CN107286860B - 一种具有导电开关性能的液晶改性环氧树脂胶黏剂及其制备方法 - Google Patents
一种具有导电开关性能的液晶改性环氧树脂胶黏剂及其制备方法 Download PDFInfo
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- CN107286860B CN107286860B CN201710471337.4A CN201710471337A CN107286860B CN 107286860 B CN107286860 B CN 107286860B CN 201710471337 A CN201710471337 A CN 201710471337A CN 107286860 B CN107286860 B CN 107286860B
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- liquid crystal
- modified epoxy
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | |
抗冲击强度(J/) | 32 | 36 | 35 | 33 | 34 | 35 |
杨氏模量(MPa) | 26 | 32 | 27 | 30 | 29 | 31 |
导热系数(W/m·K) | 1.32 | 1.36 | 1.35 | 1.33 | 1.34 | 1.33 |
电阻率(Ω·cm) | 0.056 | 0.062 | 0.060 | 0.059 | 0.058 | 0.060 |
Claims (10)
Priority Applications (1)
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CN201710471337.4A CN107286860B (zh) | 2017-06-20 | 2017-06-20 | 一种具有导电开关性能的液晶改性环氧树脂胶黏剂及其制备方法 |
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CN201710471337.4A CN107286860B (zh) | 2017-06-20 | 2017-06-20 | 一种具有导电开关性能的液晶改性环氧树脂胶黏剂及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN107286860A CN107286860A (zh) | 2017-10-24 |
CN107286860B true CN107286860B (zh) | 2019-03-22 |
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CN201710471337.4A Active CN107286860B (zh) | 2017-06-20 | 2017-06-20 | 一种具有导电开关性能的液晶改性环氧树脂胶黏剂及其制备方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111180221A (zh) * | 2020-01-06 | 2020-05-19 | 山东光韵智能科技有限公司 | 一种树脂基碳纤维复合永磁导电触头及其制造方法 |
CN112898528A (zh) * | 2021-01-27 | 2021-06-04 | 江苏汉卿新材料科技研究院有限公司 | 一种用于改性环氧树脂的液晶聚氨酯及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5541323A (en) * | 1994-02-15 | 1996-07-30 | The Dow Chemical Company | Mesogen-containing aromatic anhydride compounds |
CN102040941A (zh) * | 2009-10-12 | 2011-05-04 | 韩国锦湖石油化学株式会社 | 用于液晶显示器设备的密封剂组合物 |
CN102304215A (zh) * | 2011-07-05 | 2012-01-04 | 深圳市华星光电技术有限公司 | 液晶面板的密封框胶及其改性方法 |
CN104530387A (zh) * | 2014-12-18 | 2015-04-22 | 中科院广州化学有限公司 | 一种液晶环氧树脂及其制备方法和应用 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5376137B2 (ja) * | 2009-04-27 | 2013-12-25 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物 |
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- 2017-06-20 CN CN201710471337.4A patent/CN107286860B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5541323A (en) * | 1994-02-15 | 1996-07-30 | The Dow Chemical Company | Mesogen-containing aromatic anhydride compounds |
CN102040941A (zh) * | 2009-10-12 | 2011-05-04 | 韩国锦湖石油化学株式会社 | 用于液晶显示器设备的密封剂组合物 |
CN102304215A (zh) * | 2011-07-05 | 2012-01-04 | 深圳市华星光电技术有限公司 | 液晶面板的密封框胶及其改性方法 |
CN104530387A (zh) * | 2014-12-18 | 2015-04-22 | 中科院广州化学有限公司 | 一种液晶环氧树脂及其制备方法和应用 |
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Address after: Room 1321, Block B, No. 1011 Fuhai Road, Jiading District, Shanghai, 201821 Patentee after: Rongzhen new material technology development (Shanghai) Co., Ltd Address before: Room 1321, Block B, No. 1011 Fuhai Road, Jiading District, Shanghai, 201821 Patentee before: Shanghai Rongzhen Trading Co.,Ltd. |
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Address after: 2800 Wanyuan Road, Minhang District, Shanghai 201103 Patentee after: Rongzhen new material technology development (Shanghai) Co.,Ltd. Address before: Room 1321, Block B, No. 1011 Fuhai Road, Jiading District, Shanghai, 201821 Patentee before: Rongzhen new material technology development (Shanghai) Co.,Ltd. |
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