CN107359107B - Spray head for wafer cleaning machine and wafer cleaning machine - Google Patents
Spray head for wafer cleaning machine and wafer cleaning machine Download PDFInfo
- Publication number
- CN107359107B CN107359107B CN201710452478.1A CN201710452478A CN107359107B CN 107359107 B CN107359107 B CN 107359107B CN 201710452478 A CN201710452478 A CN 201710452478A CN 107359107 B CN107359107 B CN 107359107B
- Authority
- CN
- China
- Prior art keywords
- wafer
- water flow
- spray head
- water
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a spray head for a wafer cleaning machine and the wafer cleaning machine, wherein the spray head comprises a spray nozzle and a rotatable water flow shape adjusting ring 2 sleeved outside the spray nozzle, a water flow size control valve 3 is arranged, a water flow flat channel 5 is arranged at one side of the water flow shape adjusting ring 2, which is communicated with the water flow size control valve 3, and cleaning liquid flows into the water flow flat channel 5 after the water flow size is adjusted by the water flow size control valve 3. The spray head for the wafer cleaning machine can be used for cleaning wafers with different sizes without replacing the spray head, and can fully clean the wafers without reducing the capacity and efficiency of the machine.
Description
Technical Field
The invention relates to a spray head for a wafer cleaning machine and the wafer cleaning machine, and belongs to the technical field of integrated circuit packaging.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. In the manufacture of semiconductor devices, a plurality of chips are typically formed on a common semiconductor wafer through a number of processing steps, including etching, coating, doping, plating, etc., until a multilayer structure is finally formed.
As semiconductor processing technology advances toward miniaturization, light contaminants (e.g., particles, metals, and organics) in the packaging of LSI (L SI) will affect the yield and reliability of LSI, resulting in a decrease in yield and stability of L SI circuit products, and therefore, in each process flow segment, contaminants attached to the silicon wafer are often removed to prevent the contaminants from diffusing to the next process.
Research and improvement in wafer cleaning technology has been of interest to numerous manufacturers of semiconductor equipment in recent years. Some enterprises have improved the cleaning device, but all have attempted to improve the quality of cleaning. For example, the above-mentioned device is improved by the international integrated circuit manufacturing (shanghai) limited, and the chinese utility model patent with the application number CN03279085.6 discloses a device for monitoring the position of a wafer cleaning liquid water column, which is used for detecting the position of the wafer cleaning liquid water column and comprises an optical signal emitting device having an optical signal emitting source, wherein the optical signal emitting device is arranged at a first side edge of a wafer cleaning bearing table, and the center of the optical signal emitting source is opposite to the rotation center of the wafer cleaning bearing table; the optical signal receiving device is arranged on the opposite side of the first side of the wafer cleaning bearing table and has the capability of receiving the optical signal emitted by the optical signal emitting source; and a signal processing device connected to the optical signal receiving device and capable of determining the receiving status of the optical signal receiving device; wherein the optical signal receiving device receives a weaker optical signal when the optical signal traverses the cleaning liquid water column; the signal of the cleaning liquid water column position is detected by the wafer cleaning liquid water column position detection device to inform the operator of the wafer cleaning system to perform proper treatment.
In summary, the prior art does not solve the technical problem of how to reasonably design the structure of the nozzle to optimize the throughput and cleaning effect of the machine.
Disclosure of Invention
In order to solve the above problems, the present invention provides a head for a wafer cleaning machine, comprising: the cleaning solution flows into the water flow flat channel 5 after the water flow size is adjusted by the valve 3.
