CN107333383B - 印刷电路板 - Google Patents
印刷电路板 Download PDFInfo
- Publication number
- CN107333383B CN107333383B CN201610276848.6A CN201610276848A CN107333383B CN 107333383 B CN107333383 B CN 107333383B CN 201610276848 A CN201610276848 A CN 201610276848A CN 107333383 B CN107333383 B CN 107333383B
- Authority
- CN
- China
- Prior art keywords
- substrate
- metal plate
- differential signal
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
差分信号线 | 100 |
印刷电路板 | 10、60 |
接地面 | 110、66 |
共模滤波电路 | 6 |
第一基板 | 61 |
层板、第二基板 | 62 |
差分信号线 | 63、64 |
金属板 | 65 |
导接部 | 700 |
第一面 | 611 |
第二面 | 612 |
第三面 | 621 |
第四面 | 622 |
中心线 | 610 |
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610276848.6A CN107333383B (zh) | 2016-04-29 | 2016-04-29 | 印刷电路板 |
US15/157,339 US9907160B2 (en) | 2016-04-29 | 2016-05-17 | Printed circuit board including differential transmission lines thereon and having a conductive structure which provides immunity to common-mode noise |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610276848.6A CN107333383B (zh) | 2016-04-29 | 2016-04-29 | 印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107333383A CN107333383A (zh) | 2017-11-07 |
CN107333383B true CN107333383B (zh) | 2019-08-30 |
Family
ID=60157544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610276848.6A Active CN107333383B (zh) | 2016-04-29 | 2016-04-29 | 印刷电路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9907160B2 (zh) |
CN (1) | CN107333383B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10694620B1 (en) | 2019-04-02 | 2020-06-23 | Microsoft Technology Licensing, Llc | Method and apparatus for circuit board noise shielding and grounding |
CN113678574B (zh) * | 2019-04-11 | 2023-07-18 | 华为技术有限公司 | 一种共模抑制的封装装置和印制电路板 |
CN112784519B (zh) * | 2019-11-05 | 2024-06-25 | 富联精密电子(天津)有限公司 | Pcb走线参数设定装置、方法及存储介质 |
US11160162B1 (en) * | 2020-06-29 | 2021-10-26 | Western Digital Technologies, Inc. | Via-less patterned ground structure common-mode filter |
US11659650B2 (en) | 2020-12-18 | 2023-05-23 | Western Digital Technologies, Inc. | Dual-spiral common-mode filter |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7397320B1 (en) * | 2001-05-16 | 2008-07-08 | Cadence Design Systems, Inc. | Non-uniform transmission line for reducing cross-talk from an aggressor transmission line |
CN101909402A (zh) * | 2009-06-05 | 2010-12-08 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
CN102238803A (zh) * | 2010-05-06 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板及其共模滤波器 |
CN103310945A (zh) * | 2012-03-06 | 2013-09-18 | 三星电机株式会社 | 薄膜型共模滤波器 |
-
2016
- 2016-04-29 CN CN201610276848.6A patent/CN107333383B/zh active Active
- 2016-05-17 US US15/157,339 patent/US9907160B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7397320B1 (en) * | 2001-05-16 | 2008-07-08 | Cadence Design Systems, Inc. | Non-uniform transmission line for reducing cross-talk from an aggressor transmission line |
CN101909402A (zh) * | 2009-06-05 | 2010-12-08 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
CN102238803A (zh) * | 2010-05-06 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板及其共模滤波器 |
CN103310945A (zh) * | 2012-03-06 | 2013-09-18 | 三星电机株式会社 | 薄膜型共模滤波器 |
Also Published As
Publication number | Publication date |
---|---|
US20170318666A1 (en) | 2017-11-02 |
CN107333383A (zh) | 2017-11-07 |
US9907160B2 (en) | 2018-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107333383B (zh) | 印刷电路板 | |
JP6252699B2 (ja) | 伝送線路およびフラットケーブル | |
TWI597890B (zh) | 定向耦合器 | |
US8053679B2 (en) | Printed circuit board | |
CN106384864A (zh) | 一种基于多频耦合的ltcc平衡式带通滤波器 | |
JP2023529627A (ja) | 3dB直交ハイブリッドカプラ、高周波フロントエンドモジュール及び通信端末 | |
CN108123196B (zh) | 基于竖直双面平行带线的宽带滤波集成立体巴伦 | |
US9590288B2 (en) | Multilayer circuit substrate | |
JP2016092561A (ja) | 伝送線路およびフラットケーブル | |
CN212752225U (zh) | 线圈部件以及包括其的滤波器电路 | |
CN105450195B (zh) | 共模滤波器 | |
CN101009970A (zh) | 多功能复合基板结构 | |
CN115966875A (zh) | 基于多层电路板的微波定向耦合器 | |
CN104219871A (zh) | 印刷电路板 | |
JP5542231B1 (ja) | 多層回路基板 | |
WO2017199824A1 (ja) | 多層基板、および、電子機器 | |
JPWO2010140320A1 (ja) | ストリップ線路 | |
US7525397B2 (en) | Stripline directional coupler having a wide coupling gap | |
JP2015035468A (ja) | プリント回路基板 | |
JP2008198863A (ja) | 積層型コモンモードチョークコイル | |
JP4471281B2 (ja) | 積層型高周波回路基板 | |
JP2012191530A (ja) | 差動伝送線路 | |
JP2010177696A (ja) | 積層コンデンサ | |
CN106341097B (zh) | 共模滤波器与电路结构 | |
CN212519563U (zh) | 一种印刷电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180228 Address after: Haiyun economic and Technological Development Zone, Tianjin City, No. 80 300457 Street Applicant after: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Address before: Haiyun Binhai Economic and Technological Development Zone, Tianjin City, No. 80 300457 Street Applicant before: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No. 36, North Street, West District, economic and Technological Development Zone, Binhai New Area, Tianjin Patentee after: Fulian precision electronics (Tianjin) Co.,Ltd. Address before: No. 80 Haiyun Street, Jinshi Economic and Technological Development Zone, 300457 Patentee before: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) Co.,Ltd. |