CN107359107A - The shower nozzle and Wafer cleaning machine of a kind of Wafer cleaning machine - Google Patents
The shower nozzle and Wafer cleaning machine of a kind of Wafer cleaning machine Download PDFInfo
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- CN107359107A CN107359107A CN201710452478.1A CN201710452478A CN107359107A CN 107359107 A CN107359107 A CN 107359107A CN 201710452478 A CN201710452478 A CN 201710452478A CN 107359107 A CN107359107 A CN 107359107A
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- shower nozzle
- disk
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- current
- cleaning machine
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a kind of shower nozzle of Wafer cleaning machine and Wafer cleaning machine, the shower nozzle includes nozzle and is placed on rotatable water-flowing form regulation ring 2 outside the nozzle, current size control valve 3, current size control valve 3 is provided with current flat channel 5 towards the side of water-flowing form regulation ring 2, and cleaning fluid flows into current flat channel 5 after current size control valve 3 adjusts current size.Wafer cleaning machine shower nozzle provided by the present invention can be used for cleaning various sizes of disk without changing shower nozzle, and the production capacity and efficiency of machine can not be reduced while fully cleaning disk.
Description
Technical field
The present invention relates to a kind of shower nozzle of Wafer cleaning machine and Wafer cleaning machine, belongs to integrated antenna package technology neck
Domain.
Background technology
Wafer is the silicon wafer used in silicon semiconductor production of integrated circuits, because it is shaped as circle, therefore referred to as wafer；
Various circuit component structures can be manufactured on silicon wafer, and turn into the IC products for having specific electrical functionality.Manufacture semiconductor
During device, multiple chips typically are formed on a common semiconductor disk, this will pass through multiple tracks treatment process, including corruption
The processes such as erosion, coating, doping, plating, untill to the last forming sandwich construction.
As semiconductor process technique strides forward to the direction that becomes more meticulous, in large scale integrated circuit (LSI) encapsulation process, slightly
Pollution (such as particulate, metal and organic matter etc.) will influence large scale integrated circuit yield and reliability, cause LSI circuits
The yield of product, stability decline.Therefore, it is more in each technological process link to dispose the pollution being attached on silicon wafer
Thing, prevent contamination to next technique.Wafer cleaning has caused people to the importance of semi-conductor industry early in the beginning of the fifties
Great attention, this is due to the performance, reliability and product yield that the pollutant of crystal column surface can have a strong impact on device.With
The development of integrated circuit, the closeness of circuit increasingly improves, the size of micro-structural increasingly macro, influence of the pollutant to device
Also it is further prominent, so that the technology of preparing of clean surface turns into the key technology for making various integrated circuits.Crystal column surface
Pollutant generally crystal column surface in a manner of chemically or physically adsorbing be present in the form of atom, ion, molecule, particle or film
Or in the oxide-film of wafer itself.Wafer cleaning requirement can remove all kinds of impurity and not damage wafer.Cleaning can be divided into physics
Cleaning and Chemical cleaning, Chemical cleaning include aqueous cleaning and gas phase cleaning etc. again.Due to there is more scheme alternative,
It is inexpensive and safe, it is selectively good to impurity and matrix, impurity can be cleaned clear to many advantages such as extremely low level, the aqueous solution
Wash and occupy leading position always in cleaning technique.
It is of interest that the research and improvement of wafer cleaning technology manufacture manufacturer by numerous semiconductor equipments in recent years.Part
Enterprise is improved above-mentioned cleaning device, but is devoted to improve the quality of cleaning.For example, SMIC's integrated circuit system
Make (Shanghai) Co., Ltd. to improve said apparatus, its Chinese utility model in Application No. CN03279085.6 is special
Profit discloses a kind of wafer cleaning liquid water column monitoring position device, is detected for wafer cleaning liquid water column position, it includes optics
Sender unit, has optical signalling emission source, and the optical signaling device is located at the first of a wafer cleaning plummer
Side, and the pivot of the optical signalling emission source center face wafer cleaning plummer；Optical signal receiving arrangement, if
Opposite side in a wafer cleaning plummer first side, have and receive the optical signalling energy that the optical signalling emission source projects
Power；And signal processing apparatus, it is connected with the optical signal receiving arrangement, can determine that the reception shape of the optical signal receiving arrangement
Condition；Wherein the optical signal receiving arrangement receives fainter optical signalling when the optical signalling passes through cleaning fluid water column；
The signal that the cleaning fluid water column position is detected by Water column position detecting device for wafer cleaning liquid informs wafer cleaning system to reach
Operating personnel, to make proper treatment.
In summary, in the prior art without solve shower nozzle structure how to rationally design, can be only achieved board production capacity with
This technical problem of the optimization of cleaning performance.
The content of the invention
In order to solve the above problems, the invention provides a kind of shower nozzle of Wafer cleaning machine：Including nozzle and it is placed on institute
Rotatable water-flowing form regulation ring 2 outside nozzle, current size control valve 3 are stated, current size control valve 3 leads to current shape
The side of shape regulation ring 2 is provided with current flat channel 5, and it is flat logical that cleaning fluid flows into current after valve 3 adjusts current size
Road 5.
Further, the cross section of the current flat channel 5 is in elliptical cylinder-shape, and cleaning fluid passes through current size control valve
Current flat channel 5 is flowed into after 3 regulation current sizes, its shape is changed into elliptical cylinder-shape from cylinder, then flow to water-flowing form
Regulation ring 2, the shape of current is can adjust by water-flowing form regulation ring 2.The water-flowing form regulation ring 2 and the nozzle threads
Connection；Water-flowing form regulation ring 2 is a valve, is connected by screw thread with the nozzle, and its internal cross section is ellipse.Rotation
Water-flowing form regulation ring can control the water outlet width x of apopore, and the cleaning fluid after adjusting water outlet width x directly sprays.
On the other hand, present invention also offers a kind of Wafer cleaning machine, including above-mentioned shower nozzle.Preferably, in addition to：Disk
Rotation speed detection unit, for detecting the rotating speed RPM of disk；Shower nozzle water spray width detection unit, for detecting having for shower nozzle water spray
Cleaning width x, shower nozzle mobile control unit or disk mobile control unit are imitated, receives the disk of disk rotation speed detection unit detection
Rotating speed RPM and shower nozzle water spray width detection unit detection shower nozzle water spray effective cleaning width x, according to disk Rotating speed measring
Effective cleaning width x of the rotating speed RPM of the disk of unit detection and the shower nozzle water spray of shower nozzle water spray width detection unit detection is moved
Dynamic shower nozzle or disk.The translational speed v=[RPMx/60] 2 of shower nozzle or disk, unit is mm/second.
The present invention can bring following beneficial effect：When being sprayed water from adjustable nozzle, the water shape that adjustable nozzle sprays is adjustable
, the width of cleaning fluid is adjustable, therefore can be used for cleaning various sizes of disk without changing shower nozzle, can be fully clear
The production capacity and efficiency of machine are not reduced while washing disk.
Brief description of the drawings
Fig. 1 is the principle of Wafer cleaning machine of the prior art；
Fig. 2 is the present invention according to effective cleaning width x movement shower nozzles of the rotating speed and shower nozzle of disk water spray or showing for disk
It is intended to；
Fig. 3 is the nozzle structure figure of present invention wafer cleaning machine；
Fig. 4 is the sectional view of the current flat channel of shower nozzle in Wafer cleaning machine in the present invention；
Fig. 5 is the sectional view of the water-flowing form regulation ring of shower nozzle in Wafer cleaning machine in the present invention；
Fig. 6 is the schematic diagram when water-flowing form regulation ring maximum blocks the apopore of current flat channel in the present invention；
Fig. 7 is the logic chart of shower nozzle removable wafer cleaning machine in the present invention；
Fig. 8 is the logic chart of disk removable wafer cleaning machine in the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the present invention, the technical scheme in the present invention is clearly and completely described.
A kind of method that shower nozzle moves during Wafer cleaning is provided in the first embodiment of the present invention.This method
Comprise the following steps：
Detect the rotating speed RPM of disk.As shown in figure 1, disk is located on disk plummer, disk plummer, which rotates, drives circle
Piece synchronous axial system.
Detect effective cleaning width x of shower nozzle water spray.In another embodiment, the sequencing of above-mentioned two step can
With displacement.That is, first detect effective cleaning width x of shower nozzle water spray；Then detect the rotating speed RPM of disk, i.e., it is per minute
(60 seconds) number of revolutions.
Preferably, adjustment shower nozzle water spray drop point is also included before effective cleaning width x steps of detection shower nozzle water spray so that
Water spray drop point falls within wafer pivot to improve cleaning quality.
Shower nozzle is moved according to effective cleaning width x that the rotating speed of disk and shower nozzle are sprayed water.As shown in Fig. 2 r is set as disk
Radius, l are the length across full wafer disk, and equivalent to 2r, then it is l/ that arm of spraying water, which completes a range and moves required number,
X, or 2r/x.Disk rotation is 60/RPM (units the time required to turning around：Second).
In order to improve the cleaning efficiency of cleaning machine, disk rotation, which is turned around, completes an Integral cleaning, so required time
It is most short, i.e. l/x=1, or 2r/x=1.Therefore, shower nozzle moves moving method during Wafer cleaning provided by the invention
In, the required cleaning shortest time is t=l/x60/RPM.Therefore, can be in the moving range of water spray arm in implementation process
Arm of being sprayed water when covering full wafer disk is completed once to move, and each region of disk can be cleaned once.Then disk rotating speed with
Water spray arm translational speed relation be：
V=l/t2=2r/t2=2rRPM/60x/2r2=[RPMx/60] 2
Above-mentioned v is the translational speed of water spray arm, that is, the translational speed of shower nozzle, unit are mm/second.V=l/t
2, it is because l is the length across full wafer disk to multiply 2, and equivalent to 2r, that is, often circle has cleaned 2 times, multiplies 2 and adds equivalent to speed
Then wash number halves again.
In an illustrative embodiment, it is assumed that disk rotating speed is 300RPM, and water spray effective width is 0.01inch
(0.254mm), then
V=[RPMx/60] 2=[3000.254/60] 2=1.272=2.54mm/sec
That is, for when arm translational speed of spraying water is more than 2.54mm/sec, Wafer cleaning may occur blind
Area；Although during Wafer cleaning, water spray arm only will not be swung once, but can swing a period of time back and forth, water spray
Arm translational speed is too fast or can reduce the effect of cleaning, and subregion is not yet cleaned；On the other hand, arm of spraying water moves
Dynamic speed can reduce the production capacity and efficiency of machine slowly excessively.
Because disk is mobile and water spray arm movement is relative, disk does not move the effect and disk of water spray arm movement
Effect mobile and that arm of spraying water does not move is the same.Therefore, it is clear that a kind of disk is provided in second embodiment of the present invention
The method that disk moves during washing.This method comprises the following steps：
Step 1：Detect the rotating speed RPM of disk, i.e., (60 seconds) number of revolutions per minute.
Step 2：Detect effective cleaning width x of shower nozzle water spray.It will be understood by those of skill in the art that above-mentioned two
The sequencing of step can replace.That is, first detect effective cleaning width x of shower nozzle water spray；Then disk is detected
Rotating speed RPM.
Step 3：The effective cleaning width x removable wafers sprayed water according to the rotating speed of disk and shower nozzle.As shown in Fig. 2 set r
For the radius of disk, l is the length across full wafer disk, and equivalent to 2r, then it is required that arm of spraying water completes a range movement
Number is l/x, or 2r/x.During Wafer cleaning provided by the invention in disk movement moving method, required cleaning is most short
Time is t=l/x60/RPM.Therefore in implementation process, can justify when the moving range for arm of spraying water covers full wafer disk
Piece is completed once to move, and each region of disk can be cleaned once.Then disk rotating speed and the pass of water spray arm translational speed
It is to be：
V=l/t2=2r/t2=2rRPM/60x/2r2=[RPMx/60] 2
Above-mentioned v is the translational speed of disk, and unit is mm/second.V=l/t 2, it is because l is across full wafer disk to multiply 2
Length, equivalent to 2r, that is, often circle cleaned 2 times, multiplying 2, then wash number halves equivalent to speed doublings.
In an illustrative embodiment, it is assumed that disk rotating speed is 300RPM, and water spray effective width is 0.01inch
(0.254mm), then
V=[RPMx/60] 2=[3000.254/60] 2=1.272=2.54mm/sec
That is, for when disk translational speed is more than 2.54mm/sec, blind area may occurs in Wafer cleaning；Protect
Hold water spray arm be motionless and disk moves, can reduce the effect of cleaning when disk translational speed is too fast, subregion not yet by
Clean to, and disk translational speed can reduce the production capacity and efficiency of machine slowly excessively.
In third embodiment of the present invention, there is provided a kind of matching used with embodiment one, embodiment two
The nozzle adjustable structure of Wafer cleaning machine.As shown in figure 3, the nozzle structure includes：Nozzle 1 and it is placed on outside nozzle 1 and can revolves
The water-flowing form regulation ring 2 turned, the water-flowing form regulation ring 2 and nozzle 1 coordinate for screw thread.Shower nozzle is provided with current size control
Valve 3 processed, it is threadedly coupled with nozzle 1, including the valve core 3-1 connected with nozzle 1, rotary screw 3-2, passes through rotary screw
3-2 turn drives valve core 3-1 to be moved toward the water stream channel 4 inside shower nozzle and control current size, and water stream channel 4 is in cylinder
Shape.
Preferably, current size control valve 3 is provided with current flat channel 5, water towards the side of water-flowing form regulation ring 2
The cross section for flowing flat channel 5 is in elliptical cylinder-shape, as shown in Figure 4.Cleaning fluid is big by the regulation current of current size control valve 3
Current flat channel 5 is flowed into after small, its shape is changed into elliptical cylinder-shape from cylinder, then flow to water-flowing form regulation ring 2, passes through
Water-flowing form regulation ring 2 can adjust the shape of current.Water-flowing form regulation ring 2 is a valve, is connected by screw thread and nozzle 1
Connect, can be rotated around nozzle 1, its internal cross section is ellipse, as shown in Figure 5., can be with by rotary water current shape adjustment ring 2
Control the water outlet shape of apopore and then control its water outlet width x, the cleaning fluid after adjusting water outlet width x directly sprays.
When water-flowing form regulation ring 2 does not block the apopore of current flat channel 5, now the water outlet width of shower nozzle is maximum.Because this
When water outlet be shaped as ellipse, therefore cleaning fluid sprays in flat；If now turn water-flowing form regulation ring 2, current shape
Shape regulation ring 2 is by partial occlusion current flat channel 5, when the water outlet of current flat channel 5 is blocked in the part of water-flowing form regulation ring 2
Kong Shi, the cleaning fluid that shower nozzle sprays tend to cylinder, i.e., usually said linear pattern.Fig. 6 illustrates to work as water-flowing form regulation ring 2
Maximum blocks the situation during apopore of current flat channel 5, and now the water outlet width of shower nozzle is minimum.
In the 4th embodiment of the present invention, there is provided a kind of Wafer cleaning machine.It is included described in the 3rd embodiment
Shower nozzle, the nozzle structure includes：Nozzle 1 and it is placed on rotatable water-flowing form regulation ring 2 outside nozzle 1, the water-flowing form
Regulation ring 2 and nozzle 1 coordinate for screw thread.Shower nozzle is provided with current size control valve 3, and it is threadedly coupled with shower nozzle, including with
Valve core 3-1, the rotary screw 3-2 that nozzle 1 connects, valve core 3-1 is driven toward inside shower nozzle by rotary screw 3-2 turn
Water stream channel 4 move and control current size, water stream channel 4 in cylinder.Current size control valve 3 leads to water-flowing form
The side of regulation ring 2 is provided with current flat channel 5, and the cross section of current flat channel 5 is in elliptical cylinder-shape, and cleaning fluid passes through current
Size control valve 3 flows into current flat channel 5 after adjusting current size, and its shape is changed into elliptical cylinder-shape from cylinder, then
Water-flowing form regulation ring 2 is flow to, the shape of current can be adjusted by water-flowing form regulation ring 2.Water-flowing form regulation ring 2 is one
Valve, it is connected, can be rotated around nozzle 1 with nozzle 1 by screw thread, its internal cross section is ellipse.Pass through rotary water current shape
Regulation ring 2, the water outlet shape of apopore can be controlled and then control its water outlet width x, the cleaning after adjusting water outlet width x
Liquid directly sprays.When water-flowing form regulation ring 2 does not block the apopore of current flat channel 5, the now water outlet width of shower nozzle
It is maximum.Because now water outlet is shaped as ellipse, therefore cleaning fluid sprays in flat；If now turn water-flowing form regulation ring
2, then water-flowing form regulation ring 2 is by partial occlusion current flat channel 5, and when the part of water-flowing form regulation ring 2, to block current flat
During the apopore of passage 5, the cleaning fluid that shower nozzle sprays tends to cylinder, i.e., usually said linear pattern.Fig. 6 illustrates to work as current
The maximum of shape adjustment ring 2 blocks the situation during apopore of current flat channel 5, and now the water outlet width of shower nozzle is minimum.
In the 5th embodiment of the present invention, there is provided a kind of Wafer cleaning machine described in based on the 4th embodiment.
As shown in fig. 7, it includes：Disk rotation speed detection unit, on disk plummer, for detecting the rotating speed RPM of disk.Spray
Head water spray width detection unit, for detecting effective cleaning width x of shower nozzle water spray, shower nozzle mobile control unit, receives disk
The rotating speed RPM of the disk of rotation speed detection unit detection and the shower nozzle water spray of shower nozzle water spray width detection unit detection effective cleaning
Width x, the shower nozzle of rotating speed RPM and shower nozzle the water spray width detection unit detection of the disk detected according to disk rotation speed detection unit
Effective cleaning width x movement shower nozzles of water spray.Preferably, v=[RPM x/60] 2.Above-mentioned v is the shifting of water spray arm, i.e. shower nozzle
Dynamic speed, unit is mm/second.
In the 6th embodiment of the present invention, there is provided a kind of Wafer cleaning machine described in based on the 4th embodiment.
As shown in figure 8, it includes：Disk rotation speed detection unit, on disk plummer, for detecting the rotating speed RPM of disk.Spray
Head water spray width detection unit, for detecting effective cleaning width x of shower nozzle water spray, disk mobile control unit, receives disk
The rotating speed RPM of the disk of rotation speed detection unit detection and the shower nozzle water spray of shower nozzle water spray width detection unit detection effective cleaning
Width x, the shower nozzle of rotating speed RPM and shower nozzle the water spray width detection unit detection of the disk detected according to disk rotation speed detection unit
Effective cleaning width x movements of water spray, disk.Preferably, v=[RPM x/60] 2.Above-mentioned v be disk translational speed, unit
For mm/second.
The present invention can bring following beneficial effect：Firstth, when being sprayed water from adjustable nozzle, the water shape that adjustable nozzle sprays is
Adjustable, the width of cleaning fluid is adjustable, therefore can be used for cleaning various sizes of disk without changing shower nozzle；Secondth, it is logical
Disk rotary speed and shower nozzle water outlet width are crossed to control the translational speed of disk or arm of cleaning, can fully cleaned
The production capacity and efficiency of machine are not reduced while disk.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
- A kind of 1. shower nozzle of Wafer cleaning machine, it is characterised in that：Including nozzle and it is placed on rotatable current outside the nozzle Shape adjustment ring (2), current size control valve (3), current size control valve (3) lead to water-flowing form regulation ring (2) one Side is provided with current flat channel (5), and it is flat that cleaning fluid flows into current after current size control valve (3) adjusts current size Flat passage (5).
- 2. the shower nozzle of Wafer cleaning machine as claimed in claim 1, it is characterised in that：The horizontal stroke of the current flat channel (5) Section is in elliptical cylinder-shape, and cleaning fluid flows into current flat channel after current size control valve (3) adjusts current size (5), its shape is changed into elliptical cylinder-shape from cylinder, then flow to water-flowing form regulation ring (2), passes through water-flowing form regulation ring (2) it can adjust the shape of current.
- 3. the shower nozzle of Wafer cleaning machine as claimed in claim 2, it is characterised in that：The water-flowing form regulation ring (2) and The nozzle threads connection；Water-flowing form regulation ring (2) is a valve, is connected by screw thread with the nozzle, its inner cross sectional Face is ellipse.
- 4. the shower nozzle of Wafer cleaning machine as claimed in claim 3, it is characterised in that：Rotary water current shape adjustment ring (2) can The water outlet width x of apopore is controlled, the cleaning fluid after adjusting water outlet width x directly sprays.
- 5. a kind of Wafer cleaning machine, it includes the shower nozzle of the Wafer cleaning machine described in claim 1-4 any one.
- 6. Wafer cleaning machine as claimed in claim 5, it is characterised in that also include：Disk rotation speed detection unit, for detecting the rotating speed RPM of disk；Shower nozzle water spray width detection unit, for detecting effective cleaning width x of shower nozzle water spray；Shower nozzle mobile control unit or disk mobile control unit, turn of the disk for receiving the detection of disk rotation speed detection unit Effective cleaning width x of the shower nozzle water spray of fast RPM and shower nozzle water spray width detection unit detection, according to disk rotation speed detection unit Effective cleaning width x movement sprays of the shower nozzle water spray of rotating speed RPM and shower nozzle the water spray width detection unit detection of the disk of detection Head or disk.
- 7. Wafer cleaning machine as claimed in claim 6, it is characterised in that：The translational speed v=of the shower nozzle or the disk [RPMx/60] 2, unit are mm/second.
- 8. Wafer cleaning machine as claimed in claim 6, it is characterised in thatThe disk rotation speed detection unit is prior to shower nozzle water spray width detection cell operation；Or the shower nozzle water spray width Degree detection unit works prior to the disk rotation speed detection unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710452478.1A CN107359107B (en) | 2014-11-18 | 2014-11-18 | Spray head for wafer cleaning machine and wafer cleaning machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410660929.7A CN104377153B (en) | 2014-11-18 | 2014-11-18 | A kind of Wafer cleaning machine and its nozzle moving method, disk moving method |
| CN201710452478.1A CN107359107B (en) | 2014-11-18 | 2014-11-18 | Spray head for wafer cleaning machine and wafer cleaning machine |
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| CN201410660929.7A Division CN104377153B (en) | 2014-11-18 | 2014-11-18 | A kind of Wafer cleaning machine and its nozzle moving method, disk moving method |
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| CN107359107A true CN107359107A (en) | 2017-11-17 |
| CN107359107B CN107359107B (en) | 2020-07-14 |
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| CN201710452478.1A Active CN107359107B (en) | 2014-11-18 | 2014-11-18 | Spray head for wafer cleaning machine and wafer cleaning machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109013090A (en) * | 2018-09-18 | 2018-12-18 | 江苏金泰祥内外门业有限公司 | A kind of glue coating case |
| CN110834023A (en) * | 2018-08-15 | 2020-02-25 | 宝钢工程技术集团有限公司 | Air curtain type acid mist protection device and using method thereof |
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| CN107008038B (en) * | 2017-04-27 | 2023-07-07 | 云南科力环保股份公司 | Device for discharging concentrated ore pulp |
| CN114361059A (en) | 2020-10-13 | 2022-04-15 | 长鑫存储技术有限公司 | Wafer cleaning equipment and cleaning method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104377153B (en) | 2018-07-17 |
| CN107359107B (en) | 2020-07-14 |
| CN104377153A (en) | 2015-02-25 |
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