Further, the cross section of the water flow flat channel 5 is in an elliptic cylinder shape, cleaning liquid flows into the water flow flat channel 5 after the size of water flow is adjusted through the water flow size control valve 3, the shape of the cleaning liquid is changed from a cylindrical shape to the elliptic cylinder shape, then the cleaning liquid flows to the water flow shape adjusting ring 2, and the shape of water flow can be adjusted through the water flow shape adjusting ring 2. The water flow shape adjusting ring 2 is in threaded connection with the nozzle; the water flow shape adjusting ring 2 is a valve and is connected with the nozzle through threads, and the inner cross section of the water flow shape adjusting ring is oval. The water outlet width x of the water outlet hole can be controlled by rotating the water flow shape adjusting ring, and the cleaning liquid after the water outlet width x is adjusted is directly sprayed out.
In another aspect, the invention also provides a wafer cleaning machine, which comprises the spray head. Preferably, the method further comprises the following steps: the wafer rotating speed detection unit is used for detecting the rotating speed RPM of the wafer; the device comprises a nozzle water spray width detection unit for detecting the effective cleaning width x of the water sprayed by the nozzle, a nozzle movement control unit or a wafer movement control unit for receiving the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of the water sprayed by the nozzle detected by the nozzle water spray width detection unit, and moving the nozzle or the wafer according to the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of the water sprayed by the nozzle detected by the nozzle water spray width detection unit. The moving speed v of the spray head or the wafer is [ RPM · x/60 ]. 2, and the unit is millimeter/second.
The invention can bring the following beneficial effects: when the adjustable spray head sprays water, the shape of the water sprayed by the adjustable spray head is adjustable, and the width of the cleaning liquid is adjustable, so that the cleaning liquid can be used for cleaning wafers with different sizes without replacing the spray head, and the productivity and the efficiency of a machine can not be reduced while the wafers are fully cleaned.
Drawings
FIG. 1 is a schematic of a prior art wafer cleaning machine;
FIG. 2 is a schematic view of the present invention moving the spray head or wafer according to the rotational speed of the wafer and the effective cleaning width x of the spray water sprayed by the spray head;
FIG. 3 is a structural view of a nozzle of the wafer cleaning machine of the present invention;
FIG. 4 is a sectional view of a water flow flat passage of a nozzle head of the wafer cleaning machine according to the present invention;
FIG. 5 is a cross-sectional view of a water flow shape adjusting ring of a nozzle in the wafer cleaning machine according to the present invention;
FIG. 6 is a schematic view of the present invention when the flow shape adjustment ring maximally obstructs the outlet opening of the flat flow channel;
FIG. 7 is a logic diagram of the sprayer moving wafer cleaning machine of the present invention;
fig. 8 is a logic diagram of the wafer-moving wafer cleaning machine of the present invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings.
In a first embodiment of the invention, a method of moving a spray head during wafer cleaning is provided. The method comprises the following steps:
and detecting the rotating speed RPM of the wafer. As shown in fig. 1, the wafer is located on a wafer carrying platform, and the wafer carrying platform rotates to drive the wafer to rotate synchronously.
And detecting the effective cleaning width x of the water sprayed by the spray head. In another embodiment, the order of the above two steps may be replaced. That is, the effective cleaning width x of the water sprayed by the spray head is detected; the rotational speed RPM of the wafer, i.e. the number of revolutions per minute (60 seconds), is then detected.
Preferably, the step of detecting the effective cleaning width x of the water sprayed by the spray head further comprises adjusting a water spray drop point of the spray head, so that the water spray drop point falls on the rotation center of the wafer to improve the cleaning quality.
And moving the spray head according to the rotating speed of the wafer and the effective cleaning width x of the water sprayed by the spray head. As shown in FIG. 2, let r be the radius of the wafer, l be the length across the entire wafer, which is equivalent to 2r, the number of times the water spraying arm needs to complete one full-distance movement is l/x, or 2 r/x. The time required for one rotation of the wafer is 60/RPM (units: seconds).
