CN107431280A - Anisotropic conductive connection method and anisotropic conductive connecting structure body - Google Patents
Anisotropic conductive connection method and anisotropic conductive connecting structure body Download PDFInfo
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- CN107431280A CN107431280A CN201680014131.2A CN201680014131A CN107431280A CN 107431280 A CN107431280 A CN 107431280A CN 201680014131 A CN201680014131 A CN 201680014131A CN 107431280 A CN107431280 A CN 107431280A
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- anisotropic conductive
- conductive film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/009—Cables with built-in connecting points or with predetermined areas for making deviations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/36—Insulated conductors or cables characterised by their form with distinguishing or length marks
- H01B7/361—Insulated conductors or cables characterised by their form with distinguishing or length marks being the colour of the insulation or conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A kind of anisotropic conductive connection method is provided, anisotropic conductive connects the 1st terminal column for being located at the 1st electronic unit（11）With the 2nd terminal column for being located at the 2nd electronic unit（41）, wherein including：By anisotropic conductive film（20）It is crimped on the 1st terminal column temporarily（11）On process；And by the 2nd terminal column（41）Formally it is crimped on anisotropic conductive film（20）On process, anisotropic conductive film（20）It is colored, the anisotropic conductive film in interim crimping（20）Colored state do not change, and anisotropic conductive film when formally crimping（20）Transmittance increase.
Description
Technical field
The present invention relates to anisotropic conductive connection method and anisotropic conductive connecting structure body.
Background technology
Such as disclosed in patent document 1~3, it is known that anisotropic conductive connects（Bonding）Multiple electronic units
（1st electronic unit, the 2nd electronic unit）Technology.These electronic units are for example as substrate.Here, set in each electronic unit
There is terminal column, the terminal column of each electronic unit is connected by anisotropic conductive each other.In the technology, generally through following process
Carry out anisotropic conductive and connect multiple electronic units.
First, to being located on the 1st terminal column of the 1st electronic unit interim stickup anisotropic conductive film（ACF）.Here,
PET is pasted with a face of anisotropic conductive film（Polyethylene terephthalate）The matrix material film of film etc..Therefore,
It is pasted onto when another of anisotropic conductive film is faced on the 1st terminal column.Here, it is decorated with the 1st electronic unit to fiducial mark
Note, is configured with the 1st terminal column on the inside of alignment mark.Thus, anisotropic conductive film is pasted onto the interior of alignment mark temporarily
Side.So, alignment mark shows the interim paste position of anisotropic conductive film（And the 2nd electronic unit loading position）Base
It is accurate.
Then, by the way that the heating pressing element of heating tool etc. is abutted into matrix material film, by anisotropic conductive film
It is crimped on the 1st terminal column temporarily.The temperature of heating tool when the temperature of heating tool during interim crimping is less than formal crimping.
Then, matrix material film is peeled off from anisotropic conductive film.Then, the 2nd electronic unit is carried in anisotropic conductive film.
This, on the 2nd electronic unit is positioned in a manner of making the 2nd terminal column for being located at the 2nd electronic unit opposed with the 1st terminal column,
It is carried in anisotropic conductive film.Specifically, the 2nd electro part carrying is to the inner side of alignment mark.Then, by that will add
Hot pressing element abuts to the 2nd electronic unit, and the 2nd terminal column is formally crimped onto in anisotropic conductive film.More than
Process, carry out anisotropic conductive and connect the 1st electronic unit and the 2nd electronic unit.
In above-mentioned technology, it is very important to make the 1st electronic unit and the connection of the 2nd electronic unit anisotropic conductive.Cause
This, in patent document 2, in order to confirm situation that the 1st electronic unit and the 2nd electronic unit are connected by anisotropic conductive, makes
Anisotropic conductive film contains the resin material of the color development under conditions of formal crimping.According to the technology, if formal crimping is pressed
Carried out according to condition set in advance, then anisotropic conductive film color development.Therefore, in patent document 2, confirm after formal crimping each
Anisotropy conducting film whether color development, so as to confirm whether the 1st electronic unit and the 2nd electronic unit are connected by anisotropic conductive.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2006-127956 publications
Patent document 2：Japanese Unexamined Patent Publication 11-307154 publications
Patent document 3：Japanese Unexamined Patent Publication 2007-91798 publications
Patent document 4：Japanese Unexamined Patent Publication 4-145180 publications.
The content of the invention
The invention problem to be solved
But the state of the anisotropic conductive film after formal crimping, can be by visuognosis anisotropic conductive film because formal
Crimp and carried out from the part of the 2nd electronic unit extrusion.In technology disclosed in patent document 2, due to anisotropic conductive
The extruding part of film is colored, so the colored state based on extruding part, carries out above-mentioned confirmation.However, with the energy of patent document 2
The temperature conditionss when item enough confirmed is simply thermally compressed after all.
On the other hand, in order that the 1st terminal and the connection of the 2nd terminal anisotropic conductive are, it is necessary to make taking for the 2nd electronic unit
Carry position and be also maintained at appropriate position after formal crimping.Thus, it is also desirable to confirm this point, but in patent document 2
Such confirmation is carried out but to be not easy to.Specifically, in patent document 2, because extruding part is colored, so being difficult to regard
Feel that identification is present in the alignment mark of the rear side of extruding part.Accordingly, there exist the loading position for being difficult to confirm the 2nd electronic unit
Whether also suitably maintained after formal crimping.Thus, in the technology disclosed in patent document 2, it is impossible to correctly confirm the 1st electricity
Whether anisotropic conductive connects for subassembly and the 2nd electronic unit.
And then connected by multiple electronic unit anisotropic conductives（Bonding）Technology in, by anisotropic conductive film
Correct position is crimped on temporarily（Position in this alignment mark）It is and very important.Therefore, expecting earnestly can be true
Recognize the technology that anisotropic conductive film is crimped on correct position temporarily, but such technology is not at all by motion.
For example, the resin material disclosed in patent document 2, the not color development under conditions of interim crimping.Thus, patent document
Anisotropic conductive film disclosed in 2, remain transparent in interim crimping.Thus, in the technology disclosed in patent document 2,
It is difficult to the situation for confirming that anisotropic conductive film is crimped on correct position temporarily.
On the other hand, in patent document 3, the irradiation using UV light is disclosed come the colour former of color development.However, the colour former
The not color development in interim crimping.That is, the anisotropic conductive film disclosed in patent document 3 also remains transparent in interim crimping.
