CN107393848B - 一种高密封度的气相腐蚀腔体 - Google Patents

一种高密封度的气相腐蚀腔体 Download PDF

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Publication number
CN107393848B
CN107393848B CN201710564802.9A CN201710564802A CN107393848B CN 107393848 B CN107393848 B CN 107393848B CN 201710564802 A CN201710564802 A CN 201710564802A CN 107393848 B CN107393848 B CN 107393848B
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China
Prior art keywords
sealing
cavity
seal
tightness
phase etching
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CN201710564802.9A
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Chinese (zh)
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CN107393848A (zh
Inventor
许开东
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Jiangsu Leuven Instruments Co Ltd
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Jiangsu Leuven Instruments Co Ltd
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Priority to CN201710564802.9A priority Critical patent/CN107393848B/zh
Publication of CN107393848A publication Critical patent/CN107393848A/zh
Priority to PCT/CN2018/087657 priority patent/WO2019011056A1/zh
Priority to JP2019571415A priority patent/JP6900134B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
CN201710564802.9A 2017-07-12 2017-07-12 一种高密封度的气相腐蚀腔体 Active CN107393848B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201710564802.9A CN107393848B (zh) 2017-07-12 2017-07-12 一种高密封度的气相腐蚀腔体
PCT/CN2018/087657 WO2019011056A1 (zh) 2017-07-12 2018-05-21 一种高密封度的气相腐蚀腔体
JP2019571415A JP6900134B2 (ja) 2017-07-12 2018-05-21 高気密気相腐食キャビティ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710564802.9A CN107393848B (zh) 2017-07-12 2017-07-12 一种高密封度的气相腐蚀腔体

Publications (2)

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CN107393848A CN107393848A (zh) 2017-11-24
CN107393848B true CN107393848B (zh) 2019-12-10

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CN201710564802.9A Active CN107393848B (zh) 2017-07-12 2017-07-12 一种高密封度的气相腐蚀腔体

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JP (1) JP6900134B2 (ja)
CN (1) CN107393848B (ja)
WO (1) WO2019011056A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107393848B (zh) * 2017-07-12 2019-12-10 江苏鲁汶仪器有限公司 一种高密封度的气相腐蚀腔体
JP7066263B2 (ja) * 2018-01-23 2022-05-13 株式会社ディスコ 加工方法、エッチング装置、及びレーザ加工装置
CN111336792B (zh) * 2018-12-19 2022-03-11 江苏鲁汶仪器有限公司 一种干燥微水珠的腔体
CN117367924A (zh) * 2022-06-29 2024-01-09 江苏鲁汶仪器股份有限公司 金属沾污收集系统和金属沾污收集方法
CN115535485B (zh) * 2022-09-24 2023-04-25 临沂市春明化工有限公司 用于化工品的防泄漏存贮装置
CN118173472B (zh) * 2024-03-14 2024-08-16 迈睿捷(南京)半导体科技有限公司 一种防微小颗粒漂浮的晶圆密封加热装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137520A (zh) * 2011-11-30 2013-06-05 昆山中辰矽晶有限公司 半导体晶片气蚀装置
CN104103561A (zh) * 2014-07-24 2014-10-15 河北神通光电科技有限公司 用于气态氟化氢刻蚀二氧化硅的刻蚀腔体及其刻蚀系统
CN105304443A (zh) * 2014-05-30 2016-02-03 盛美半导体设备（上海）有限公司 干法刻蚀装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103685B2 (ja) * 1989-05-06 1994-12-14 大日本スクリーン製造株式会社 基板の洗浄処理方法および装置
JPH09115889A (ja) * 1995-10-17 1997-05-02 Nippon Asm Kk 半導体エッチング装置及びその方法
JP3526284B2 (ja) * 2001-07-13 2004-05-10 エム・エフエスアイ株式会社 基板表面の処理方法
JP5865095B2 (ja) * 2012-01-30 2016-02-17 住友精密工業株式会社 エッチング装置
CN107393848B (zh) * 2017-07-12 2019-12-10 江苏鲁汶仪器有限公司 一种高密封度的气相腐蚀腔体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137520A (zh) * 2011-11-30 2013-06-05 昆山中辰矽晶有限公司 半导体晶片气蚀装置
CN105304443A (zh) * 2014-05-30 2016-02-03 盛美半导体设备（上海）有限公司 干法刻蚀装置
CN104103561A (zh) * 2014-07-24 2014-10-15 河北神通光电科技有限公司 用于气态氟化氢刻蚀二氧化硅的刻蚀腔体及其刻蚀系统

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Publication number Publication date
JP6900134B2 (ja) 2021-07-07
JP2020524913A (ja) 2020-08-20
CN107393848A (zh) 2017-11-24
WO2019011056A1 (zh) 2019-01-17

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Address after: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province

Patentee after: Jiangsu Luwen Instrument Co.,Ltd.

Address before: 221300 No.8, Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province

Patentee before: JIANGSU LEUVEN INSTRUMMENTS Co.,Ltd.