In order to improve the cleaning efficiency of the cleaning machine, the wafer is integrally cleaned once in one rotation, so that the required time is the shortest, namely l/x is 1, or 2r/x is 1. Therefore, in the method for moving the spray head in the wafer cleaning process, the required minimum cleaning time is t equal to l/x.60/RPM. Therefore, in the implementation process, the water spraying arm can finish one-time movement when the movement range of the water spraying arm covers the whole wafer, and each area of the wafer can be cleaned once. The relationship between the wafer rotating speed and the moving speed of the water spraying arm is as follows:
v＝l/t·2＝2r/t·2＝2r·RPM/60·x/2r·2＝[RPM·x/60]·2
the v is the moving speed of the water spraying arm, namely the moving speed of the spray head, and the unit is millimeter/second. v is l/t.2 multiplied by 2 because l is the length across the entire wafer, corresponding to 2r, i.e. 2 washes per turn, and multiplied by 2 corresponds to a doubling of the speed, which halves the number of washes.
In the illustrative embodiment, assuming a wafer speed of 300RPM and a water spray effective width of 0.01inch (0.254mm), then
v＝[RPM·x/60]·2＝[300·0.254/60]·2＝1.27·2＝2.54mm/sec
That is, when the moving speed of the water spraying arm exceeds 2.54mm/sec, a dead zone can occur in wafer cleaning; although the water spraying arm does not swing once but swings back and forth for a period of time when the wafer is cleaned, the cleaning effect is reduced due to the fact that the water spraying arm moves at a too high speed, and a part of the area is not cleaned; on the other hand, too low a moving speed of the water spraying arm can reduce the productivity and efficiency of the machine.
Because the wafer moves relative to the water spraying arm, the effect that the wafer does not move the water spraying arm is the same as the effect that the wafer moves but the water spraying arm does not move. Accordingly, in a second embodiment of the invention, a method of moving a wafer during a wafer cleaning process is provided. The method comprises the following steps:
the method comprises the following steps: the rotation speed RPM of the wafer, i.e. the number of revolutions per minute (60 seconds), is detected.
Step two: and detecting the effective cleaning width x of the water sprayed by the spray head. It will be appreciated by those skilled in the art that the order of the above two steps may be permuted. That is, the effective cleaning width x of the water sprayed by the spray head is detected; the RPM of the wafer is then detected.
Step three: and moving the wafer according to the rotating speed of the wafer and the effective cleaning width x of the water sprayed by the spray head. As shown in FIG. 2, let r be the radius of the wafer, l be the length across the entire wafer, which is equivalent to 2r, the number of times the water spraying arm needs to complete one full-distance movement is l/x, or 2 r/x. In the wafer moving and moving method in the wafer cleaning process, the required shortest cleaning time is t equal to l/x.60/RPM. Therefore, in the implementation process, the wafer can be moved once when the moving range of the water spraying arm covers the whole wafer, and each area of the wafer can be cleaned once. The relationship between the wafer rotating speed and the moving speed of the water spraying arm is as follows:
v＝l/t·2＝2r/t·2＝2r·RPM/60·x/2r·2＝[RPM·x/60]·2
the above v is the moving speed of the wafer in mm/sec. v is l/t 2 multiplied by 2 because l is the length across the entire wafer, corresponding to 2r, i.e. 2 washes per turn, and multiplied by 2 corresponds to a doubling of the speed, which halves the number of washes.
In the illustrative embodiment, assuming a wafer speed of 300RPM and a water spray effective width of 0.01inch (0.254mm), then
v＝[RPM·x/60]·2＝[300·0.254/60]·2＝1.27·2＝2.54mm/sec
That is, when the wafer moving speed exceeds 2.54mm/sec, a dead zone may occur in the wafer cleaning; keeping the water spraying arm still and the wafer moving can reduce the cleaning effect when the wafer moving speed is too high, part of the area is not cleaned yet, and the wafer moving speed is too low, so that the productivity and the efficiency of the machine can be reduced.