Thus, in the technology disclosed in patent document 3, it could not at all solve the above problems.
In addition, in patent document 4, the anisotropically conducting adhesive to change colour under conditions of formal crimping is disclosed.Should
Anisotropically conducting adhesive is colored in interim crimping.Thus, in the technology disclosed in patent document 4, it is able to confirm that
Anisotropic conductive film is crimped on the situation of correct position temporarily.However, in the technology, anisotropic conductive film is formally being pressed
The problem of being also colored after connecing, therefore being difficult to the rear side of visuognosis extruding part after the formal crimping of presence.
Therefore, the present invention conceives in view of the above problems, and it is an object of the invention to provide can more correctly confirm
Anisotropic conductive film is crimped on the situation of correct position temporarily and the 1st electronic unit and the 2nd electronic unit anisotropy are led
Situation, novel and improvement the anisotropic conductive connection method of electrical connection and anisotropic conductive connecting structure body.
For solving the scheme of problem
In order to solve above-mentioned problem, a certain viewpoint according to the present invention, there is provided anisotropic conductive connection method, be anisotropy
It is conductively connected the anisotropic conductive for being located at the 1st terminal column of the 1st electronic unit He being located at the 2nd terminal column of the 2nd electronic unit
Connection method, it is included：Process anisotropic conductive film being crimped on temporarily on the 1st terminal column；And by the 2nd terminal column just
Formula is crimped on the process in anisotropic conductive film, and anisotropic conductive film is colored, the anisotropic conductive in interim crimping
The colored state of film does not change, and when formally crimping anisotropic conductive film transmittance increase.
Here, anisotropic conductive film can also be with being drawn in the 1st electronic unit, the 1st terminal column and the 1st electronic unit
The similar color dyes of any one of alignment mark.
Coloured alternatively, it is also possible to the 1st electronic unit with transparent or netrual colour, anisotropic conductive film with the 1st terminal column
And any one similar color dyes of alignment mark.
In addition, the 1st electronic unit is alternatively ceramic substrate.
Other viewpoints according to the present invention, there is provided the anisotropic conductive made by above-mentioned anisotropic conductive connection method
Connecting structure body.
According to the above-mentioned viewpoint of the present invention, in interim crimping, the colored state of anisotropic conductive film will not change, because
This can more correctly confirm that anisotropic conductive film is crimped on the situation of correct position temporarily.And then formally crimping
When anisotropic conductive film transmittance increase, therefore can more correctly confirm to carry out according to condition set in advance formal
The situation of crimping.And then it is capable of the rear side of the easily extruding part of visuognosis anisotropic conductive film, therefore can be more
The loading position for correctly confirming the 2nd electronic unit is added to maintain in position.Thus, it is possible to more correctly confirm the 1st
The anisotropic conductive of electronic unit and the 2nd electronic unit connects.
Invention effect
As described above according to the present invention, it can more correctly confirm that anisotropic conductive film is crimped on correctly temporarily
Position situation and the 1st electronic unit and the 2nd electronic unit situation about being connected by anisotropic conductive.
Brief description of the drawings
[Fig. 1] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Fig. 2] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Fig. 3] is the top view for illustrating the anisotropic conductive connection method involved by embodiments of the present invention.
[Fig. 4] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Fig. 5] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Fig. 6] is the top view for illustrating the anisotropic conductive connection method involved by embodiments of the present invention.
[Fig. 7] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Fig. 8] is the top view for illustrating the anisotropic conductive connection method involved by embodiments of the present invention.
[Fig. 9] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Figure 10] is the lateral section for illustrating the anisotropic conductive connection method involved by embodiments of the present invention
Figure.
[Figure 11] is the top view for illustrating the anisotropic conductive connection method involved by embodiments of the present invention.
Embodiment
Following one side referring to the drawings, while the preferred embodiment of the present invention is described in detail.In addition, in this explanation
In book and accompanying drawing, for the structural element with substantially the same functional structure, repetition is omitted by marking identical label
Explanation.
The structure ＞ of the anisotropic conductive films of ＜ 1.
In the present embodiment, using the anisotropic conductive film 20 shown in Fig. 7, carry out anisotropic conductive connection and be arranged on substrate
Substrate 10（1st electronic unit）The 1st terminal 11 and be arranged on flexible base board 40（2nd electronic unit）The 2nd terminal 41.Cause
This, first, illustrates to the structure of the anisotropic conductive film 20 involved by present embodiment.Anisotropic conductive film 20 to
Less resin, propylene polymerization compound, thermal cure initiators, colouring agent and electroconductive particle are formed comprising film.
It is the resin for keeping anisotropic conductive film 20 with film shape that film, which forms resin,.As long as film, which forms resin, to be made
Resin is formed with the film for existing anisotropic conductive film 20 to be just not particularly limited.Resin is formed as film, being capable of use example
Such as epoxy resin, phenoxy resin, polyester urethane resin, polyester resin, polyurethane（polyurethane）Resin, propylene tree
The various resins of fat, polyimide resin, butyral resin etc..In addition, in the present embodiment, both only it can use these films
Any one, can also be combined two or more and use among formation resin.In addition, from making film formative and bonding reliable
Property it is good from the viewpoint of, film formed resin be preferably phenoxy resin.
Propylene polymerization compound is the resin solidified because of heat together with thermal cure initiators.The propylene polymerization of solidification
Property compound is bonded the 1st terminal column and the 2nd terminal column in bond layer 20a described later, and electroconductive particle is maintained at
In bond layer 20a.
Propylene polymerization compound is in monomer of the intramolecular with the acrylic of 1 or more than 2, oligomer or pre-
Polymers.As propylene polymerization compound, such as methyl acrylate, ethyl acrylate, isopropyl acrylate, acrylic acid can be enumerated
Isobutyl ester, epoxy acrylate, glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane tris acrylic acid
Ester, dihydroxymethyl tricyclic decane diacrylate, 1,4- butanediols tetraacrylate, the acryloyl-oxies of 2- hydroxyls -1,3- two
Double ［ 4- (acryloyl-oxy ylmethoxy) phenyl ］ propane of base propane, 2,2-, double ［ 4- (acryloyloxyethoxy) benzene of 2,2-
Base ］ propane, dicyclopentenyl acrylate, three ring certain herbaceous plants with big flowers base acrylate, three (acryloyl-oxyethyl) isocyanuric acid esters, amino
Acrylate etc..
In the present embodiment, both can use the above-mentioned propylene polymerization compound enumerated among it is any, can also
Combination is any two or more and uses.
Thermal cure initiators are the materials solidified by heat together with aforesaid propylene polymerizable compound.The inventors discovered that
In the case where using specific thermal cure initiators as thermal cure initiators, colouring agent will not fade during interim crimping,
And the color of colouring agent disappears in formal crimping（That is, the transmittance increase of anisotropic conductive film）.Specifically, this implementation
The thermal cure initiators of mode include di-tert-butyl peroxide hexahydro terephthalic acid ester（ジ-t- Block チ Le パ-オ キ シ
ヘキサヒドロテレフタレート）.The thermal cure initiators of present embodiment can also further include di-t-butyl mistake
Aoxidize the known thermal cure initiators beyond hexahydro terephthalic acid ester.In addition, the amount of thermal cure initiators is without spy
Do not limit, as long as being the amount suitable for known anisotropic conductive film 20.
Colouring agent is the material coloured to anisotropic conductive film 20.The species of colouring agent is not particularly limited, such as
Fruit is that the colouring agent for present embodiment can be just can serve as suitable for the colouring agent of existing anisotropic conductive film 20.Example
Such as, the colouring agent as present embodiment, various pigments, dyestuff, pigment etc. can be used.
Here, as described later, basal substrate 10 be present（1st electronic unit）, the 1st terminal 11, the 1st wiring pattern 12,
And any one of alignment mark 10a is by with the situation of colour coloring.Hereinafter, these components are also referred to as " basal component ".At this
In the case of, the color of colouring agent is preferably color similar with the basal component coloured with colour.Here, the color of basal component
" similar color " refer to it is close with the color of basal component on hue circle（But and differ）Color.It is more specific and
Speech, it is 4 parts by hue circle even partition.Here, so that the color configuration of basal component is in any one divided region（With
Under, also referred to as " cut zone "）The mode at center hue circle is divided into 4 parts.Moreover, point belonging to the color of basal component
Cutting the color in region and same area turns into " the similar color " of color of basal component.It is the color of colouring agent, i.e. each to different
Property the color of conducting film 20 and in the case that the color of basal component turns into similar color, improve anisotropy during interim crimping
The visibility of conducting film 20.Thereby, it is possible to easily confirm whether anisotropic conductive film 20 is crimped on correct position temporarily
Put.In addition, color differs the area for referring in the case where hue circle is divided into more than 24 parts, be present in different segmentations
Domain.
In addition, the area of basal substrate 10 is maximum among basal component.Therefore, among the color of basal component, substrate base
The color of plate 10 is most obvious.Therefore, the color of anisotropic conductive film 20 is similar face most preferably with the color of basal substrate 10
Color.But the situation for also thering is basal substrate 10 to be coloured with the coloring of transparent or netrual colour, other basal components with colour.
In this case, the color of anisotropic conductive film 20 is strikingly color as described later, or for the 1st terminal 11 and being aligned
Mark 10a any one similar color.
Here, the color as basal substrate 10（It is colored）, can enumerate for example dark brown（Delustring is dark brown）, not good merchantable, shallow tea
Color, crocus, green etc..Moreover, as dark brown, not good merchantable, shallow dark brown similar color, such as crocus, red can be enumerated
Deng.In addition, the similar color as crocus, can be enumerated such as yellow, red.As the similar color of green, can enumerate
Such as yellow green etc..
In addition, the color as the 1st terminal 11, the 1st wiring pattern 12 and alignment mark 10a（It is colored）, can enumerate for example
Gold etc..Moreover, the similar color as gold, can be enumerated such as red, crocus, yellow green.
In addition, basal component is present by with netrual colour（Such as milky, silver color）The situation of coloring.In addition, basal substrate
10 and the 1st terminal 11 also has with transparent component（Such as glass, ITO）The situation of composition.Moreover, all turn into basal component
Netrual colour or it is transparent in the case of, the color of anisotropic conductive film 20 is preferably with easily by the distinct of visual visuognosis
Color dyes.Here, strikingly color refers to, when detecting color by CCD etc. detector, than other colors be more prone to
Detect the residual quantity of peak value（That is, the peak value detected relative to strikingly color（Peak value of magnitude of voltage etc.）Than relative to other
The peak value that color detection goes out is more prone to distinguish）Color.As strikingly color, can enumerate for example centered on crocus
Color in above-mentioned cut zone.
Electroconductive particle is the material that anisotropic conductive connects the 1st terminal column and the 2nd terminal column in bond layer 20a
Material.Specifically, the electroconductive particle seized on both sides by the arms in bond layer 20a by the 1st terminal column and the 2nd terminal column, the 1st terminal column is made
Turned on the 2nd terminal column.On the other hand, other electroconductive particles（For example, the electric conductivity into 11 mutual gap of the 1st terminal
Particle, the electroconductive particle into 41 mutual gap of the 2nd terminal）It is dispersed in bond layer 20a, therefore will not leads mutually
It is logical.Therefore, electroconductive particle can maintain the 1st terminal 11 each other and the 41 mutual insulation of the 2nd terminal in bond layer 20a
Property, further, it is possible to turn on the 1st terminal column and the 2nd terminal column.That is, electroconductive particle anisotropy in bond layer 20a is led
Electrically connect the 1st terminal column and the 2nd terminal column.
The species of electroconductive particle is not particularly limited.As electroconductive particle, such as metallic and metal bag can be enumerated
Cover resin particle etc..As metallic, metallic such as nickel, cobalt, copper, silver, gold or palladium etc. can be enumerated.As gold
Belong to resin-coated particle, can enumerate such as with the metallic cover styrene-divinylbenzene combined polymerization nickel, copper, gold or palladium
The core tree of thing, benzoguanamine resin, cross-linked polystyrene resin, allyl resin or styrene-silica compound resin etc.
Particle on surface of fat granule etc..Gold or palladium membranes can also be formed on the surface of electroconductive particle or is formed thin to crimping
When the insulating resin film of degree that can be destroyed etc..
The anisotropic conductive film 20 of present embodiment can also include the photocuring for making propylene polymerization compound cures
Initiator.The species of trigger for optical solidification is not particularly limited.As trigger for optical solidification, such as optical free radical aggretion type can be enumerated
Curing agent etc..
