackle that the interarea of material substrate is inclined.
2. in brittle substrate according to claim 1 Incline Crack forming method, it is characterised in that
The absolute value at the inclination angle is 1.0 °～3.0 °.
3. in brittle substrate according to claim 1 and 2 Incline Crack forming method, it is characterised in that
The prescribed direction is the formation direction of advance of the line of rabbet joint.
4. in brittle substrate according to claim 1 and 2 Incline Crack forming method, it is characterised in that
The open position is decided to be curve-like,
The prescribed direction is the tangential direction of the open position.
5. a kind of brittle substrate disconnects method, for disconnecting brittle substrate, it is characterised in that include：
Incline Crack formation process, by the shape of Incline Crack in the brittle substrate any one of Claims 1-4
Become method, Incline Crack is formed in the brittle substrate；And
Operation is disconnected, and the brittle substrate is disconnected along the Incline Crack.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-170437 | 2015-08-31 | ||
| JP2015170437A JP6544149B2 (en) | 2015-08-31 | 2015-08-31 | Method of forming inclined cracks in brittle material substrate and method of dividing brittle material substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106477866A true CN106477866A (en) | 2017-03-08 |
| CN106477866B CN106477866B (en) | 2019-08-23 |
Family
ID=58273115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556619.XA Expired - Fee Related CN106477866B (en) | 2015-08-31 | 2016-07-14 | The forming method of Incline Crack and substrate disconnect method in brittle material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6544149B2 (en) |
| KR (1) | KR101851453B1 (en) |
| CN (1) | CN106477866B (en) |
| TW (1) | TWI625211B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6955754B2 (en) * | 2017-07-25 | 2021-10-27 | 三星ダイヤモンド工業株式会社 | Diamond cutting edge and substrate cutting method |
| US11934976B2 (en) | 2018-08-24 | 2024-03-19 | Enterlab Inc. | Method, device and program for controlling specialist platform |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001002438A (en) * | 1999-06-15 | 2001-01-09 | Mitsuboshi Diamond Industrial Co Ltd | Glass scriber |
| CN102046346A (en) * | 2008-05-30 | 2011-05-04 | 三星钻石工业股份有限公司 | Method for chamfering brittle material substrate |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4962075A (en) * | 1972-09-21 | 1974-06-15 | ||
| US4498451A (en) * | 1983-08-05 | 1985-02-12 | At&T Technologies, Inc. | Cutting articles along known planes |
| JP2785906B2 (en) * | 1994-02-14 | 1998-08-13 | 日本板硝子株式会社 | Glass plate cutting method |
| JP4916312B2 (en) * | 2004-07-30 | 2012-04-11 | 三星ダイヤモンド工業株式会社 | Vertical crack forming method and vertical crack forming apparatus for substrate |
| PL2551085T3 (en) * | 2005-07-06 | 2019-06-28 | Mitsuboshi Diamond Industrial Co., Ltd. | Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using same |
| JP5832064B2 (en) * | 2009-01-30 | 2015-12-16 | 三星ダイヤモンド工業株式会社 | Cutter and method for dividing brittle material substrate using the same |
| JP5244202B2 (en) * | 2011-01-27 | 2013-07-24 | 三星ダイヤモンド工業株式会社 | Method for scribing a brittle material substrate |
| TWI483911B (en) * | 2011-09-28 | 2015-05-11 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus |
| KR101421353B1 (en) * | 2012-11-30 | 2014-07-18 | (주)제일로닉 | Brittle material plate cutting apparatus |
| JP6201608B2 (en) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | Scribing method |
| WO2015063960A1 (en) * | 2013-10-30 | 2015-05-07 | 坂東機工株式会社 | Glass plate scribing device |
-
2015
- 2015-08-31 JP JP2015170437A patent/JP6544149B2/en not_active Expired - Fee Related
-
2016
- 2016-07-12 TW TW105121922A patent/TWI625211B/en not_active IP Right Cessation
- 2016-07-14 CN CN201610556619.XA patent/CN106477866B/en not_active Expired - Fee Related
- 2016-07-19 KR KR1020160091188A patent/KR101851453B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001002438A (en) * | 1999-06-15 | 2001-01-09 | Mitsuboshi Diamond Industrial Co Ltd | Glass scriber |
| CN102046346A (en) * | 2008-05-30 | 2011-05-04 | 三星钻石工业股份有限公司 | Method for chamfering brittle material substrate |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201707914A (en) | 2017-03-01 |
| TWI625211B (en) | 2018-06-01 |
| JP6544149B2 (en) | 2019-07-17 |
| KR20170026118A (en) | 2017-03-08 |
| CN106477866B (en) | 2019-08-23 |
| JP2017047546A (en) | 2017-03-09 |
| KR101851453B1 (en) | 2018-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3127673B1 (en) | Method for cutting brittle-material substrate | |
| CN106182467A (en) | In brittle substrate, forming method and the substrate of vertical crack disconnect method | |
| CN106477866A (en) | In brittle substrate, the forming method of Incline Crack and substrate disconnect method | |
| TWI677475B (en) | Method for forming vertical cracks in fragile material substrate and method for cutting fragile material substrate | |
| JP6311798B2 (en) | Method for dividing brittle substrate | |
| JP6645577B2 (en) | Method of cutting brittle substrate | |
| JP6413694B2 (en) | Method for dividing brittle substrate | |
| TWI605024B (en) | Breaking method of brittle substrate | |
| CN106466888B (en) | Method for forming vertical crack in brittle material substrate and method for dividing same | |
| CN106182468A (en) | In brittle substrate, forming method and the substrate of vertical crack disconnect method | |
| TWI607845B (en) | Breaking method of brittle substrate | |
| JP2016098154A (en) | Cutting method of brittle substrate | |
| TW201741107A (en) | Method of dividing brittle substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190823 |