CN107277948A - Far infrared compound resin heating base plate, its preparation method and application - Google Patents
Far infrared compound resin heating base plate, its preparation method and application Download PDFInfo
- Publication number
- CN107277948A CN107277948A CN201710305713.2A CN201710305713A CN107277948A CN 107277948 A CN107277948 A CN 107277948A CN 201710305713 A CN201710305713 A CN 201710305713A CN 107277948 A CN107277948 A CN 107277948A
- Authority
- CN
- China
- Prior art keywords
- far infrared
- compound resin
- metallic
- base plate
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Resistance Heating (AREA)
Abstract
The invention provides a kind of far infrared compound resin heating base plate, including the first compound resin substrate set gradually, metallic conduction paper tinsel chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer and the second compound resin substrate, wherein, the metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, first insulating barrier, geometry resistance chip and the second insulating barrier, the releasing far infrared inorganic non-metallic Far infrared electric resistance layer includes the releasing far infrared inorganic non-metallic far infrared graphite resistive film of substrate and deposition on the substrate.
Description
Technical field
The invention belongs to compound resin technical field, more particularly to a kind of far infrared compound resin heating base plate, its preparation
Method and application.
Background technology
Electronics, electrical equipment industry are the high-tech industries developed rapidly over nearly 30 years, and electronic functional material is electronic component
Basis and support with electronics, are widely used in the every field of electronics industry.With electronic component manufacturing technology
Leap progress, the slimming of electronic product forward direction small-size light-weight, high performance, multifunction, the direction of health are developed, and then pushed away
The continuous progress of dynamic electronic material.Composite resin material has many excellent properties, such as intensity is high, fatigue resistance is good, corrosion-resistant,
Low and unique material designability of dimensionally stable, density etc..Therefore, since the advent of the world is quickly grown, and is had been widely used
In electronics industry, as structural member and structure function part, product is assigned with spies such as lightweight, high intensity, high rigidity, high dimensional accuracies
Property, the technical indicator of product is improved, the demand for development of modern high technology has been better adapted to.Because composite resin material is than strong
Spend height, good electrical property, good heat-insulating property and electrical insulation capability, it is lightweight the advantages of, be widely used in oil, salt manufacturing, system
In the industry such as medicine, desalinization, bioengineering, environmental project, automobile, food, high ferro EMUs, carbon fiber in recent years is particularly
Composite resin material etc. has been widely used in aerospace vehicle structure, four used as aerospace field
One of big structure material.Although composite resin material industry fast development, it is in integrated wall top, shower house, optical wave house, sweat
Steam room, roof snow melt, pet supplies, fishpond heating plate, livestock breeding industry, cultivation of fruit tree, heating bed board, medicine equipment, health care
The fields such as household articles, building heating or blank out.With " Chinese dream " be done step-by-step and population structure change, I
State has stepped into aging society, and country continues to increase to health industry input, living standards of the people improve constantly with
Lifting to health perception, health industry correlation intension is enriched constantly, and various healthy articles for use enjoy favor.It is used as healthy articles for use
The research and development success of emphasis core component-high-performance far infrared compound resin heating base plate, the life that can necessarily change people is practised
It is used.In scientific and technological high development, today with rapid changepl. never-ending changes and improvements, health, high-quality life turn into pursuing a goal for common people, so high
Performance far infrared compound resin heating base plate is bound to turn into one of indispensable key function material of healthy electronic product.
The content of the invention
It is an object of the invention to provide a kind of far infrared compound resin heating base plate and preparation method thereof, it is intended to solves existing
There is the problem of technology can not provide a kind of far infrared heating substrate containing compound resin.
Another object of the present invention is to provide a kind of application of far infrared compound resin heating base plate.
The present invention is achieved in that a kind of far infrared compound resin heating base plate, including first set gradually are combined
Resin substrate, metallic conduction paper tinsel chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer and the second compound resin
Substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate,
One insulating barrier, geometry resistance chip and the second insulating barrier,
The releasing far infrared inorganic non-metallic Far infrared electric resistance layer includes substrate and deposited on the substrate
Releasing far infrared inorganic non-metallic far infrared graphite resistive film.
And, a kind of preparation method of far infrared compound resin heating base plate comprises the following steps：
Metallic conduction paper tinsel is fitted on insulating carrier film, patterned process formation geometry resistance chip is carried out, uses
Insulating carrier film is packaged processing to the geometry resistance chip, obtains metallic conduction paper tinsel chip layer semi-finished product；
There is releasing far infrared inorganic non-gold in the surface laminating deposition of the metallic conduction paper tinsel chip layer semi-finished product
Belong to the resistance film substrate of far infrared graphite resistive film, reflection of being fitted on another surface of the metallic conduction paper tinsel chip layer semi-finished product
Aluminium foil；
Respectively in the reflective aluminium foil and the first compound resin of resistive film substrate surface hot pressing substrate, the second compound tree
Aliphatic radical piece, obtains far infrared compound resin heating base plate.
And, a kind of application of far infrared compound resin heating base plate, the far infrared compound resin heating base plate is upper
The far infrared compound resin heating base plate stated, application field is melted including integrated wall top, shower house, optical wave house, sweat-steaming house, roof
Snow, pet supplies, fishpond heating plate, livestock breeding industry, cultivation of fruit tree, heating bed board, medicine equipment, health treatment, building are supplied
Warm, household appliance technical field.
The far infrared compound resin heating base plate that the present invention is provided, with advantages below：
1st, the geometry resistance chip of the far infrared compound resin heating base plate is handled by reinforced insulation twice, its
Resistance stabilization, electric stability energy and excellent in durability.
2nd, the far infrared compound resin heating base plate is provided with two layers of compound resin substrate, can avoid being disposed there between
The metallic conduction paper tinsel chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer in complex environment from not
Profit influence, and obtain product high mechanical strength, will not be deformed, and environment-protective no-smell.In addition, the compound tree of the far infrared
Fat heating base plate protection against the tide moisture-proof characteristic is strong, there is good anti-microbial effect and acid and alkali resistance, organic solvent and seawater corrosion effect
Ability.Far infrared compound resin heating base plate that the present invention is provided is permeable, water imbibition and hygroscopicity are very low, classification of waterproof：
IPX8 (continues diving run), or even waterproof, can directly be embedded in water and use for a long time.
3rd, the far infrared compound resin heating base plate contains releasing far infrared inorganic non-metallic Far infrared electric resistance layer,
Heating temp is uniform, rich in 8-14 microns of far infrareds, is conducive to health.
4th, the far infrared compound resin heating base plate is planar heat producing body, and unit area power density is low, surface temperature
Uniformly, high-low temperature difference is only 2 DEG C.
5th, the far infrared compound resin heating base plate, its geometry resistance chip uses PI film (polyimides up and down
Film) or the encapsulation of PET (polyester film) dielectric film, two layers of compound resin substrate are then wrapped in again to be treated in the middle of finished product, and through height
Warm hot-pressing processing and form an entirety, obtained product resistance stabilization, excellent in durability.And its resistance material be metal and
Inorganic material is made, and in the absence of oxidation, aging phenomenon, product is through national infrared Spot detection, service life >=50000 hour.
6th, the far infrared compound resin heating base plate, specious, rich color, full of unifications, profile is different；Product
The special-shaped outward appearance such as tabular, arc-shaped can be made, and without secondary decoration.Its good decorative property, any surface finish can be configured to each
Gay colours is planted, different decorative patterns and pattern can also be produced, various decorative panels, large-scale embossment and technique is suitably manufactured beautiful
Art sculpture etc..
7th, the far infrared compound resin heating base plate that the present invention is provided, with cost is low, fatigue resistance is good, uviolresistance
Can strong, corrosion-resistant, density low and unique material designability the advantages of, product purpose is extensive.