In addition, in anisotropic conductive film 20, in addition to mentioned component, various additives etc. can also be included.Make
For can to anisotropic conductive film 20 add additive, can enumerate silane coupler, inorganic filler, antioxidant and
Antirust agent etc..The species of silane coupler is not particularly limited.As silane coupler, such as epoxies, amine, mercapto can be enumerated
Base/sulfide-based, ureide derivative silane coupler etc..The situation of these silane couplers is being added to anisotropic conductive film 20
Under, it is possible to increase to the cementability of the inorganic substrate of glass substrate etc..
In addition, inorganic filler is for adjusting the mobility of anisotropic conductive film 20 and the additive of film-strength.Nothing
The species of machine filler is also not particularly limited.As inorganic filler, can enumerate for example silica, talcum, titanium oxide, calcium carbonate,
Magnesia etc..
The anisotropic conductive connection method ＞ of ＜ 2.
Then, based on Fig. 1~Figure 10, the anisotropic conductive connection method involved by present embodiment is illustrated.In addition,
In the following description, anisotropic conductive is connected to the 2nd end on the 1st terminal 11 and flexible base board 40 on basal substrate 10
The situation of son 41 illustrates anisotropic conductive connection method as an example.Basal substrate 10 is one of the 1st electronic unit
Example, flexible base board 40 are an example of the 2nd electronic unit.Certainly, these electronic units are not limited to substrate.For example, the 2nd electricity
Subassembly is alternatively to form the IC chip of multiple salient points as the 2nd terminal column etc..
First, as shown in figure 1, carrying basal substrate 10 on sample bench 100.Here, the species of basal substrate 10 is without spy
Do not limit.As the species of basal substrate 10, can enumerate such as glass substrate, rigid substrates and ceramic substrate.Glass substrate
For transparent substrate.Additionally, there are on the surface of glass substrate formed with some films（Oxide-film）Deng the situation of the film color development.
In this case, the color of film can also be considered as to the color of glass substrate.Rigid substrates and ceramic substrate it is with good grounds they
Material is with various colored, netrual colour coloring situations.For example, rigid substrates have with the situation of milky white chromatic colorant.Ceramic substrate has
With dark brown（Delustring is dark brown）The situation of coloring.
Here, in the case where basal substrate 10 is ceramic substrate, it is equipped with compares in basal substrate 10 in most cases
The electronic unit of high price.For example, ceramic substrate can serve as the substrate for camera module, but form the electronics of camera module
Part is mostly high price thing.Therefore, bad frequency occurs, it is necessary to reduce as far as possible in the case where basal substrate 10 is ceramic substrate
Rate.That is, the formal crimping of the interim crimping of anisotropic conductive film 20, the 2nd terminal 41 to anisotropic conductive film 20 needs more
Add correct and reliably carry out.This point, in the present embodiment, it can more correctly confirm that anisotropic conductive film 20 is faced
When be crimped on the situation of correct position.And then can more correctly confirm basal substrate 10 and flexible base board 40 by it is each to
The situation that the opposite sex is conductively connected.Thus, in the case where basal substrate 10 is ceramic substrate, the effect that present embodiment is brought is more
Add and significantly embody.
In addition, the 1st terminal 11 and the 1st wiring pattern 12 are provided with basal substrate 10.It is provided with basal substrate 10 more
Individual 1st terminal 11.1st terminal 11 is parallel each other, and the 1st terminal column is formed by multiple 1st terminals 11.
The material of the 1st terminal 11 is formed, is just not particularly limited as long as there is electric conductivity.As the material for forming the 1st terminal 11
Material, can enumerate the metal such as aluminium, silver, nickel, copper and gold；Tin indium oxide（ITO）, indium zinc oxide（IZO）, indium oxide, conduction
Property tin oxide, antimony tin oxide（ATO）And the conductive metal oxide of electroconductive zinc oxide etc.；Polyaniline, polypyrrole and
Electroconductive polymer of polythiophene etc. etc..The metal for forming the 1st terminal 11 can also be by various metal-plateds.Such as described later
In embodiment, the 1st terminal 11 being made up of gold-plated and nickel copper is formd.In this case, the 1st terminal 11 can be colored as gold
Color.
1st wiring pattern 12 is the wiring pattern extended from the 1st terminal 11, and is arranged on basal substrate 10.Form the 1st
The material of wiring pattern 12 and the 1st terminal 11 are same.1st terminal 11 and the 1st wiring pattern 12 according to their material with
Various colored, netrual colour colorings.For example, the 1st terminal 11 and the 1st wiring pattern 12 have the situation for being colored as gold.
In addition, in basal substrate 10, as shown in figure 3, being decorated with alignment mark 10a.Alignment mark 10a is to represent anisotropy
The mark of the benchmark of the set location of the interim paste position and flexible base board 40 of conducting film 20.Thus, although omitting in figure 3
Diagram, but it is configured with the 1st terminal column in alignment mark 10a.Moreover, in the present embodiment, alignment mark 10a's
Inner side sets the leading section of flexible base board 40.Thus, anisotropic conductive film 20 also crimps temporarily in the position.Alignment mark
10a is coloured with various colored, netrual colours.For example, alignment mark 10a is in the feelings that basal substrate 10 is rigid substrates or ceramic substrate
Under condition, have with the situation of gold coloring.In addition, alignment mark 10a has with silver in the case where basal substrate 10 is glass substrate
The situation of chromatic colorant.
Then, as shown in Figures 2 and 3, the anisotropy involved by present embodiment is pasted temporarily in alignment mark 10a
Conducting film 20.Here, be configured with the 1st terminal column in alignment mark 10a, therefore anisotropic conductive film 20 is interim is pasted onto the
On 1 terminal column.In addition, it is pasted with matrix material film 30 in anisotropic conductive film 20.Thus, here, in anisotropic conductive
One face of film 20 is pasted with PET（Polyethylene terephthalate）The matrix material film 30 of film etc..Therefore, by anisotropy
Another of conducting film 20 is pasted onto in alignment mark 10a when facing.Here, matrix material film 30 supports anisotropic conductive film
20, for example, in PET（Polyethylene terephthalate：Poly Ethylene Terephthalate）、OPP（Orient poly- third
Alkene：Oriented Polypropylene）、PMP（Poly 4-methylpene-1：Poly-4-methylpentene-1）、
PTFE（Polytetrafluoroethylene (PTFE)：Polytetrafluoroethylene）Etc. the remover for being coated with silicone etc..Matrix material film 30 is anti-
The only drying of anisotropic conductive film 20, and maintain the shape of anisotropic conductive film 20.
Then, as shown in figure 4, padded coaming 200 is arranged on matrix material film 30.Then, by by heating tool
Deng heating pressing element 300 abut to padded coaming 200, so as to which anisotropic conductive film 20 is crimped on into the 1st terminal temporarily
Row.Pressed temperature, plus-pressure during interim crimping are, for example, 60~80 DEG C, 1~2MPa.Pressing time can lead according to anisotropy
Material of electrolemma 20 etc. and suitably adjust, but be at least set as that anisotropic conductive film 20 can be allowed to be fixed on basal substrate 10
Degree value.The pressed temperature when temperature of pressed temperature, i.e. heating pressing element is less than formal crimping described later.So
Interim crimping when under conditions of, the colored state of anisotropic conductive film 20（Form and aspect, the deep or light of color, transmittance etc.）Will not
Change.
Then, as shown in Figures 5 and 6, matrix material film 30 is peeled off from anisotropic conductive film 20.Here, respectively to different
Property conducting film 20 colored state will not change because of interim crimping.Thus, anisotropic conductive film 20 is after interim crimping
Fully coloured（Do not fade）.Therefore, it is possible to more correctly confirm that anisotropic conductive film 20 is crimped on just temporarily
True position, the situation i.e. in alignment mark 10a.
Here, in basal component（Such as basal substrate 10）In the case of being coloured with colour, anisotropic conductive film 20 is excellent
Choosing is with color dyes similar with the color of basal component.In addition, situation about being coloured in basal component with all transparent or netrual colour
Under, the color of anisotropic conductive film 20 is preferably coloured with strikingly color.The color and substrate structure of anisotropic conductive film 20
The detailed relation of the color of part is as described above.In the case of so color of selection anisotropic conductive film 20, improve each
The visibility of anisotropy conducting film 20.Shown in embodiment as be described hereinafter, anisotropic conductive film 20 is recognized in direct vision
Situation and via CCD camera carry out visuognosis（The shooting image that i.e. visuognosis is obtained by CCD camera）Feelings
Under condition both of these case, the visibility of anisotropic conductive film 20 is improved.In addition, in the color of anisotropic conductive film 20
In the case of color similar with the color of basal component, moreover it is possible to expect to reduce the fatigue of observer.
In addition, in recent years, the feelings that automatic identification anisotropic conductive film 20 is crimped on correct position are temporarily also inquired into
The technology of condition.In the technology, anisotropic conductive film 20 and its periphery are shot using CCD camera etc., and make automatic identification
Device identifies shooting image.Moreover, automatic identification equipment is based on shooting image, judge whether anisotropic conductive film 20 presses temporarily
It is connected on correct position.In the case where the color of anisotropic conductive film 20 is color similar with the color of basal component, energy
Expect the precision of raising automatic identification.
Then, as shown in Figures 7 and 8, the leading section of flexible base board 40 is carried in anisotropic conductive film 20.More specifically
For, the leading section of flexible base board 40 is equipped in alignment mark 10a.Be configured with alignment mark 10a the 1st terminal column and
Anisotropic conductive film 20.Thus, flexible base board 40 is positioned in a manner of making the 2nd terminal column opposed with the 1st terminal column, herein
On the basis of, it is carried in anisotropic conductive film 20.
Here, flexible base board 40 is the substrate formed by flexible and high flexibility material.Form the material of flexible base board 40
Material is not particularly limited, and present embodiment is also can be suitably used for suitable for the material of known flexible base board.As the flexible base of composition
The material of plate 40, such as polyethylene terephthalate, PEN, polyether sulfone, polyethylene, poly- carbonic acid
Beyond the resin of ester, polyimides and allyl resin etc., metal or glass of filming etc. can be enumerated.
2nd terminal 41 is provided with multiple in the leading section of flexible base board 40.2nd terminal 41 is each parallel to each other, passes through
Multiple 2nd terminals 41 form the 2nd terminal column.2nd terminal 41 is each connected with the anisotropic conductive of the 1st terminal 11.That is, the 1st end
Son row connect with the 2nd terminal column anisotropic conductive.Material and the 1st terminal 11 for forming the 2nd terminal 41 are same.
2nd wiring pattern 42 is from the wiring pattern of the 2nd terminal column extension, is arranged on basal substrate 10.Form the 2nd cloth
The material of line pattern 42 and the 1st terminal 11 are same.
Then, as shown in figure 9, the 2nd terminal column is formally crimped on into anisotropic conductive film 20.Specifically, will buffer
Material 200 is arranged on flexible base board 40.Then, by the way that heating pressing element 300 is connected into padded coaming 200, by the 2nd end
Son row are formally crimped in anisotropic conductive film 20.Pressed temperature, plus-pressure during formal crimping is because of anisotropic conductive film
Deng material and changed, but at least set in the range of 120~190 DEG C, 0.5~8MPa.Pressing time energy
Material according to anisotropic conductive film 20 etc. and suitably adjusted, but being at least set in flows anisotropic conductive film 20
The value of dynamic, solidification degree.
Thus, a part for anisotropic conductive film 20 is remained between the 1st terminal column and the 2nd terminal column, and remainder is the 1st
Between terminal 11, between the 2nd terminal 41 or outside of the 1st terminal column and the 2nd terminal column flowing.Then, respectively to different
Property conducting film 20 solidifies, and turns into bond layer 20a.Among bond layer 20a, remain between the 1st terminal column and the 2nd terminal column
Partially ON 1st terminal column and the 2nd terminal column, but other parts maintain insulating properties.Thus, for example, the 1st terminal 11 that
This and the 2nd terminal 41 are insulated each other.Thus, bond layer 20a anisotropic conductives connect the 1st terminal 11 and the 2nd terminal
41.That is, bond layer 20a anisotropic conductives connection basal substrate 10 and flexible base board 40.Among bond layer 20a, the 1st
The part of the outside of terminal column and the 2nd terminal column flowing, so-called extruding part, turn into the object of observed person's observation.Scheming
11 show to form the situation of extruding part.
The transmittance increase because of formal crimping of anisotropic conductive film 20.That is, the color of anisotropic conductive film 20 disappears.
