CN108021970B - Transparent invisible RFID label material and preparation method thereof - Google Patents
Transparent invisible RFID label material and preparation method thereof Download PDFInfo
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- CN108021970B CN108021970B CN201711407980.7A CN201711407980A CN108021970B CN 108021970 B CN108021970 B CN 108021970B CN 201711407980 A CN201711407980 A CN 201711407980A CN 108021970 B CN108021970 B CN 108021970B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
Abstract
The invention discloses a transparent invisible RFID label material and a preparation method thereof, wherein the transparent invisible RFID label material sequentially comprises a substrate layer, a conductive layer and an adhesive layer from top to bottom, the light transmittance of the substrate layer is more than 95%, the thickness of the conductive layer is 10-50 mu m, the surface resistivity of the conductive layer is less than 30 omega, the transparency is more than 90%, and the thickness of the adhesive layer is 1-10 mu m. The preparation method of the transparent invisible RFID tag comprises the steps of firstly, flatly paving a substrate layer on a coating platform, coating nano silver wire conductive silver paste on the substrate layer through a coating machine, forming a conductive layer after the nano silver wire conductive silver paste is solidified, and forming a conductive pattern on the conductive layer through screen printing or mechanical imprinting. And finally, further coating an adhesive on the conductive layer, and curing to obtain the transparent invisible RFID label material. The invention provides a transparent invisible RFID label material which has high transparency, good flexibility, extremely low surface resistance, good bending resistance and good anti-theft and anti-counterfeiting functions, and a preparation method thereof.
Description
Technical Field
The invention relates to the technical field of RFID (radio frequency identification devices), in particular to a transparent invisible RFID label material and a preparation method thereof.
Background
The conventional RFID label performs the RFID management identification function, but the RFID label on the market is prepared by using copper foil and aluminum foil, so that the RFID label is opaque, and can be removed by a lawless person by many means, such as tearing one corner of the label, completely removing the label in a hot air blowing mode or other methods, and transferring the label to other articles, so that the authenticity and uniqueness of the product are lost, and the conventional RFID label is weak in bending resistance and easy to damage.
Therefore, the development of a transparent RFID label material with good flexibility, extremely low surface resistance, strong bending resistance and good anti-theft and anti-counterfeiting functions is a technical problem which needs to be solved urgently at present.
Disclosure of Invention
The invention aims to provide a transparent invisible RFID label material which is transparent, good in flexibility, extremely low in surface resistance, strong in bending resistance and good in anti-theft and anti-counterfeiting functions and a preparation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme: the transparent invisible RFID label material comprises a substrate layer, a conducting layer and an adhesive layer from top to bottom in sequence, wherein the light transmittance of the substrate layer is larger than 95%, the thickness of the conducting layer is 10-50 mu m, the surface resistivity of the conducting layer is smaller than 30 omega, the transparency of the conducting layer is larger than 90%, and the thickness of the adhesive layer is 1-10 mu m. At present, the RFID labels commonly used in the market are not transparent, and are easy to be discovered and torn off by lawbreakers, so that the RFID labels lose the effect. The RFID label material mainly comprises a three-layer structure, the light transmittance of the selected substrate layer is more than 95%, the transparency of the material can be ensured, and the RFID label material is not easy to find when being pasted on a product. The thickness of the conductive layer is less than 10 mu m, so that the conductive performance is reduced, and the use effect is influenced; conductive layer thicknesses greater than 50 μm can reduce the transparency of the RFID tag material. If the surface resistivity of the conducting layer is larger than 30 omega, the induction sensitivity of the label material is reduced, and the transparent effect of the material can be ensured only by ensuring that the transparency of the material is larger than 90% after the conducting layer is coated; the thickness of the adhesive layer is less than 1 μm, so that the adhesive force is weak and the product cannot be stably adhered; the thickness of the adhesive layer of more than 10 μm may reduce the transparency of the RFID material, and thus the object of the present invention may not be achieved.
Further, the conducting layer is prepared by mixing any one or more of nano silver wires, nano nickel wires, copper wires, nano silver particles or nano silver snowflakes with conductive silver paste. The nano wire can be effectively connected with the nano particles to form a net structure with a more compact structure, so that the electric conductivity is improved.
Still further, it is characterized in that: the nano silver wire conductive silver paste contains 0.1-0.3% of nano silver wires, and the ratio of the length to the diameter of the nano silver wires is more than 500. The larger the ratio of the length to the diameter of the silver nanowires is, the lower the percolation threshold of conduction between the silver nanowires is, the less silver paste is required, and the better the transparency is.