The preparation method for the far infrared compound resin heating base plate that the present invention is provided, method is simple and easily controllable, can be real
Existing large-scale production.
The application for the far infrared compound resin heating base plate that the present invention is provided, can radiate 8-14 microns of far infrared,
Heating is uniform and thermal stability is good, can be adapted to moistureproof damp proof occasion and uses.
Brief description of the drawings
Fig. 1 is the configuration schematic diagram of far infrared compound resin heating base plate provided in an embodiment of the present invention；
Fig. 2 is the overlooking the structure diagram of packaged resistance chip layer provided in an embodiment of the present invention.
Embodiment
In order that technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with
Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only to explain
The present invention, is not intended to limit the present invention.
With reference to Fig. 1, Fig. 2, the embodiments of the invention provide a kind of far infrared compound resin heating base plate, including set gradually
The first compound resin substrate 1, metallic conduction paper tinsel chip layer 2, the releasing far infrared and of inorganic non-metallic Far infrared electric resistance layer 3
Second compound resin substrate 4, wherein, the metallic conduction paper tinsel chip layer 2 is included on the first compound resin substrate 1 successively
The reflective aluminium foil 21 of setting, the first insulating barrier 221, geometry resistance chip 222 and the second insulating barrier 223, the release are remote
Ultrared inorganic non-metallic Far infrared electric resistance layer 3 includes substrate and deposition on the substrate releasing far infrared inorganic
Nonmetallic far infrared graphite resistive film, the explosive view of far infrared compound resin heating base plate is as shown in Figure 1.
Specifically, the embodiment of the present invention uses the first compound resin substrate 1, the second compound resin substrate 4, lead to
Heat pressing process pressing is crossed by the metallic conduction paper tinsel chip layer 2 and releasing far infrared inorganic non-metallic Far infrared electric resistance layer 3
It is encapsulated in centre.The metallic conduction paper tinsel chip layer 2 that can avoid being disposed there between, releasing far infrared inorganic non-metallic
Far infrared electric resistance layer 3 is in complex environment from adverse effect.Specifically, the first compound resin substrate 1, described second is multiple
The setting of resin substrate 4 so that the obtained moistureproof moisture-proof characteristic of far infrared compound resin heating base plate is strong, there is anti-micro- well
Biological agent and the ability of acid and alkali resistance, organic solvent and seawater corrosion effect.The far infrared compound resin heating that the present invention is provided
Substrate is permeable, water imbibition and hygroscopicity are very low, classification of waterproof：IPX8 (continues diving run), or even waterproof, can be direct for a long time
Used in embedment water.In addition, the first compound resin substrate 1, the second compound resin substrate 4 assign obtained product machine
Tool intensity is high, be not deformed, fatigue resistance is good, anti-ultraviolet property is strong, low corrosion-resistant, density, environment-protective no-smell, cost are low
The advantages of.
In the embodiment of the present invention, the metallic conduction paper tinsel chip layer 2 is included on the first compound resin substrate 1 successively
The reflective aluminium foil 21 of setting, the first insulating barrier 221, geometry resistance chip 222 and the second insulating barrier 223.In addition, the gold
Category conductive foil chip layer 2 is additionally provided with lead ends (not marked in figure) and lead terminal (not marked in figure), the geometric form
Shape resistance chip 222, lead ends, lead terminal are collectively forming chip assembly.Wherein, the first insulating barrier 221, the second insulating barrier
Geometry resistance chip 222 or chip assembly (lead ends are exposed outside) are wrapped in centre by 223, to geometry resistance
Chip 222 or chip assembly carry out insulating encapsulation process, form packaged resistance chip layer 22.The thus obtained far infrared
Compound resin heating base plate, its geometry resistance chip 222 or chip assembly by the processing of reinforced insulation twice (insulating barrier and
The double hyer insulation of compound resin substrate), its resistance stabilization, electric stability energy and excellent in durability, it is in electrical strength
1 minute nothing punctures flashover under conditions of 3750V, 2MA.
Wherein, first insulating barrier 221, the second insulating barrier 223 are that PI films (polyimide film) insulating barrier or PET are (poly-
Ester film) insulating barrier.It is preferred that insulating materials, not only insulation effect is good, and with preferable resistance to elevated temperatures, so as to be conducive to
Insulating barrier after hot pressing forms packaging effect.
First insulating barrier 221, geometry resistance chip 222 and the second insulating barrier 223 formation packaged resistance chip layer 22,
Can by it is cold mount, seal, hot pressing is realized.It is preferred that, geometry resistance chip 222 and the first insulating barrier of its upper and lower surface
221st, the second insulating barrier 223 forms a packaged resistance chip layer 22 through hot pressing, so as to obtain more preferable packaging effect, resistance and electricity
The more stable packaged resistance chip layer 22 of gas performance.
It is further preferred that the region for not setting geometry resistance chip 222 in the packaged resistance chip layer 22, often
10cm2At least provided with 2 a diameter of 6-8mm through hole 220, to prevent product to be layered, packaged resistance chip layer 22 is bowed
It is as shown in Figure 2 depending on structure chart.
In the embodiment of the present invention, the releasing far infrared inorganic non-metallic Far infrared electric resistance layer 3 includes substrate and heavy
The releasing far infrared inorganic non-metallic far infrared graphite resistive film of product on the substrate.The substrate, which has, clearly to be limited,
Using performance more preferably mica substrate.
It is preferred that, the releasing far infrared inorganic non-metallic far infrared graphite resistive film is situated between by matrix material and liquid
Matter is made, and described matrix material is made up of the following raw materials according of following parts by weight：
Wherein, nano-titanium oxide is contained in the far-infared ceramic powder.
Releasing far infrared inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, first, with oxygen
Change bismuth, zinc oxide, antimony oxide and be used as main film forming substance so that releasing far infrared inorganic non-metallic far infrared graphite
The film layer of resistive film can form the continuous dry film with preferable intensity；Further, releasing far infrared inorganic non-metallic
Other metallic compounds, such as strontium carbonate, magnesia, quartz sand, lithium carbonate and alkali formula carbon are also added in far infrared graphite resistive film
Sour copper.On the one hand, such as strontium carbonate, magnesia, quartz sand, lithium carbonate and basic copper carbonate participate in film forming as film forming matter；Separately
On the one hand, above-mentioned substance can be cooperateed with mutually as functional additive, made up using bismuth oxide, zinc oxide, antimony oxide and be used as master
Want the deficiency functionally of the resistive film of film forming matter.Specifically, the bismuth oxide, zinc oxide, antimony oxide cooperate,
The operating temperature of graphite resistance film and the stability of electric property can be improved；Meanwhile, the strontium carbonate, magnesia, quartz sand,
Lithium carbonate and basic copper carbonate mating reaction, further increase adhesive force, surface strength and the wearability of resistive film, it is to avoid release
The inorganic non-metallic far infrared graphite resistive film of the far infrared cracking phenomenon (cracking, peeling) in sintering process is put, with
And in the scuffing for using or storing process.
Secondly, releasing far infrared inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, simultaneously
Ultrafine mica powder, far-infared ceramic powder functional powder are with the addition of, assigns resistive film excellent electric combination property and far infrared
Performance.Specifically, the far-infared ceramic powder (containing nano-titanium oxide) used cooperatively with the ultrafine mica powder, rich in far infrared
Line, its far-infrared radiation rate enhancing more than 15%；Releasing far infrared inorganic non-metallic far infrared graphite can be made simultaneously
Resistive film has preferable catalysis oxidation function, can effectively remove benzene, formaldehyde, sulfide, ammonia and the stink substance of interior, and has
There is sterilizing function.It is different from generally by ultrafine mica powder, far-infared ceramic powder that film forming is different come the technology that plays a role respectively, this
The releasing far infrared inorganic non-metallic far infrared graphite resistive film of inventive embodiments, with bismuth oxide, zinc oxide, three oxidations two
On the premise of antimony, strontium carbonate, magnesia, quartz sand, lithium carbonate, basic copper carbonate etc. are as film forming matter, ultra-fine cloud can be achieved
Added while female powder, far-infared ceramic powder and then prepare the releasing far infrared inorganic non-metallic far infrared graphite electricity of individual layer
Hinder film.
