KR20190011681A - A blade tip of diamond and method of dividing a substrate - Google Patents

Abstract

The present invention provides a diamond blade tip capable of stably suppressing the size of intersection defects and the occurrence frequency of intersection skips. The diamond blade tip (51) has an angle between top surface ridges of 160-172°. The angle between top surface ridges is the angle of the tip formed by a top surface (SD1) and a ridge (PS) around an apex (PP).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a diamond tip and a method for dividing a substrate,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond blade edge and a method of dividing a substrate.

BACKGROUND OF THE INVENTION [0002] In the manufacture of electric devices such as flat display panels or solar panels, it is often necessary to divide a brittle substrate. In a typical separation method, a crack line is first formed on a brittle substrate. In the present specification, "crack line" means that a crack partially extending in the thickness direction of the brittle substrate extends in a line shape on the surface of the brittle substrate. Next, a so-called brake process is performed. Specifically, by applying stress to the brittle substrate, the cracks in the crack line progress completely in the thickness direction. As a result, the brittle substrate is divided along the crack line.

According to Patent Document 1, a dent on the upper surface of the glass plate occurs at the time of scribing. In this patent document 1, this dent is called a " scribe line ". In addition, a crack extending in a direction directly below the scribe line occurs simultaneously with the scribe line scribe line. As shown in the technique of Patent Document 1, in a typical conventional technique, a crack line is formed simultaneously with the formation of the scribe line.

Patent Document 2 proposes a dividing technique that is significantly different from the above-described typical dividing technique. According to this technique, first, a groove shape called "scribe line" is formed in this patent document 2 by causing plastic deformation by sliding of a blade edge on a brittle substrate. Hereinafter, this groove shape will be referred to as " trench line " in this specification. At the time when the trench line is formed, a crack is not formed under the trench line. Thereafter, a crack is formed by extending a crack along the trench line. That is, unlike typical techniques, a trench line that does not involve cracking is once formed, and then a crack line is formed along the trench line. Thereafter, a normal breaking process is performed along the crack line.

In a typical conventional technique, the fact that cracks are not formed at the time of scribing means failure of scribing. However, in the dividing technique of Patent Document 2, trench lines that do not involve cracks are intentionally formed by scribing. Thereafter, a crack line is generated along the trench line. The trench line that is not accompanied by the crack used in the technique of Patent Document 2 can be formed by sliding the edge at a lower load as compared with a typical scribe line accompanying simultaneous formation of cracks. The smaller the load, the smaller the damage done to the blade edge. Therefore, according to this breaking technique, the life of the blade can be increased.

Japanese Patent Application Laid-Open No. 9-188534 International Publication No. 2015/151755

In order to form a crack line along the trench line after formation of the trench line, it is necessary to provide a brittle substrate with a mechanism that releases the internal stress generated in the brittle substrate by the formation of the trench line. As one of the methods for imparting this gauge, the present inventors have studied a method of intersecting a first crack line that has been previously formed in order to form a trench line. In this method, the second crack line extends from the intersection along the trench line as a result of the edge of the intersection with the first crack line at the intersection. According to this method, first and second crack lines intersecting with each other are obtained.

According to the study by the present inventors, when the above method is applied, the following problems may occur. First, the brittle substrate divided along the first crack line and the second crack line is broken at a portion corresponding to the intersection point (hereinafter also referred to as " intersection defects "), The size exceeds the allowable limit. In the case where the brittle substrate is divided along a line intersecting with each other, it is generally accepted that a small deflection occurs at an intersection, but an excessive excessive deflection must be avoided. Secondly, it is assumed that the second crack line extends from the intersection, and when the probability of occurrence of a phenomenon in which the extension does not occur (hereinafter also referred to as " intersection jump ") is increased to an extent that can not be ignored .

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a diamond blade edge and a substrate dividing method capable of stably suppressing the size of the intersection defects and the occurrence frequency of the intersection jump.

The diamond blade edge of the present invention has an angle between the top and bottom ridge lines of 160 DEG to 172 DEG.