In a third embodiment of the present invention, an adjustable nozzle structure for a wafer cleaning machine is provided which is used in combination with the first and second embodiments. As shown in fig. 3, the head structure includes: the water flow shape adjusting device comprises a nozzle 1 and a water flow shape adjusting ring 2 which is sleeved outside the nozzle 1 and can rotate, wherein the water flow shape adjusting ring 2 is in threaded fit with the nozzle 1. The spray head is provided with a water flow size control valve 3 which is in threaded connection with the spray nozzle 1 and comprises a valve core 3-1 communicated with the spray nozzle 1 and a rotary screw 3-2, the valve core 3-1 is driven to move towards a water flow channel 4 in the spray head by the rotation of the rotary screw 3-2 to control the water flow size, and the water flow channel 4 is cylindrical.
Preferably, the side of the water flow size control valve 3, which leads to the water flow shape adjusting ring 2, is provided with a water flow flat channel 5, and the cross section of the water flow flat channel 5 is in an elliptic cylinder shape, as shown in fig. 4. The cleaning liquid flows into the water flow flat channel 5 after the size of the water flow is adjusted by the water flow size control valve 3, the shape of the cleaning liquid is changed from a cylindrical shape to an elliptic cylindrical shape, then the cleaning liquid flows to the water flow shape adjusting ring 2, and the shape of the water flow can be adjusted by the water flow shape adjusting ring 2. The water flow shape adjusting ring 2 is a valve, is connected with the nozzle 1 through threads, can rotate around the nozzle 1, and has an oval inner cross section as shown in fig. 5. By rotating the water flow shape adjusting ring 2, the water outlet shape of the water outlet hole can be controlled so as to control the water outlet width x, and the cleaning liquid after the water outlet width x is adjusted is directly sprayed out. When the water flow shape adjusting ring 2 does not block the water outlet hole of the water flow flat channel 5, the water outlet width of the spray head is maximum at the moment. Because the shape of the discharged water is oval at this time, the cleaning liquid is sprayed out in a flat shape; at this time, if the water flow shape adjusting ring 2 is rotated, the water flow shape adjusting ring 2 will partially block the water flow flat channel 5, and when the water flow shape adjusting ring 2 partially blocks the water outlet hole of the water flow flat channel 5, the cleaning liquid sprayed from the nozzle tends to be cylindrical, which is called a linear type. Fig. 6 illustrates the situation when the water flow shape adjusting ring 2 blocks the outlet opening of the water flow flat channel 5 the most, and the outlet width of the nozzle is the smallest.
In a fourth embodiment of the present invention, a wafer cleaning machine is provided. The shower nozzle of the third embodiment is included, and the shower nozzle structure comprises: the water flow shape adjusting device comprises a nozzle 1 and a water flow shape adjusting ring 2 which is sleeved outside the nozzle 1 and can rotate, wherein the water flow shape adjusting ring 2 is in threaded fit with the nozzle 1. The spray head is provided with a water flow size control valve 3 which is in threaded connection with the spray head and comprises a valve core 3-1 communicated with the spray nozzle 1 and a rotary screw 3-2, the valve core 3-1 is driven to move towards a water flow channel 4 in the spray head by the rotation of the rotary screw 3-2 to control the water flow size, and the water flow channel 4 is cylindrical. The water flow size control valve 3 is provided with a water flow flat channel 5 on one side of the water flow shape adjusting ring 2, the cross section of the water flow flat channel 5 is in an elliptic cylinder shape, the cleaning liquid flows into the water flow flat channel 5 after the water flow size is adjusted through the water flow size control valve 3, the shape of the cleaning liquid is changed from a cylindrical shape to an elliptic cylinder shape, then the cleaning liquid flows to the water flow shape adjusting ring 2, and the shape of the water flow can be adjusted through the water flow shape adjusting ring 2. The water flow shape adjusting ring 2 is a valve, is connected with the nozzle 1 through threads, can rotate around the nozzle 1, and has an oval inner cross section. By rotating the water flow shape adjusting ring 2, the water outlet shape of the water outlet hole can be controlled so as to control the water outlet width x, and the cleaning liquid after the water outlet width x is adjusted is directly sprayed out. When the water flow shape adjusting ring 2 does not block the water outlet hole of the water flow flat channel 5, the water outlet width of the spray head is maximum at the moment. Because the shape of the discharged water is oval at this time, the cleaning liquid is sprayed out in a flat shape; at this time, if the water flow shape adjusting ring 2 is rotated, the water flow shape adjusting ring 2 will partially block the water flow flat channel 5, and when the water flow shape adjusting ring 2 partially blocks the water outlet hole of the water flow flat channel 5, the cleaning liquid sprayed from the nozzle tends to be cylindrical, which is called a linear type. Fig. 6 illustrates the situation when the water flow shape adjusting ring 2 blocks the outlet opening of the water flow flat channel 5 the most, and the outlet width of the nozzle is the smallest.