Again, releasing far infrared inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, graphite
Resistive film main framework material makes for inorganic high-temp metal oxide materials, and resistance, electric property are more stablized, it is easy to industry
Change, large-scale production；Releasing far infrared inorganic non-metallic far infrared graphite resistive film is with materials such as bismuth oxide, silica
For framework material, material softening point temperature is significantly improved, and the graphite resistance film prepared by it, application is more extensive.Simultaneously
Using antimony oxide, zinc oxide and lithium carbonate as raw material, the antimony oxide and zinc oxide are used to effectively improve product
Adhesive force between carrier, and then improve and combine effect, the lithium carbonate can reconcile antimony oxide, zinc oxide and other are former
The amalgamation between composition is expected, so as to ensure the realization of the effect above.
Releasing far infrared inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, mechanical strength
Height, with preferable enhancing toughness, adhesive force, anti-ageing property, corrosion resistance, anti acid alkali performance, corrosion resistance, its thermal coefficient of expansion
It is small, the phenomenons such as cracking, peeling will not be produced.In addition, the releasing far infrared inorganic non-metallic far infrared graphite resistive film
Constitutive material is free of precious metals species, and not even containing metallics, therefore, price is human-oriented, is conducive to graphite resistance film civilian
Field is popularized；Meanwhile, releasing far infrared inorganic non-metallic far infrared graphite resistance provided in an embodiment of the present invention
Film, does not contain leaded material, can avoid preparing that discarded object pollution on the environment and lead brings to health is unfavorable
Influence, meets environmental protection theory.
Specifically, described matrix material includes two parts, the glass micro mist skeleton that a part is made up of metal oxide
Material, including bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, quartz sand, lithium carbonate, alkali
Formula copper carbonate；The functional material that another part is made up of graphite powder, ultrafine mica powder, far-infared ceramic powder.Wherein, it is described
The aggregate of framework material charging resistor film, to support membrane structure；The functional material assigns resistive film utility function.
Specifically, the graphite powder is as one of major function raw material, it is far red in releasing far infrared inorganic non-metallic
It is a kind of far infrared resistance material for playing electric action in outer graphite resistance film.Releasing far infrared inorganic non-metallic is far red
Under electric field action violent friction and shock occurs for outer graphite resistance film between the carbon molecules between graphitic composition therein,
Produce the main heat energy externally transmitted with far infrared radiation and convection current form.In the embodiment of the present invention, the weight of the graphite powder
Number is 150-300 parts, can be specially 150 parts, 180 parts, 200 parts, 220 parts, 250 parts, 280 parts, preferably 300 parts, 180-
280 parts.Further, inventor has found by numerous studies, the releasing far infrared nothing of specific composition of the embodiment of the present invention
In the nonmetallic far infrared graphite resistive film of machine, the granularity of the graphite must be very strictly controlled.When the graphite powder particle is spent
When greatly, more than 400 mesh, can cause releasing far infrared inorganic non-metallic far infrared graphite resistive film generate heat it is uneven and
Produce the excessive phenomenon of resistance dispersion.In view of this, the mesh of the granularity of the graphite powder≤400.It is preferred that, the graphite powder
Particle diameter is 400-500 mesh.
The ultrafine mica powder is the releasing far infrared inorganic non-metallic far infrared graphite resistive film of the embodiment of the present invention
The reinforcing agent of mid and far infrared line, meanwhile, it is also phase lap in releasing far infrared inorganic non-metallic far infrared graphite resistive film
The stabilizer connect.The addition of the ultrafine mica powder, can not only strengthen releasing far infrared inorganic non-metallic far infrared stone
The radiation of black resistive film mid and far infrared line, moreover, the ultrafine mica powder can promote the mutual fusion between each component, especially
It is enhancing bismuth oxide, zinc oxide, between antimony oxide and strontium carbonate, magnesia, quartz sand, lithium carbonate, basic copper carbonate
Mutually overlap, so that improve film forming and the mechanical strength of releasing far infrared inorganic non-metallic far infrared graphite resistive film,
Releasing far infrared inorganic non-metallic far infrared graphite resistive film is avoided locally to produce cracking, peeling etc. in use
Phenomenon.The ultrafine mica powder parts by weight are 90-180 parts, concretely 90 parts, 100 parts, 120 parts, 150 parts, 180 parts.It is excellent
Choosing, the ultrafine mica powder parts by weight are 100-170.Further, the embodiment of the present invention is to the ultrafine mica powder
Particle diameter also has strict control, specifically, the particle diameter of the ultrafine mica powder (i.e. granularity is less than 500 mesh) below 500 mesh.If
The granularity of the ultrafine mica powder is more than between 500 mesh, each component, particularly strengthens bismuth oxide, zinc oxide, antimony oxide
Phase lap intensity between strontium carbonate, magnesia, quartz sand, lithium carbonate, basic copper carbonate is deteriorated, and film-formation result is poor, release
The inorganic non-metallic far infrared graphite resistive film of far infrared can locally produce the phenomenons such as cracking, peeling in use.It is excellent
Choosing, the particle diameter of the ultrafine mica powder is 500-600 mesh.
The far-infared ceramic powder is the releasing far infrared inorganic non-metallic far infrared graphite resistance of the embodiment of the present invention
The indispensable infrared radiant material of film.Specifically, the far-infared ceramic powder is the far-infrared ceramic containing nano-titanium oxide
Powder.As the functional material of graphite resistance film, the far-infared ceramic powder can not only cooperate rich with the ultrafine mica powder
Rich far infrared intensity effect, and with preferable catalysis oxidation function, rich in far infrared, its far-infrared radiation rate increases
It is strong by more than 15%, benzene, formaldehyde, sulfide, ammonia and the stink substance of interior can be effectively removed, and with sterilizing function.It is preferred that,
Counted using the gross weight of the far-infared ceramic powder as 100%, the weight percentage of the nano-titanium oxide is 8-12%, if institute
The weight percentage for stating nano-titanium oxide is too high, can cause resistive film poor adhesive force, easily layering etc. defect, influence resistive film into
The service life of film effect and resistive film；If the weight percentage of the nano-titanium oxide is too low, it is effectively to remove
The materials such as indoor benzene, formaldehyde, sulfide, ammonia and stink, and without sterilizing function, i.e. health effect can not spy show.
The parts by weight of the far-infared ceramic powder are 60-120 parts, concretely 60 parts, 80 parts, 100 parts, 120 parts.It is preferred that, institute
The parts by weight for stating far-infared ceramic powder are 70-110 parts.The nonmetallic far infrared graphite resistive film of machine of the embodiment of the present invention is to remote red
The granularity of outer ceramic powder is by being strict with, specifically, the particle diameter of the far-infared ceramic powder should be less than 500 mesh.If described remote
The granularity of infrared ceramic powder is more than 500 mesh, and its far-infrared radiation intensity can weaken.It is preferred that, the far-infared ceramic powder
Particle diameter be 500-600 mesh.