According to the present invention, it is possible to stably suppress the size of the intersection defects and the occurrence frequency of the intersection skips.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart schematically showing a substrate dividing method in Embodiment 1 of the present invention. FIG.
2 is a plan view schematically showing one step of a substrate dividing method in an embodiment of the present invention.
FIG. 3 is a schematic partial cross-sectional view along line III-III of FIG. 2. FIG.
4 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
5 is a schematic partial cross-sectional view along line V-V in Fig.
6 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
7 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
FIG. 8 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention. FIG.
9 is a plan view schematically showing one step of a substrate dividing method in an embodiment of the present invention.
10 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
11 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
12 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
13 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
14 is a plan view schematically showing one step of the substrate dividing method in the embodiment of the present invention.
15 is a plan view showing an example of the phenomenon of intersection skipping.
16 is a partial plan view showing an example of a phenomenon of intersection defects observed on a brittle substrate before separation.
17 is a partial plan view showing an example of the phenomenon of intersection defects observed at the edges of the brittle substrate after division.
18 is a side view schematically showing a configuration of a cutting mechanism having a diamond blade edge according to an embodiment of the present invention.
19 is a plan view schematically showing the tip of the diamond blade of Fig. 18 in the view of the arrow XI X.
Fig. 20 is a plan view for explaining the definition of the angle of the surface of the diamond blade of Fig. 19; Fig.
Fig. 21 is a schematic partial cross-sectional view along the line XXI-XXI in Fig. 20, illustrating the definition of the ridge angle of the diamond blade edge. Fig.
FIG. 22 is a schematic partial cross-sectional view along the line XXII-XXII in FIG. 20, illustrating the definition of the angle between the tops of the diamond edges.
23 is a diagram showing a surface angle determined depending on the ridge angle and the angle between the surface ridges, together with examples of setting angles between the surface of the rugged substrate and the surface of the brittle substrate.
FIG. 24 is a diagram showing the experimental results of the relationship between the conditions of the ridge line angle and the angle between the top surface ridge line and the evaluation result of the intersection skip / intersection point fuzz.
25 is a schematic view showing the relationship between the conditions of the angle between the ridgeline angle and the top surface ridgeline estimated from the experimental results of Fig. 24 and the result of the division of the substrate. Fig.

(Mode for carrying out the invention)

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Substrate separation method)

Fig. 1 is a flow chart schematically showing a method of dividing a substrate in this embodiment. Figs. 2, 4, and 6 to 14 are plan views schematically showing the method of dividing the substrate. In these plan views, the trench lines are shown in broken lines and the crack lines are shown in solid lines in order to make the drawings easy to see, but the actual trench lines are not continuous in a broken line shape. Each of Figures 3 and 5 is a schematic partial cross-sectional view along line III-III (Figure 2) and line V-V (Figure 4).

At step S10 (Fig. 1), at least one diamond blade edge is prepared. The configuration of the diamond edge will be described later.

Referring to Fig. 2, as a step S20 (Fig. 1), a glass substrate 11 (brittle substrate) is prepared. The glass substrate 11 has a surface SF1.

The trench line TL1 (first trench line) is formed by sliding any one of the above-mentioned at least one diamond edge on the surface SF1 of the glass substrate 11. [ In the illustrated example, the trench line TL1 is formed at a position N1 on the edge of the surface SF1 from one position on the surface SF1, away from the edge of the surface SF1.

3, the trench line TL1 is formed in such a manner that the glass substrate 11 extends in the extending direction of the trench line TL1 (in FIG. 2), below the trench line TL1 in the thickness direction DT, In the direction (DC) (FIG. 3) intersecting with the longitudinal direction (longitudinal direction). In the cracked state, the trench line TL1 due to plastic deformation is formed, but no crack is formed along the trench line TL1. In order to obtain the crackle state, the load applied to the end of the diamond blade is small enough not to cause a crack at the time of forming the trench line TL1, and the plastic deformation to produce an internal stress state for generating a crack line in a subsequent step So as to be formed.

Referring to Fig. 4, a crack line CL1 (first crack line) along the trench line TL1 (Fig. 2) is formed as a step S30 (Fig. 1). In the present embodiment, the crack line CL1 starts to be formed on the basis of the impact when the edge of the glass substrate 11 is lowered at the position N1 of the edge. More specifically, the internal stress generated by the formation of the trench line TL1 is released by the impact, whereby the crack line CL1 is formed.

With reference to Fig. 5, the above-mentioned crackle state (Fig. 3) is broken by forming the crack line CL1. In other words, under the trench line TL1, the glass substrate 11 is etched by the crack line CL1 in the direction (DC) intersecting the extending direction of the trench line TL1 (vertical direction in Fig. 2) The continuous connection is disconnected. Here, " continuous connection ", in other words, is a connection not blocked by a crack. Further, in the state where the continuous connection is broken as described above, the portions of the glass substrate 11 may be in contact with each other via the crack of the crack line CL1. In addition, a slightly continuous connection may be left directly below the trench line TL1.

