CN106711059B - A kind of liquid-state protective structure for backside of wafer - Google Patents
A kind of liquid-state protective structure for backside of wafer Download PDFInfo
- Publication number
- CN106711059B CN106711059B CN201510772629.2A CN201510772629A CN106711059B CN 106711059 B CN106711059 B CN 106711059B CN 201510772629 A CN201510772629 A CN 201510772629A CN 106711059 B CN106711059 B CN 106711059B
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- China
- Prior art keywords
- wafer
- collection cups
- deionized water
- backside
- bracket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Abstract
The present invention relates to the water-tight devices for preventing backside of wafer from staiing in the technique units such as the development of monolithic wet method equipment, cleaning, specifically a kind of liquid-state protective structure for backside of wafer, including collection cups and in the collection cups, the vacuum chuck that adsorbs wafer and wafer is driven to rotate, collection cups and vacuum chuck are installed in technique unit；Collection cups are divided into collection cups outer cover and collection cups inner cover, cover in collection cups and are equipped with protective ring, and the inner ring of protective ring is located at the lower section of wafer, and there are the working clearances between wafer；Protective ring is respectively arranged below with the gas tip bracket and deionized water head cartridge being mounted in technique unit, deionized water head cartridge is equipped with the deionized water spray head to working clearance sprinkling deionized water, and gas tip bracket is equipped with the gas tip of air blowing and then dry backside of wafer.The present invention can be effectively prevented liquid and enter backside of wafer, achieve the purpose that backside of wafer is protected.
Description
Technical field
The present invention relates to the waders for preventing backside of wafer from staiing in the technique units such as the development of monolithic wet method equipment, cleaning
It sets, specifically a kind of liquid-state protective structure for backside of wafer.
Background technique
In monolithic wet method equipment, wafer often needs to use a large amount of developer solution or chemicals is developed, cleaned
Technological action, a large amount of liquid can be left to backside of wafer along side wall, and the back side is then caused to stain or enter very along sucker
Empty set system, causes vacuum tube to pass by the damage of the components such as motor.Therefore, after the completion of technique, chemicals needs are completely removed, cannot
It is remained on wafer.Common method is to be rinsed in wafer frontside and the back side using a large amount of DIW (deionized water), then pass through high speed
The modes such as rotation or nitrogen purging are completely dried crystal column surface.This method can rinse out positive chemicals, but wafer
The back side is difficult to remove close to the chemicals of chuck (sucker) nearby, or causes liquid to enter vacuum system because liquid measure is excessive
System.
Summary of the invention
In order to solve the problems, such as that backside of wafer chemicals difficulty removes, the purpose of the present invention is to provide one kind to carry on the back for wafer
The liquid-state protective structure in face.The liquid-state protective structure utilizes the surface tension of liquid itself, in contactless mode, realizes brilliant
The purpose of circle backside chemical product protection.
The purpose of the present invention is achieved through the following technical solutions:
The present invention include collection cups and in the collection cups, adsorb wafer and drive wafer rotate vacuum chuck, institute
It states collection cups and vacuum chuck is installed in technique unit；The collection cups are divided into collection cups outer cover and collection cups inner cover,
It is covered in the collection cups and protective ring is installed, the inner ring of the protective ring is located at the lower section of the wafer, and stays between wafer
There is the working clearance；The protective ring is respectively arranged below with the gas tip bracket and deionization being mounted in the technique unit
Sprinkler head bracket, the deionized water head cartridge are equipped with the deionized water spray head to working clearance sprinkling deionized water,
The gas tip bracket is equipped with the gas tip of air blowing and then dry backside of wafer.
Wherein: the gas tip bracket is identical as the structure of deionized water head cartridge, include horizontal adjustment bracket,
Angle-adjusting bracket and connecting plate, the horizontal adjustment bracket are mounted in the technique unit, are opened in the horizontal adjustment bracket
There are multiple strip-shaped holes, the connecting plate is mounted in horizontal adjustment bracket, and different in horizontal adjustment bracket by being mounted on
Strip-shaped hole carrys out the height of regulating gas spray head or deionized water spray head；The angle-adjusting bracket is mounted on connecting plate by bolt
On, it is provided with arcuate socket on the angle-adjusting bracket, angle-adjusting bracket is adjusted by the bolt in the movement of arcuate socket
The angle of gas tip or deionized water spray head；
The end face of the horizontal adjustment bracket is L shape, and being mounted in the technique unit on one side for the L shape is another
Edge short transverse is provided with multiple strip-shaped holes；The angle-adjusting bracket be it is discoid, be along the circumferential direction evenly equipped with multiple
Arcuate socket, the gas tip or deionized water spray head are mounted on the angle-adjusting bracket, and respectively with gas source or deionization
Water source is connected；
The protective ring is mounted in collection cups by multiple fastening nuts and is covered, around each fastening nut
It is evenly equipped with the adjusting jackscrew of working clearance between multiple adjusting protective rings and wafer；Protective ring inner ring edge upwardly extends,
It is the working clearance between the extension and the wafer；The collection cups inner cover is located at the lower section of wafer, the collection cups outer cover
Top be located at the top of wafer.
Advantages of the present invention and good effect are as follows:
1. the present invention uses contactless structure, using the surface tension of liquid, liquid entrance can be effectively prevented
Backside of wafer separates backside of wafer by the protective ring every liquid, is sprayed by the fixed point of spray head, is rinsed and dries up, can be with
The chemicals for effectively removing backside of wafer achievees the purpose that backside of wafer is protected, and will not be to backside of wafer and vacuum line
It pollutes.
2. gas tip and deionized water nozzle angle of the invention and height are adjustable, Zi Shui is made to be sprayed at protective ring
At working clearance between wafer, reach optimal protection effect.
3. the working clearance between protective ring of the present invention and wafer is adjustable, and then controls the flowing of liquid.
4. protective ring of the invention can be selected according to wafer size, do not limited by wafer size.
5. the present invention can effectively completely cut off the chemicals of backside of wafer, effectively accomplishes " separating dry space from moist space ", effectively prevent chemistry
Product enter the parts such as vacuum system, rotating mechanism, and equipment key part is protected not to be damaged.
6. the present invention can be removed directly, maintains easily and replace.
Detailed description of the invention
Fig. 1 is schematic diagram of internal structure of the invention；
Fig. 2 is schematic perspective view of the invention；
Fig. 3 is one of working state schematic representation of the invention；
Fig. 4 is the two of working state schematic representation of the invention；
Fig. 5 is the three of working state schematic representation of the invention；
Fig. 6 is one of gas tip bracket of the present invention or schematic perspective view of deionized water head cartridge；
Fig. 7 is the two of the schematic perspective view of gas tip bracket of the present invention or deionized water head cartridge；
Wherein: 1 is collection cups outer cover, and 2 be collection cups inner cover, and 3 be protective ring, and 4 be wafer, and 5 be vacuum chuck, and 6 be gas
Body head cartridge, 7 be gas tip, and 8 be deionized water spray head, and 9 be deionized water head cartridge, and 10 is adjust jackscrew, and 11 are
Fastening nut, 12 be the working clearance, and 13 be chemicals, and 14 be horizontal adjustment bracket, and 15 be angle-adjusting bracket, and 16 be bar shaped
Hole, 17 be connecting plate, and 18 be arcuate socket.
Specific embodiment
The invention will be further described with reference to the accompanying drawing.
In a complete development or cleaning process unit, the protection that collection cups are used to chemicals (prevents from splashing unit
It is external) and waste liquid collection, while gas-liquid separation can be played the role of.As shown in Figure 1, liquid-state protective structure packet of the invention
Include collection cups and in the collection cups, absorption wafer 4 and the vacuum chuck 5 for driving wafer 4 to rotate, collection cups and vacuum chuck
5 are installed in technique unit.Collection cups are divided into collection cups outer cover 1 and collection cups inner cover 2, and collection cups outer cover 1 is to protect most
Outer layer is used to completely isolated process island and non-process area；Collection cups inner cover 2 is located in collection cups outer cover 1, for separate gas and
Liquid, while the support construction as 4 lower rear protective ring 3 of wafer.Wafer 4 is adsorbed by vacuum chuck 5 by vacuum,
Guarantee that wafer 4 can be fixed and as vacuum chuck 5 is rotated.5 motor of vacuum chuck drives, can be in 0~5000rpm/
Revolving speed is arbitrarily adjusted in min velocity interval, to meet the needs of not same process.
Collection cups inner cover 2 is located at the lower section of wafer 4, and the top of collection cups outer cover 1 is located at the top of wafer 4.In collection cups
The top of inner cover 2 is equipped with protective ring 3, and the inner ring of protective ring 3 is located at the lower section of wafer 4, and edge upwardly extends, the extension
There are the working clearances 12 between portion and wafer 4.The adjustment working clearance 12 is best between 0.9mm~1.1mm under normal circumstances,
But it has to guarantee that uniformly continuous is wanted in the gap of whole circumference.Protective ring 3 can be selected according to the size of wafer 4, not by equipment
The limitation of size.As shown in Fig. 2, protective ring 3 is fixed on collection cups inner cover 2 by multiple fastening nuts 11, in each fastening
The adjusting jackscrew 10 of working clearance 12 between multiple adjusting protective rings 3 and wafer 4 is evenly equipped with around nut 11；The present embodiment
Fastening nut 11 is three, has respectively been uniformly distributed two adjusting jackscrews 10 around each fastening nut 11.When adjustment, first unclamp
Fastening nut 11, then adjust and adjust jackscrew 10, so that the top edge of 3 inner ring of protective ring is reached requirement (0.9mm at a distance from wafer 4
~1.1mm) distance, fastening nut 11 is then locked, the protective ring 3 of fixed 4 lower rear of wafer is completed.Note that when adjusting,
Guarantee that six adjusting jackscrews 10 are all completely attached to collection cups inner cover 2.
Protective ring 3 is respectively arranged below with the gas tip bracket 6 being mounted in technique unit and deionized water spray head branch
Frame 9, the deionized water head cartridge 9 are equipped with the deionized water spray head 8 that deionized water is sprayed to the working clearance 12, gas tip
Bracket 6 is equipped with the gas tip 7 of air blowing and then dry 4 back side of wafer.As shown in Figure 6, Figure 7, gas tip bracket 6 with go
The structure of deionized water nozzle bracket 9 is identical, includes horizontal adjustment bracket 14, angle-adjusting bracket 15 and connecting plate 17, level
The end face of adjusting bracket 14 is L shape, which is fixed in technique unit on one side, and another side is provided with more along short transverse
A strip-shaped hole 16；The strip-shaped hole 16 of the present embodiment is two.Angle-adjusting bracket 15 be it is discoid, be along the circumferential direction evenly equipped with more
A arcuate socket 18 (arcuate socket 18 of the present embodiment is two), gas tip 7 or deionized water spray head 8 are mounted on angular adjustment branch
On frame 15, and it is connected respectively with gas source (gas of the invention can be nitrogen) or deionized water source.Angle-adjusting bracket 15 is logical
Bolt is crossed to be mounted on connecting plate 17, angle-adjusting bracket 15 by bolt arcuate socket 18 movement come regulating gas spray head 7
Or the angle of deionized water spray head 8, make what is sprayed to go from water or gas towards the position of working clearance 12, to reach optimal
Protection effect.It is provided with multiple threaded holes on connecting plate 17, is mounted in horizontal adjustment bracket 14 by bolt, and by being mounted on
Different strip-shaped holes 16 carrys out the height of regulating gas spray head 7 or deionized water spray head 8 in horizontal adjustment bracket 14.
The operation principle of the present invention is that:
As seen in figures 3-5, at work, chemicals 13 is sprayed on 4 front of wafer, and wafer 4 is in vacuum chuck 5
It drives lower in static or rotation status.Under low speed rotation or stationary state, chemicals 13 can be overflow along the side of wafer 4
The back side of wafer 4.Chemicals 13 is prevented to continue to flow to 4 back side of wafer at this point, the protective ring 3 of 4 lower rear of wafer can play
Effect.When chemicals 13 touches the protective ring 3 of 4 lower rear of wafer, due to the effect of surface tension of liquid, chemicals
13 can be stopped in 12 position of working clearance, can not continue to 4 intermediate flow of wafer.In this way, can be effectively by 4 back side of wafer
Dry and wet region separate, in order to guarantee the cleaning at the back side after the completion of technique.
After the completion of cleaning or developing process, vacuum chuck 5 drives 4 high speed rotation of wafer, and the chemicals 13 on wafer 4 is made
It is disposed with the mode of centrifuge dripping；Deionized water spray head 8 is opened at this time, goes to the position that the working clearance 12 is sprayed to from water,
Using the high-speed rotating centrifugal force of wafer 4, deionized water can be flowed out along the working clearance 12, chemical to reach the cleaning back side
The purpose of 13 Polluted area of product.After completing flushing movement, gas tip 7 is opened, auxiliary nitrogen purging can thoroughly dry wafer 4
The back side, complete entire technical process.
Claims (6)
1. a kind of liquid-state protective structure for backside of wafer, including collection cups and it is located in the collection cups, absorption wafer and band
The vacuum chuck of dynamic wafer rotation, the collection cups and vacuum chuck are installed in technique unit；It is characterized by: the receipts
Collection cup is divided into collection cups outer cover (1) and collection cups inner cover (2), is equipped with protective ring (3) on the collection cups inner cover (2), described
The inner ring of protective ring (3) is located at the lower section of the wafer (4), and there are working clearance (12) between wafer (4)；The protection
Ring (3) is respectively arranged below with the gas tip bracket (6) and deionized water head cartridge being mounted in the technique unit
(9), which is equipped with the deionized water spray head to the working clearance (12) sprinkling deionized water
(8), the gas tip bracket (6) is equipped with the gas tip (7) of air blowing and then dry wafer (4) back side；
The gas tip bracket (6) is identical as the structure of deionized water head cartridge (9), includes horizontal adjustment bracket
(14), angle-adjusting bracket (15) and connecting plate (17), which is mounted in the technique unit, described
It being provided in horizontal adjustment bracket (14) multiple strip-shaped holes (16), the connecting plate (17) is mounted on horizontal adjustment bracket (14),
And by being mounted on strip-shaped hole (16) different on horizontal adjustment bracket (14) come regulating gas spray head (7) or deionized water spray head
(8) height；The angle-adjusting bracket (15) is mounted on connecting plate (17) by bolt, in the angle-adjusting bracket (15)
On be provided with arcuate socket (18), angle-adjusting bracket (15) by the bolt arcuate socket (18) movement come regulating gas spray head
(7) or the angle of deionized water spray head (8).
2. the liquid-state protective structure according to claim 1 for backside of wafer, it is characterised in that: the horizontal adjustment bracket
(14) end face is L shape, which is mounted on one side in the technique unit, and another side is provided with multiple along short transverse
The strip-shaped hole (16).
3. the liquid-state protective structure according to claim 1 for backside of wafer, it is characterised in that: the angle-adjusting bracket
(15) it to be discoid, is along the circumferential direction evenly equipped with multiple arcs hole (18), the gas tip (7) or deionized water spray head (8)
It is mounted on the angle-adjusting bracket (15), and is connected respectively with gas source or deionized water source.
4. the liquid-state protective structure according to claim 1 for backside of wafer, it is characterised in that: the protective ring (3) is logical
It crosses multiple fastening nuts (11) to be mounted on collection cups inner cover (2), be evenly equipped with around each fastening nut (11) more
A adjusting jackscrew (10) for adjusting the working clearance (12) between protective ring (3) and wafer (4).
5. the liquid-state protective structure according to claim 4 for backside of wafer, it is characterised in that: in the protective ring (3)
Circle edge upwardly extends, and is between the extension and the wafer (4) working clearance (12).
6. the liquid-state protective structure according to claim 1 for backside of wafer, it is characterised in that: the collection cups inner cover
(2) it is located at the lower section of wafer (4), the top of the collection cups outer cover (1) is located at the top of wafer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772629.2A CN106711059B (en) | 2015-11-12 | 2015-11-12 | A kind of liquid-state protective structure for backside of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772629.2A CN106711059B (en) | 2015-11-12 | 2015-11-12 | A kind of liquid-state protective structure for backside of wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711059A CN106711059A (en) | 2017-05-24 |
| CN106711059B true CN106711059B (en) | 2019-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510772629.2A Active CN106711059B (en) | 2015-11-12 | 2015-11-12 | A kind of liquid-state protective structure for backside of wafer |
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| Country | Link |
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| CN (1) | CN106711059B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453003B (en) * | 2020-11-03 | 2022-02-15 | 四川美术学院 | Semiconductor wafer clamping equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6286178B1 (en) * | 2000-03-10 | 2001-09-11 | United Microelectronics Corp. | Jet cleaning device for developing station |
| CN102427047A (en) * | 2011-09-28 | 2012-04-25 | 上海华力微电子有限公司 | Wafer back cleaning device and wafer back cleaning method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110714A (en) * | 1999-10-13 | 2001-04-20 | Sony Corp | Chemical liquid coater and chemical liquid coating method |
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2015
- 2015-11-12 CN CN201510772629.2A patent/CN106711059B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6286178B1 (en) * | 2000-03-10 | 2001-09-11 | United Microelectronics Corp. | Jet cleaning device for developing station |
| CN102427047A (en) * | 2011-09-28 | 2012-04-25 | 上海华力微电子有限公司 | Wafer back cleaning device and wafer back cleaning method |
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| Publication number | Publication date |
|---|---|
| CN106711059A (en) | 2017-05-24 |
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| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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