In the embodiment of the present invention, it is different from generally by ultrafine mica powder, far-infared ceramic powder that film forming plays a role respectively
Technology it is different, the releasing far infrared inorganic non-metallic far infrared graphite resistive film of the present invention, with bismuth oxide, zinc oxide,
, will be super on the premise of antimony oxide, strontium carbonate, magnesia, quartz sand, lithium carbonate, basic copper carbonate etc. are as film forming matter
Added while thin mica powder, far-infared ceramic powder, slurry is formed under liquid medium effect, and then it is remote red to prepare individual layer release
The inorganic non-metallic far infrared graphite resistive film of outside line, is conducive to improving far infrared radiation intensity, and then it is excellent to assign resistive film
Electric combination property.
As the presently preferred embodiments, the particle diameter of the graphite powder is 400-500 mesh；The particle diameter of the ultrafine mica powder is 500-
600 mesh；The particle diameter of the far-infared ceramic powder is 500-600 mesh.By the particle diameter of above-mentioned substance, improve releasing far infrared
The resistance dispersion of inorganic non-metallic far infrared graphite resistive film, improves its sheet resistance repeatability.
Containing the graphite, ultrafine mica powder, far-infared ceramic powder releasing far infrared inorganic non-metallic far infrared
Graphite resistance film, under electric field action, produced far infrared dominant wavelength ranges are 8-14 μm, medical field also appellation it
" healthy light " and " life light ".It can activate the activity of large biological molecule, enable the molecule of organism be excited and
In compared with high vibration state, so make the activity that have activated the biological big hydrone such as nucleic acid protein, so as to play biological big
The function of the activity such as molecular regulation organism metabolism, immune, is conducive to recovery and the balance of function, reaches the purpose prevented and cured diseases,
Promote and improve blood circulation, etc..Based on this, far-infrared ray power has transferability from high to low, i.e. energy can be from
A powerful side is transmitted to a weak side, and the energy balance to regulation each organ of human body is particularly significant, so releasing far infrared
Inorganic non-metallic far infrared graphite resistive film just can be in medical treatment, health care, physical efficiency recovery, rehabilitation, building heating, household electrical appliance etc.
Field is widely used.
In the embodiment of the present invention, during the bismuth oxide is releasing far infrared inorganic non-metallic far infrared graphite resistive film
Material of main part, play in the middle of skeleton function.Specifically, the parts by weight of the bismuth oxide are 300-500 parts, could effectively it send out
Wave the effect of middle skeleton, be specifically as follows 300 parts, 330 parts, 350 parts, 380 parts, 400 parts, 430 parts, 450 parts, 470 parts,
500 parts.It is preferred that, the parts by weight of the bismuth oxide are 330-470 parts.Bismuth oxide environmental protection described in the embodiment of the present invention, to people
Body health not damaged, the also sound development beneficial to preserving the ecological environment.But relative to lead oxide, the bismuth oxide has higher
Softening temperature and environmental protection characteristic, therefore, a large amount of use of bismuth oxide significantly improve releasing far infrared inorganic non-metallic
The film-forming temperature and temperature in use of far infrared graphite resistive film.
The releasing far infrared inorganic non-metallic far infrared graphite resistive film needs to be attached on carrier, further system
It is standby into various electronic components.Adhesive ability of the slurry largely obtained using the bismuth oxide on carrier is poor.It is of the invention real
Apply in the releasing far infrared inorganic non-metallic far infrared graphite resistive film of example, with the addition of zinc oxide as material component.It is described
Zinc oxide can be effectively improved the coefficient of expansion of releasing far infrared inorganic non-metallic far infrared graphite resistive film, prevent out
Split；Meanwhile, the zinc oxide also as fluxing agent, promotes the rapid fusion between each component, so that forming properties stable homogeneous
Fused mass.By the fluxing action of the zinc oxide, make releasing far infrared inorganic non-metallic far infrared graphite resistive film
Thermal coefficient of expansion it is consistent with carrier, effectively adjust releasing far infrared inorganic non-metallic far infrared graphite resistive film and carrier
Between adhesion and adhesive force, make combination of the releasing far infrared inorganic non-metallic far infrared graphite resistive film on carrier
Power is more preferably.The parts by weight of the zinc oxide be 250-350 parts, concretely 250 parts, 280 parts, 300 parts, 320 parts, 340 parts,
350 parts.It is preferred that, the parts by weight of the zinc oxide are 260-340 parts.
In the embodiment of the present invention, on the one hand, the bismuth oxide, the cooperation of the antimony oxide and the zinc oxide make
With, the operating temperature of releasing far infrared inorganic non-metallic far infrared graphite resistive film can be improved, it is possible to decrease linear expansion coefficient,
Heat shock resistance is strong, heat endurance is improved, so as to expand releasing far infrared inorganic non-metallic far infrared graphite resistive film
The scope of application and properties of product.On the other hand, the antimony oxide coordinates the lithium carbonate, boric acid and strontium carbonate, common to make
With improvement far-infared ceramic powder, the adhesive force of glass granules (including bismuth oxide and other metal oxides) and carrier promote remote
Cohesive force between infrared ceramic powder, glass granules；Meanwhile, the antimony oxide can also strengthen far-infared ceramic powder, glass
Binding ability between particulate and the graphite powder, so that obtained releasing far infrared inorganic non-metallic far infrared stone
Black resistive film electric property is more stablized.The parts by weight of the antimony oxide be 100-150 parts, concretely 100 parts,
110 parts, 120 parts, 130 parts, 140 parts, 150 parts, preferably 110-130 parts.
In the embodiment of the present invention, the boric acid as bismuth oxide complementary element, collectively as releasing far infrared nothing
The intermediate host material of the nonmetallic far infrared graphite resistive film of machine.The addition of the boric acid, can promote material in manufacturing process
The Flashmelt of material, fusion, it is ensured that releasing far infrared inorganic non-metallic far infrared graphite resistive film is being used and made
It will not be cracked and cracking phenomena in journey, so as to improve product quality and stability.In addition, the boric acid is also with described three
Aoxidize two antimony, strontium carbonate improves far-infared ceramic powder, glass granules (including bismuth oxide and other metal oxides) and load together
The adhesive force of body；Strengthen the binding ability between far-infared ceramic powder, glass granules and the graphite powder simultaneously.The boric acid
Parts by weight are 180-250 parts, concretely 180 parts, 200 parts, 220 parts, 250 parts, preferably 190-230 parts.
The strontium carbonate as supplement raw material, except improve together with the antimony oxide, boric acid far-infared ceramic powder,
Outside the adhesive force of glass granules (including bismuth oxide and other metal oxides) and carrier, while strengthening far-infared ceramic powder, glass
Outside binding ability between glass particulate and the graphite powder.In addition, the strontium carbonate can also coordinate with the magnesia, promote stone
The Surface hardened layer of black resistive film, prevents releasing far infrared inorganic non-metallic far infrared graphite resistive film running, storing
Scratch and dampen in journey.The parts by weight of the strontium carbonate be 70-120 parts, concretely 70 parts, 80 parts, 90 parts, 100 parts,
110 parts, 120 parts.It is preferred that, the parts by weight of the strontium carbonate are 85-110 parts.
By using the antimony oxide, boric acid and strontium carbonate of above-mentioned parts by weight, on the one hand, improve ceramics, glass micro-
Surface adhesion between powder and between ceramics, glass granules and carbon dust, improves releasing far infrared inorganic non-metallic far red
Adhesion inside outer graphite resistance film and the adhesive force with carrier；On the other hand, it can improve releasing far infrared inorganic
The temperature applicable range and material softening temperature spot of nonmetallic far infrared graphite resistive film.In addition, each component is mutually coordinated, moreover it is possible to
The thermal coefficient of expansion of releasing far infrared inorganic non-metallic far infrared graphite resistive film is effectively improved, its heat endurance is improved.