Thus, the situation that the color by confirming extruding part disappears, it is able to confirm that out that being formally crimped on condition set in advance is carried out
Situation.And then due to the transmittance increase of extruding part, it is capable of the rear side of fully visuognosis extruding part.Figure 11
In shown example, can fully visuognosis be present in extruding part rear side alignment mark 10a.Therefore, it is possible to hold
Easily confirm that the loading position of flexible base board 40 after formally crimping also suitably maintains after formal crimping.
Process more than, can make what basal substrate 10 connected with the anisotropic conductive of flexible base board 40（It is more detailed
For thin, the 1st terminal column and the connection of the 2nd terminal column anisotropic conductive）Anisotropic conductive connecting structure body.Hereinafter,
Anisotropic conductive connecting structure body is only called " connecting structure body ".As shown in Figure 10, connecting structure body possesses：Basal substrate
10；1st terminal column；1st wiring pattern 12；Flexible base board 40；2nd terminal 41；2nd wiring pattern 42；And bond layer
20a。
Embodiment
（The making of anisotropic conductive film）
（Embodiment 1）
By mixing phenoxy resin（The name of an article：YP-50, Nippon Steel live King Company's system）40 mass parts, propylene monomer（The name of an article：
ARONIX M-315, East Asia Synesis Company system）15 mass parts, amino acrylate oligomer（The name of an article：ARONIX M1600, east
Sub- Synesis Company's system）25 mass parts, rubber constituent（The name of an article：SG80H, NAGASE CHEMTEX company systems）5 mass parts, propylene
Phosphorus acid monomer（The name of an article：Light Ester P-1M, chemical company of common prosperity society system）1 mass parts, thermal cure initiators（The name of an article：
KAYA Ester HTP-65W, KAYAKU AKZO（Chemical drug ア Network ゾ）Company system）3 mass parts, colouring agent（The name of an article：Kayaset
Orange A-N, Japanese chemical drug company system）0.3 mass parts, electroconductive particle（It is coated with Ni and Au allyl resin particle, particle diameter
10μm）5 mass parts, have made adhesive composite.Moreover, adhesive composite is coated in 50 μm of thickness using bar coater
Matrix material film（PET systems, sur-face peeling processing）And it is subject to drying, so as to obtain the anisotropic conductive film of 25 μm of thickness.
KAYA Ester HTP-65W are the thermal cure initiators for including di-tert-butyl peroxide hexahydro terephthalic acid ester.Respectively to different
Property conducting film using colouring agent with orange chromatic colorant.
（Embodiment 2）
Except colouring agent to be changed to " Kayaset Blue A-2R "（Japanese chemical drug company system）Carry out in addition same with embodiment 1
The processing of sample, so as to obtain the anisotropic conductive film of thickness same as Example 1.The anisotropic conductive film utilizes coloring
Agent is with blue-colored.
（Embodiment 3）
Except colouring agent to be changed to " Kayaset Green A-B "（Japanese chemical drug company system）Carry out in addition same with embodiment 1
The processing of sample, so as to obtain the anisotropic conductive film of thickness same as Example 1.The anisotropic conductive film utilizes coloring
Agent is with green coloring.
（Comparative example 1）
" NYPER BW " are changed to except being thermally cured initiator（Nof Corp.'s system）Carry out in addition similarly to Example 1
Processing, so as to obtain the anisotropic conductive film of thickness same as Example 1." NYPER BW " are to include benzoyl peroxide
Thermal cure initiators.The anisotropic conductive film is using colouring agent with orange chromatic colorant.
（The making of evaluation connecting structure body）
（Embodiment 4）
As basal substrate, ITO pattern glass is prepared.In the ITO pattern glass, with 200 μm of spacing formed with by ITO structures
Into the 1st terminal.In addition, the height of the 1st terminal is 2000, the thickness of glass part is 0.4mm.In addition, in the 1st terminal column
Periphery be decorated with the alignment mark of silver color.The shape of alignment mark is the shape shown in Fig. 3.Thus, basal substrate and the 1st terminal
It is classified as transparent, alignment mark is silver color（Netrual colour）.
In addition, as flexible base board, the flexible base board of polyimides is prepared.The thickness of flexible base board is 25 μm.Separately
Outside, the 2nd terminal formed in the flexible base board with 200 μm of spacing formed with the copper by having plated gold and nickel.The height of 2nd terminal is
12μm.In addition, flexible base board is the substrate of long chi, the 2nd terminal column is configured with its leading section.In addition, anisotropic conductive connects
Connect is to utilize bridge manufacturing company CCM（Camera module）Carried out with ACF connectors.The connector in-built CCD shines
Camera, each component can be shot using CCD camera.In addition, observer is capable of the shooting image of visuognosis CCD camera.
Then, basal substrate is set in sample bench.Then, in alignment mark it is interim paste made by embodiment 1 it is each
Anisotropy conducting film.Here, being pasted with matrix material film in a face of anisotropic conductive film, therefore another face is pasted
In alignment mark.
Then, the silicone rubber membrane of 200 μm of thickness is provided with matrix material film as padded coaming.Then, to buffering
Material abuts width 2.0mm heating tool, so as to which anisotropic conductive film to be crimped on to the 1st terminal column temporarily.Interim crimping
When pressed temperature, plus-pressure, pressing time be set to 50 DEG C, 1MPa, 7 seconds.The pressing position of heating tool is the 1st terminal column
Surface.Then, matrix material film is peeled off from anisotropic conductive film.Then, anisotropy when have rated interim crimping is led
The visibility of electrolemma.Specific evaluation method is aftermentioned.
Then, the leading section of flexible base board is equipped with anisotropic conductive film.More specifically, by flexible base board
Leading section is mounted in alignment mark.Then, it is provided with the silicon rubber of 200 μm of thickness on flexible substrates as padded coaming
Film.Then, width 2.0mm heating tool is abutted to padded coaming, is led so as to which the 2nd terminal column is formally crimped on into anisotropy
On electrolemma.That is, bond layer is formd between the 1st terminal column and the 2nd terminal column.Pressed temperature, pressurization during formal crimping
Power, pressing time be set to 140 DEG C, 2MPa, 7 seconds.Then, it have rated the visibility of the bond layer after formal crimping.Tool
The evaluation method of body is aftermentioned.Moreover, attempt 100 above-mentioned experiments.
（Embodiment 5）
As basal substrate, the dark brown ceramic substrate of delustring is prepared.In the ceramic substrate with 200 μm of spacing formed with by plating
The 1st terminal that the copper of gold and nickel is formed.In addition, the height of the 1st terminal is 10 μm, the thickness of ceramic substrate is 0.4mm.In addition,
The alignment mark of gold is decorated with the periphery of the 1st terminal column.The shape being shaped as shown in Fig. 3 of alignment mark.Thus, ceramic base
The color of plate is that delustring is dark brown（It is colored）, the color of the 1st terminal column and alignment mark is gold（It is colored）.Utilize the basal substrate
Processing is similarly to Example 4 carried out.
（Embodiment 6）
Processing similarly to Example 5 has been carried out in addition to using the anisotropic conductive film made by embodiment 2.
（Embodiment 7）
Processing similarly to Example 5 has been carried out in addition to using the anisotropic conductive film made by embodiment 3.
（Embodiment 8）
As basal substrate, milky rigid substrates are prepared.In the rigid substrates with 200 μm of spacing formed with by having plated gold
And the 1st terminal that the copper of nickel is formed.In addition, the height of the 1st terminal is 35 μm, the thickness of rigid substrates is 0.95mm.In addition,
It is decorated with the alignment mark of gold in the periphery of 1st terminal column.The shape being shaped as shown in Fig. 3 of alignment mark.Thus, ceramic substrate
Color be milky（Netrual colour）, the color of the 1st terminal column and alignment mark is gold（It is colored）.Entered using the basal substrate
The processing gone similarly to Example 4.
（Comparative example 2）
Processing similarly to Example 4 has been carried out in addition to using the anisotropic conductive film made by comparative example 1.
（Comparative example 3）
The processing same with comparative example 2 has been carried out in addition to using the ceramic substrate of embodiment 5.
（Comparative example 4）
The processing same with comparative example 2 has been carried out in addition to using the rigid substrates of embodiment 8.
（The evaluation of visibility）
In evaluation in interim crimping, direct vision identification and via CCD and anisotropy that visuognosis crimps temporarily is led
Electrolemma, judge to judge that anisotropic conductive film is present in alignment mark within 1 second.Moreover, the trial of 100 times is whole
The situation that above-mentioned judgement can be carried out is evaluated as " A ", is had the trial of more than 90 times to carry out the situation of above-mentioned judgement in 100 times and is commented
Valency is " B ", has the trial less than 90 times to carry out the situation of above-mentioned judgement in 100 times and is evaluated as " C ".
In evaluation after formal crimping, direct vision identification and the visuognosis extrusion of bond layer via CCD
Part.Moreover, determined the extruding part that bond layer whether can be all judged within 1 second color disappear situation, with
And flexible base board is carried to the situation in alignment mark.If the color of extruding part disappears, it is referred to as formally crimping according to pre-
The condition first set is carried out.And then if flexible base board is carried in alignment mark, referred to as the loading position of flexible base board is tieed up
Hold in position.Thus, by confirming above-mentioned item, it is able to confirm that the anisotropic conductive of basal substrate and flexible base board
Connection.Moreover, the situation that the trial that have 95 times in 100 times can all be carried out to above-mentioned judgement is evaluated as " A ", by 100 times
There is the trial of more than 90 times to carry out the situation of above-mentioned judgement and be evaluated as " B ", the trial in 100 times less than 90 times can be carried out
The situation for stating judgement is evaluated as " C ".Evaluation result is collected and is shown in Table 1.
[table 1]
（Table 1）
In embodiment 4~8, good result can be obtained.That is, in embodiment 4~8, the anisotropic conductive after interim crimping
The color of film also fully remains, therefore being capable of easy visuognosis anisotropic conductive film.In addition, bonding agent after formal crimping
The color of layer fully disappears, and adds the transmittance of bond layer.Therefore, it is possible to easily confirm bond layer after formal crimping
Color disappear situation.As a result, it can easily confirm that formal crimping is carried out according to condition set in advance.And then can
The rear side of easy visuognosis extruding part.Therefore, it is possible to easily confirm that it is appropriate that the loading position of flexible base board maintains
Position.In addition, either direct vision identification still can obtain same result via CCD visuognosis.Thus, in profit
With in CCD automatic identification equipment, also expecting that correct automatic identification can be carried out.
Here, in embodiment 4, basal component is transparent or netrual colour, in contrast, anisotropic conductive film is with distinctness
Color（Crocus）Coloring.In addition, in embodiment 5, anisotropic conductive film is with color dyes similar with the color of basal substrate.
In embodiment 8, basal substrate is milky, in contrast, anisotropic conductive film is coloured with strikingly color.In addition, respectively to
The color of anisotropic conductive film also turns into the color with the 1st terminal（It is golden）Similar color.On the other hand, embodiment 6,7 it is each to
The color of anisotropic conductive film turns into the inhomogeneous color of any color with basal component.Therefore, in the evaluation crimped temporarily
In, embodiment 4,5,8 can be obtained than 6,7 better result of embodiment.
On the other hand, comparative example 2~4 has obtained the evaluation lower than embodiment 4~8 in the evaluation crimped temporarily.Than
Compared with example 2~4, the color of anisotropic conductive film can almost disappear during crimping temporarily, therefore be evaluated as such.In addition,
Extruding part after formal crimping turns into substantially transparent, therefore the evaluation after formal crimping turns into and embodiment 4~8 is same comments
Valency.But the color of anisotropic conductive film has almost disappeared before formal crimping, therefore in comparative example 2~4, it is impossible to
Correctly judge formally whether to crimp according to condition set in advance.
（Conducting resistance determines）
Determine the conducting resistance of embodiment 4~8.Specifically, connecting structure is flowed through using 4 terminal methods to determine electric current 1mA
Conduction resistance value during body.Digital multimeter is employed in measure（Yokogawa Motor company system）.As a result, embodiment 4~8 is led
The resistance that is powered can obtain the value especially having no problem in practical.
（Determining bonding strength）
The adhesive strength of embodiment 4~8, utilizes tensile testing machine（AND company systems）Carry out.That is, by the substrate of connecting structure body
Substrate is maintained at sample bench, and flexible base board is stretched from top.Finding speed（Draw speed）It is set to 50mm/sec.Moreover, will be soft
Property substrate（Specifically it is the 2nd terminal）Tensile strength when being completely exfoliated from the 1st terminal is set to adhesive strength.As a result, energy
Obtain the value especially having no problem in practical.
More than, while the preferred embodiment of the present invention is described in detail on one side referring to the drawings, but it is of the invention
It is not limited to relevant example.If the personnel of the general knowledge with the technical field of the invention, then obviously it is contemplated that
The various modifications or fixed case carried out in the category of technological thought described in claims, it should be apparent that these are certainly
Belong to the technical scope of the present invention.
Label declaration
1 connecting structure body；10 basal substrates；11 the 1st terminals；12 the 1st wiring patterns；20 anisotropic conductive films；30 matrix materials
Expect film；40 flexible base boards；41 the 2nd terminals；42 the 2nd wiring patterns.
Claims (5)
1. a kind of anisotropic conductive connection method, anisotropic conductive connection be located at the 1st electronic unit the 1st terminal column and
The 2nd terminal column of the 2nd electronic unit is located at, wherein including：
Process anisotropic conductive film being crimped on temporarily on the 1st terminal column；And
The process 2nd terminal column being formally crimped in the anisotropic conductive film,
The anisotropic conductive film is colored, and in the interim crimping, the colored state of the anisotropic conductive film does not have
Change, and the transmittance of the anisotropic conductive film increases during the formal crimping.
2. anisotropic conductive connection method as claimed in claim 1, wherein, the anisotropic conductive film is with being drawn in institute
Any one the similar color for stating the alignment mark of the 1st electronic unit, the 1st terminal column and the 1st electronic unit
Color.
3. anisotropic conductive connection method as claimed in claim 2, wherein,
1st electronic unit is coloured with transparent or netrual colour,
The anisotropic conductive film is with any one similar color dyes with the 1st terminal column and alignment mark.
4. the anisotropic conductive connection method as described in any one of claims 1 to 3, it is characterised in that the 1st electronics
Part is ceramic substrate.
5. a kind of anisotropic conductive connecting structure body, connected by the anisotropic conductive described in any one of Claims 1 to 4
Method is connect to make.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015058067A JP6508677B2 (en) | 2015-03-20 | 2015-03-20 | Anisotropic conductive connection method and anisotropic conductive connection structure |
| JP2015-058067 | 2015-03-20 | ||
| PCT/JP2016/058296 WO2016152673A1 (en) | 2015-03-20 | 2016-03-16 | Anisotropic electroconduction connection method and anisotropic electroconduction connection structure |
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| CN107431280A true CN107431280A (en) | 2017-12-01 |
| CN107431280B CN107431280B (en) | 2020-03-03 |
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|---|---|
| JP (1) | JP6508677B2 (en) |
| KR (1) | KR101992549B1 (en) |
| CN (1) | CN107431280B (en) |
| HK (1) | HK1245510A1 (en) |
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| WO (1) | WO2016152673A1 (en) |
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| JPH04145180A (en) * | 1990-10-05 | 1992-05-19 | Shin Etsu Polymer Co Ltd | Adhesive having anisotropic electrical conductivity and connection structure using the same |
| JPH11307154A (en) * | 1998-04-16 | 1999-11-05 | Fujikura Ltd | Anisotropic conductive material |
| KR20110001481A (en) * | 2009-06-30 | 2011-01-06 | 엘지디스플레이 주식회사 | Anisotropic conductive film of display device and detecting method for the same |
| WO2014024980A1 (en) * | 2012-08-10 | 2014-02-13 | 旭硝子株式会社 | Electrically connected structure, glass plate having terminal including said structure attached thereto, and manufacturing method for glass plate having terminal attached thereto |
| CN103597667A (en) * | 2011-06-06 | 2014-02-19 | 日立化成株式会社 | Film-shaped circuit connecting material and circuit connecting structure |
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| JP3433836B2 (en) * | 1994-01-25 | 2003-08-04 | ソニー株式会社 | Anisotropic conductive film and liquid crystal display panel connected by anisotropic conductive film |
| JP4145180B2 (en) | 2003-03-27 | 2008-09-03 | 株式会社クボタ | Assembly method and assembly production facility |
| JP4555943B2 (en) | 2004-10-29 | 2010-10-06 | 日立化成工業株式会社 | Anisotropic conductive film, method for manufacturing anisotropic conductive film, connection body using the same, and semiconductor device |
| JP2007091798A (en) | 2005-09-27 | 2007-04-12 | Sony Chemical & Information Device Corp | Color developing agent, set of color developing agent, adhesive, adhesive set and adhesion method |
| KR101260440B1 (en) * | 2010-02-04 | 2013-05-02 | 주식회사 이그잭스 | Conductive adhesive composition for connecting circuit electrodes, circuit connecting material including the conductive adhesive composition, connected circuit structure and method of the connected circuit structure using the circuit connecting material |
-
2015
- 2015-03-20 JP JP2015058067A patent/JP6508677B2/en active Active
-
2016
- 2016-03-16 CN CN201680014131.2A patent/CN107431280B/en active Active
- 2016-03-16 KR KR1020177014949A patent/KR101992549B1/en active IP Right Grant
- 2016-03-16 WO PCT/JP2016/058296 patent/WO2016152673A1/en active Application Filing
- 2016-03-17 TW TW105108306A patent/TWI692913B/en active
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04145180A (en) * | 1990-10-05 | 1992-05-19 | Shin Etsu Polymer Co Ltd | Adhesive having anisotropic electrical conductivity and connection structure using the same |
| JPH11307154A (en) * | 1998-04-16 | 1999-11-05 | Fujikura Ltd | Anisotropic conductive material |
| KR20110001481A (en) * | 2009-06-30 | 2011-01-06 | 엘지디스플레이 주식회사 | Anisotropic conductive film of display device and detecting method for the same |
| CN103597667A (en) * | 2011-06-06 | 2014-02-19 | 日立化成株式会社 | Film-shaped circuit connecting material and circuit connecting structure |
| WO2014024980A1 (en) * | 2012-08-10 | 2014-02-13 | 旭硝子株式会社 | Electrically connected structure, glass plate having terminal including said structure attached thereto, and manufacturing method for glass plate having terminal attached thereto |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1245510A1 (en) | 2018-08-24 |
| JP2016178015A (en) | 2016-10-06 |
| CN107431280B (en) | 2020-03-03 |
| JP6508677B2 (en) | 2019-05-08 |
| KR101992549B1 (en) | 2019-06-24 |
| KR20170081664A (en) | 2017-07-12 |
| TW201705616A (en) | 2017-02-01 |
| WO2016152673A1 (en) | 2016-09-29 |
| TWI692913B (en) | 2020-05-01 |
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