Referring to Fig. 6, the same method is repeated, whereby crack lines CL1a to CL1d are formed as a plurality of crack lines CL1.

Referring to Fig. 7, as step S40 (Fig. 1), on the surface SF1 of the glass substrate 11 along a trajectory having intersections (N2a in the figure) intersecting the crack line CL1a , So that at least one of the diamond blade tips prepared in step S10 (Fig. 1) is slid (see the arrows in the figure). As the edge used in step S40, the edge used in step S20 may be used again. Alternatively, a plurality of blade tips are prepared in step S10 (FIG. 1), and another blade edge not used in step S20 may be used in step S40. By the sliding, the trench line TL2a (second trench line) is formed from the position N2p away from the edge of the surface SF1 to the position N2a. The trench line TL2a is formed so as to obtain a crackle state as in the case of the trench line TL1 (see Fig. 3).

8, a crack line CL2a (second crack line) is formed along the trench line TL2a from the intersection portion, that is, from the position N2a to the position N2p, as a step S50 (Fig. 1) (See the dashed arrow in the figure). The moment of this formation is an impact when the edge of the blade intersects the crack line CL1a at the position N2a. By this impact, the internal stress generated by the formation of the trench line TL2a from the position N2p to the position N2a is released, so that the crack line CL2a from the position N2a to the position N2p The temple. The crack line CL2a causes the glass substrate 11 to extend downward from the trench line TL2a in the direction intersecting the extended direction of the trench line TL2a 8), the continuous connection is broken. That is, the crackle state is broken. The relationship between the trench line TL2a and the crack line CL2a is the same as the relationship between the trench line TL1 and the crack line CL1 shown in Fig.

Referring to Fig. 9, as the step S40 (Fig. 1), the tip slid up to the position N2a further has a trajectory having an intersection portion (position N2b in the figure) intersecting the crack line CL1b (See arrows in the figure). Whereby the trench line TL2a is further formed from the position N2a to the position N2b.

10, a crack line CL2a is additionally formed along the trench line TL2a from the intersection portion, that is, from the position N2b to the position N2a (Step S50 (Fig. 1) , See the dashed arrow). The cause of this formation is the impact when the blade edge crosses the crack line CL1b at the position N2b. This impact causes the crack line CL2a to move from the position N2b to the position N2a by opening the internal stress generated by the formation of the trench line TL2a from the position N2a to the position N2b The temple.

11), the edge (see Fig. 9) that has been slid to the position N2b as the step S40 (Fig. 1) further includes an intersection (intersection N2c in the figure) intersecting the crack line CL1c. (See arrows in the figure). As a result, the trench line TL2a is further formed from the position N2b to the position N2c.

12, a crack line CL2a is additionally formed along the trench line TL2a from the intersection point, that is, from the position N2c to the position N2b (step S50 in Fig. 1) , See the dashed arrow). The cause of this formation is the impact when the blade edge intersects the crack line CL1c at the position N2c. By this impact, the internal stress generated by the formation of the trench line TL2a from the position N2b to the position N2c is released, so that the crack line CL2a extends from the position N2c to the position N2b The temple.

13), the edge (refer to Fig. 12) that has been slid to the position N2c as the step S40 (Fig. 1) further includes an intersection portion (position N2d in the figure) intersecting the crack line CL1d, . Accordingly, the trench line TL2 is further formed from the position N2c to the position N2d. As a step S50 (Fig. 1), the crack line CL2a is moved from the position N2d to the position N2d along the trench line TL2a by the impact that the edge intersects the crack line CL1d at the position N2d N2c.

The tip intersected with the crack line CL1d at the position N2d falls further from the glass substrate 11 after further sliding at the position N2q. The position N2q may be separated from the edge of the surface SF1 of the glass substrate 11. [

7 to 13, the trench line TL2a and the crack line CL2a along the trench line TL2a are formed. By repeating the same process, the trench lines TL2b to TL2d and the crack lines CL2b to CL2d along the trench lines TL2b to TL2d are formed, respectively, as shown in Fig. The trench lines TL2a to TL2d are collectively referred to as a trench line TL2 (second trench line). The crack lines CL2a to CL2d are collectively referred to as a crack line CL2 (second crack line).

