CN101439494A

CN101439494A - Cleaner for CMP equipment grinding head

Info

Publication number: CN101439494A
Application number: CNA200710094260XA
Authority: CN
Inventors: 祝志敏; 瞿治军
Original assignee: Shanghai Hua Hong NEC Electronics Co Ltd
Current assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority date: 2007-11-22
Filing date: 2007-11-22
Publication date: 2009-05-27

Abstract

The invention discloses a device used for cleaning the grinding head of CMP equipment, comprising a water supply module, a grinding head cleaning control air passage, a pneumatic water valve 1, a bearing platform water supply pipe, and a grinding head assembly/disassembly device; wherein, the internal bottom of the grinding head assembly/disassembly device is a silicon plate bearing platform which is provided with pure water nozzles which are communicated with the bearing platform water supply pipe; the device also comprises a pneumatic water valve 2 and a peripheral cleaning water supply pipe; the grinding head cleaning control air passage controls the openness and closeness of the pneumatic water valve 1 and the pneumatic water valve 2 at the same time, thus communicating or preventing the pure water in the water supply module from entering the bearing platform water supply pipe and the peripheral cleaning water supply pipe; one end of the peripheral cleaning water supply pipe is a peripheral cleaning nozzle which is additionally arranged beside the grinding head assembly/disassembly device; furthermore, the outlet of the nozzle faces inwards; the gushed pure water can wash the grinding head peripheral area above the grinding head assembly/disassembly device. The device used for cleaning the grinding head of CMP equipment can reduce the frequency and time of maintenance operation of CMP equipment, and can reduce the possibility that the grains exceed the standard and the product is scraped.

Description

CMP equipment grinding head cleaning device

Technical field

The invention belongs to field of semiconductor manufacture, relate to the clean and maintenance of semiconductor equipment, particularly a kind of CMP equipment grinding head cleaning device.

Background technology

CMP (Chemical Mechanical Polishing) equipment is the abbreviation of semicon industry chemical mechanical polishing apparatus.The cleaning device of existing CMP equipment grinding head as shown in Figure 1.Comprise water supply module 11, grinding head cleaning control gas circuit 12, pneumatic water valve 13, plummer feed pipe 14, grinding head handler 3, grinding head handler 3 as shown in Figure 2, the device inner bottom part is a silicon wafer bearing table 31, be distributed with eight ultra-pure water nozzles 32 on the plummer 31, the ultra-pure water nozzle is communicated with plummer feed pipe 14, and the ultra-pure water in pneumatic water valve 13 connections of grinding head cleaning control gas circuit 12 controls or the blocking-up water supply module 11 is to plummer feed pipe 14.In CMP equipment availability process, when grinding head has silicon chip to load task, after the CMP apparatus control system sends and loads ready signal, equipment can move to this grinding head 1 grinding head handler 3 tops, before loading silicon chip, carrying out grinding head earlier cleans, grinding head cleaning control gas circuit 12 can control be opened pneumatic water valve 13, ultra-pure water in the water supply module 11 can be through pneumatic water valve 13, eight ultra-pure water nozzles, 32 ejections that plummer feed pipe 14 distributes from plummer 31, grinding head is carried out the pure water rinsing fixed time (being generally 5 seconds), the part 15 (barrier film and retaining ring) that each only flushing contacts with silicon chip, and the grinding head other parts all can't obtain flushing.

Grinding head as shown in Figure 3, the grinding head bottom is the part that contacts with silicon chip, i.e. barrier film 41 and retaining ring 42, and retaining ring 42 tops are large tracts of land grinding head neighboring area 43, when grinding head need load silicon chip, inhaling vacuum by barrier film 41 can be adsorbed on silicon chip on the barrier film of grinding head.Silicon chip is carried out in the process of lapping, there is chemical grinding liquid at the grinding table/grinding pad upper reaches of rotation at a high speed, silicon chip is pressed in rotation on one side on grinding table/grinding pad by barrier film 41, grind on one side, retaining ring 42 also is pressed on the grinding pad around the silicon chip, the silicon chip that guarantees rotation does not skid off in grinding head, to realize grinding function.The cleaning device of existing CMP equipment grinding head is owing to only be distributed with ultra-pure water nozzle 32 on silicon wafer bearing table 31, only can be flushed to the part that contacts with silicon chip on the grinding head during cleaning, be barrier film 41 and retaining ring 42, and can't effectively wash the large tracts of land neighboring area 43 of grinding head retaining ring 42 tops.

During the CMP equipment availability, grinding head rotates on the grinding pad of rotation at a high speed under a certain size pressure, can make soup splash to the large tracts of land neighboring area 43 of grinding head.Because the acid or alkaline lapping liquid that CMP equipment uses all forms crystallization easily, as untimely flushing, in the full maintenance frequency, to there be big medicine amount liquid ingot to be adsorbed on 43 surfaces, large tracts of land neighboring area of grinding head, when dismounting grinding head or himself motion, these block adsorbates might drop on grinding pad at any time, thereby silicon chip product surface smoothness and state are constituted greatly threat, finally influence the yield rate of silicon chip product.

Usually solution is that the operating personnel safeguards every doing once cleaning two weeks now, coagulation to 43 surfaces, grinding head large tracts of land neighboring area when safeguarding strikes off, but this kind maintenance is wasted time and energy, effect is also bad, cleaning can make surface, grinding head neighboring area become more coarse, easier from now on formation coagulation causes that easily particle exceeds standard and produces little scuffing, is unfavorable for the long-time continuous operation of CMP equipment.

Summary of the invention

The technical problem to be solved in the present invention is to reduce the frequency and the time of CMP plant maintenance operation, reduces the possibility that particle exceeds standard and goods scratch, and enhances productivity.

For solving the problems of the technologies described above, the invention provides a kind of CMP equipment grinding head cleaning device, comprise water supply module, grinding head cleaning control gas circuit, pneumatic water valve one, the plummer feed pipe, the grinding head handler, grinding head handler inner bottom part is a silicon wafer bearing table, be distributed with the pure water nozzle on the plummer, the pure water nozzle is communicated with the plummer feed pipe, it is characterized in that, also comprise pneumatic water valve two, periphery cleans feed pipe, grinding head cleaning control gas circuit is controlled the switching of pneumatic water valve one and pneumatic water valve two simultaneously, thereby the pure water that is communicated with or blocks in the water supply module cleans feed pipe to plummer feed pipe and periphery, the end that periphery cleans feed pipe is peripheral washer jet, it is inside to be installed at grinding head handler next door and jet expansion, and the pure water of ejection can be flushed to the grinding head neighboring area above the grinding head handler.

CMP equipment grinding head cleaning device of the present invention, grinding head cleaning control gas circuit is controlled the switching of pneumatic water valve one and pneumatic water valve two simultaneously, pure water nozzle on the grinding head handler inner bottom part silicon wafer bearing table sprays pure water together with peripheral washer jet and cleans grinding head, and the pure water of ejection can effectively be flushed to the grinding head neighboring area above the grinding head handler.Thereby can effectively prevent the crystallization cohesion of soup on grinding head, reduce the possibility that particle exceeds standard and goods scratch, improve the yield of goods.Can reduce plant maintenance cleaning time and frequency, improve efficiency of equipment.

Description of drawings

Below in conjunction with the drawings and the specific embodiments the present invention is described in further detail.

Fig. 1 is the cleaning device schematic diagram of existing CMP equipment grinding head;

Fig. 2 is a CMP equipment grinding head handler schematic diagram;

Fig. 3 is a CMP equipment grinding head schematic diagram;

Fig. 4 is CMP equipment grinding head cleaning device one an embodiment schematic diagram of the present invention.

The specific embodiment

CMP equipment grinding head cleaning device one embodiment of the present invention as shown in Figure 4, comprise water supply module 11, grinding head cleaning control gas circuit 12, pneumatic water valve 1, plummer feed pipe 14, grinding head handler 3, grinding head handler 3 as shown in Figure 2, the device inner bottom part is a silicon wafer bearing table 31, be distributed with eight pure water nozzles 32 on the plummer 31, the pure water nozzle is communicated with plummer feed pipe 14; Also comprise pneumatic water valve 2 23, periphery cleans feed pipe 24, the end that periphery cleans feed pipe 24 is peripheral washer jet, grinding head cleaning control gas circuit 12 is controlled the switching of pneumatic water valve 1 and pneumatic water valve 2 23 simultaneously, thereby the ultra-pure water that is communicated with or blocks in the water supply module 11 cleans feed pipe 24 to plummer feed pipe 14 and periphery, the peripheral washer jet that periphery cleans an end of feed pipe 24 is installed at grinding head handler 3 next doors, jet expansion is inside, guarantees that the ultra-pure water that sprays can effectively be flushed to the grinding head neighboring area above grinding head handler 3.

As an embodiment, can select arbitrarily modular plastic flexible pipe (LOC-LINE) the conduct periphery cleaning feed pipe 24 of crooked location of 1/4 inch caliber for use, so that location, prevent that periphery from cleaning feed pipe 24 with moving component (grinding head on the CMP equipment, CROSS, manipulator etc.) the generation location conflicts.With 1/4 inch caliber PFA flexible pipe (acid and alkali-resistance atmosphere, do not have the pipe that produces dirt and particle) insert in 1/4 inch caliber modular flexible pipe, end near grinding head handler 3 sides exposes a small amount of flexible pipe (about 4mm length) directly as peripheral washer jet (common ultra-pure water pressure 30 ± 5psi, during as insufficient pressure, can connect a nozzle at the water jet end, 120 ° of spray angles are to guarantee developing result).Flexible pipe is run into movement parts needing to be fixed on the equipment side plate with bandage near CMP plant machinery hand portion to prevent the flexible pipe position from becoming flexible.Utilize the silicon chip turnover space of grinding head handler, outside water pipe is guided to CMP equipment along the space in the CMP equipment under.The CMP device bottom is guided in the space of water pipe in CMP equipment, be connected on the water supply module of equipment by a pneumatic water valve two, pneumatic water valve two is had or not by control gas circuit control ultra-pure water, and the control gas circuit is controlled the pneumatic water valve one that leads to the pure water nozzle that distributes on the grinding head handler inner bottom part silicon wafer bearing table simultaneously.This control gas circuit 12 is started when washing grinding head at every turn, control pneumatic water valve 1,2 23 connections of pneumatic water valve, continue 5 seconds at every turn, can just satisfy needs grinding head flushing ultra-pure water, can not waste too many ultra-pure water, and to goods operation also not influence.12 of control gas circuits need be connected on respectively on two pneumatic water valves with a three-way connection the tracheae one-to-two.

Need adjust peripheral washer jet direction during use, method is: when carrying out grinding head flushing action, the periphery washer jet has the ultra-pure water ejection, the grinding head periphery is washed, adjusting module formula flexible pipe direction, make the large tracts of land neighboring area of grinding head retaining ring (Retaining Ring) top of rotation to be washed into, and can not run into peripheral washer jet during the CMP equipment availability and get final product.

CMP equipment grinding head cleaning device of the present invention, grinding head cleaning control gas circuit is controlled the switching of pneumatic water valve one and pneumatic water valve two simultaneously, pure water nozzle on the silicon wafer bearing table of grinding head handler inner bottom part sprays pure water together with peripheral washer jet and cleans grinding head, and the pure water of ejection can effectively be flushed to the grinding head neighboring area above the grinding head handler.Can effectively prevent the crystallization cohesion of soup on grinding head, reduce the possibility that particle exceeds standard and goods scratch, improve the yield of goods.Can reduce plant maintenance cleaning time and frequency, improve efficiency of equipment.

Claims

1, a kind of CMP equipment grinding head cleaning device, comprise water supply module, grinding head cleaning control gas circuit, pneumatic water valve one, the plummer feed pipe, the grinding head handler, grinding head handler inner bottom part is a silicon wafer bearing table, be distributed with the pure water nozzle on the plummer, the pure water nozzle is communicated with the plummer feed pipe, it is characterized in that, also comprise pneumatic water valve two, periphery cleans feed pipe, grinding head cleaning control gas circuit is controlled the switching of pneumatic water valve one and pneumatic water valve two simultaneously, thereby the pure water that is communicated with or blocks in the water supply module cleans feed pipe to plummer feed pipe and periphery, the end that periphery cleans feed pipe is peripheral washer jet, it is inside to be installed at grinding head handler next door and jet expansion, and the pure water of ejection can be flushed to the grinding head neighboring area above the grinding head handler.

2, CMP equipment grinding head cleaning device according to claim 1 is characterized in that, it is the modular plastic flexible pipe that periphery cleans feed pipe.

3, CMP equipment grinding head cleaning device according to claim 1 is characterized in that, the control gas circuit, is connected on respectively on pneumatic water valve one and the pneumatic water valve two the tracheae one-to-two with a three-way connection.