Furthermore, the thickness of the substrate layer is 0.01-0.3 mm. When the thickness of the substrate layer is less than 0.01mm, the substrate layer is easy to be bent and damaged, and when the thickness of the substrate layer is more than 0.3mm, the light transmittance is reduced.
Still further, the substrate layer is made of any one of PET, PE, TPU and PVC. PET, PE, TPU and PVC materials have good flexibility and transparency, and the light transmittance of the substrate layer is ensured to be more than 95%.
Still further, the nano silver wire conductive silver paste contains 0.1% -0.3% of nano silver wires, the diameter of each nano silver wire is less than 50nm, and the length of each nano silver wire is greater than 10 microns. If the content of the nano silver wires in the nano silver wire conductive silver paste is less than 0.1%, the conductivity is reduced, and the induction sensitivity of the tag prepared by using the RFID tag material is influenced; the flexibility and the bending resistance of the RFID tag material are affected when the content of the nano silver wires in the nano silver wire conductive silver paste is more than 0.3%.
Still further, the adhesive layer is any one of ultraviolet light curing type pressure sensitive adhesive, hot melt type adhesive and solvent type resin adhesive. The three adhesives, namely the ultraviolet light curing pressure-sensitive adhesive, the hot melting adhesive and the solvent type adhesive, have good adhesion performance, good aging resistance and good peeling resistance, and the service life of the prepared RFID label material is prolonged.
A preparation method of a transparent invisible RFID label material comprises the following steps:
s1, preparing a conductive layer: the substrate layer is flatly laid on the coating platform, conductive silver paste is coated on the substrate layer through a coating machine, the coating thickness is 10-50 mu m, and the conductive layer is obtained after curing; conductive silver paste is uniformly coated on the substrate layer through the coating machine, so that the phenomenon that the overall resistivity distribution is uneven due to nonuniform coating and the use effect is influenced is avoided. The conductive silver paste added with the nano silver wire, the nano nickel wire, the copper wire, the nano silver particles or the nano silver snowflakes can ensure that the conductive layer has good conductivity and low resistivity, and the coating thickness is 10-50 mu m to ensure that the conductive layer has certain flexibility.
S2, conductive layer pattern preparation: forming a conductive pattern on the conductive layer prepared in the step S1 through screen printing or mechanical stamping; the material is very suitable for adopting the methods of simple and rapid processing precision, high enough screen printing or mechanical imprinting and the like, and avoids adopting the chemical etching and electroplating process with serious pollution of transmission or the expensive laser engraving process.
S3, adhesive layer preparation: and (4) further coating any one of ultraviolet curing type pressure-sensitive adhesive, hot-melt type adhesive or solvent type resin adhesive on the surface of the conductive layer prepared in the step (S2), wherein the coating thickness is 1-10 mu m, and curing for 2-3 hours to obtain the transparent invisible RFID label material. The ultraviolet-curing pressure-sensitive adhesive, the hot-melting adhesive and the solvent-type resin adhesive have good adhesion performance, good aging resistance and good peeling resistance, and the coating thickness is 1-10 mu m, so that the adhesive layer has certain support property.
Compared with the prior art, the invention has the beneficial technical effects that:
first, high transparency and good flexibility. The substrate layer of the RFID label material is made of materials with good flexibility and high transparency, and the three-layer composition structure can reduce the light transmittance of the materials influenced by the multilayer structure. The thicknesses of the conducting layer and the adhesive layer are both in a micron level, the influence on the light transmittance of the substrate layer is very small, the conducting layer and the adhesive layer are tightly attached together, and the flexibility of the substrate layer is not influenced.
Secondly, the surface resistance is extremely low, and the bending resistance is strong. The conductive layer of the RFID tag material is the nano silver wire conductive silver paste, the nano silver wire is effectively connected with the silver nano particles and the spherical silver powder in the silver paste to form a more perfect net structure, the conductivity is improved, the surface resistance is reduced, and the induction sensitivity is improved. The ratio of the length to the diameter of the used nano silver wire is more than 500, the nano silver wire in the specification range has good conductivity and strong flexibility, and the conductivity of the nano silver wire can not be influenced by bending and folding, so that the prepared RFID tag material has wide application atmosphere.
