CN110577771A - conductive ink, RFID antenna, electronic tag and preparation method - Google Patents

conductive ink, RFID antenna, electronic tag and preparation method Download PDF

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Publication number
CN110577771A
CN110577771A CN201910878536.6A CN201910878536A CN110577771A CN 110577771 A CN110577771 A CN 110577771A CN 201910878536 A CN201910878536 A CN 201910878536A CN 110577771 A CN110577771 A CN 110577771A
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parts
rfid antenna
rfid
antenna
conductive ink
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吴丽琼
刘兆平
周书瑶
张楠
王国良
刘湘祁
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Ningbo Graphene Innovation Center Co Ltd
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Ningbo Graphene Innovation Center Co Ltd
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Priority to CN201910878536.6A priority Critical patent/CN110577771A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/106Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Details Of Aerials (AREA)

Abstract

the application provides conductive ink, an RFID antenna, an electronic tag and a preparation method, and relates to the field of electronic tags. The conductive ink comprises the following raw materials in parts by weight: 20-40 parts of graphene nanosheets, 10-40 parts of metal fillers, 2-10 parts of polymerization monomers, 1-5 parts of photoinitiators, 1-5 parts of dispersing agents, 1-5 parts of coupling agents and 30-60 parts of solvents. The RFID antenna adopts the antenna structure made of the conductive ink, and the square resistance of the RFID antenna is 0.5-10 omega. The RFID electronic tag comprises an Inlay layer consisting of a chip and the RFID antenna, the RFID antenna is attached to one side face of the chip, and a hot melt adhesive layer and a base layer are sequentially overlapped on the two side faces of the Inlay layer. The RFID antenna has high conductivity and stability, the RFID electronic tag is resistant to high-temperature washing, the manufacturing cost is low, and the production efficiency is high.

Description

conductive ink, RFID antenna, electronic tag and preparation method
Technical Field
The application relates to the field of electronic tags, in particular to conductive ink, an RFID antenna, an electronic tag and a preparation method.
background
RFID (Radio Frequency Identification ) is a contactless data automatic acquisition technology. The RFID tag has the biggest characteristic that the information acquisition speed is high, mechanical or optical contact is not needed, the RFID tag is completely completed through a wireless communication technology, hundreds of thousands of object information can be acquired simultaneously within 1 second, and the information acquisition accuracy rate is high.
In recent years, researches show that the graphene material has a micro topological structure and high conductivity, the graphene is powdered to prepare composite conductive slurry, and the RFID tag manufactured by the printed antenna method has wide application prospects. However, due to the selection and the dosage of materials and other reasons, the existing composite conductive paste often has the problem that the conductive performance does not reach the standard, so that the RFID label is unqualified. In addition, in the process of manufacturing the RFID electronic tag by utilizing the graphene conductive ink printed antenna, a heating furnace is usually used, and the problems of high drying temperature, long drying time, low production efficiency, poor product stability and the like exist. In addition, the common RFID label cannot adapt to environments such as high temperature washing, acid-base washing and the like, the performance of the label is gradually reduced after multiple times of high temperature washing, and the misreading and misreading rate is increased.
Disclosure of Invention
the embodiment of the application aims to provide the conductive ink, the RFID antenna, the electronic tag and the preparation method thereof, the conductivity and the stability of the RFID antenna are high, the RFID electronic tag is resistant to high-temperature washing, the manufacturing cost is low, and the production efficiency is high.
In a first aspect, an embodiment of the present application provides a conductive ink, which comprises, by weight: 20-40 parts of graphene nanosheets, 10-40 parts of metal fillers, 2-10 parts of polymerization monomers, 1-5 parts of photoinitiators, 1-5 parts of dispersing agents, 1-5 parts of coupling agents and 30-60 parts of solvents.
In the technical scheme, the conductive ink is of a photo-curing type, and the raw materials of the conductive ink comprise a graphene material, a metal filler, a polymerization monomer, a photoinitiator, a dispersant, a coupling agent and a solvent. Specifically, a solvent is adopted to form a solvent system, and other raw materials can be uniformly dispersed in the solvent system under the action of a dispersing agent; the graphene and the metal particles are soaked in the coupling agent, and the particle surfaces can generate good compatibility with the solvent after being treated by the coupling agent; the photoinitiator can absorb the light radiation energy to initiate the crosslinking and curing of the polymerization monomer, so that the liquid drop component is cured, and the solid particles are obtained to form the RFID antenna. The photoinitiator is dispersed in a solvent system according to a certain proportion, so that almost all the photoinitiator can be radiated by light; the polymerized monomers are dispersed in a solvent system according to a certain proportion, so that almost all the polymerized monomers can be crosslinked and cured. By adopting the conductive ink to manufacture the RFID antenna through photocuring, the agglomeration of graphene nanosheets and the oxidation of metal fillers can be effectively prevented, and the conductivity and stability of the RFID antenna are improved. In addition, the conductive ink can be printed on almost all substrates such as plastic films, paper, ceramics, fibers and the like, and the label substrate has a wide range; and the conductive ink has high cost performance, and particularly has a larger cost advantage compared with the conventional conductive silver paste.
In one possible implementation, the feedstock comprises:
The graphene is selected from at least one of pure graphene, oxidized graphene, nitrogen-doped graphene and fluorine-doped graphene;
And/or, the metal filler is selected from at least one of gold, silver, copper, aluminum and silver-coated copper;
And/or the polymerized monomer is an ethylene unsaturated monomer and/or a propylene unsaturated monomer, and optionally, the polymerized monomer is selected from at least one of methyl acrylate and methyl methacrylate;
And/or the photoinitiator is selected from at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, benzophenone, thioxanthone, camphorquinone and thioxanthone;
And/or the dispersing agent is selected from at least one of polyethylene glycol, methyl cellulose, ethyl cellulose and polyvinylpyrrolidone;
And/or the coupling agent is selected from at least one of a silane coupling agent KH550, a silane coupling agent KH560, a silane coupling agent KH570, a silane coupling agent KH792 and a silane coupling agent DL 602;
And/or the solvent is at least one selected from water, ethanol, isopropanol, N-butanol, tert-butanol, terpineol, N-dimethylformamide, N-methylpyrrolidone, dibasic ester and ethyl acetate.
in the technical scheme, the specific graphene has excellent conductivity; the specific metal filler has excellent conductive performance; the specific polymerized monomers can ensure that the molecules are crosslinked and polymerized to form macromolecules; the specific photoinitiator can initiate the polymerization of the monomers; the special dispersant ensures the dispersing effect; specific coupling agents are capable of achieving a hydrophobic effect; specific solvents are capable of forming a solvent system.
In a second aspect, an embodiment of the present application provides a method for preparing the conductive ink provided in the first aspect, in which raw materials are mixed and stirred, so that the graphene nanosheets and the metal filler are uniformly dispersed in a solvent system; and grinding and homogenizing.
in the technical scheme, the raw materials are mixed, and the graphene nanosheets and the metal filler can be uniformly dispersed in a solvent system under the action of the raw materials such as a dispersing agent and the like; and grinding and homogenizing treatment are carried out, so that particles of the graphene nanosheets and the metal filler can be further uniformly dispersed in a solvent system, and the prepared RFID antenna is high in conductivity and stability.
In a third aspect, an embodiment of the present application provides an RFID antenna, which is manufactured by using the conductive ink provided in the first aspect, and a sheet resistance of the RFID antenna is 0.5 to 10 Ω.
In the technical scheme, the antenna structure manufactured by the conductive ink has high conductivity and the square resistance is 0.5-10 omega.
In one possible implementation, the RFID antenna is a coil antenna, a dipole antenna, or a microstrip antenna;
Optionally, the RFID antenna is a coil antenna, the coil length is 60-100mm, the width is 60-100mm, the line width is 0.5-2mm, the line spacing is 0.2-0.5mm, and the number of turns is 6-10.
In the technical scheme, the RFID antenna has various forms and wide application range.
In a fourth aspect, an embodiment of the present application provides a method for preparing an RFID antenna provided in the third aspect, including the following steps:
printing conductive ink on a base material to obtain an antenna pattern;
And (4) irradiating the antenna pattern by adopting pulse intense light to perform photocuring treatment to obtain the RFID antenna.
According to the technical scheme, the conductive ink is printed on the base material, and the RFID antenna is manufactured by curing through a pulse strong light irradiation method, so that the method can effectively prevent the graphene nanosheet from agglomerating and the metal filler from oxidizing in the drying process of the RFID antenna, and the conductivity and the stability of the RFID antenna are improved. The inventor discovers that in the process of implementing the application: in the traditional heating curing and illumination curing, due to the requirement of higher temperature and/or longer drying time, the graphene nanosheets are often subjected to local agglomeration, and metal is oxidized, so that the performance of the RFID antenna is affected; the pulse strong light curing conductive ink can reach the photosensitive layer in a short time by using the extremely high peak energy of the conductive ink to complete curing, so that stacking of graphene nanosheets and oxidation of metal in the drying process of the conductive ink can be effectively prevented, and the conductivity and stability of the RFID antenna are improved. Moreover, the pulsed hard light curing technology has the characteristics of starting and stopping immediately, does not need preheating, has short curing time and can greatly improve the production efficiency.
in one possible implementation, the voltage of the pulsed intense light is 1000-3000V, the pulse width is 1-10ms, and the number of pulse periods is 5-50.
In the technical scheme, the conductive ink is printed, the RFID antenna is manufactured through intensive pulse light curing, and an excellent curing effect can be achieved by adjusting parameters such as single-time output energy, pulse frequency and spectral distribution.
In one possible implementation, the photocuring treatment time is 5-50 s.
in the technical scheme, the excellent curing effect is achieved by adjusting the light curing time.
In a fifth aspect, an embodiment of the present application provides an RFID electronic tag, which includes an Inlay layer composed of a chip and an RFID antenna provided in the third aspect, the RFID antenna is attached to one side surface of the chip, and a hot melt adhesive layer and a base layer are sequentially stacked on both side surfaces of the Inlay layer.
In the above technical solution, the RFID tag includes the following components that are sequentially stacked: the base layer, the hot melt adhesive layer, the Inlay layer, the hot melt adhesive layer and the base layer are protected by the high-temperature-resistant hot melt adhesive layer, the hot melt adhesive layer has excellent heat resistance, shows excellent reliability in long-term high-temperature use or rapid temperature change, and simultaneously has good chemical corrosion resistance and can be washed or even soaked at high temperature.
In a sixth aspect, an embodiment of the present application provides a method for preparing an RFID electronic tag provided in the fifth aspect, which includes the following steps: attaching the RFID antenna to one side surface of the chip to form an Inlay layer; and hot melt adhesive layers are respectively arranged on two side surfaces of the Inlay layer and fused with the base layer.
In the above technical solution, the applicant finds that: the existing RFID label preparation process is to form a protective layer outside an Inlay layer through an adhesive to prepare the RFID label, but the process of forming the protective layer outside the Inlay layer through the adhesive has great limitation, and the adhesive layer formed by the adhesive can be separated after repeated high-temperature water washing to cause damage to the RFID label. This application is through using high temperature resistant hot melt adhesive layer to change current bonding technology into and fuse the technology, can solve the RFID label of current technology production and can not high temperature washing scheduling problem, the RFID electronic tags who makes is high temperature resistant to wash, and low in manufacturing cost, production efficiency height.
Drawings
in order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
FIGS. 1 and 2 are schematic structural views of a coil antenna of a high frequency RFID;
Fig. 3 and 4 are schematic structural diagrams of a dipole antenna of the uhf RFID;
FIG. 5 is a schematic diagram of a process of pulsed high light photocuring according to an embodiment of the present application;
Fig. 6 is a graph of the read distance of the RFID tag versus the operating frequency.
Detailed Description
in order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The conductive ink, the RFID antenna, the electronic tag, and the manufacturing method of the embodiment of the present application are specifically described below.
The embodiment of the application provides conductive ink which comprises the following raw materials in parts by weight: 20-40 parts of graphene nanosheets, 10-40 parts of metal fillers, 2-10 parts of polymerization monomers, 1-5 parts of photoinitiators, 1-5 parts of dispersing agents, 1-5 parts of coupling agents and 30-60 parts of solvents. Optionally, the raw materials include, by weight: 30-40 parts of graphene nanosheets, 20-40 parts of metal fillers, 5-10 parts of polymerization monomers, 1-3 parts of photoinitiators, 3-5 parts of dispersing agents, 1-3 parts of coupling agents and 40-60 parts of solvents. Illustratively, the raw materials comprise, by weight: 20 parts, 25 parts, 30 parts, 35 parts or 40 parts of graphene nanosheets, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 35 parts or 40 parts of metal fillers, 2 parts, 4 parts, 6 parts, 8 parts or 10 parts of polymerization monomers, 1 part, 2 parts, 3 parts, 4 parts or 5 parts of photoinitiators, 1 part, 2 parts, 3 parts, 4 parts or 5 parts of dispersing agents, 1 part, 2 parts, 3 parts, 4 parts or 5 parts of coupling agents and 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts or 60 parts of solvents.
The raw materials are as follows:
The thickness of the graphene nanoplatelets is typically 500nm-50 μm. The graphene is selected from at least one of pure graphene, oxidized graphene, nitrogen-doped graphene and fluorine-doped graphene; optionally, the graphene is selected from at least one of graphene oxide, nitrogen-doped graphene and fluorine-doped graphene; in one embodiment, the graphene nanoplatelets are fluorine-doped graphene nanoplatelets, and the conductivity of the graphene is improved by increasing the carrier concentration of the graphene through fluorine doping.
The particle size of the metal filler is generally in the range of 1 to 300 nm. The metal filler is selected from at least one of gold, silver, copper, aluminum and silver-coated copper; optionally, the metal filler is selected from at least one of silver and silver-coated copper, and has proper price, good conductivity and stability; as an embodiment, the metal filler is silver-coated copper nano powder. The metal filler can be obtained by directly purchasing commercially available metal nanoparticles or by self-preparation, for example, by mixing a metal salt, a complexing agent, a pH regulator and a solvent by a chemical reduction method, adding a reducing agent, heating for chemical reduction, and drying after solid-liquid separation to obtain the metal filler.
The polymerized monomer is ethylene unsaturated monomer and/or propylene unsaturated monomer. Optionally, the polymerized monomer is selected from at least one of methyl acrylate, butyl acrylate, methyl methacrylate, vinyl acetate and vinyl ether; as an embodiment, the polymerized monomer is methyl acrylate, and the photo-initiated polymerization effect is good.
The photoinitiator is selected from at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, benzophenone, thioxanthone, camphorquinone and thioxanthone. Optionally, the photoinitiator is selected from at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether and benzophenone, and can generate better photo-initiated curing effect.
The dispersant is at least one selected from polyethylene glycol, methylcellulose, ethylcellulose and polyvinylpyrrolidone (PVP). Optionally, the dispersant is at least one of carboxymethyl cellulose and ethyl cellulose, so that good ink dispersibility is ensured.
the coupling agent is selected from at least one of a silane coupling agent KH550 (gamma-aminopropyltriethoxysilane), a silane coupling agent KH560 (gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane), a silane coupling agent KH570 (gamma-methacryloxypropyltrimethoxysilane), a silane coupling agent KH792(N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane) and a silane coupling agent DL 602. Optionally, the coupling agent is selected from at least one of a silane coupling agent KH550 and a silane coupling agent KH 560.
The solvent is selected from at least one of water, ethanol, isopropanol, N-butanol, t-butanol, terpineol, N, N-Dimethylformamide (DMF, N, N-dimethyl formimide), N-methylpyrrolidone (NMP, N-methyl-2-pyrrolidone), dibasic ester (DBE) and ethyl acetate. Optionally, the solvent is at least one selected from terpineol, N-dimethylformamide, N-methylpyrrolidone, dibasic ester and ethyl acetate, and the dispersibility and stability of the conductive ink are good.
The embodiment of the application also provides a preparation method of the conductive ink, which comprises the steps of mixing and stirring the raw materials, so that the graphene nanosheets and the metal filler are uniformly dispersed in a solvent system; and grinding and homogenizing.
The embodiment of the application also provides an RFID antenna which is an antenna structure manufactured by adopting the conductive ink, and the square resistance of the RFID antenna is 0.5-10 omega.
In some possible implementations, the antenna structure is a coil antenna, a dipole antenna, or a microstrip antenna, for example, the coil antenna of the high frequency RFID is structured as shown in fig. 1 and 2; a dipole antenna for uhf RFID is shown in fig. 3 and 4. Optionally, the antenna structure is a coil antenna, the coil length is 60-100mm, the width is 60-100mm, the line width is 0.5-2mm, the line spacing is 0.2-0.5mm, and the number of turns is 6-10.
The embodiment of the application also provides a preparation method of the RFID antenna, which comprises the following steps:
Step S1: the conductive ink is printed on a substrate, which is a plastic substrate or paper, and the printing may be screen printing, gravure printing, letterpress printing, offset printing or offset printing, to obtain an antenna pattern.
Step S2: carrying out photocuring treatment by adopting a pulse intense light irradiation antenna pattern, wherein the process of photocuring is shown in figure 5, the voltage of the pulse intense light is 1000-3000V, the pulse width is 1-10ms, and the pulse cycle times are 5-50; the light curing treatment time is 5-50 s; optionally, the voltage of the pulse strong light is 2000-2500V, the pulse width is 5-10ms, and the number of pulse cycles is 10-20; and (3) carrying out photocuring treatment for 10-20s, compacting after curing, and obtaining the RFID antenna with the thickness of 20-50 microns.
The embodiment of the application further provides an RFID electronic tag, which comprises an Inlay layer consisting of a chip and the RFID antenna, wherein the RFID antenna is attached to one side surface of the chip, and the two side surfaces of the Inlay layer are sequentially overlapped with a hot melt adhesive layer and a base layer. In general, the reading distance of the RFID electronic tag is 2-12 m.
Wherein, the material of the base layer can be a fabric base material or a plastic base material. As an embodiment, the fabric substrate may be: acrylic, polyester, spandex, chinlon, bamboo fiber, viscose fiber or flax. The plastic substrate may be: polyethylene terephthalate (PET), Polyimide (PI), or Polyethylene (PE).
it should be noted that the Inlay layer is a pre-laminated product of a PVC sheet, a chip, and an RFID antenna.
The embodiment of the application also provides a preparation method of the RFID electronic tag, which comprises the following steps: adopting a reverse packaging process, and attaching the RFID antenna to one side surface of the chip by using conductive adhesive to form an Inlay layer; and respectively bonding the base layer on two sides of the Inlay layer by using hot melt adhesive layers.
The features and properties of the present application are described in further detail below with reference to examples.
Example 1
The embodiment provides an RFID tag, which is manufactured according to the following steps:
Preparing conductive ink: 40 parts of graphene nanosheets, 20 parts of nano copper powder, 5 parts of methyl acrylate, 1 part of benzoin ethyl ether, 5 parts of carboxymethyl cellulose, KH 5502 parts of a silane coupling agent and 60 parts of terpineol; mixing the raw materials, stirring and dispersing; and grinding the dispersed mixture for 6 hours by using a three-roller machine, and homogenizing to obtain the conductive ink.
manufacturing an RFID antenna: printing conductive ink on a paper substrate to obtain a dipole antenna, and performing pulsed light photocuring, curing and compacting to a thickness of 30 microns, wherein the pulsed light voltage is 2000V, the pulse width is 5ms, the pulse period is 10 times, the photocuring time is 15s, and the square resistance of the cured RFID antenna is-5 omega (-about).
Manufacturing an RFID electronic tag: connecting the chip and the RFID antenna by using conductive adhesive through a reverse packaging process to obtain an Inlay layer; compounding a high-temperature-resistant water-washing hot-melt film on a fabric base material, fusing an Inlay layer in the middle through an upper layer hot-melt plastic film and a lower layer hot-melt plastic film to obtain the RFID electronic tag, wherein the working frequency range of the RFID electronic tag is 860-960MHz, and the reading distance at 915MHz is 5-6 m.
Example 2
The embodiment provides an RFID tag, which is manufactured according to the following steps:
Preparing conductive ink: 40 parts of graphene nanosheets, 40 parts of nano copper powder, 5 parts of methyl methacrylate, 2 parts of benzophenone, 5 parts of carboxymethyl cellulose, 7922 parts of silane coupling agent KH and 60 parts of dibasic ester; mixing the raw materials, stirring and dispersing; and grinding the dispersed mixture for 6 hours by using a three-roller machine, and homogenizing to obtain the conductive ink.
Manufacturing an RFID antenna: printing conductive ink on a paper substrate to obtain a dipole antenna, performing pulsed light photocuring, curing, compacting until the thickness is 20-50 μm, the pulsed light voltage is 2500V, the pulse width is 10ms, the pulse cycle time is 10 times, the photocuring time is 15s, and the sheet resistance of the cured RFID antenna is-1 omega.
manufacturing an RFID electronic tag: connecting the chip and the RFID antenna by using conductive adhesive through a reverse packaging process to obtain an Inlay layer; compounding a high-temperature-resistant water-washing hot-melt film on a fabric base material, fusing an Inlay layer in the middle through an upper layer hot-melt plastic film and a lower layer hot-melt plastic film to obtain the RFID electronic tag, wherein the working frequency range of the RFID electronic tag is 860-960MHz, and the reading distance at 915MHz is 7-8 m.
Example 3
The embodiment provides an RFID tag, which is manufactured according to the following steps:
Preparing conductive ink: 40 parts of graphene nanosheets, 20 parts of nano copper powder, 5 parts of methyl methacrylate, 2 parts of benzophenone, 10 parts of carboxymethyl cellulose, KH 5705 parts of a silane coupling agent and 60 parts of dibasic ester; mixing the raw materials, stirring and dispersing; and grinding the dispersed mixture for 6 hours by using a three-roller machine, and homogenizing to obtain the conductive ink.
Manufacturing an RFID antenna: printing conductive ink on a paper substrate to obtain a dipole antenna, performing pulsed light photocuring, curing, compacting until the thickness is 20-50 μm, the pulsed light voltage is 2000V, the pulse width is 5ms, the pulse cycle time is 10 times, the photocuring time is 15s, and the sheet resistance of the cured RFID antenna is 6-8 omega.
Manufacturing an RFID electronic tag: connecting the chip and the RFID antenna by using conductive adhesive through a reverse packaging process to obtain an Inlay layer; compounding a high-temperature-resistant water-washing hot-melt film on a fabric base material, fusing an Inlay layer in the middle through an upper layer hot-melt plastic film and a lower layer hot-melt plastic film to obtain the RFID electronic tag, wherein the working frequency range of the RFID electronic tag is 860-960MHz, and the reading distance at 915MHz is 4-5 m.
Comparative example 1
The comparative example provides an RFID electronic tag, which was produced according to the following steps:
Preparing conductive ink: 40 parts of graphene nanosheets, 40 parts of nano copper powder, 5 parts of methyl methacrylate, 2 parts of benzophenone, 5 parts of carboxymethyl cellulose, 2 parts of a coupling agent and 60 parts of dibasic ester; mixing the raw materials, stirring and dispersing; and grinding the dispersed mixture for 6 hours by using a three-roller machine, and homogenizing to obtain the conductive ink.
Manufacturing an RFID antenna: printing conductive ink on a paper base to obtain a dipole antenna, and carrying out thermocuring and drying at 80 ℃ for 3h to obtain the cured RFID antenna with the sheet resistance of 10 omega.
Manufacturing an RFID electronic tag: connecting the chip and the RFID antenna by using conductive adhesive through a reverse packaging process to obtain an Inlay layer; compounding a high-temperature-resistant water-washing hot-melt film on a fabric base material, fusing an Inlay layer in the middle through an upper layer hot-melt plastic film and a lower layer hot-melt plastic film to obtain the RFID electronic tag, wherein the working frequency range of the RFID electronic tag is 860-960MHz, and the reading distance at 915MHz is 2-3 m.
comparative example 2
Comparative example provides an RFID electronic tag, which was prepared in substantially the same manner as in comparative example 1, except that:
Manufacturing an RFID antenna: printing conductive ink on a paper base to obtain a dipole antenna, carrying out photocuring, and irradiating for 50s by using a UV-LED light source module until the dipole antenna is cured, wherein the UV-LED light source comprises a UVA light source with the central wavelength of 365nm, and the energy per unit area of the UV-LED light source is 6000MJ/cm2the UV-LED light source module rotates around the central shaft at a linear speed of 1-3m/min, and the total light emitting area is 0.2m2The total power is 2kW, and the square resistance of the cured RFID antenna is 5-10 omega.
The working frequency range of the finally obtained RFID electronic tag is 860-960MHz, and the reading distance at the working frequency of 915MHz is 3-5 m.
First, comparing the results of example 2 and comparative example 2, it can be found that: compared with UV light curing, the RFID antenna obtained by adopting the method of strong pulse light curing has lower sheet resistance, and the reading distance of the manufactured RFID electronic tag is larger.
the read distances of the RFID tags of examples 1 to 3 and comparative example 1 were plotted against the operating frequency, as shown in fig. 6. In fig. 6, a curve a is a corresponding relationship between a reading distance and an operating frequency of the RFID tag of embodiment 1; the curve of line b is the corresponding relationship between the reading distance and the working frequency of the RFID tag of embodiment 2; the curve c is the corresponding relationship between the reading distance and the working frequency of the RFID tag of embodiment 3; the d-curve is the correspondence between the read distance and the operating frequency of the RFID tag of comparative example 1. As can be seen from FIG. 6, the RFID electronic tag of the embodiment of the application has a large reading distance and good stability.
Second, through washing test and high temperature test, the RFID electronic tag of this application embodiment can realize repeated washing at least 100 times, high temperature 150 ℃.
in summary, according to the conductive ink, the RFID antenna, the electronic tag and the preparation method thereof, the conductivity and the stability of the RFID antenna are high, the RFID electronic tag is resistant to high-temperature washing, the manufacturing cost is low, and the production efficiency is high.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. The conductive ink is characterized by comprising the following raw materials in parts by weight: 20-40 parts of graphene nanosheets, 10-40 parts of metal fillers, 2-10 parts of polymerization monomers, 1-5 parts of photoinitiators, 1-5 parts of dispersing agents, 1-5 parts of coupling agents and 30-60 parts of solvents.
2. The conductive ink of claim 1, wherein in the raw materials:
The graphene is selected from at least one of pure graphene, oxidized graphene, nitrogen-doped graphene and fluorine-doped graphene;
and/or, the metal filler is selected from at least one of gold, silver, copper, aluminum and silver-coated copper;
and/or the polymerized monomer is an ethylene unsaturated monomer and/or a propylene unsaturated monomer, optionally, the polymerized monomer is selected from at least one of methyl acrylate and methyl methacrylate;
And/or the photoinitiator is selected from at least one of benzoin, benzoin ethyl ether, benzoin butyl ether, benzoin dimethyl ether, benzophenone, thioxanthone, camphorquinone and thioxanthone;
And/or the dispersing agent is selected from at least one of polyethylene glycol, methyl cellulose, ethyl cellulose and polyvinylpyrrolidone;
and/or the coupling agent is selected from at least one of a silane coupling agent KH550, a silane coupling agent KH560, a silane coupling agent KH570, a silane coupling agent KH792 and a silane coupling agent DL 602;
and/or the solvent is at least one selected from water, ethanol, isopropanol, N-butanol, tert-butanol, terpineol, N-dimethylformamide, N-methylpyrrolidone, dibasic ester and ethyl acetate.
3. a method for preparing the conductive ink according to claim 1, wherein the raw materials are mixed and stirred to uniformly disperse the graphene nanoplatelets and the metal filler in a solvent system; and grinding and homogenizing.
4. An RFID antenna, characterized in that it is made with the conductive ink of claim 1, and the square resistance of the RFID antenna is 0.5-10 Ω.
5. the RFID antenna of claim 4, wherein the RFID antenna is a coil antenna, a dipole antenna, or a microstrip antenna;
Optionally, the RFID antenna is a coil antenna, the coil length is 60-100mm, the width is 60-100mm, the line width is 0.5-2mm, the line spacing is 0.2-0.5mm, and the number of turns is 6-10.
6. A method for preparing an RFID antenna according to claim 4, comprising the steps of:
printing the conductive ink on a base material to obtain an antenna pattern;
and irradiating the antenna pattern by adopting pulse intense light to perform photocuring treatment to obtain the RFID antenna.
7. The method as claimed in claim 6, wherein the voltage of the pulsed intense light is 1000-3000V, the pulse width is 1-10ms, and the number of pulse cycles is 5-50.
8. The method for manufacturing an RFID antenna according to claim 6, wherein the photo-curing process time is 5 to 50 seconds.
9. An RFID electronic tag is characterized by comprising an Inlay layer which consists of a chip and the RFID antenna of claim 4, wherein the RFID antenna is attached to one side surface of the chip, and a hot melt adhesive layer and a base layer are sequentially overlapped on the two side surfaces of the Inlay layer.
10. a method for preparing an RFID tag according to claim 9, characterized in that it comprises the following steps: attaching the RFID antenna to one side surface of the chip to form an Inlay layer; and hot melt adhesive layers are respectively arranged on two side surfaces of the Inlay layer and are fused with the base layer.
CN201910878536.6A 2019-09-17 2019-09-17 conductive ink, RFID antenna, electronic tag and preparation method Pending CN110577771A (en)

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Application publication date: 20191217