In the embodiment of the present invention, the aluminum oxide as another skeletal support raw material, for build the graphite powder and
The bridge of mutual overlap joint between the micro- material of far-infared ceramic powder, glass (including other each metal oxides), so that each group
Dividing can fully combine, merge, and improve the compactness and stability of resistive film, while so that graphite powder and far-infared ceramic powder are assigned
The electric property given can give full play to.The parts by weight of the aluminum oxide be 50-100 parts, concretely 50 parts, 60 parts, 70
Part, 80 parts, 90 parts, 100 parts.It is preferred that, the parts by weight of the aluminum oxide are 55-80 parts.
In the embodiment of the present invention, the magnesia can coordinate as miscellaneous function raw material with the strontium carbonate, common to make
With graphite resistance film Surface hardened layer is promoted, prevent releasing far infrared inorganic non-metallic far infrared graphite resistive film operation,
Scratch and dampen during storage.In addition, the magnesia also with the borate complex, promote various metal oxides fully to melt
Melt, make various metal oxide fusions uniform.The parts by weight of the magnesia be 30-70 parts, concretely 30 parts, 40 parts,
50 parts, 60 parts, 70 parts.It is preferred that, the parts by weight of the magnesia are 35-60 parts.
The quartz sand is the alternative materials of bismuth oxide, and bismuth oxide forms the framework supporting structure of resistive film together.It is logical
The replacement of quartz sand is crossed, the content of bismuth oxide can be reduced, so that the releasing far infrared inorganic non-metallic of appropriateness reduction is far red
The film-forming temperature and temperature in use of outer graphite resistance film.Because the property of quartz sand is limited, it is impossible to be excessively added to replace oxidation
The content of bismuth.Specifically, the parts by weight of the quartz sand be 25-70 parts, concretely 25 parts, 30 parts, 40 parts, 50 parts, 60
Part, 70 parts.It is preferred that, the parts by weight of the quartz sand are 30-60 parts.
Because the content of the bismuth oxide is higher so that releasing far infrared inorganic non-metallic far infrared graphite resistive film
Caking property between each component is substantially reduced.The lithium carbonate a small amount of by adding of the embodiment of the present invention, make the bismuth oxide and
Adhesion between other components is greatly increased.By the mutual cooperation between the strontium carbonate and the bismuth oxide, improve
The adhesion of releasing far infrared inorganic non-metallic far infrared graphite resistive film, it is therefore prevented that releasing far infrared inorganic non-gold
The problems such as there is crackle, explosion, cracking, peeling in the sintering process of preparation technology in category far infrared graphite resistive film.Meanwhile, lead to
The adjustment effect of percarbonic acid lithium, dramatically increases the adhesion between bismuth oxide, three kinds of framework materials of antimony oxide zinc oxide,
And then form the enhanced stable skeleton structure of mechanical strength.The parts by weight of the lithium carbonate are 50-120 parts, concretely 50
Part, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts.It is preferred that, the parts by weight of the lithium carbonate are 55-100
Part.
In the releasing far infrared inorganic non-metallic far infrared graphite resistive film of the embodiment of the present invention, basic carbonate with the addition of
Copper is used as raw material components.On the one hand the basic copper carbonate as fluxing agent, promotes the rapid fusion between each component, so that shape
Into the fused mass of performance stable homogeneous；On the other hand, its catalysis of the basic copper carbonate and levelling effect.The basic copper carbonate
Parts by weight be 10-25 parts, concretely 10 parts, 15 parts, 20 parts, 25 parts.It is preferred that, the parts by weight of the basic copper carbonate
Number is 12-20 parts.
The embodiment of the present invention is used as main film forming substance using bismuth oxide, zinc oxide, antimony oxide so that release far infrared
The film layer of the inorganic non-metallic far infrared graphite resistive film of line can form the continuous dry film with preferable intensity；Further,
Other metal oxides, such as strontium carbonate, oxidation are also added in releasing far infrared inorganic non-metallic far infrared graphite resistive film
Magnesium, quartz sand, lithium carbonate and basic copper carbonate.On the one hand, such as strontium carbonate, magnesia, quartz sand, lithium carbonate and basic copper carbonate
Film forming is participated in as film forming matter；On the other hand, above-mentioned substance can be cooperateed with mutually as functional additive, make up with bismuth oxide,
Zinc oxide, antimony oxide as the resistive film of main film forming substance deficiency functionally.Specifically, the bismuth oxide, oxygen
Change zinc, antimony oxide to cooperate, the operating temperature of graphite resistance film and the stability of electric property can be improved；Meanwhile,
The strontium carbonate, magnesia, quartz sand, lithium carbonate and basic copper carbonate mating reaction, further increase the attachment of resistive film
Power, surface strength and wearability, it is to avoid releasing far infrared inorganic non-metallic far infrared graphite resistive film is in sintering process
Cracking phenomenon (cracking, peeling), and in the scuffing for using or storing process.It should be appreciated that in the embodiment of the present invention, respectively
Framework material and non-individual play respective effect and play the effect above, but by mutual between each framework material and multidirectional match somebody with somebody
Close, collective effect, assist to improve the combination property of releasing far infrared inorganic non-metallic far infrared graphite resistive film.
As a preferred embodiment situation, the parts by weight of the graphite powder are 180-280 parts；The ultrafine mica powder
Parts by weight be 90-180 parts；The parts by weight of the far-infared ceramic powder are 70-110 parts；The parts by weight of the bismuth oxide
Number is 330-470 parts；The weight fraction of the zinc oxide is 260-340 parts；The parts by weight of the antimony oxide are 110-
130 parts；The parts by weight of the boric acid are 200-240 parts；The parts by weight of the aluminum oxide are 55-80 parts；The strontium carbonate
Parts by weight be 85-110 parts；The parts by weight of the magnesia are 35-60 parts；The parts by weight of the quartz sand are 30-
60 parts；The parts by weight of the lithium carbonate are 55-100 parts.
In the embodiment of the present invention, the raw material of the releasing far infrared inorganic non-metallic far infrared graphite resistive film is also wrapped
Liquid medium is included, the liquid medium makes above-mentioned matrix material formation slurry, and then deposits film forming.It is preferred that, the liquid is situated between
Matter is organic media, and the weight ratio of described matrix raw material and the organic media is (1365-2355):(2320-4946).Such as
The usage amount of really described organic media is too high or too low, and silk-screen printing will be unable to film forming, and the resistive film of printing thickness by nothing
Method is controlled.It is further preferred that the organic media is the relatively low organic media of boiling point, specifically, the boiling of the organic media
Point is at 180-250 DEG C, and to ensure in follow-up drying process process, the organic media can be vaporized completely.
Specific preferred, the organic media includes the following component of following parts by weight：
1972-4204 parts of terpinol；
209-445 parts of ethyl cellulose；
139-298 parts of silane coupler.
The far infrared compound resin heating base plate contains releasing far infrared inorganic non-metallic Far infrared electric resistance layer, by
Carbon and inorganic material rich in far infrared are made, and performance is highly stable, and the far infrared heating temperature of generation is uniform, rich in 8-
14 microns of far infrared (medical field also appellation its " healthy light " and " life light "), is conducive to health.
As most preferred embodiment, a kind of far infrared compound resin heating base plate, including the first compound resin set gradually
Substrate 1, metallic conduction paper tinsel chip layer 2, releasing far infrared inorganic non-metallic Far infrared electric resistance layer 3 and the second compound resin base
Piece 4, wherein,
The metallic conduction paper tinsel chip layer 2 is included in the reflective aluminium foil set gradually on the first compound resin substrate 1
21st, PI or PET insulating barriers 221, geometry resistance chip 222 and PI or PET insulating barriers 223, the geometry resistor core
Piece 222 forms a packaged resistance chip layer with the PI films (polyimides) of its upper and lower surface or the hot pressing of PET (polyester) insulating barriers
22, and the region that geometry resistance chip 222 is not set in the packaged resistance chip layer 22, per 10cm2At least provided with 2
A diameter of 6-8mm through hole 220；
The releasing far infrared inorganic non-metallic Far infrared electric resistance layer 3 includes mica substrate and is deposited on the substrate
On releasing far infrared inorganic non-metallic far infrared graphite resistive film, wherein, the releasing far infrared inorganic non-gold
Category far infrared graphite resistive film be made up of matrix material and liquid medium, described matrix material by following parts by weight following original
Material composition：
Wherein, nano-titanium oxide is contained in the far-infared ceramic powder.
