CN1072850C - 特别适用于电子控制设备的配置及其制造方法 - Google Patents

特别适用于电子控制设备的配置及其制造方法 Download PDF

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CN1072850C
CN1072850C CN97191812A CN97191812A CN1072850C CN 1072850 C CN1072850 C CN 1072850C CN 97191812 A CN97191812 A CN 97191812A CN 97191812 A CN97191812 A CN 97191812A CN 1072850 C CN1072850 C CN 1072850C
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contact pin
face
configuration
substrate
plug connector
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CN1209910A (zh
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埃尔马·胡贝尔
罗尔夫·利青格
托马斯·拉伊卡
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Sunworld Industries Saxony Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
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    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

公开一种配置，其具有一个底板和至少有一个置于其上的用于电气和/或电子元件的基底以及具有一个插接件。该插接件具有多个置入绝缘材料的插针，插针的第一端头用于连接外部的插接装置，其第二端头经连接导线同基底电连接。为了在该配置中减少插针网目尺寸，使该配置结构小而紧凑，建议每个插针采用冲压加工制成，其第二端头各具有一个大体上平行基底分布并通过冲压加工制成的端面，连接导线直接焊接于冲制的插针端面。此外，介绍一种制作该配置的方法。

Description

特别适用于电子控制设备的配置及其制造方法
本发明涉及一种配置及其制造方法，该配置特别适用于电子控制设备。
该类型的配置在DE4240755Al里已公开，特别适用于电子控制设备。该配置包括一块装有印刷电路板基底的底板，该基底装有电子线路及电路元件，该配置还包括一个同底板连接的插接件。该插接件具有多个置入绝缘材料内并从插接件两端面引出的插针。譬如，该配置可从机动车里连接到车外可插入本插针第一端头的插接件上。该插针朝向印刷电路板的第二端头，平行印刷电路板分布，其端面垂直对准印刷电路板，通过连接导线将印刷电路板上的接线面同轧制的插针侧面连接。这种配置的缺点是，必须在平行印刷电路板基底和底板的插针侧面上方留出足够的空间，以便接线作业时在插针上安放接线工具。因此不能采用多排平行布局的插针配置，尤其是插针很多的插接件，务必使插接板横向扩大，从而加大插接件的空间尺寸，存在着对位置需求大的缺陷。此外，由于距较外边插针的距离很大，在轧制插针的侧面上只能连接直径0.1～0.3mm的粗导线。其缺点是，粗导线连接作业比细导线连接需要更多时间。除此之外，比如人们所知道的混合电路机柜，其插针端面要有凹槽或平台，以便能直接在插针的平台上连接。它的缺点是，需增加昂贵的加工步骤，由于凹槽空间的延伸，总体上加大了插接件。
本发明的目的是，提出一种配置，它适用于电子控制设备，其总体结构小，紧凑。
本发明的另一目的是，提出一种制造上述配置的方法，这种方法简单，经济，可靠。
按照本发明，提出了一种配置，尤其是用于电子控制设备的配置，具有一个底板和至少一个置于其上的、用于电气和/或电子元件的基底，并且具有一个插接件，该插接件有多个置入绝缘材料内的插针，插针具有用于连接外部的插接装置的第一端头，插针的第二端头经连接导线同基底电连接，插针为冲压件，至少第二端头各具有一个大体上平行基底分布的经冲压加工制成的端面，连接导线直接焊接在插针的冲制的端面上。
按照本发明还提出了一种制造配置的方法，特别是用于电子控制设备的配置，该配置具有一个底板和至少一个置于其上的、用于电气和/或电子元件的基底，并且具有一个插接件，该插接件有多个置入绝缘材料内的插针，插针具有用于连接外部的插接装置的第一端头，插针的第二端头经连接导线同基底电连接，该方法的特征如下列步骤：