As a step S60 (Fig. 1), the glass substrate 11 is divided along the crack line CL1 and the crack line CL2. Namely, a so-called brake process is performed. The breaking process can be performed by application of an external force to the glass substrate 11. [ Accordingly, the glass substrate 11 can be divided along the lines crossing each other.

Further, when the crack line is completely advanced in the thickness direction DT (see Fig. 5) at the time of forming the crack line, the formation of the crack line and the division of the glass substrate 11 occur at the same time.

(About the intersection jump and the phenomenon of intersection jump)

Fig. 15 shows an example of the surface SF1 of the glass substrate 11 when a phenomenon of intersection skip occurs in the step of forming the crack line CL2. Unlike the case shown in Fig. 14, the crack line CL2 is not formed in a part where the crack line CL2 is supposed to be formed, and only the trench line TL2 is formed. The probability of occurrence of the intersection skip depends on the shape of the diamond edge, as will be described later.

16 is a partial plan view showing an example of a phenomenon of intersection defects observed on the glass substrate 11 after the formation of the crack line CL1 and the crack line CL2 and before the separation of the glass substrate 11. Fig. In the figure, the broken arrow indicates the formation direction of the crack line CL2, and the solid line arrow indicates the formation direction of the trench line TL2 (not shown) formed before the crack line CL2. The position N2 indicates the intersection of the crack line CL1 and the crack line CL2. Ideally, only the crack line CL1 and the crack line CL2 are generated in the vicinity of the intersection (position N2). However, in practice, when the crackline CL2 starts to be formed at the position N2, a crack CA extending from the position displaced from the position N2 can be formed. The crack CA extends from the position on the crack line CL1 and joins the crack line CL2.

17, when the glass substrate 11 on which the cracks CA (Fig. 16) is formed is divided, the portions corresponding to the positions N2 (hereinafter referred to as " intersection defects CP &Quot;). It is acceptable that a small intersection overload (CP) occurs, but an excessively large intersection overload (CP) must be avoided. The size of the intersection gap CP depends on the shape of the diamond edge, as will be described later.

(Cutting mechanism having a diamond edge)

Fig. 18 is a side view schematically showing a cutting mechanism 50 having a diamond blade edge 51 as a blade edge prepared in step S10 (Fig. 1). In the drawing, a state in which the diamond blade edge 51 slides in the direction DA on the surface SF1 of the glass substrate 11 is shown by a broken line. 19 is a plan view schematically showing the diamond blade edge 51 (Fig. 18) in the view of the arrow XI X. The cutting mechanism 50 has a diamond blade edge 51 and a shank 52. The diamond blade edge 51 is supported by the shank 52 as its holder. The shank 52 extends in the axial direction AX. The diamond blade edge 51 is preferably attached to the shank 52 such that the normal direction of the surface SD1 generally follows the axial direction AX.

The diamond blade edge 51 has a plurality of surfaces surrounding the topsheet SD1 and the topsheet SD1. These plural surfaces include a side surface SD2 and a side surface SD3. The ceiling surface SD1, the side surface SD2, and the side surface SD3 are oriented in mutually different directions, and are adjacent to each other. The diamond edge 51 has a vertex PP formed by joining the top face SD1, side face SD2 and side face SD3 with each other. The diamond blade edge 51 also has a ridge line PS formed by joining the side surface SD2 and the side surface SD3 together. The ridgeline (PS) extends linearly from the apex (PP).

Preferably, the diamond blade edge 51 is made of a single crystal diamond. More preferably, the crystallographic plane, SD1, is the {001} plane. Further, a diamond other than a single crystal may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, polycrystalline diamond sintered from a fine graphite or non-graphite carbon with no binder such as an iron group element, or a sintered diamond obtained by bonding diamond particles with a binding material such as an iron family element may be used .

The sliding of the diamond blade edge 51 on the surface SF1 of the glass substrate 11 is carried out while the vertex PP is in contact with the surface SF1 and between the surface SD1 and the surface SF1 Is carried out by moving the diamond blade edge 51 in the direction DA while maintaining the set angle GS of the blade tip 51 at a predetermined angle equal to or greater than 0 degrees. The direction DA is directed from the ridge line PS to the top surface SD1. Preferably, the direction DA follows a straight line image obtained by projecting the ridgeline PS onto the surface SF1. Also preferably, the angle formed by each of the side surface SD2 and the side surface SD3 and the surface SF1 is considered to be equal to each other.