Further, the far infrared compound resin heating base plate also includes the power line set, and further comprises
It is arranged on the waterproof and dampproof high-temperature resistance plastice shield on its surface.
Far infrared compound resin heating base plate provided in an embodiment of the present invention, with advantages below：
1st, the geometry resistance chip of the far infrared compound resin heating base plate is handled by reinforced insulation twice, its
Resistance stabilization, electric stability energy and excellent in durability.
2nd, the far infrared compound resin heating base plate is provided with two layers of compound resin substrate, during can preventing from being arranged on
The metallic conduction paper tinsel chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer in adverse environment by shadow
Ring, and high mechanical strength, will not be deformed, and environment-protective no-smell.In addition, the far infrared compound resin heating base plate is moistureproof
Moisture-proof characteristic is strong, the ability for having good anti-microbial effect and acid and alkali resistance, organic solvent and seawater corrosion effect.The present invention
The far infrared compound resin heating base plate of offer is permeable, water imbibition and hygroscopicity are very low, classification of waterproof：IPX8 (lasting diving examinations
Test), in addition it is waterproof, it can directly be embedded in water and use for a long time.
3rd, the far infrared compound resin heating base plate contains releasing far infrared inorganic non-metallic Far infrared electric resistance layer,
Heating temp is uniform, rich in 8-14 microns of far infrareds, is conducive to health.
4th, the far infrared compound resin heating base plate is planar heat producing body, and unit area power density is low, surface temperature
Uniformly, high-low temperature difference is only 2 DEG C.
5th, the far infrared compound resin heating base plate, its geometry resistance chip uses PI films (polyimides) up and down
Or the encapsulation of PET (polyester) dielectric film, two layers of compound resin substrate are then wrapped in again to be treated in the middle of finished product, and through high temperature hot pressing
Handle and form an entirety, obtained product resistance stabilization, excellent in durability.And its resistance material is metal and inorganic material
Material is made, and in the absence of oxidation, aging phenomenon, product is through national infrared Spot detection, service life >=50000 hour.
6th, the far infrared compound resin heating base plate, specious, rich color, full of unifications, profile is different；Product
The special-shaped outward appearance such as tabular, arc-shaped can be made, and without secondary decoration.Its good decorative property, any surface finish can be configured to each
Gay colours is planted, different decorative patterns and pattern can also be produced, various decorative panels, large-scale embossment and technique is suitably manufactured beautiful
Art sculpture etc..
7th, the far infrared compound resin heating base plate that the present invention is provided, with cost is low, fatigue resistance is good, uviolresistance
Can strong, corrosion-resistant, density low and unique material designability the advantages of, product purpose is extensive.
Far infrared compound resin heating base plate provided in an embodiment of the present invention, can be prepared by following methods.
And, a kind of preparation method of far infrared compound resin heating base plate comprises the following steps：
S01. metallic conduction paper tinsel is fitted on insulating carrier film, carries out patterned process formation geometry resistor core
Piece, processing is packaged with insulating carrier film to the geometry resistance chip, obtains metallic conduction paper tinsel chip layer semi-finished product；
Specifically, in above-mentioned steps S01, patterned process formation geometry resistor core is carried out to the metallic conduction paper tinsel
The method of piece is preferably photoetching or engraving method.Specifically, in the metallic conduction paper tinsel oil surface being fitted on insulating carrier film,
Baking, exposure, development step preparation geometry are sequentially passed through, further, the product after development can also be tested, repaiied
Benefit, etching process.
Then processing is packaged to the geometry resistance chip with insulating carrier film, encapsulation process can be using heat
Press technological forming.
S02. have releasing far infrared inorganic in the surface laminating deposition of the metallic conduction paper tinsel chip layer semi-finished product
The resistance film substrate of nonmetallic far infrared graphite resistive film, fits on another surface of the metallic conduction paper tinsel chip layer semi-finished product
Reflective aluminium foil；
In above-mentioned steps S02, there is release remote red in the surface laminating deposition of the metallic conduction paper tinsel chip layer semi-finished product
The resistance film substrate of the inorganic non-metallic far infrared graphite resistive film of outside line, is preferably realized by following methods：
S21. each component is weighed according to the formula of above-mentioned releasing far infrared inorganic non-metallic far infrared graphite resistive film；
S22. by bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, quartz sand, carbonic acid
Lithium, basic copper carbonate heating melting, are ground after cooling, sieve, add graphite powder, ultrafine mica powder, far-infared ceramic powder
Mixing, obtains base material mixture；
S23. it is (1365-2355) according to base material mixture and organic media weight ratio in the base material mixture：
The ratio addition organic media of (2320-4946), is mixed to get mixed slurry；
S24., substrate is provided, by mixed slurry printing on the substrate, is dried, sintering processes, is released
Put the inorganic non-metallic far infrared graphite resistive film of far infrared.
Specifically, in above-mentioned steps S21, the releasing far infrared inorganic non-metallic far infrared graphite resistive film is matched somebody with somebody
Side and its preferable case, as described above, in order to save length, here is omitted.
In above-mentioned steps S22, by bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, stone
Sand, lithium carbonate, basic copper carbonate heating melting, form the first eutectic.It is preferred that, the temperature of the heating melting is 800-
1250 DEG C, so as to ensure that each raw material components are fully quickly merged.If the heating melting temperature is too low, it can not fill
Divide and effectively melt each metal oxide；If the temperature is too high, the softening point of base material mixture will be improved, and can influence resistance
The film-formation result and film forming sintering temperature of film.
The first eutectic after cooling is ground, sieving is handled, the relatively uniform particulate of particle diameter is formed, so that favorably
In the electric property for obtaining stabilization.Then graphite powder, ultrafine mica powder, far-infared ceramic powder mixing are added, base material mixing is obtained
Thing.In order to be sufficiently mixed uniformly with the graphite powder, ultrafine mica powder, far-infared ceramic powder, and obtain the mixing of uniform particle diameter
System, and then formation even compact, the film layer of performance temperature after follow-up film forming, it is preferred that the sieving processing will be cooled down, ground
Fused mass after mill crosses the screen cloth of the mesh of mesh number >=500.By controlling the particle diameter of fused mass, improve releasing far infrared inorganic non-
The resistance dispersion of metal far infrared graphite resistive film, improves its sheet resistance repeatability.
In above-mentioned steps S23, mixed slurry of the organic media formation suitable for film forming is added in the base material mixture, its
In, the base material mixture is (1365-2355) with organic media weight ratio：The ratio addition organic media of (2320-4946),
It is mixed to get mixed slurry.
There is provided substrate in above-mentioned steps S24, the substrate includes mica substrate, reinforced glass substrate, high-boron-silicon glass base
Plate, quartz glass substrate, without glass substrate, aluminium oxide ceramic substrate, porcelain enamel substrate, certainly, not limited to this.By the mixing
Slurry prints on the substrate, is dried successively, sintering processes, is released the inorganic non-metallic far infrared of far infrared
Graphite resistance film.Wherein, the printing is preferred to use silk-screen printing, wherein, the mesh of silk screen is 40-300 mesh, is more elected as
100-300 mesh.