Thirdly, the preparation process is simple and easy to realize batch production. The preparation process mainly comprises two steps, firstly, the nano silver wire conductive silver paste is uniformly coated on a base film through a coating machine, a conductive layer is formed by curing, then, an adhesive is coated on the conductive layer and then cured, and the preparation is finished. The whole preparation process does not need special instruments and equipment, and batch production is easy to realize.
Fourthly, the anti-theft and anti-counterfeiting function is good. The transparent invisible RFID label material is thin and high in transparency, and the anti-counterfeiting anti-theft RFID label prepared by the material is not easy to find when being pasted on a product, so that the anti-counterfeiting anti-theft RFID label can be prevented from being torn off by a lawbreaker and pasted on other fake products or torn off so as to be stolen.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention, the present invention will now be further described with reference to the specific embodiments.
Example 1
Preparation of a transparent invisible RFID label material:
s1, taking a PET film with the thickness of 0.01mm as a substrate film, flatly paving the PET film on a coating platform, coating 0.1% of nano-silver wire conductive silver paste on the substrate layer through a coating machine, wherein the ratio of the length to the diameter of the nano-silver wire is 1000, the coating thickness is 30 microns, and the nano-silver wire conductive silver paste is solidified at room temperature to obtain a conductive layer;
s2, conductive layer pattern preparation: forming a conductive pattern on the conductive layer prepared in the step S1 through screen printing;
s3, adhesive layer preparation: further coating ultraviolet curing pressure sensitive adhesive on the conductive layer with a thickness of 5 μm on the surface of the conductive layer prepared in step S2, wherein the thickness is 2J/cm under the irradiation of ultraviolet lamp2Curing the energy to obtain the transparent invisible RFID label material.
Example 2
Preparation of a transparent invisible RFID label material:
s1, taking a PE film with the thickness of 0.2mm as a substrate film, flatly paving the PE film on a coating platform, coating 0.2% of nano silver wires and nano silver particle conductive silver paste on the substrate layer through a coating machine, wherein the ratio of the length to the diameter of the nano silver wires is 700, the coating thickness is 40 mu m, and the nano silver wire conductive silver paste is solidified at room temperature to obtain a conductive layer;
s2, conductive layer pattern preparation: the conductive layer prepared in step S1 is mechanically imprinted to form a conductive pattern;
s3, adhesive layer preparation: and (4) further coating a hot-melt adhesive on the conductive layer on the surface of the conductive layer prepared in the step (S2), wherein the coating thickness is 8 mu m, and curing for 3 hours at room temperature to obtain the transparent invisible RFID label material.
Example 3
Preparation of a transparent invisible RFID label material:
s1, taking a PVC film with the thickness of 0.3mm as a substrate film, flatly paving the substrate film on a coating platform, coating 0.3% of nano-silver wire conductive silver paste on the substrate layer through a coating machine, wherein the ratio of the length to the diameter of the nano-silver wire is 500, the coating thickness is 50 microns, and the nano-silver wire conductive silver paste is solidified at room temperature to obtain a conductive layer;
s2, conductive layer pattern preparation: the conductive layer prepared in step S1 is mechanically imprinted to form a conductive pattern;
s3, adhesive layer preparation: and (4) further coating a solvent type resin adhesive on the conductive layer on the surface of the conductive layer prepared in the step S2, wherein the coating thickness is 10 mu m, and curing for 3 hours at room temperature to obtain the transparent invisible RFID label material.
The conductive circuit and the antenna pattern can be manufactured by adopting the processes of high-precision laser engraving or simple and quick screen printing and the like on one side of the transparent invisible RFID label material adhesive layer obtained in the 3 embodiments, so that the required RFID label can be obtained.
The performance test results of the transparent invisible RFID label material prepared by the embodiment are shown in the table.
TABLE 1 Performance test results for transparent invisible RFID tag materials
The results in table 1 show that the transparent RFID tag material prepared by the invention has a low surface resistance, a surface resistance of less than 30 Ω, a light transmittance of more than 90%, and a haze of less than 2%, and has good tensile strength and elongation at break.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; those of ordinary skill in the art can readily practice the present invention as described above; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the scope of the invention as defined by the appended claims; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (4)
1. A transparent invisible RFID tag material, characterized in that: the transparent invisible RFID tag material comprises a substrate layer, a conducting layer and an adhesive layer in sequence from top to bottom, wherein the light transmittance of the substrate layer is more than 95%, the thickness of the conducting layer is 10-50 mu m, the surface resistivity of the conducting layer is less than 30 omega, the transparency of the conducting layer is more than 90%, the thickness of the adhesive layer is 1-10 mu m, the conducting layer is prepared by mixing one or more of nano silver wires, nano nickel wires, copper wires, nano silver particles or nano silver snowflakes with conductive silver paste, the nano silver wire conductive silver paste contains 0.1-0.3% of nano silver wires, the ratio of the length to the diameter of the nano silver wires is more than or equal to 500, and the substrate layer is prepared from any one of PET, PE, TPU and PVC.
2. The transparent invisible RFID label material of claim 1, wherein: the thickness of the substrate layer is 0.01-0.3 mm.
3. The transparent invisible RFID label material of claim 2, wherein: the adhesive layer is any one of ultraviolet light curing pressure-sensitive adhesive, hot melt adhesive and solvent type resin adhesive.
4. A preparation method of a transparent invisible RFID label material is characterized by comprising the following steps: the preparation steps are as follows:
s1, preparing a conductive layer: the substrate layer is flatly laid on the coating platform, conductive silver paste is coated on the substrate layer through a coating machine, the coating thickness is 10-50 mu m, and the conductive silver paste is solidified to obtain a conductive layer;
s2, conductive layer pattern preparation: forming a conductive pattern on the conductive layer prepared in the step S1 through screen printing or mechanical stamping;
s3, adhesive layer preparation: further coating any one of ultraviolet light curing type pressure-sensitive adhesive, hot melt type adhesive or solvent type resin adhesive on the surface of the conductive layer prepared in the step S2, wherein the coating thickness is 1-10 mu m, and curing for 2-3 hours to obtain a transparent invisible RFID label material;
the surface resistivity of the conducting layer is less than 30 omega, the transparency is more than 90 percent, the conducting layer is prepared by mixing any one or more of nano silver wires, nano nickel wires, copper wires, nano silver particles or nano silver snowflakes with conducting silver paste, the nano silver wire conducting silver paste contains 0.1 to 0.3 percent of nano silver wires, and the ratio of the length to the diameter of the nano silver wires is more than or equal to 500.
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| CN112072296A (en) * | 2020-09-07 | 2020-12-11 | 昆山睿翔讯通通信技术有限公司 | Method for manufacturing transparent antenna |
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| CN202285125U (en) * | 2011-10-21 | 2012-06-27 | 北京物资学院 | Radio frequency identification tag applied to clothing |
| CN105632588A (en) * | 2016-02-22 | 2016-06-01 | 昆山海斯电子有限公司 | High-conductivity silver paste and preparation method thereof |
| CN106024100A (en) * | 2016-07-20 | 2016-10-12 | 苏州顾氏新材料有限公司 | Low-temperature conductive silver paste and preparation method and application thereof |
| CN107346447A (en) * | 2017-09-05 | 2017-11-14 | 北京石墨烯研究院 | NFC/RFID intelligent labels and its manufacture method and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100998263B1 (en) * | 2009-12-01 | 2010-12-03 | (주) 부성 리싸이클링 | Manufacture method and rfid tag of brailleblock for walking guidance for a blind person thereof |
| CN102118918A (en) * | 2011-04-12 | 2011-07-06 | 中国计量学院 | Flexible transparent electronic circuit and preparation method thereof |
| CN104680224B (en) * | 2015-03-09 | 2018-05-29 | 中山金利宝胶粘制品有限公司 | A kind of label paster for being implanted with RFID chip and preparation method thereof |
| CN104794989A (en) * | 2015-04-17 | 2015-07-22 | 武汉华工图像技术开发有限公司 | Transparent hidden holographic identification and manufacturing method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202285125U (en) * | 2011-10-21 | 2012-06-27 | 北京物资学院 | Radio frequency identification tag applied to clothing |
| CN105632588A (en) * | 2016-02-22 | 2016-06-01 | 昆山海斯电子有限公司 | High-conductivity silver paste and preparation method thereof |
| CN106024100A (en) * | 2016-07-20 | 2016-10-12 | 苏州顾氏新材料有限公司 | Low-temperature conductive silver paste and preparation method and application thereof |
| CN107346447A (en) * | 2017-09-05 | 2017-11-14 | 北京石墨烯研究院 | NFC/RFID intelligent labels and its manufacture method and application |
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