在保留将插针的第一端头连接起来的横条情况下，用金属带自由冲压出插针，
精冲插针，特别是第二端头的端面，
至少在插针的端面电镀金属触头层，
切掉横条，
将插针放入压铸模里，通过压铸入绝缘材料制作插接件，
使插针的端面大体上平行于基底分布地将插接件插入底板的凹槽内，
在各插针的端面和底板上的基底之间完成导线连接。
相比而言，本发明的配置的优点是，用简单方法就可明显减少插针至基底接线位置的需求以及减少插接件的宽度。这就是使连接导线直接接到平行于底板上的基底的冲压插针端面。这样有利于选用很小的全冲压件以缩小插针间距，使插针网目尺寸与基底上接线面的网目尺寸相当，此外，还利于减少插针和基底接线面之间的距离，使基底尺寸减小。因此，总体上可实现本配置结构更小、更紧凑。
插接件插针多排平行布局是其突出的优点，因为所有插针的端面均能自由接近，导线连接作业时，接线工具可从靠基底的底板面过来，安放在插针端面上。通过插针多排平行布局，既使插针端面比接线面宽点，插针端面网目宽度也不大于基底上接线面网目宽度。
另一优点是，为了提高连接导线和插针间的焊接质量，至少在插针冲压边镀金属层。
插接件制造的优点是，当插针第二端头有一段由压铸的插接件竖立伸出时，因为在插接件压铸时能使插针以高精度在压铸模内调整地被保持。
此外，插接件装在底板凹槽内的优点是，插针能以特别简单的方法定位在基底接线面附近。
作为简单冲压件制作插针特别经济。通过精冲插针，使插针端面达到导线连接所要求的表面质量。同时还有利于靠一侧的连接条保持插针，待进行镀层工艺之后再去掉该连接条。
特别适用于直径为0.025～0.1mm细导线连接，其连接作业同现有技术中的粗导线连接相比快的多。
附图所示为本发明结构示例，后文有其详细说明。其中，
图1是具有一底板和一插接件的本发明之配置沿图2中Ⅰ-Ⅰ线的局部剖视图。
图2是具有一底板和一插接件的本发明之配置的局部俯视图。
图3示出了经过第一道冲压工序之后，由一个侧横条连接起来的插针。
图1是本发明配置的一个剖视图，该配置例如可用于机动车的电子控制装置，它包括一底板1，如构成控制装置的底板，底板1上面装有一块基底3，它可以是印刷电路板、混合陶瓷基底或多层陶瓷涂层金属板。该基底3包括带电子元件4的电子线路，已在图1和图2示出，但未画出连接电子元件4的线路。基底3上有同线路部分和电子元件4连接的接线面6，同固定在底板1凹槽5内的插接件2连接，这种固定可采用螺钉、粘接或其他适当方式进行。插接件2为压铸件，其上有多个置入绝缘材料内、由简单冲压件制成的插针7，其两端从插接件2引出。插针由镀镍和镀金的CuFe2制成，并具有尺寸为0.6×0.6mm的正方形横截面。在底板1的背向基底3的侧面上，从插接件2引出的插针7的第一端头9，用于连接外部的对应插座。在朝向基底3的底板1之上面引出的插针第二端头8，同基底3电连接。重要的是，插针第二端头的端面10平行于基底3及接线面6，接线工具可安放到插针端面10和接线面6上并可用导线连接端面10和接线面6。图1和图2示出了连接基底3的接线面6和插针端面10的连接导线11，它可用粗线也可用细线，如用细线连接，宜用直径0.025～0.1mm金丝，如用粗线连接，宜用直径0.1～0.3mm铝线。在插接件2上的插针7为两排平行布局，也可采用多排结构，如图2所示，插针7在插接件2上的布局为前后两排相互错位排列，端面10的网目尺寸相当于基底3接线面6的网目尺寸。结果是，端面10的网目宽度不大于接线面6的网目宽度，使接线面6和插针端面10相对，从而有利地减少了该配置的空间尺寸。端面10采取双排错位布局，可使导线连接距基底3较远的那排的端面10时不会覆盖靠基底更近的前排的端面10，因此与前排的导线连接不会有问题。由于这样的布局方案，插针端面10靠近接线面6，两个面之间的连接导线相对短。因此，即可用粗导线也可用细导线连接。用粗导线连接时，特别适用于大电流接线。
下面叙述上面配置的制造方法。如图3所示，首先在第一个冲压步骤中，由金属带材20、例如由CuFe2金属带材冲出插针的轮廓(图3所示实线)，同时保留一侧的横条22，该横条连接插针的第一端头9。第一步冲压粗冲出插针，随后还必须在精密冲压步骤中再一次冲压(图3所示虚线)，以获得最终外形。在第二次冲压时冲压边的光滑度大大提高，尤其是插针7的作为连接面的端面10达到光滑、可连接的表面结构。该工步之后，至少在插针端面10镀上一层镍基层和一层金层，并且沿图3的线21切掉横条。将插针7放入压铸模内，直到绝缘材料压铸入插针第一端头9和第二端8头为止。如用细导线连接时，第二端头9距插接件表面的距离不大于1mm，粗导线连接时，不大于0.5mm。成品插接件2被固定在底板1的凹槽5里，使插针7第二端头8的端面10平行于基底3上的接线面6。随后，通过导线11，用接线工具将接线面6与端面10连接。

Claims (7)

1．配置，尤其是用于电子控制设备的配置，具有一个底板(1)和至少一个置于其上的、用于电气和/或电子元件(4)的基底(3)，并且具有一个插接件(2)，该插接件(2)有多个置入绝缘材料内的插针(7)，插针具有用于连接外部的插接装置的第一端头(9)，插针的第二端头(8)经连接导线(11)同基底(3)电连接，其特征是，插针(7)为冲压件，至少第二端头(8)各具有一个大体上平行基底(3)分布的经冲压加工制成的端面(10)，连接导线(11)直接焊接在插针(7)的冲制的端面(10)上。
2．根据权利要求1的配置，其特征是，在插接件(2)内至少设置有两排插针(7)。
3．根据权利要求1的配置，其特征是，作为冲压件加工的插针(7)至少在端面(10)上电镀有一个金属层。
4．根据权利要求1的配置，其特征是，插针(7)的第二端头(8)一段由压铸制成的插接件(2)竖立伸出。
5．根据权利要求1的配置，其特征是，插接件(2)固定在底板(1)的凹槽(5)内。
6．制造配置的方法，特别是用于电子控制设备的配置，该配置具有一个底板(1)和至少一个置于其上的、用于电气和/或电子元件(4)的基底(3)，并且具有一个插接件(2)，该插接件(2)有多个置入绝缘材料内的插针(7)，插针具有用于连接外部的插接装置的第一端头(9)，插针的第二端头(8)经连接导线(11)同基底(3)电连接，该方法的特征如下列步骤：
-在保留将插针(7)的第一端头(9)连接起来的横条(22)情况下，用金属带(20)自由冲压出插针(7)，
-精冲插针(7)，特别是第二端头(8)的端面(10)，
-至少在插针(7)的端面(10)电镀金属触头层，
-切掉横条(22)，
-将插针(7)放入压铸模里，通过压铸入绝缘材料制作插接件(2)，
-使插针(7)的端面(10)大体上平行于基底(3)分布地将插接件(2)插入底板(1)的凹槽(5)内，
-在各插针(7)的端面(10)和底板(1)上的基底(3)之间完成导线(11)连接。
7．根据权利要求6的方法，其特征是，连接导线采用厚度为0.025～0.1mm的细导线。
CN97191812A 1996-11-29 1997-08-22 特别适用于电子控制设备的配置及其制造方法 Expired - Fee Related CN1072850C (zh)

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