CN107452769B - 一种oled微型显示器及其焊盘键合方法 - Google Patents
一种oled微型显示器及其焊盘键合方法 Download PDFInfo
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- CN107452769B CN107452769B CN201710365162.9A CN201710365162A CN107452769B CN 107452769 B CN107452769 B CN 107452769B CN 201710365162 A CN201710365162 A CN 201710365162A CN 107452769 B CN107452769 B CN 107452769B
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 95
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 239000010949 copper Substances 0.000 claims abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 4
- 230000032683 aging Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 7
- 238000005498 polishing Methods 0.000 description 7
- UFNIBRDIUNVOMX-UHFFFAOYSA-N 2,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1Cl UFNIBRDIUNVOMX-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
- H10K59/1275—Electrical connections of the two substrates
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
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Priority Applications (1)
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CN201710365162.9A CN107452769B (zh) | 2017-05-22 | 2017-05-22 | 一种oled微型显示器及其焊盘键合方法 |
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CN201710365162.9A CN107452769B (zh) | 2017-05-22 | 2017-05-22 | 一种oled微型显示器及其焊盘键合方法 |
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CN107452769A CN107452769A (zh) | 2017-12-08 |
CN107452769B true CN107452769B (zh) | 2020-08-25 |
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CN201710365162.9A Active CN107452769B (zh) | 2017-05-22 | 2017-05-22 | 一种oled微型显示器及其焊盘键合方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110718579A (zh) * | 2019-11-18 | 2020-01-21 | 昆山梦显电子科技有限公司 | 硅基微显示屏及其制备方法 |
US11244996B2 (en) | 2020-04-27 | 2022-02-08 | Facebook Technologies, Llc | Micro OLEDs having narrow bezel |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1582409A (zh) * | 2001-11-07 | 2005-02-16 | 英特尔公司 | 设置在半导体衬底上并具有位于衬底相对侧上用于驱动调制器的微处理器电路的空间光调制器 |
CN102157662A (zh) * | 2010-02-12 | 2011-08-17 | 台湾积体电路制造股份有限公司 | 装置及其形成方法 |
CN102629667A (zh) * | 2012-04-25 | 2012-08-08 | 上海大学 | 硅基顶发射有机发光微显示器及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101924169B (zh) * | 2009-06-16 | 2012-07-18 | 日月光半导体制造股份有限公司 | 光学芯片的封装构造及其制造方法 |
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- 2017-05-22 CN CN201710365162.9A patent/CN107452769B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1582409A (zh) * | 2001-11-07 | 2005-02-16 | 英特尔公司 | 设置在半导体衬底上并具有位于衬底相对侧上用于驱动调制器的微处理器电路的空间光调制器 |
CN102157662A (zh) * | 2010-02-12 | 2011-08-17 | 台湾积体电路制造股份有限公司 | 装置及其形成方法 |
CN102629667A (zh) * | 2012-04-25 | 2012-08-08 | 上海大学 | 硅基顶发射有机发光微显示器及其制备方法 |
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Effective date of registration: 20210824 Address after: 518000 Room 302, building 2, chunhaian Yaju, No. 4, Gaoxin South Ring Road, Nanshan District, Shenzhen, Guangdong Patentee after: Zhao Liang Address before: 518000 floor 44, Xinhao e Du, 7018 CaiTian Road, Futian District, Shenzhen, Guangdong Patentee before: Sheng Sheng Effective date of registration: 20210824 Address after: 518000 No.2, east side, 1st floor, building D, tefa information port, No.2 Kefeng Road, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen zhilianhui network system enterprise (L.P.) Address before: 518000 Room 302, building 2, chunhaian Yaju, No. 4, Gaoxin South Ring Road, Nanshan District, Shenzhen, Guangdong Patentee before: Zhao Liang |
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Effective date of registration: 20210918 Address after: 210000 room 603, building C, Xingzhi science and Technology Park, No. 6, Xingzhi Road, Nanjing Economic and Technological Development Zone, Jiangsu Province Patentee after: Nanjing Ruixian Electronic Technology Co.,Ltd. Address before: 518000 No.2, east side, 1st floor, building D, tefa information port, No.2 Kefeng Road, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen zhilianhui network system enterprise (L.P.) |
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