CN107464780B - 一种优化侧壁金属化基板金属毛刺的切割方法 - Google Patents

一种优化侧壁金属化基板金属毛刺的切割方法 Download PDF

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CN107464780B
CN107464780B CN201710648812.0A CN201710648812A CN107464780B CN 107464780 B CN107464780 B CN 107464780B CN 201710648812 A CN201710648812 A CN 201710648812A CN 107464780 B CN107464780 B CN 107464780B
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slide glass
chip
optimization
cutting
substrate metal
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CN107464780A (zh
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孙洪权
李建
李俊霖
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Sichuan Bright Photoelectric Technology Co Ltd
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Sichuan Bright Photoelectric Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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Abstract

本发明公开了一种优化侧壁金属化基板金属毛刺的切割方法，包括以下步骤：S1：将载片放置在热板上加热；S2：在载片上均匀涂抹粘接蜡，并将芯片贴在载片上；S3：用粘接蜡涂抹包裹整片芯片；S4：将粘接了芯片的载片贴合在聚酯薄膜上；S5：对载片进行切割；S6：切割分离后用用丙酮清洗芯片，将粘接蜡清洗掉。本发明使用粘接蜡将待切割的芯片包裹粘接在载片（普通玻璃片）上，使芯片所有面都被保护起来，避免切割造成的碎屑和金属拉丝；同时，本发明将芯片粘接在载片上，可以切入更深，避免切割相角。

Description

一种优化侧壁金属化基板金属毛刺的切割方法
技术领域
本发明涉及半导体器件制造技术领域，尤其涉及一种优化侧壁金属化基板金属毛刺的切割方法。
背景技术
在目前半导体器件制造中，有时会要求芯片侧面拥有图形化的金属结构，并与正面的图形相连接，以实现芯片的某些特有功能。在完成整版产品图形制作后，需要将其切割分离成独立单元。
传统的切割分离，会将整版芯片安装在mylar（聚酯薄膜）上固定和保护，但是这样只有芯片与mylar的接触面会被保护，在切割过程中，侧面的金属层会被拉起造成毛刺，造成切割废品。
发明内容
本发明的目的在于克服现有技术的不足，提供一种优化侧壁金属化基板金属毛刺的切割方法，解决现有技术的切割造成的毛刺、碎屑和金属拉丝。
本发明的目的是通过以下技术方案来实现的：一种优化侧壁金属化基板金属毛刺的切割方法，包括以下步骤：
S1：将载片放置在热板上加热；
S2：在载片上均匀涂抹粘接蜡，并将芯片贴在载片上；
S3：用粘接蜡涂抹包裹整片芯片；
S4：将粘接了芯片的载片贴合在聚酯薄膜上；
S5：对载片进行切割；
S6：切割分离后用用丙酮清洗芯片，将粘接蜡清洗掉。
进一步地，所述的载片为玻璃片。
进一步地，步骤S2中所述的将芯片贴在载片上包括：缓慢平稳将芯片放置在载片上，适当按压芯片保证芯片与载片之间没有较大气泡，并且芯片与载片相对水平。
本发明的有益效果是：本发明使用粘接蜡将待切割的芯片包裹粘接在载片（普通玻璃片）上，使芯片所有面都被保护起来，避免切割造成的碎屑和金属拉丝；同时，本发明将芯片粘接在载片上，可以切入更深，避免切割相角。
附图说明
图1为本发明方法流程图。
具体实施方式
下面结合附图进一步详细描述本发明的技术方案：如图1所示，一种优化侧壁金属化基板金属毛刺的切割方法，包括以下步骤：
S1：将载片放置在热板上加热；
S2：在载片上均匀涂抹粘接蜡，缓慢平稳将芯片放置在载片上，适当按压芯片保证芯片与载片之间没有较大气泡，并且芯片与载片相对水平，避免切割后芯片侧壁呈倾斜；
S3：用粘接蜡涂抹包裹整片芯片；
S4：将粘接了芯片的载片贴合在聚酯薄膜上；
S5：对载片进行切割；
S6：切割分离后用用丙酮清洗芯片，将粘接蜡清洗掉。
更优地，在本实施例中，所述的载片为玻璃片。

Claims (3)

1.一种优化侧壁金属化基板金属毛刺的切割方法，其特征在于：包括以下步骤：
S1：将载片放置在热板上加热；
S2：在载片上均匀涂抹粘接蜡，并将芯片贴在载片上；
S3：用粘接蜡涂抹包裹整片芯片；
S4：将粘接了芯片的载片贴合在聚酯薄膜上；
S5：对载片进行切割；
S6：切割分离后用丙酮清洗芯片，将粘接蜡清洗掉。
2.根据权利要求1所述的一种优化侧壁金属化基板金属毛刺的切割方法，其特征在于：所述的载片为玻璃片。
3.根据权利要求1所述的一种优化侧壁金属化基板金属毛刺的切割方法，其特征在于：步骤S2中所述的将芯片贴在载片上包括：缓慢平稳将芯片放置在载片上，适当按压芯片保证芯片与载片之间没有较大气泡，并且芯片与载片相对水平。
CN201710648812.0A 2017-08-01 2017-08-01 一种优化侧壁金属化基板金属毛刺的切割方法 Active CN107464780B (zh)

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