CN107295758B - 电子部件安装装置和电子部件制造方法 - Google Patents

电子部件安装装置和电子部件制造方法 Download PDF

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Publication number
CN107295758B
CN107295758B CN201610787260.7A CN201610787260A CN107295758B CN 107295758 B CN107295758 B CN 107295758B CN 201610787260 A CN201610787260 A CN 201610787260A CN 107295758 B CN107295758 B CN 107295758B
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CN
China
Prior art keywords
electronic component
crimp head
substrate
unit
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610787260.7A
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English (en)
Chinese (zh)
Other versions
CN107295758A (zh
Inventor
上岛直人
八木桥俊
内藤健治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
Original Assignee
Athlete FA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Athlete FA Corp filed Critical Athlete FA Corp
Publication of CN107295758A publication Critical patent/CN107295758A/zh
Application granted granted Critical
Publication of CN107295758B publication Critical patent/CN107295758B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201610787260.7A 2016-03-30 2016-08-31 电子部件安装装置和电子部件制造方法 Active CN107295758B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-067313 2016-03-30
JP2016067313A JP6681241B2 (ja) 2016-03-30 2016-03-30 電子部品実装装置および電子部品製造方法

Publications (2)

Publication Number Publication Date
CN107295758A CN107295758A (zh) 2017-10-24
CN107295758B true CN107295758B (zh) 2019-10-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610787260.7A Active CN107295758B (zh) 2016-03-30 2016-08-31 电子部件安装装置和电子部件制造方法

Country Status (3)

Country Link
JP (1) JP6681241B2 (ja)
KR (1) KR101850808B1 (ja)
CN (1) CN107295758B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019102771A (ja) * 2017-12-08 2019-06-24 アスリートＦａ株式会社 電子部品実装装置及び電子部品実装方法
JP6691197B1 (ja) * 2018-12-12 2020-04-28 エイチアンドセオン カンパニー リミテッドＨ＆ｃｅｏｎ ｃｏ．， ｌｔｄ． ヒーターアセンブリー
KR102229860B1 (ko) * 2019-02-07 2021-03-19 (주)에이피텍 카트리지 일체형 디스펜싱 용액 경화 히터
CN112743184A (zh) * 2019-10-30 2021-05-04 昆山锡典机械设备科技有限公司 一种新型锡焊头结构
JP2022071993A (ja) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 電子部品接合装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022395A (ja) * 1998-04-30 2000-01-21 Toshiba Corp 電子部品の実装方法および実装装置
JP4122170B2 (ja) * 2002-04-22 2008-07-23 松下電器産業株式会社 部品実装方法及び部品実装装置
JP2011254032A (ja) * 2010-06-04 2011-12-15 Shinkawa Ltd 電子部品実装装置及びその方法
JP2015111613A (ja) * 2013-12-06 2015-06-18 株式会社リコー 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022395A (ja) * 1998-04-30 2000-01-21 Toshiba Corp 電子部品の実装方法および実装装置
JP4122170B2 (ja) * 2002-04-22 2008-07-23 松下電器産業株式会社 部品実装方法及び部品実装装置
JP2011254032A (ja) * 2010-06-04 2011-12-15 Shinkawa Ltd 電子部品実装装置及びその方法
JP2015111613A (ja) * 2013-12-06 2015-06-18 株式会社リコー 物品移送装置、電子部品実装装置、物品移送方法、電子部品実装方法及び電子部品実装体

Also Published As

Publication number Publication date
KR20170112890A (ko) 2017-10-12
KR101850808B1 (ko) 2018-04-20
JP6681241B2 (ja) 2020-04-15
JP2017183451A (ja) 2017-10-05
CN107295758A (zh) 2017-10-24

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