(The angle that characterizes the diamond edge)

20 is a plan view of the same field of view as Fig. The ceiling surface SD1 has an edge tangent to the apex PP. The angle of this edge is the ceiling angle (GC). Fig. 21 is a schematic partial cross-sectional view along the line XXI-XXI in Fig. 20, and the view is perpendicular to the ridge line PS. In this section, the diamond blade edge 51 has edges formed by the side surfaces SD2 and SD3 around the ridge line PS. The angle of this edge is the ridge angle (GA). Fig. 22 is a schematic partial cross-sectional view along the line XXII-XXII in Fig. 20, and the view is parallel to the ridge PS and perpendicular to the surface SD1. In this section, the diamond blade edge 51 has edges formed by the top surface SD1 and the ridge line PS around the apex PP. The angle of this edge is the angle (GB) between the top and bottom ridges.

23 shows a top-surface angle GC (FIG. 20) that is geometrically determined depending on the conditions of the ridge angle GA (FIG. 21) and the top-surface ridge angle GB (FIG. 22) , And in the case where a suitable example of the set angle GS (Fig. 18) in the condition is examined, the value is a table showing the second line with parentheses attached thereto. Further, the condition indicated by "(F)" is that the range of load conditions applied to the diamond blade edge 51 is very narrow, so that it is practically impossible to carry out the method of dividing the substrate in this embodiment. Although the substrate separation method can be implemented by the setting angle GS = 3 ° in the condition that the ridge angle GA is 130 ° and the angle between the top surface ridges GB is 171 °, It is difficult to set the load condition because the difference between an appropriate load at the time of forming the trench line TL2 and an appropriate load at the time of forming the trench line TL2 is large. In addition, under the condition that the ridge angle (GA) is 150 degrees and the angle between the surface ridges (GB) is 170 degrees, the required load is larger than other conditions.

24 is a diagram showing experimental results of the relationship between the condition of the ridge angle GA and the angle between the surface of the surface of the ridgeline and the evaluation result of the intersection skip / intersection defocus. The results of the evaluation of the intersection skip and the intersection ambiguity are shown before and after the " / ".

Regarding the evaluation of the crossing skip, when the crossing skip can be eliminated, the width at the time of forming the trench line TL1 and the range of the load at the time of forming the trench line TL2 were also evaluated. The evaluation result " A " indicates that even when the load at the time of forming the trench line TL2 is reduced to the degree of load at the time of forming the trench line TL1, the crossing skip can be eliminated. When the load at the time of forming the trench line TL2 is reduced to the degree of the load at the time of forming the trench line TL1, the result of the evaluation "B" shows that the intersection jump occurs. However, TL1) is greater than the load at the time of formation of the TL1, the intersection jump can be eliminated. The evaluation result " C " indicates that even if the load is adjusted, only the result without intersection jump is unstable.

The evaluation result "A" indicates that the size of the bridge is smaller than the evaluation results "B" and "C", and the evaluation result "B" indicates that the size of the bridge is smaller than the evaluation result "A" Quot; C " and the evaluation result " C " indicates that the size of the failure is larger than the evaluation result " B ".

The condition indicated by "F" in FIG. 24 corresponds to the condition indicated by "(F)" in the table of FIG. 23, and the implementation of the method of dividing the substrate in this embodiment is practically impossible I did it.

In the drawings, the shapes attached to the respective conditions show a comprehensive evaluation. The hatching of the lattice shape is good with respect to the evaluation of both the intersection skip and the intersection damping and also shows that the adjustment of the load condition to the diamond edge 51 is easy. The hatching of the oblique shape indicates that although a suitable range of the load condition to the diamond blade edge 51 is slightly narrow, good results are obtained almost stably with respect to the evaluation of both the crossing skip and the intersection flare. Surrounding the dashed line indicates that it is difficult to adjust the load condition to the diamond blade edge 51, so that only good results concerning evaluation of both the crossing skip and the intersection deflection are obtained unstably. Surrounding the solid line indicates that the method of dividing the substrate in this embodiment is practically impossible.

In view of the above experimental results, the angle (GB) (FIG. 22) between the topsurface ridges becomes 160 degrees or more and 172 degrees or less. Preferably, the angle between the topspeed ridges (GB) is 165 DEG or more. Also preferably, the angle between the topsurface ridges (GB) is 171 DEG or less. It is preferable that the ceiling surface angle GC (FIG. 21) is 37.1 DEG to 79.1 DEG. Preferably, the top surface angle GC is 46.5 DEG or more. Also, preferably, the ceiling surface angle (GC) is 64.0 DEG or less. A diamond blade edge 51 that satisfies these angular conditions is used in each of steps S20 and S40 (Fig. 1).

Fig. 25 is a schematic diagram showing the relationship between the conditions of the ridge angle GA and the angle between the topsurface ridgeline GB and the result of substrate separation, which is inferred from the experimental results of Fig. The triangular area RA having the point CS, the point CT and the point CU in the two-dimensional space formed by the ridge angle GA and the angle between the top surface ridgelines GB in the present embodiment The substrate separation method of the present invention can be easily performed.

The region RQ in which the ridge angle GA (Fig. 21) is excessive, which is defined by the straight line LQ including the point CS and the point CT, It is difficult to perform the method of dividing the substrate according to the present embodiment. The region RR in which the angle between the topsurrounding ridges GB (Fig. 22) defined by the straight line LR including the point CT and the point CU is excessive can not be practically practiced And the like. This is considered to be related to the fact that the adjustment range of the setting angle GS (Fig. 18) becomes very limited if the angle GB between the surface-to-surface ridges is close to 180 deg. The region RP in which the top surface angle GC (FIG. 20) is excessive, which is defined by the straight line LP including the point CU and the point CS, . It is assumed that the point CS corresponds to a ridge angle GA of about 130 ° and a surface ridge angle GB of about 160 °. It is estimated that the point CT corresponds to a ridge angle GA of about 135 DEG and a top surface ridge angle GB of about 173 DEG. It is estimated that the point CU corresponds to a ridge angle GA of about 148 DEG and a top surface ridge angle GB of about 169 DEG.

(Summary of effects)

Since the angle (GB) between the top and bottom ridges is 160 degrees or more and 172 degrees or less, the size of the intersection defects and the occurrence frequency of the intersection points can be stably suppressed. Preferably, the angle between the topspeed ridges (GB) is 165 DEG or more. As a result, the size of the intersection defects and the occurrence frequency of the intersection skips can be more reliably suppressed. Preferably, the angle between the topsurface ridges (GB) is 171 DEG or less. As a result, the size of the intersection defects and the occurrence frequency of the intersection skips can be more reliably suppressed.

Preferably, the ceiling surface angle GC is 37.1 DEG or more. Accordingly, the load condition of the diamond blade edge 51 can be easily set. Therefore, the substrate can be divided more stably. Preferably, the ceiling surface angle GC is 79.1 DEG or less. As a result, the size of the intersection defects can be more reliably suppressed. Preferably, the top surface angle GC is 46.5 DEG or more. Thus, the load condition of the diamond blade edge 51 can be more easily set. Preferably, the ceiling surface angle GC is 79.1 DEG or less. Thus, the load condition of the diamond blade edge 51 can be more easily set. Preferably, the ceiling surface angle GC is 64.0 DEG or less. As a result, the size of the intersection defects can be more reliably suppressed.

GA: Ridge angle
GB: Angle between top and bottom ridges
GC: Surface angle
CL1, CL1a to CL1d, CL2, CL2a to CL2d:
SD1: Surface
SD2, SD3: Side
SF1: Surface
GS: Setting angle
PP: Vertex
TL1, TL2, TL2a to TL2d: Trench line
PS: Ridgeline
11: Glass substrate (brittle substrate)
51: diamond edge

Claims (7)

A diamond blade edge having an angle between a surface of the plane of the surface of not less than 160 degrees and not more than 172 degrees. The method according to claim 1,
Wherein the angle between the top and bottom ridges is 165 DEG or more. 3. The method according to claim 1 or 2,
Wherein the angle between the top surface ridgeline is 171 DEG or less. 4. The method according to any one of claims 1 to 3,
A diamond edge having a surface angle of at least 37.1 DEG and not more than 79.1 DEG. 5. The method of claim 4,
Wherein the face angle is at least 46.5 degrees. The method according to claim 4 or 5,
Wherein the face angle is not more than 64.0 DEG. A method for manufacturing a diamond blade, comprising the steps of: preparing the diamond blade tip according to any one of claims 1 to 6 as at least one blade tip;
A step of forming a first trench line by sliding any one of said at least one edge on a brittle substrate,
Forming a first crack line along the first trench line after forming the first trench line;
Forming a second trench line by sliding any one of the at least one edge on the brittle substrate along a trajectory having an intersection with the first crack line;
Forming a second crack line from the intersection along the second trench line
Wherein the substrate is a substrate.

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