It is preferred that, the drying mode is drying, and drying temperature is 120-280 DEG C, and drying time is preferably 10-20min,
Fully to remove the organic media in film layer, dense film is formed.The drying temperature is unsuitable too high or too low, if temperature mistake
Height, then can cause obtained film layer because internal-external temperature difference is big, be heated uneven and produce cracking, layering, foaming, explosion；If described
Temperature is too low, then is difficult to effectively remove organic media, and then during follow-up sintering, volatilization forms stomata influence film layer matter
Amount.It is preferred that, the temperature of the sintering is 480-680 DEG C, so as to form the stable uniform film layer of electric property.
The preparation method of releasing far infrared inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention,
Only graphite powder, ultrafine mica powder, far-infared ceramic powder need to will be added after the processing of each oxide fusion, then add organic media and be made
Slurry film forming, not only method is simple, and obtained excellent product performance.In addition, breakthrough of the embodiment of the present invention is traditional by work(
The technique of energy property powder ultrafine mica powder, far-infared ceramic powder difference film forming formation surface far-infrared radiation coating, will be described
Ultrafine mica powder, far-infared ceramic powder are added simultaneously, one-pass film-forming, are ensureing that performance is stable, it is strong to be particularly far-infrared radiation
On the premise of degree, the production duration is shortened, production cost is reduced, is more suitable for civilian resistive film field.
Further, in another surface laminating reflective aluminium foil of the metallic conduction paper tinsel chip layer semi-finished product.
S03. answered respectively in the reflective aluminium foil and the first compound resin of resistive film substrate surface hot pressing substrate, second
Resin substrate, obtains far infrared compound resin heating base plate.
The preparation method of far infrared compound resin heating base plate provided in an embodiment of the present invention, method is simple and is easy to control
System, can be achieved large-scale production.
And, the embodiment of the present invention additionally provides a kind of application of far infrared compound resin heating base plate, the far infrared
Compound resin heating base plate is above-mentioned far infrared compound resin heating base plate, and application field includes integrated wall top, shower house, light
Ripple room, sweat-steaming house, roof snow melt, pet supplies, fishpond heating plate, livestock breeding industry, cultivation of fruit tree, heating bed board, Medical treatment device
Tool, health treatment, building heating, household appliance technical field.
The application of far infrared compound resin heating base plate provided in an embodiment of the present invention, can radiate 8-14 microns remote red
Outside line, heating is uniform and thermal stability is good, can be adapted to moistureproof damp proof occasion and uses.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of far infrared compound resin heating base plate, it is characterised in that including the first compound resin substrate, the gold set gradually
Belong to conductive foil chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer and the second compound resin substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, first exhausted
Edge layer, geometry resistance chip and the second insulating barrier,
The releasing far infrared inorganic non-metallic Far infrared electric resistance layer includes the release of substrate and deposition on the substrate
The inorganic non-metallic far infrared graphite resistive film of far infrared.
2. far infrared compound resin heating base plate as claimed in claim 1, it is characterised in that the releasing far infrared nothing
The nonmetallic far infrared graphite resistive film of machine is made up of matrix material and liquid medium, and described matrix material is by following parts by weight
Following raw materials according is constituted：
Wherein, nano-titanium oxide is contained in the far-infared ceramic powder.
3. far infrared compound resin heating base plate as claimed in claim 1 or 2, it is characterised in that the geometry resistance
Chip forms packaged resistance chip layer with first insulating barrier of its upper and lower surface and the second insulating barrier hot pressing.
4. far infrared compound resin heating base plate as claimed in claim 3, it is characterised in that in the packaged resistance chip layer
The region of geometry resistance chip is not set, per 10cm2At least provided with 2 a diameter of 6-8mm through hole.
5. far infrared compound resin heating base plate as claimed in claim 1, it is characterised in that first insulating barrier, second
Insulating barrier is PI insulating barriers or PET insulating barriers.
6. far infrared compound resin heating base plate as claimed in claim 1, it is characterised in that the metallic conduction paper tinsel chip layer
It is additionally provided with lead ends and lead terminal.
7. far infrared compound resin heating base plate as claimed in claim 1, it is characterised in that the substrate is mica substrate.
8. far infrared compound resin heating base plate as claimed in claim 1, it is characterised in that first including setting gradually answers
The compound tree of resin substrate, metallic conduction paper tinsel chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer and second
Aliphatic radical piece, wherein,
The metallic conduction paper tinsel chip layer be included in the reflective aluminium foil set gradually on the first compound resin substrate, PI films or
PET insulating barriers, geometry resistance chip and PI or PET insulating barriers, the geometry resistance chip and its upper and lower surface
The hot pressing of PI or PET insulating barriers forms a packaged resistance chip layer, and does not have setting geometry in the packaged resistance chip layer
The region of resistance chip, per 10cm2At least provided with 2 a diameter of 6-8mm through hole；
The releasing far infrared inorganic non-metallic Far infrared electric resistance layer includes mica substrate and deposited on the substrate
Releasing far infrared inorganic non-metallic far infrared graphite resistive film, wherein, the releasing far infrared inorganic non-metallic is remote
Infrared graphite resistance film is made up of matrix material and liquid medium, described matrix material by following parts by weight following raw materials according group
Into：
Wherein, nano-titanium oxide is contained in the far-infared ceramic powder.
9. a kind of preparation method of far infrared compound resin heating base plate, comprises the following steps：
Metallic conduction paper tinsel is fitted on insulating carrier film, patterned process formation geometry resistance chip is carried out, with insulation
Carrier film is packaged processing to the geometry resistance chip, obtains metallic conduction paper tinsel chip layer semi-finished product；
There is releasing far infrared inorganic non-metallic remote in the surface laminating deposition of the metallic conduction paper tinsel chip layer semi-finished product
The resistance film substrate of infrared graphite resistance film, reflective aluminum of being fitted on another surface of the metallic conduction paper tinsel chip layer semi-finished product
Paper tinsel；
Respectively in the reflective aluminium foil and the first compound resin of resistive film substrate surface hot pressing substrate, the second compound resin base
Piece, obtains far infrared compound resin heating base plate.