In a fifth embodiment of the present invention, there is provided a wafer cleaning machine according to the fourth embodiment. As shown in fig. 7, it includes: and the wafer rotating speed detection unit is arranged on the wafer bearing platform and is used for detecting the rotating speed RPM of the wafer. The device comprises a spray head water spray width detection unit for detecting the effective cleaning width x of the spray head water spray, a spray head movement control unit for receiving the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of the spray head water spray detected by the spray head water spray width detection unit, and moving the spray head according to the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of the spray head water spray detected by the spray head water spray width detection unit. Preferably, v ═ RPM x/60] 2. The v is the moving speed of the water spraying arm, namely the spray head, and the unit is millimeter/second.
In a sixth embodiment of the present invention, there is provided the wafer cleaning machine according to the fourth embodiment. As shown in fig. 8, it includes: and the wafer rotating speed detection unit is arranged on the wafer bearing platform and is used for detecting the rotating speed RPM of the wafer. The wafer cleaning device comprises a spray head water spray width detection unit for detecting the effective cleaning width x of water sprayed by a spray head, a wafer movement control unit for receiving the rotating speed RPM of a wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of water sprayed by the spray head detected by the spray head water spray width detection unit, and moving the wafer according to the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of water sprayed by the spray head detected by the spray head water spray width detection unit. Preferably, v ═ RPM x/60] 2. The above v is the moving speed of the wafer in mm/sec.
The invention can bring the following beneficial effects: firstly, when the adjustable spray head sprays water, the shape of the water sprayed by the adjustable spray head is adjustable, and the width of cleaning liquid is adjustable, so that the adjustable spray head can be used for cleaning wafers with different sizes without replacing the spray head; and secondly, the moving speed of the wafer or the cleaning arm is controlled through the rotating speed of the wafer and the water outlet width of the spray head, so that the wafer can be fully cleaned without reducing the capacity and efficiency of the machine.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The utility model provides a shower nozzle that disk cleaning machine used which characterized in that: the cleaning agent cleaning device comprises a nozzle and a rotatable water flow shape adjusting ring (2) sleeved outside the nozzle, wherein a water flow size control valve (3) is further arranged between the nozzle and the water flow shape adjusting ring (2), a water flow flat channel (5) is arranged at one side of the water flow size control valve (3) communicated with the water flow shape adjusting ring (2), cleaning agent flows into the water flow flat channel (5) after the water flow size is adjusted through the water flow size control valve (3), then flows to the water flow shape adjusting ring (2), and the shape of water flow is adjusted by rotating the water flow shape adjusting ring (2);
wherein, the cross section of rivers flat passage (5) is the elliptic cylinder form, the inside cross section of rivers shape adjustable ring (2) is the elliptic cylinder form, and the washing liquid flows into rivers flat passage (5) after rivers size control valve (3) regulation rivers size, and its shape is become the elliptic cylinder form by cylindrical, then flows to rivers shape adjustable ring (2), through the shape of rivers shape adjustable ring (2) adjustable rivers.
2. The spray head for a wafer washer as claimed in claim 1, characterized in that: the water flow shape adjusting ring (2) is in threaded connection with the nozzle; the water flow shape adjusting ring (2) is a valve and is connected with the nozzle through threads.
