CN107446525A - 含有导电高分子聚合物的膏状导热胶 - Google Patents

含有导电高分子聚合物的膏状导热胶 Download PDF

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CN107446525A
CN107446525A CN201710645766.9A CN201710645766A CN107446525A CN 107446525 A CN107446525 A CN 107446525A CN 201710645766 A CN201710645766 A CN 201710645766A CN 107446525 A CN107446525 A CN 107446525A
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闫晓琦
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Kunshan De Rayi Scarlett Electronic Mstar Technology Ltd
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Abstract

本发明涉及一种含有导电高分子聚合物的膏状热胶，是将高分子导电聚合物作为导热填料而制成一种用于散热器件的具有导热功能的导热胶，导热胶的特征在于含有导电高分子聚合物，包括本征和掺杂的高分子导电聚合物，导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料，该导热胶不仅具有高导热系数，而且导热填料与胶体同属于高分子类，具有很好的相容性，同时在导电性上也表现优异。

Description

含有导电高分子聚合物的膏状导热胶
技术领域
本发明涉及一种用于散热器件的具有导热功能的膏状导热胶，尤其涉及一种含有导电高分子聚合物的膏状导热胶。
背景技术
目前手机、电子计算机等电子设备的散热主要采用在需要散热的元器件上粘贴散热器件的方式，石墨、铜碳体等散热器件需要通过粘结胶水或胶带(双面胶带或单面胶带)等方式与需要散热的元器件连接。
现有的导热胶通常导热系数小，难以满足散热的需要。为了提高导热系数，都着眼于导热填料的选择。现有技术中，在高分子聚合物中添加碳纳米管或石墨烯时，会因添加量过大，降低粘度，而无法大量应用于导热胶；而在高分子聚合物中添加陶瓷导热填料或金属填料时，则因填料添加量有限的原因，胶中导热成分不够，导热系数较低。
逯平采取了组合使用法，将现有技术条件下的导热胶成分组合使用，即在高分子聚合物中添加纳米陶瓷导热填料、纳米金属导热填料以及碳纳米管或石墨烯制成新型导热胶(CN104178048B)，可以容纳更大量的导热成分填料，而不会降低其粘性。导热胶还可以在薄至0.5μm的厚度下具有25W/(m·k)以上的导热系数，并且该厚度下的导热胶带可以具备相对现有的导热胶带更大的力学强度，具备更好的机械性能。
自白川英树获诺贝尔奖以来，高分子导电聚合物以其高导电的特性迅速成为世人瞩目的新材料。其构特征为分子具有大的共轭电子体系，载流子是具有跨键移动能力的价电子。高分子导电聚合物的电导率在石墨和锗之间，经溴、碘等掺杂，更可达铜以上的电导率。材料的导电性与导热性是正相关的，因此，可将高分子导电聚合物作为导热填料应用于导热胶，即可制成一种新型膏状导热胶，不仅具有高导热系数，而且导热填料与胶体同属于高分子类，具有很好的相容性。
发明内容
为解决上述技术问题，本发明提供一种含有导电高分子聚合物的膏状导热胶。
本发明采用的技术方案是：含有导电高分子聚合物的膏状导热胶，导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
优选地，各成分重量份数为：高分子聚合物35-45份，高分子导电聚合物导热填料5-50份，纳米陶瓷导热填料5-10份，纳米金属导热填料5-10份，功能碳材料5-30份。
优选地，高分子导电聚合物导热填料为聚乙炔、聚环氧乙烷、聚吡咯、聚苯硫醚、聚酞菁类化合物、聚苯胺、聚噻吩中的一种或任意组合的混合物。
优选地，高分子导电聚合物导热填料为本征高分子导电聚合物或经溴、碘和五氧化砷等掺杂的高分子导电聚合物。
优选地，纳米金属导热填料为纳米金属颗粒、纳米金属片、纳米金属线中的一种或任一组合的混合物。
优选地，纳米金属导热填料为纳米金、纳米银、纳米铜、纳米铝中的一种或任一组合的混合物。
优选地，高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、聚对苯二甲酸乙二酯、聚氯乙烯中的一种或任一组合的混合物。
优选的，功能碳材料为碳纳米管或石墨烯中的一种或混合物
本发明具有的优点和积极效果是：采用本方案制作的导热胶具有更高的导热系数(25W/(m·k)以上)，并且引入的高分子导电聚合物导热填料在同为高分子的胶体中的相容性更好，胶体质地均匀。
具体实施方式
本发明的发明点即在于提供了一种含导电高分子聚合物的新型膏状导热胶，能够制作具有25W/(m·k)以上的导热系数的膏状导热胶，并且该导热胶中导热填料在胶体中相容性更好，胶体质地均匀。
导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料，经研究发现，添加高分子导电聚合物的膏状导热胶可以获得好的导电导热性能；经多次试验比对得出添加如下质量分数个组分能够制备出导电系数高，力学强度高，机械性能好的导热胶，具体质量份数为：高分子聚合物35-45份，高分子导电聚合物导热填料5-50份，纳米陶瓷导热填料5-10份，纳米金属导热填料5-10份，功能碳材料5-30份。
高分子导电聚合物的分子具有大的共轭电子体系，其载流子是具有跨键移动能力的价电子，因此在导热胶中不仅可以起到更好的导热效果，而且还与胶体具有更好的相容性，胶体质地均匀。该导热填料采用本征高分子导电聚合物或经溴、碘和五氧化砷等掺杂的高分子导电聚合物，具体可采用聚乙炔、聚环氧乙烷、聚吡咯、聚苯硫醚、聚酞菁类化合物、聚苯胺、聚噻吩中的一种或任意组合的混合物作为填料，生产时可以根据应用范围和使用对象选择不同成分的高分子导电聚合物导热填料，再通过型号进行区分。
纳米陶瓷导热填料可以为纳米氧化锆、纳米氧化铝、纳米金刚石、纳米氮化硼、纳米氮化铝、纳米氧化铍之一或其混合物；纳米金属导热填料为纳米金属颗粒、纳米金属片、纳米金属线中的一种或任一组合的混合物，纳米材料为纳米金、纳米银、纳米铜、纳米铝中的一种或任一组合的混合物。
高分子聚合物是胶体的基体，起到粘合作用。可以是聚乙烯、聚丙乙烯、环氧树脂、聚对苯二甲酸乙二酯、聚氯乙烯中的一种或任一组合的混合物，功能碳材料属于导热填料中的一类，是利用此类新型碳材料自身特殊的结构，沿石墨片层进行热传导。该功能碳材料是碳纳米管或石墨烯中的一种或混合物。
实施例1：
一种含有导电高分子聚合物的膏状导热胶，其中导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
具体成分及各成分重量份数为：聚乙烯45份，聚环氧乙烷5份，纳米氧化铝10份，纳米金颗粒5份，碳纳米管30份。
实施例2：
一种含有导电高分子聚合物的膏状导热胶，其中导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
具体成分及各成分重量份数为：聚丙乙烯35份，聚乙炔20份，纳米氮化硼5份，纳米银片10份，石墨烯5份。
实施例3：
一种含有导电高分子聚合物的膏状导热胶，其中导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
具体成分及各成分重量份数为：环氧树脂40份，聚吡咯50份，纳米金刚石8份，纳米铝线8份，碳纳米管20份。
实施例4：
一种含有导电高分子聚合物的膏状导热胶，其中导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
具体成分及各成分重量份数为：聚对苯二甲酸乙二酯33份，聚噻吩40份，纳米氧化锆6份，纳米铜颗粒6份，石墨烯15份。
实施例5：
一种含有导电高分子聚合物的膏状导热胶，其中导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
具体成分及各成分重量份数为：聚乙烯20份，聚氯乙烯22份，聚苯硫醚35份，纳米氧化铝3份，纳米氮化硼3份，纳米银颗粒3份，纳米铝3份，石墨烯8份。
实施例6：
一种含有导电高分子聚合物的膏状导热胶，其中导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
具体成分及各成分重量份数为：
聚丙乙烯10份，环氧树脂30份，聚苯硫醚5份，聚酞菁类化合物5份，聚苯胺10份，纳米氧化铝10份，纳米银颗粒8份，碳纳米管25份。
以上对本发明的一个实施例进行了详细说明，但所述内容仅为本发明的较佳实施例，不能被认为用于限定本发明的实施范围。凡依本发明申请范围所作的均等变化与改进等，均应仍归属于本发明的专利涵盖范围之内。

Claims (10)

1.一种含有导电高分子聚合物的膏状导热胶，其特征在于：所述导热胶成分包括高分子聚合物，高分子导电聚合物导热填料，纳米陶瓷导热填料，纳米金属导热填料，功能碳材料。
2.根据权利要求1所述的含有导电高分子聚合物的膏状导热胶，其特征在于：各成分重量份数为：高分子聚合物35-45份，高分子导电聚合物导热填料5-50份，纳米陶瓷导热填料5-10份，纳米金属导热填料5-10份，功能碳材料5-30份。
3.根据权利要求1或2所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述高分子导电聚合物导热填料为聚乙炔、聚环氧乙烷、聚吡咯、聚苯硫醚、聚酞菁类化合物、聚苯胺、聚噻吩中的一种或任意组合的混合物。
4.根据权利要求1或2所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述高分子导电聚合物导热填料为本征高分子导电聚合物或经溴、碘和五氧化砷等掺杂的高分子导电聚合物。
5.根据权利要求3所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述纳米金属导热填料为纳米金属颗粒、纳米金属片、纳米金属线中的一种或任一组合的混合物。
6.根据权利要求4所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述纳米金属导热填料为纳米金属颗粒、纳米金属片、纳米金属线中的一种或任一组合的混合物。
7.根据权利要求6所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述纳米金属导热填料为纳米金、纳米银、纳米铜、纳米铝中的一种或任一组合的混合物。
8.根据权利1或2所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述纳米陶瓷填料为纳米氧化锆、纳米氧化铝、纳米金刚石、纳米氮化硼、纳米氮化铝、纳米氧化铍之一或其混合物
9.根据权利要求1或2所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述高分子聚合物为聚乙烯、聚丙乙烯、环氧树脂、聚对苯二甲酸乙二酯、聚氯乙烯中的一种或任一组合的混合物。
10.根据权利要求1或2所述的含有导电高分子聚合物的膏状导热胶，其特征在于：所述功能碳材料为碳纳米管或石墨烯中的一种或混合物。
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