10. a kind of application of far infrared compound resin heating base plate, it is characterised in that the far infrared compound resin heating base plate
For any described far infrared compound resin heating base plates of claim 1-7, application field includes integrated wall top, shower house, light
Ripple room, sweat-steaming house, roof snow melt, pet supplies, fishpond heating plate, livestock breeding industry, cultivation of fruit tree, heating bed board, Medical treatment device
Tool, health treatment, building heating, household appliance technical field.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710305713.2A CN107277948B (en) | 2017-05-03 | 2017-05-03 | Far infrared composite resin heating substrate, preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710305713.2A CN107277948B (en) | 2017-05-03 | 2017-05-03 | Far infrared composite resin heating substrate, preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107277948A true CN107277948A (en) | 2017-10-20 |
| CN107277948B CN107277948B (en) | 2021-01-22 |
Family
ID=60073680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710305713.2A Active CN107277948B (en) | 2017-05-03 | 2017-05-03 | Far infrared composite resin heating substrate, preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107277948B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708234A (en) * | 2017-10-25 | 2018-02-16 | 厦门宝益科技有限公司 | A kind of flexible electrical hot plate and preparation method thereof |
| CN109526074A (en) * | 2019-01-09 | 2019-03-26 | 河南问暖电子科技有限公司 | Electric-heating thin film component and preparation method thereof |
| CN111788379A (en) * | 2018-03-19 | 2020-10-16 | 全耐塑料高级创新研究公司 | Vehicle system for injecting an aqueous solution into a combustion chamber of an internal combustion engine and method for injecting an aqueous solution into a combustion chamber of an internal combustion engine |
| WO2022246877A1 (en) * | 2021-05-26 | 2022-12-01 | 佛山巧鸾科技有限公司 | Mid-infrared heating supply wall cloth and heating supply method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1044746A (en) * | 1989-02-03 | 1990-08-15 | 广州市华远电热电器厂 | A kind of binding type electrically-heating body and manufacturing technology thereof |
| CN203136200U (en) * | 2013-01-28 | 2013-08-14 | 苏州住邦新能源科技有限公司 | A fully-coated PTC carbon crystal heat-generating body |
| CN103489550A (en) * | 2013-09-13 | 2014-01-01 | 李琴 | Inorganic resistor thick film and preparing method and application of inorganic resistor thick film |
| CN104113942A (en) * | 2013-04-19 | 2014-10-22 | 中环股份有限公司 | Electric heating assembly |
| CN104159341A (en) * | 2014-08-19 | 2014-11-19 | 北京新宇阳科技有限公司 | Self-temperature-limiting conductive polymer electrothermal film with grounding layer |
| JP2015122180A (en) * | 2013-12-24 | 2015-07-02 | 日本ノズル株式会社 | Flexible heater |
| CN104797016A (en) * | 2015-03-25 | 2015-07-22 | 上海迈永节能新材料科技有限公司 | Inorganic non-metal semiconductor far infrared electric heating film material and preparation process thereof |
| CN105218164A (en) * | 2015-10-19 | 2016-01-06 | 福建省德化县华茂陶瓷有限公司 | Copper red furnace transmutation glaze and by its copper red furnace transmutation glaze ceramic prepared and preparation method |
| CN205430641U (en) * | 2016-03-28 | 2016-08-03 | 江苏米阳碳晶科技有限公司 | Double -deck stainless steel board that generates heat |
| CN205510434U (en) * | 2016-02-24 | 2016-08-24 | 深圳市长奇节能环保科技有限公司 | Safe voltage infrared ray warms up hand, warm foot, warm waist cushion |
-
2017
- 2017-05-03 CN CN201710305713.2A patent/CN107277948B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1044746A (en) * | 1989-02-03 | 1990-08-15 | 广州市华远电热电器厂 | A kind of binding type electrically-heating body and manufacturing technology thereof |
| CN203136200U (en) * | 2013-01-28 | 2013-08-14 | 苏州住邦新能源科技有限公司 | A fully-coated PTC carbon crystal heat-generating body |
| CN104113942A (en) * | 2013-04-19 | 2014-10-22 | 中环股份有限公司 | Electric heating assembly |
| CN103489550A (en) * | 2013-09-13 | 2014-01-01 | 李琴 | Inorganic resistor thick film and preparing method and application of inorganic resistor thick film |
| JP2015122180A (en) * | 2013-12-24 | 2015-07-02 | 日本ノズル株式会社 | Flexible heater |
| CN104159341A (en) * | 2014-08-19 | 2014-11-19 | 北京新宇阳科技有限公司 | Self-temperature-limiting conductive polymer electrothermal film with grounding layer |
| CN104797016A (en) * | 2015-03-25 | 2015-07-22 | 上海迈永节能新材料科技有限公司 | Inorganic non-metal semiconductor far infrared electric heating film material and preparation process thereof |
| CN105218164A (en) * | 2015-10-19 | 2016-01-06 | 福建省德化县华茂陶瓷有限公司 | Copper red furnace transmutation glaze and by its copper red furnace transmutation glaze ceramic prepared and preparation method |
| CN205510434U (en) * | 2016-02-24 | 2016-08-24 | 深圳市长奇节能环保科技有限公司 | Safe voltage infrared ray warms up hand, warm foot, warm waist cushion |
| CN205430641U (en) * | 2016-03-28 | 2016-08-03 | 江苏米阳碳晶科技有限公司 | Double -deck stainless steel board that generates heat |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708234A (en) * | 2017-10-25 | 2018-02-16 | 厦门宝益科技有限公司 | A kind of flexible electrical hot plate and preparation method thereof |
| CN111788379A (en) * | 2018-03-19 | 2020-10-16 | 全耐塑料高级创新研究公司 | Vehicle system for injecting an aqueous solution into a combustion chamber of an internal combustion engine and method for injecting an aqueous solution into a combustion chamber of an internal combustion engine |
| CN111788379B (en) * | 2018-03-19 | 2022-07-12 | 全耐塑料高级创新研究公司 | Vehicle system and method for injecting an aqueous solution into an intake line upstream of or into a combustion chamber of an internal combustion engine |
| US11623881B2 (en) | 2018-03-19 | 2023-04-11 | Plastic Omnium Advanced Innovation And Research | Vehicle system for injecting an aqueous solution in the combustion chamber of the internal combustion engine and method for injecting an aqueous solution in the combustion chamber of the internal combustion |
| CN109526074A (en) * | 2019-01-09 | 2019-03-26 | 河南问暖电子科技有限公司 | Electric-heating thin film component and preparation method thereof |
| WO2022246877A1 (en) * | 2021-05-26 | 2022-12-01 | 佛山巧鸾科技有限公司 | Mid-infrared heating supply wall cloth and heating supply method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107277948B (en) | 2021-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107277948A (en) | Far infrared compound resin heating base plate, its preparation method and application | |
| CN106255238B (en) | A kind of graphene thermo electric material and its application | |
| CN103935103B (en) | Preparation method of graphene/metal composite panel | |
| CN103296437B (en) | Manufacturing method for metamaterial board, metamaterial antenna housing and manufacturing method for metamaterial antenna housing | |
| CN108034284A (en) | A kind of prussian blue nano particle composite material and preparation method thereof | |
| CN113858724A (en) | High-temperature-resistant multi-layer heat-insulating material based on multifunctional reflecting screen and preparation method thereof | |
| CN102080197B (en) | Method for coating surface of reinforcement in composite material | |
| CN114133888B (en) | Heat-conducting composite material and plate | |
| CN107288371A (en) | Optical wave house | |
| CN105507550B (en) | The material of built-in heating layer electric heating solid wooden compound floor | |
| CN110405910B (en) | Preparation method of far infrared health-preserving, health-care, environment-friendly and energy-saving integrated wall surface | |
| CN102808491A (en) | Heat insulation decoration board and manufacturing method thereof | |
| CN110653895B (en) | Manufacturing method of negative oxygen ion ecological plate | |
| CN104582278B (en) | A kind of circuit board and preparation method thereof | |
| CN112468636A (en) | Housing and processing method thereof | |
| CN107459828B (en) | A kind of artificial rose wood and preparation method thereof | |
| CN202826780U (en) | Transfer printing membrane assembly and shell comprising same | |
| CN101914984A (en) | Build-up board for buildings and preparation method thereof | |
| CN110757677B (en) | Shielding material containing hard conductive sponge structure and manufacturing method thereof | |
| CN110527449A (en) | A kind of even heat-insulation composite material and preparation method thereof | |
| KR101658159B1 (en) | And a method for manufacturing the far-infrared-emitting sheet | |
| CN104341938A (en) | Conductive metal powder composite coating and preparation method thereof | |
| CN107197544A (en) | Inorganic non-metallic far infrared graphite resistive film, its preparation method and application | |
| CN114989529B (en) | Environment-friendly composite surface sheet layer and preparation method and application method thereof | |
| CN211775302U (en) | Hydrophobic and oleophobic nano-plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201229 Address after: 523000 L2, 5th floor, 83 Wenquan South Road, Xihu village, Shilong Town, Dongguan City, Guangdong Province Applicant after: Dongguan Hongyang Thermal Energy Technology Co.,Ltd. Address before: No.125-5, Taibei Road, gaoshayuan, Gaoyou, Yangzhou, Jiangsu, 225600 Applicant before: Tao Zhibin |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |