CN115374895A - Preparation method of RFID electronic tag intelligent package - Google Patents
Preparation method of RFID electronic tag intelligent package Download PDFInfo
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- CN115374895A CN115374895A CN202210998947.0A CN202210998947A CN115374895A CN 115374895 A CN115374895 A CN 115374895A CN 202210998947 A CN202210998947 A CN 202210998947A CN 115374895 A CN115374895 A CN 115374895A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
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- Computer Networks & Wireless Communication (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Theoretical Computer Science (AREA)
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Abstract
A preparation method of an RFID electronic tag intelligent package relates to the field of electronic tag manufacturing, and comprises the following steps of S1: printing an antenna Dipole area on the packaging bag, and arranging a labeling area of an antenna Loop area on the packaging bag; step S2: manufacturing an antenna Loop area on a base material; and step S3: and pasting the antenna Loop area on the labeling area within the labeling deviation range, so that the antenna Dipole area is coupled with the line Loop area. The invention adopts the method that the antenna Dipole area is directly printed on the packaging bag, only the part for printing is needed, and the prior carrier is changed into the packaging bag needed by a client. Not only saves the material of the carrier and the material required by compounding, but also saves the step of integrally labeling in the process. The Loop area is pasted on the packaging bag by using the pasting head independently, so that the original structure that the Loop area of the antenna is connected with the Dipole area is broken. The Loop region is now separated from the Dipole region.
Description
Technical Field
The invention relates to the field of electronic tag manufacturing, in particular to a preparation method of an intelligent package of an RFID electronic tag.
Background
In lay in the electronic tag adopted in the traditional intelligent package is a whole and comprises a Loop area and a Dipole area, and the Loop area and the Dipole area are connected together. The traditional intelligent package preparation method comprises the following processes: the aluminum foil is etched on the PET or paper carrier by adopting an imprinting and etching method, a Loop area and a Dipole area are etched on the aluminum foil, the redundant parts are dissolved by a corrosive agent, then the adhesive dispensing and fixing chip is hot-pressed and then wound, the substrate, the in lay and the plane materiel are used for die cutting to obtain the required size, the redundant substrate is die-cut and then is discharged, and then the labeling machine is used for attaching the packaging bag to form the intelligent packaging bag. The method has the problems of long process flow, large material waste and more waste materials, in addition, the problems of environmental pollution, low efficiency and high cost can occur no matter the aluminum foil is etched on the PET or paper, and the energy consumption is large, thereby causing environmental pollution.
Disclosure of Invention
In order to save the production cost of intelligent packaging, improve the production efficiency and reduce the waste on the premise of ensuring the sensitivity of the electronic tag, the invention adopts the following technical scheme:
a preparation method of an RFID electronic tag intelligent package comprises the following steps:
step S1: printing an antenna Dipole area on the packaging bag, and arranging a labeling area of an antenna Loop area on the packaging bag;
step S2: manufacturing an antenna Loop area on a base material;
and step S3: and pasting the antenna Loop area on the labeling area within the labeling deviation range, so that the antenna Dipole area is coupled with the line Loop area.
Specifically, the method for printing the antenna Dipole area on the packaging bag comprises the following steps:
step S11: preparing conductive slurry, wherein the conductive slurry is formed by mixing an adhesive and glass powder; the mass fraction ratio of the adhesive to the glass powder is 2;
step S12: and (3) formulating a screen printing plate according to the pattern of the Dipole area, printing the conductive paste on the packaging bag through the screen printing plate, and curing for 20min at the temperature of 80-120 ℃ to form the material of the electric conductor.
Step S13: and then drying the Dipo area for 20min.
Specifically, the Loop region of the antenna manufactured on the substrate comprises the following steps:
step 21: etching the aluminum foil on the substrate according to the Loop area patterns to form a plurality of antenna Loop areas;
step 22: dispensing glue on each antenna Loop area, then pasting a chip, sequentially carrying out hot-press plastic packaging on the antenna Loop areas, and then carrying out performance test and screening;
step 23: adhering the plurality of antenna Loop areas to a substrate, then carrying out die cutting on the plurality of antenna Loop areas, and dividing the plurality of antenna Loop areas into a plurality of independent antenna Loop areas;
step 24: and rolling the Loop areas of the multiple antennas.
Specifically, the labeling deviation range is as follows: and (3) taking the labeling area as the center of a circle and taking 0.1-0.5 mm as the radius to form a circle, and sticking the central point of the Loop area to the labeling area.
In conclusion, the invention has the following advantages: the invention adopts the method that the antenna dipole area is directly printed on the packaging bag, only the part for printing is needed, and the prior carrier is changed into the packaging bag needed by a client. Not only saves the material of the carrier and the material required by compounding, but also saves the step of integrally labeling in the process. The Loop area is pasted on the packaging bag by independently using the pasting head to break the original structure that the Loop area of the antenna is connected with the Dipo area. The Loop region is now separated from Dipo le.
Drawings
Fig. 1-2 show the distance between the received signal and the reflected signal of the RFI D electronic tag, respectively, when the chip is disposed on top of the Loop area, the Loop area partially covers the Dipo area;
fig. 3-4 are a power diagram of the power received by the RFI D electronic tag and the reflection of the tag, respectively, when the chip is placed on top of the Loop area, which partially covers the Dipo area;
fig. 5 is a schematic structural diagram of an RFI D electronic tag in which a Loop region partially covers a Dipo region and a chip is disposed on the top of the Loop region;
fig. 6-7 show the distance between the signal received by the RFI D electronic tag and the distance between the reflected signals when the chip is disposed on top of the Loop area, respectively;
FIGS. 8-9 are power diagrams of the power received by the RFI D tag and the reflection of the tag, respectively, when the chip is placed on top of the Loop region, the Loop region abutting the Dipo le region;
FIG. 10 is a schematic structural diagram of an RFI D electronic tag in which a Loop area is attached to a Dipo le area and a chip is arranged on the top of the Loop area;
11-12 are respectively the distance of the received signal and the reflected signal of the RFI D electronic tag when the chip is arranged on the top of the Loop region, the Loop region is vertically deviated by 1mm from the Dipo le region, and the RFI D electronic tag is arranged on the top of the Loop region;
FIGS. 13-14 are power graphs of received power and tag reflection, respectively, for an RFI D tag with the chip disposed on top of the Loop region, with the Loop region disposed vertically up to 1mm above the Dipo le region;
FIG. 15 is a schematic structural diagram of an RFI D electronic tag in which a Loop region is attached to an intelligent package with a distance of 1mm from a Dipo region vertically upward, and a chip is arranged on the top of the Loop region;
FIGS. 16-17 show the distance between the chip and the RFI D tag when the chip is disposed at the bottom of the Loop region, the distance between the Loop region and the Dipo region is 0.5mm vertically upward, and the distance between the RFI D tag and the received signal is equal to the distance between the RFI D tag and the reflected signal;
18-19 are power graphs of the power received by the RFI D tag and the reflection of the tag, respectively, when the chip is placed on top of the Loop region, the Loop region is vertically offset 0.5mm from the Dipo region;
FIG. 20 is a schematic structural diagram of an RFI D electronic tag in which a Loop area is attached to an intelligent package with a distance of 0.5mm vertically upward from a Dipo area, and a chip is arranged on the top of the Loop area;
reference numerals: 1Loop region; 2, a Dipo region; 3, a chip; 101 a first side edge; 102 a second side; the bottom edge of the notch in the 201Dipo area.
Detailed Description
The present invention will be further described with reference to fig. 1 to 20.
Specific example 1:
a preparation method of an RFI D electronic tag intelligent package comprises the following steps:
step S1: printing an antenna Dipo area on the packaging bag, wherein the Dipo area is symmetrical, a rectangular notch is formed in the Dipo area, and the notch is a labeling area of the antenna Loop area on the packaging bag.
Step S11: preparing conductive slurry, wherein the conductive slurry is formed by mixing an adhesive and glass powder; the mass fraction ratio of the adhesive to the glass powder is 2;
step S12: and (3) formulating a screen printing plate according to the pattern of the Dipo area, printing the conductive paste on a packaging bag through the screen printing plate, and curing for 20min at the temperature of 80-120 ℃ to form the material of the electric conductor.
Step S13: and then drying the Dipo area for 20min.
Step S2: manufacturing an antenna Loop area on a base material;
step 21: etching the aluminum foil on the substrate according to the Loop area pattern to form a plurality of antenna Loop areas;
step 22: the Loop areas are in a hollow rectangular shape, glue is dispensed on each antenna Loop area, then a chip is pasted on the antenna Loop area, the chip is pasted on a first side edge of the Loop area, the antenna Loop areas are sequentially subjected to hot-press plastic package, then performance test and screening are carried out, and unqualified products are removed;
step 23: adhering a qualified antenna Loop area on a substrate, then carrying out die cutting on the antenna Loop area, and dividing the antenna Loop area into a plurality of independent antenna Loop areas;
step 24: and rolling the Loop areas of the multiple antennas.
And step S3: unreel the antenna Loop district of rolling and paste the second side edge that covers the breach in Dipo district with antenna Loop district for antenna Dipo district and line Loop district coupling, wherein the first side edge in antenna Loop district is relative with the second side edge, accomplishes the label and pastes on the packing this moment.
As can be seen from FIG. 1, the frequency band of 902-928mhz is adopted by the tag, and the tag can be received and read within a range of 8.5-10 meters from the tag. As can be seen from fig. 2, the distance from the tag to reflect the signal is in the range of 4.5 to 6 meters. As can be seen from FIG. 3, the frequency band of 902-928mhz is adopted by the tag, the power that the tag can receive is-17.25 to-16 dbm, and as can be seen from FIG. 4, the power that the tag can reflect is-29.5 to-27.5 dbm. Fig. 5 is a structural diagram of the electronic tag attached to the packaging bag, wherein the second side edge of the Loop area of the antenna covers the bottom edge of the notch of the Dipo area, and at this time, the tag is attached to the packaging bag.
Specific example 2:
steps S1 to S24 are the same as in embodiment 1,
and step S3: and (3) tightly attaching the second side edge of the antenna Loop area to the bottom edge of the notch of the Dipo area, so that the Dipo area of the antenna is coupled with the line Loop area, wherein the first side edge is opposite to the second side edge, and the label is adhered to the package at the moment.
As can be seen from FIG. 6, the frequency band of 902-928mhz is adopted by the tag, and the tag can be received and read within a range of 8.75-10.5 meters away from the tag. As can be seen from fig. 7, the distance from the tag to reflect the signal is in the range of 2.5 to 4.25 meters. As can be seen from FIG. 8, the frequency band of 902-928mhz is adopted by the tag, the power that the tag can receive is-17 to-15 dbm, and as can be seen from FIG. 9, the power that the tag can reflect is-22.5 to-20 dbm. Fig. 10 is a structural diagram of the electronic tag attached to the packaging bag, wherein the second side edge of the Loop area of the antenna is tightly attached to the bottom edge of the notch of the Dipo area.
Specific example 3:
steps S1 to S24 are the same as in embodiment 1,
and step S3: and (3) enabling the second side edge of the antenna Loop area to be 1mm away from the bottom edge of the notch of the Dipo area, so that the Dipo area is coupled with the line Loop area, wherein the first side edge is opposite to the second side edge, and at the moment, the label is pasted on the package.
As can be seen from fig. 11, the frequency band of 902-928mhz is adopted by the tag, and the tag can be received and read within a range of 6.75-7.75 meters from the tag. As can be seen from fig. 12, the distance from the tag to reflect the signal is in the range of 2.75 to 3 meters. As can be seen from FIG. 13, the frequency band of 902-928mhz is adopted by the tag, the power that the tag can receive is-15.5 to-13 dbm, and as can be seen from FIG. 14, the power that the tag can reflect is-34 to-33.5 dbm. FIG. 15 is a structural diagram of the electronic tag attached to the packaging bag, wherein the second side of the Loop area of the antenna is 1mm away from the bottom edge of the notch of the Dipo area.
Specific example 4:
step S1: printing an antenna Dipo area on the packaging bag, wherein the Dipo area is symmetrical, a rectangular notch is formed in the Dipo area, and the notch is a labeling area of the antenna Loop area on the packaging bag.
Step S11: preparing conductive slurry, wherein the conductive slurry is formed by mixing an adhesive and glass powder; the mass fraction ratio of the adhesive to the glass powder is 2;
step S12: and (3) formulating a screen printing plate according to the pattern of the Dipo area, printing the conductive paste on a packaging bag through the screen printing plate, and curing for 20min at the temperature of 80-120 ℃ to form the material of the electric conductor.
Step S13: and then drying the Dipo area for 20min.
Step S2: manufacturing an antenna Loop area on a base material;
step 21: etching the aluminum foil on the substrate according to the Loop area pattern to form a plurality of antenna Loop areas;
step 22: the Loop areas are in a hollow rectangular shape, glue is dispensed on each antenna Loop area and then a chip is pasted on the second side edge of each Loop area, the antenna Loop areas are subjected to hot-press plastic package in sequence, and then performance test and screening are carried out;
step 23: adhering the plurality of antenna Loop areas to a substrate, then carrying out die cutting on the plurality of antenna Loop areas, and dividing the plurality of antenna Loop areas into a plurality of independent antenna Loop areas;
step 24: and rolling the Loop areas of the multiple antennas.
And step S3: and (3) enabling the second side edge of the Loop area of the antenna to be 0.5mm away from the bottom edge of the notch of the Dipo area, so that the Dipo area of the antenna is coupled with the Loop area of the wire.
As can be seen from fig. 16, the frequency band of 902-928mhz is adopted by the tag, and the tag can be received and read within a range of 8-8.75 meters from the tag. As can be seen from fig. 17, the distance from the tag to reflect the signal is in the range of 3.25 to 3.75 meters. As can be seen from FIG. 18, the frequency band of 902-928mhz is adopted by the tag, the power that the tag can receive is-15.25 to-13.25 dbm, and as can be seen from FIG. 19, the power that the tag can reflect is-32 to-31.25 dbm. FIG. 20 is a structural diagram of the electronic tag attached to the packaging bag, wherein the second side of the Loop area of the antenna is 0.5mm away from the bottom edge of the notch of the Dipo area.
From a comparison of specific examples 1 to 4, it can be seen that: when the electronic tag is adhered to the packaging bag, the position where the chip is placed on the Loop area has no influence on the coupling between the Loop area and the Dipo area of the electronic tag, and the Loop area is adhered to the labeling area, so that the tag reading performance has no great influence. Therefore, the invention adopts the method of directly printing the antenna dipole area on the packaging bag, only the part for printing is needed, and the prior carrier is changed into the packaging bag needed by a client. Not only saves the material of the carrier and the material required by compounding, but also saves the step of integrally labeling in the process. The Loop area is pasted on the packaging bag by independently using the pasting head, so that the original structure that the Loop area of the antenna is connected with the Dipo area is broken. The Loop region is now distinguished from Dipo le.
It should be understood that the detailed description of the invention is merely illustrative of the invention and is not intended to limit the invention to the specific embodiments described. It will be appreciated by those skilled in the art that the present invention may be modified or substituted equally as well to achieve the same technical result; as long as the use requirements are met, the method is within the protection scope of the invention.
Claims (4)
1. A preparation method of an RFID electronic tag intelligent package is characterized by comprising the following steps:
step S1: printing an antenna Dipole area on a packaging bag, and arranging a labeling area of an antenna Loop area on the packaging bag;
step S2: manufacturing an antenna Loop area on a base material;
and step S3: and pasting the antenna Loop area in the labeling deviation range to the labeling area so as to couple the antenna Dipole area with the line Loop area.
2. The method for preparing the RFID electronic tag intelligent package according to claim 1, wherein the step of printing the antenna Dipole area on the package bag comprises the following steps:
step S11: preparing conductive slurry, wherein the conductive slurry is formed by mixing an adhesive and glass powder; the mass fraction ratio of the adhesive to the glass powder is 2;
step S12: and (3) formulating a screen printing plate according to the pattern of the Dipole area, printing the conductive paste on a packaging bag through the screen printing plate, and curing for 20min at the temperature of 80-120 ℃ to form the material of the electric conductor.
Step S13: then drying the Dipole area for 20min.
3. The method for preparing the RFID electronic tag intelligent package according to the claim 1, wherein the step of manufacturing the Loop area of the antenna on the substrate comprises the following steps:
step 21: etching the aluminum foil on the substrate according to the Loop area pattern to form a plurality of antenna Loop areas;
step 22: dispensing glue on each antenna Loop area, then pasting a chip, sequentially carrying out hot-press plastic packaging on the antenna Loop areas, and then carrying out performance test and screening;
step 23: adhering the plurality of antenna Loop areas to a substrate, then carrying out die cutting on the plurality of antenna Loop areas, and dividing the plurality of antenna Loop areas into a plurality of independent antenna Loop areas;
step 24: and rolling the Loop areas of the multiple antennas.
4. The method for preparing the intelligent RFID electronic label package as claimed in claim 1, wherein the labeling deviation range is as follows: and taking the labeling area as the center of a circle and taking 0.1-0.5 mm as the radius to form a circle, and sticking the central point of the Loop area to the labeling area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210998947.0A CN115374895A (en) | 2022-08-19 | 2022-08-19 | Preparation method of RFID electronic tag intelligent package |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210998947.0A CN115374895A (en) | 2022-08-19 | 2022-08-19 | Preparation method of RFID electronic tag intelligent package |
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| CN202210998947.0A Pending CN115374895A (en) | 2022-08-19 | 2022-08-19 | Preparation method of RFID electronic tag intelligent package |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201348076A (en) * | 2012-05-23 | 2013-12-01 | Taiwan Lamination Ind Inc | Packaging bag having external pasting communication main body |
| CN110577771A (en) * | 2019-09-17 | 2019-12-17 | 宁波石墨烯创新中心有限公司 | conductive ink, RFID antenna, electronic tag and preparation method |
| CN212032193U (en) * | 2020-06-09 | 2020-11-27 | 苏州汇成芯通物联网科技有限公司 | A dual-frenquency electronic tags for tobacco is anti-fake and commodity circulation management and control |
| CN114065892A (en) * | 2021-11-19 | 2022-02-18 | 永道射频技术股份有限公司 | Environment-friendly RFID (radio frequency identification) tag and manufacturing method thereof |
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2022
- 2022-08-19 CN CN202210998947.0A patent/CN115374895A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201348076A (en) * | 2012-05-23 | 2013-12-01 | Taiwan Lamination Ind Inc | Packaging bag having external pasting communication main body |
| CN110577771A (en) * | 2019-09-17 | 2019-12-17 | 宁波石墨烯创新中心有限公司 | conductive ink, RFID antenna, electronic tag and preparation method |
| CN212032193U (en) * | 2020-06-09 | 2020-11-27 | 苏州汇成芯通物联网科技有限公司 | A dual-frenquency electronic tags for tobacco is anti-fake and commodity circulation management and control |
| CN114065892A (en) * | 2021-11-19 | 2022-02-18 | 永道射频技术股份有限公司 | Environment-friendly RFID (radio frequency identification) tag and manufacturing method thereof |
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