3. The spray head for a wafer washer as claimed in claim 2, characterized in that: the water outlet width x of the water outlet hole can be controlled by rotating the water flow shape adjusting ring (2), and the cleaning liquid is directly sprayed out after the water outlet width x is adjusted.
4. A wafer cleaning machine comprising the head for a wafer cleaning machine claimed in any one of claims 1 to 3.
5. Wafer cleaning machine as claimed in claim 4, characterized in that it further comprises:
the wafer rotating speed detection unit is used for detecting the rotating speed RPM of the wafer;
a nozzle water spray width detection unit for detecting an effective cleaning width x of the nozzle water spray;
and the spray head movement control unit or the wafer movement control unit is used for receiving the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of the spray head water spray detected by the spray head water spray width detection unit, and moving the spray head or the wafer according to the rotating speed RPM of the wafer detected by the wafer rotating speed detection unit and the effective cleaning width x of the spray head water spray detected by the spray head water spray width detection unit.
6. Wafer cleaning machine as claimed in claim 5, characterized in that: the moving speed v of the spray head or the wafer is [ RPM · x/60 ]. 2, and the unit is millimeter/second.
7. Wafer cleaning machine as claimed in claim 5,
the wafer rotating speed detection unit works before the spray head water spray width detection unit; or the spray head water spray width detection unit works before the wafer rotating speed detection unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710452478.1A CN107359107B (en) | 2014-11-18 | 2014-11-18 | Spray head for wafer cleaning machine and wafer cleaning machine |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710452478.1A CN107359107B (en) | 2014-11-18 | 2014-11-18 | Spray head for wafer cleaning machine and wafer cleaning machine |
| CN201410660929.7A CN104377153B (en) | 2014-11-18 | 2014-11-18 | A kind of Wafer cleaning machine and its nozzle moving method, disk moving method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410660929.7A Division CN104377153B (en) | 2014-11-18 | 2014-11-18 | A kind of Wafer cleaning machine and its nozzle moving method, disk moving method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107359107A CN107359107A (en) | 2017-11-17 |
| CN107359107B true CN107359107B (en) | 2020-07-14 |
Family
ID=52555988
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710452478.1A Active CN107359107B (en) | 2014-11-18 | 2014-11-18 | Spray head for wafer cleaning machine and wafer cleaning machine |
| CN201410660929.7A Active CN104377153B (en) | 2014-11-18 | 2014-11-18 | A kind of Wafer cleaning machine and its nozzle moving method, disk moving method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410660929.7A Active CN104377153B (en) | 2014-11-18 | 2014-11-18 | A kind of Wafer cleaning machine and its nozzle moving method, disk moving method |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN107359107B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107008038B (en) * | 2017-04-27 | 2023-07-07 | 云南科力环保股份公司 | Device for discharging concentrated ore pulp |
| CN110834023A (en) * | 2018-08-15 | 2020-02-25 | 宝钢工程技术集团有限公司 | Air curtain type acid mist protection device and using method thereof |
| CN109013090B (en) * | 2018-09-18 | 2020-07-07 | 江苏金泰祥内外门业有限公司 | Glue coating box |
| CN114361059A (en) | 2020-10-13 | 2022-04-15 | 长鑫存储技术有限公司 | Wafer cleaning equipment and cleaning method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400632A (en) * | 2001-07-26 | 2003-03-05 | 株式会社东芝 | Liquid film forming method and solid film forming method |
| CN101666980A (en) * | 2008-09-04 | 2010-03-10 | 东京毅力科创株式会社 | Cleaning and drying-preventing method, and cleaning and drying-preventing apparatus |
| CN102553851A (en) * | 2010-12-28 | 2012-07-11 | 东京毅力科创株式会社 | Liquid treatment apparatus and method |
| CN103586154A (en) * | 2013-10-29 | 2014-02-19 | 华中科技大学 | Electrospray device, method of producing solar cell anti-reflection layer by electrospray, and solar cell |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4730787B2 (en) * | 2006-08-29 | 2011-07-20 | 大日本スクリーン製造株式会社 | Substrate processing method and substrate processing apparatus |
| CN101069888A (en) * | 2007-06-14 | 2007-11-14 | 北京七星华创电子股份有限公司 | Method and apparatus for washing single silicon-chip |
| KR101258002B1 (en) * | 2010-03-31 | 2013-04-24 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate treatment apparatus and substrate treatment method |
| CN102043340B (en) * | 2010-10-29 | 2012-10-03 | 沈阳芯源微电子设备有限公司 | Method for uniformly spraying photoresist |
| US9691641B2 (en) * | 2012-12-13 | 2017-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method of cleaning wafers |
| JP2014130883A (en) * | 2012-12-28 | 2014-07-10 | Ebara Corp | Substrate cleaning apparatus and substrate cleaning method |
-
2014
- 2014-11-18 CN CN201710452478.1A patent/CN107359107B/en active Active
- 2014-11-18 CN CN201410660929.7A patent/CN104377153B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400632A (en) * | 2001-07-26 | 2003-03-05 | 株式会社东芝 | Liquid film forming method and solid film forming method |
| CN101666980A (en) * | 2008-09-04 | 2010-03-10 | 东京毅力科创株式会社 | Cleaning and drying-preventing method, and cleaning and drying-preventing apparatus |
| CN102553851A (en) * | 2010-12-28 | 2012-07-11 | 东京毅力科创株式会社 | Liquid treatment apparatus and method |
| CN103586154A (en) * | 2013-10-29 | 2014-02-19 | 华中科技大学 | Electrospray device, method of producing solar cell anti-reflection layer by electrospray, and solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104377153A (en) | 2015-02-25 |
| CN104377153B (en) | 2018-07-17 |
| CN107359107A (en) | 2017-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107359107B (en) | Spray head for wafer cleaning machine and wafer cleaning machine | |
| JP5123122B2 (en) | Substrate processing apparatus and processing method | |
| US9174324B2 (en) | Polishing apparatus with polishing head cover | |
| US7811412B2 (en) | Substrate processing apparatus and substrate processing method drying substrate | |
| KR20150034644A (en) | Substrate treatment method and substrate treatment apparatus | |
| JP6061710B2 (en) | Resin coating equipment | |
| CN110729180B (en) | Crystal edge washing process method | |
| CN208127151U (en) | Wafer cleaning device | |
| US20110180113A1 (en) | Method of wafer cleaning and apparatus of wafer cleaning | |
| CN105006424A (en) | Monolithic wet cleaning method | |
| CN102148131A (en) | Method and device for cleaning wafer | |
| CN105319871A (en) | Semiconductor substrate developing apparatus and semiconductor substrate developing method | |
| JP5954776B2 (en) | Substrate processing equipment | |
| TWI727461B (en) | Substrate processing method and substrate processing apparatus | |
| CN103622652A (en) | Top spraying mechanism of dish-washing machine | |
| CN102489464B (en) | Spun resist washing device and method | |
| US7578887B2 (en) | Apparatus for and method of processing substrate | |
| JP2002151455A (en) | Cleaning apparatus for semiconductor wafer | |
| KR20110077705A (en) | The apparatus and method for cleaning single wafer | |
| JP6482402B2 (en) | Single wafer cleaning apparatus and wafer cleaning method | |
| CN106711059B (en) | A kind of liquid-state protective structure for backside of wafer | |
| CN109727841A (en) | The cleaning method of wafer | |
| JP7104580B2 (en) | Substrate cleaning equipment and substrate cleaning method | |
| JP2014075472A (en) | Method of manufacturing semiconductor device, and cmp device | |
| CN210006697U (en) | Throw stroke mechanism of corrosion cleaning machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |