CN107277948B - Far infrared composite resin heating substrate, preparation method and application thereof - Google Patents
Far infrared composite resin heating substrate, preparation method and application thereof Download PDFInfo
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- CN107277948B CN107277948B CN201710305713.2A CN201710305713A CN107277948B CN 107277948 B CN107277948 B CN 107277948B CN 201710305713 A CN201710305713 A CN 201710305713A CN 107277948 B CN107277948 B CN 107277948B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
The invention provides a far infrared composite resin heating substrate which comprises a first composite resin substrate, a metal conductive foil chip layer, an inorganic nonmetal far infrared resistance layer releasing far infrared rays and a second composite resin substrate which are sequentially arranged, wherein the metal conductive foil chip layer comprises a reflective aluminum foil, a first insulation layer, a geometric shape resistance chip and a second insulation layer which are sequentially arranged on the first composite resin substrate, and the inorganic nonmetal far infrared resistance layer releasing far infrared rays comprises a substrate and an inorganic nonmetal far infrared graphite resistance layer releasing far infrared rays deposited on the substrate.
Description
Technical Field
The invention belongs to the technical field of composite resin, and particularly relates to a far infrared composite resin heating substrate, and a preparation method and application thereof.
Background
The electronic and electrical industry is a high-technology industry rapidly developed in recent 30 years, and electronic functional materials are the foundation and support of electronic components and electronic equipment and are widely applied to various fields of the electronic industry. With the rapid progress of electronic component manufacturing technology, electronic products are being developed in the direction of miniaturization, light weight, thinness, high performance, multi-functionalization and health, and further, the continuous progress of electronic materials is being promoted. The composite resin material has many excellent properties, such as high strength, good fatigue resistance, corrosion resistance, stable size, low density, and unique material designability. Therefore, the composite material has been developed rapidly since the advent, has been widely used in the electronic industry as a structural member and a structural functional member, endows the product with the characteristics of light weight, high strength, high rigidity, high dimensional accuracy and the like, improves the technical indexes of the product, and better meets the development requirements of modern high technology. The composite resin material has the advantages of high specific strength, good electrical property, good thermal insulation property, electrical insulation property, light weight and the like, and is widely applied to industries such as petroleum, salt production, pharmacy, seawater desalination, bioengineering, environmental engineering, automobiles, food, high-speed rail motor train units and the like, particularly, carbon fiber composite resin materials and the like are widely applied to aerospace vehicle structures in recent years, and become one of four structural materials used in the aerospace field. Although the composite resin material industry is developed rapidly, the composite resin material is still a blank in the fields of wall tops, shower rooms, light wave rooms, sweat steam rooms, roof snow melting, pet products, fish pond heating plates, livestock breeding industry, fruit tree cultivation, heating bed plates, medical appliances, health care household products, building heating and the like. With the gradual realization of 'Chinese dream' and the change of population structure, China gradually enters an aging society, the investment of the state on health industry is continuously increased, the living standard of people is continuously improved, the health consciousness is improved, the related connotation of the health industry is continuously enriched, and various health products are favored. The successful research and development of the high-performance far infrared composite resin heating substrate which is a key core component of health products can change the living habits of people. Nowadays, with the advanced development of science and technology and the change of the science and technology, healthy and high-quality life has become the pursuit target of common people, so the high-performance far infrared composite resin heating substrate can certainly become one of the indispensable key functional materials of healthy electronic products.
Disclosure of Invention
The invention aims to provide a far infrared composite resin heating substrate and a preparation method thereof, and aims to solve the problem that the prior art cannot provide a far infrared heating substrate containing composite resin.
The invention also aims to provide application of the far infrared composite resin heating substrate.
The invention is realized in such a way that the far infrared composite resin heating substrate comprises a first composite resin substrate, a metal conductive foil chip layer, an inorganic nonmetal far infrared resistance layer for releasing far infrared rays and a second composite resin substrate which are arranged in sequence, wherein,
the metal conductive foil chip layer comprises a reflective aluminum foil, a first insulating layer, a geometric resistance chip and a second insulating layer which are sequentially arranged on the first composite resin substrate,
the inorganic nonmetal far infrared resistance layer for releasing far infrared rays comprises a substrate and an inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays, which is deposited on the substrate.
And, a preparation method of the far infrared composite resin heating substrate, comprising the following steps:
attaching a metal conductive foil to an insulating carrier film, carrying out patterning treatment to form a geometric resistance chip, and carrying out packaging treatment on the geometric resistance chip by using the insulating carrier film to obtain a semi-finished product of a metal conductive foil chip layer;
attaching a resistive film substrate deposited with an inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays to one surface of the semi-finished metal conductive foil chip layer, and attaching a reflective aluminum foil to the other surface of the semi-finished metal conductive foil chip layer;
and respectively carrying out hot pressing on the surfaces of the reflective aluminum foil and the resistive film substrate to obtain a first composite resin substrate and a second composite resin substrate so as to obtain the far infrared composite resin heating substrate.
The application field of the far infrared composite resin heating substrate comprises the fields of integrated wall roofs, shower rooms, light wave rooms, sweat steam rooms, roof snow melting, pet products, fish pond heating plates, livestock breeding industry, fruit tree cultivation, heating bed plates, medical instruments, health care products, building heating and household appliances.
The far infrared composite resin heating substrate provided by the invention has the following advantages:
1. the geometric resistance chip of the far infrared composite resin heating substrate is subjected to two times of reinforced insulation treatment, and has stable resistance, good electrical stability and good durability.
2. The far infrared composite resin heating substrate is provided with two layers of composite resin substrates, so that the metal conductive foil chip layer and the inorganic nonmetal far infrared resistance layer which releases far infrared rays which are arranged between the two layers of composite resin substrates can be prevented from being adversely affected in a complex environment, and the obtained product has high mechanical strength, can not deform, and is environment-friendly and free from peculiar smell. In addition, the far infrared composite resin heating substrate has strong moisture-proof and moisture-proof performance and has good antimicrobial effect and the capability of resisting acid, alkali, organic solvent and seawater corrosion. The far infrared composite resin heating substrate provided by the invention has very low water permeability, water absorbability and moisture absorbability, and the waterproof grade is as follows: IPX8 (continuous diving test), even water impermeable, can be buried directly in water for long periods of time.
3. The far infrared composite resin heating substrate contains an inorganic nonmetal far infrared resistance layer which releases far infrared rays, has uniform heating temperature and is rich in 8-14 microns of far infrared rays, and is beneficial to human health.
4. The far infrared composite resin heating substrate is a planar heating body, the power density per unit area is low, the surface temperature is uniform, and the temperature difference between high and low is only 2 ℃.
5. The upper and lower parts of the geometric resistance chip of the far infrared composite resin heating substrate are encapsulated by PI (polyimide) films or PET (polyester) films, then the geometric resistance chip is wrapped between two layers of composite resin substrates to be finished products, and the finished products are subjected to high-temperature hot-pressing treatment to form a whole, so that the obtained product has stable resistance and good durability. And the resistance materials are made of metal and inorganic materials, oxidation and aging phenomena do not exist, and the service life of the product is longer than or equal to 50000 hours through detection of the national infrared center.
6. The far infrared composite resin heating substrate has beautiful appearance, rich colors, perfect individuality and various appearances; the product can be made into the special-shaped appearance such as flat plate shape, circular arc shape and the like without secondary decoration. It has good decorative effect and smooth surface, can be made into various bright colors, also can be made into different patterns, and is suitable for making various decorative plates, large-scale relief and artistic sculptures, etc.
7. The far infrared composite resin heating substrate provided by the invention has the advantages of low cost, good fatigue resistance, strong ultraviolet resistance, corrosion resistance, low density, unique material designability and the like, and the product has wide application.
The preparation method of the far infrared composite resin heating substrate provided by the invention is simple and easy to control, and can realize large-scale production.
The application of the far infrared composite resin heating substrate provided by the invention can radiate 8-14 microns of far infrared rays, has uniform heating and good thermal stability, and can be suitable for damp-proof and damp-proof occasions.
Drawings
Fig. 1 is an exploded view of a far infrared composite resin heating substrate according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a top view structure of a packaged resistive chip layer according to an embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
With reference to fig. 1 and 2, an embodiment of the present invention provides a far infrared composite resin heating substrate, which includes a first composite resin substrate 1, a metal conductive foil chip layer 2, an inorganic non-metal far infrared resistance layer 3 for releasing far infrared rays, and a second composite resin substrate 4, which are sequentially disposed, wherein the metal conductive foil chip layer 2 includes a reflective aluminum foil 21, a first insulation layer 221, a geometric resistance chip 222, and a second insulation layer 223, which are sequentially disposed on the first composite resin substrate 1, the inorganic non-metal far infrared resistance layer 3 for releasing far infrared rays includes a substrate and an inorganic non-metal far infrared graphite resistance film for releasing far infrared rays, which is deposited on the substrate, and an exploded view of the far infrared composite resin heating substrate is shown in fig. 1.
Specifically, in the embodiment of the present invention, the first composite resin substrate 1 and the second composite resin substrate 4 are used, and the metal conductive foil chip layer 2 and the inorganic nonmetallic far infrared resistance layer 3 for releasing far infrared rays are encapsulated in the middle by a hot pressing process. The metal conductive foil chip layer 2, the inorganic nonmetallic far-infrared resistance layer 3 that releases far-infrared rays, disposed therebetween can be prevented from being adversely affected in a complicated environment. Specifically, the first composite resin substrate 1 and the second composite resin substrate 4 are arranged, so that the obtained far infrared composite resin heating substrate is high in moisture-proof and moisture-proof performance, and has good antimicrobial effect and good capability of resisting acid, alkali, organic solvent and seawater corrosion. The far infrared composite resin heating substrate provided by the invention has very low water permeability, water absorbability and moisture absorbability, and the waterproof grade is as follows: IPX8 (continuous diving test), even water impermeable, can be buried directly in water for long periods of time. In addition, the first composite resin substrate 1 and the second composite resin substrate 4 endow the obtained product with the advantages of high mechanical strength, no deformation, good fatigue resistance, strong ultraviolet resistance, corrosion resistance, low density, environmental protection, no peculiar smell, low cost and the like.
In the embodiment of the present invention, the metal conductive foil chip layer 2 includes a reflective aluminum foil 21, a first insulating layer 221, a geometric resistor chip 222, and a second insulating layer 223, which are sequentially disposed on the first composite resin substrate 1. In addition, the metal conductive foil chip layer 2 is provided with lead terminals (not shown) and lead terminals (not shown), and the geometric resistor chip 222, the lead terminals and the lead terminals together form a chip assembly. The geometric resistive chip 222 or the chip assembly (the lead ends are exposed outside) is wrapped in the first insulating layer 221 and the second insulating layer 223, and the geometric resistive chip 222 or the chip assembly is subjected to insulation packaging treatment to form the packaged resistive chip layer 22. The geometric resistance chip 222 or the chip component of the far infrared composite resin heating substrate obtained by the method is subjected to two times of reinforced insulation treatment (double-layer insulation of the insulation layer and the composite resin substrate), the resistance is stable, the electric stability performance and the durability are good, and the far infrared composite resin heating substrate does not have a breakdown flashover phenomenon in 1 minute under the conditions of the electric strength of 3750V and 2 MA.
The first insulating layer 221 and the second insulating layer 223 are PI film (polyimide film) insulating layers or PET (polyester film) insulating layers. The preferred insulating material has good insulating effect and better high-temperature resistance, thereby being beneficial to forming an insulating layer with a packaging effect through hot pressing.
The first insulating layer 221, the geometric resistor chip 222 and the second insulating layer 223 form the packaged resistor chip layer 22, which may be achieved by cold mounting, heat sealing, and hot pressing. Preferably, the geometric resistor chip 222, the first insulating layer 221 and the second insulating layer 223 on the upper and lower surfaces thereof are thermally pressed to form a packaged resistor chip layer 22, so as to obtain a packaged resistor chip layer 22 with better packaging effect and more stable resistance and electrical performance.
Further preferably, the area of the packaged resistive chip layer 22 where no geometric shape resistive chip 222 is disposed is every 10cm2At least 2 through holes 220 with the diameter of 6-8mm are arranged to prevent the product from layering, and the top view structure of the packaging resistance chip layer 22 is shown in fig. 2.
In the embodiment of the present invention, the far infrared ray-releasing inorganic nonmetallic far infrared resistance layer 3 includes a substrate and a far infrared ray-releasing inorganic nonmetallic far infrared graphite resistive film deposited on the substrate. The substrate is clearly defined, and a mica substrate with better performance is adopted.
Preferably, the inorganic nonmetal far infrared graphite resistive film for releasing far infrared is made of a base material and a liquid medium, wherein the base material is composed of the following raw materials in parts by weight:
wherein, the far infrared ceramic powder contains nano titanium oxide.
According to the inorganic nonmetal far-infrared graphite resistive film capable of releasing far-infrared rays, firstly, bismuth oxide, zinc oxide and antimony trioxide are used as main film forming substances, so that a film layer of the inorganic nonmetal far-infrared graphite resistive film capable of releasing far-infrared rays can form a continuous dry film with good strength; further, other metal compounds, such as strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and basic copper carbonate, are added to the inorganic non-metallic far infrared graphite resistive film which releases far infrared rays. On the one hand, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and basic copper carbonate are taken as film forming substances to participate in film forming; on the other hand, the above substances as functional additives can cooperate with each other to make up for the functional deficiency of the resistive film using bismuth oxide, zinc oxide, and antimony trioxide as main film forming substances. Specifically, the bismuth oxide, the zinc oxide and the antimony trioxide are matched with each other, so that the working temperature of the graphite resistive film and the stability of the electrical performance can be improved; meanwhile, the strontium carbonate, the magnesium oxide, the quartz sand, the lithium carbonate and the basic copper carbonate have a synergistic effect, so that the adhesive force, the surface strength and the wear resistance of the resistive film are further improved, and the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays is prevented from cracking (cracking and peeling) in the sintering process and being scratched in the using or storing process.
In addition, the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays provided by the embodiment of the invention is added with the superfine mica powder and the far infrared ceramic powder functional powder, so that the resistive film has excellent electrical comprehensive performance and far infrared performance. Specifically, the far infrared ceramic powder (containing nano titanium oxide) used in cooperation with the superfine mica powder is rich in far infrared rays, and the far infrared radiance of the far infrared ceramic powder is enhanced by more than 15%; meanwhile, the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays has a good catalytic oxidation function, can effectively remove indoor benzene, formaldehyde, sulfide, ammonia and odor substances, and has a sterilization function. Different from the technology that the superfine mica powder and the far infrared ceramic powder are respectively formed into films to play a role, the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays in the embodiment of the invention can realize simultaneous addition of the superfine mica powder and the far infrared ceramic powder and further prepare the single-layer inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays on the premise that bismuth oxide, zinc oxide, antimony trioxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate, basic copper carbonate and the like are taken as film forming substances.
Thirdly, according to the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays provided by the embodiment of the invention, the main framework material of the graphite resistive film is made of an inorganic high-temperature metal oxide material, so that the resistance and the electric appliance are more stable, and the industrial and large-scale production is easy to realize; the inorganic nonmetal far infrared graphite resistive film for releasing far infrared takes bismuth oxide, silicon dioxide and other materials as framework materials, the softening point temperature of the materials is obviously improved, and the prepared graphite resistive film has wider application range. And meanwhile, antimony trioxide, zinc oxide and lithium carbonate are used as raw materials, the antimony trioxide and the zinc oxide are used for effectively improving the adhesive force between the product and the carrier, so that the combination effect is improved, and the lithium carbonate can be adjusted to be fused with the antimony trioxide, the zinc oxide and other raw material components, so that the realization of the effect is ensured.
The inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays provided by the embodiment of the invention has high mechanical strength, better toughness, adhesive force, aging resistance, corrosion resistance, acid and alkali resistance and corrosion resistance, small thermal expansion coefficient and no cracking, peeling and the like. In addition, the raw materials of the inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays do not contain precious metal substances, even metal substances, so that the price is relative to the people, and the popularization of the graphite resistive film in the civil field is facilitated; meanwhile, the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays provided by the embodiment of the invention does not contain lead-containing substances, can avoid pollution of preparation wastes to the environment and adverse effects of lead on human health, and accords with the green environmental protection concept.
Specifically, the matrix material comprises two parts, wherein one part is a glass micro powder framework material consisting of metal oxides, and the glass micro powder framework material comprises bismuth oxide, zinc oxide, antimony trioxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and basic copper carbonate; the other part is a functional material consisting of graphite powder, superfine mica powder and far infrared ceramic powder. The framework material charges the aggregate of the resistance film to support the film structure; the functional material gives the resistive film a practical function.
Specifically, the graphite powder is used as one of main functional raw materials, and is a far infrared resistance material which plays a conductive role in an inorganic nonmetal far infrared graphite resistance film which releases far infrared rays. Under the action of an electric field, carbon molecules among graphite components in the inorganic nonmetal far infrared graphite resistive film releasing far infrared rays are subjected to violent friction and impact to generate heat energy which is mainly transmitted outwards in the forms of far infrared radiation and convection. In the embodiment of the invention, the weight part of the graphite powder is 150-300 parts, specifically 150 parts, 180 parts, 200 parts, 220 parts, 250 parts, 280 parts and 300 parts, and preferably 180-280 parts. Further, the inventors have conducted extensive studies to find that in the far infrared ray-releasing inorganic nonmetallic far infrared graphite resistive film of the specific composition of the embodiment of the present invention, the particle size of the graphite must be strictly controlled. When the granularity of the graphite powder is too large and exceeds 400 meshes, the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays can not uniformly generate heat and generate the phenomenon of overlarge resistance dispersion. In view of this, the granularity of the graphite powder is less than or equal to 400 meshes. Preferably, the particle size of the graphite powder is 400-500 meshes.
The superfine mica powder is an enhancer for the far infrared rays in the inorganic nonmetal far infrared graphite resistive film which releases the far infrared rays, and is also a stabilizer which is mutually overlapped in the inorganic nonmetal far infrared graphite resistive film which releases the far infrared rays. The addition of superfine mica powder not only can strengthen the radiation of far infrared ray in the inorganic nonmetal far infrared graphite resistive film of release far infrared ray, moreover, superfine mica powder can promote the mutual fusion between each component, especially strengthens mutual overlap joint between bismuth oxide, zinc oxide, antimony trioxide and strontium carbonate, magnesium oxide, quartz sand, lithium carbonate, the copper carbonate of alkali to improve the mechanical strength of film forming ability and the inorganic nonmetal far infrared graphite resistive film of release far infrared ray, avoid releasing the inorganic nonmetal far infrared graphite resistive film of far infrared ray and can produce phenomenons such as chap, skinning in the use part. The weight portion of the superfine mica powder is 90-180, and specifically 90, 100, 120, 150 and 180. Preferably, the weight portion of the ultrafine mica powder is 100-170. Further, the embodiment of the invention also strictly controls the particle size of the superfine mica powder, and specifically, the particle size of the superfine mica powder is below 500 meshes (i.e. the particle size is less than 500 meshes). If the granularity of the superfine mica powder is larger than 500 meshes, the mutual overlapping strength among the components, particularly the reinforced bismuth oxide, the zinc oxide, the antimony trioxide, the strontium carbonate, the magnesium oxide, the quartz sand, the lithium carbonate and the basic copper carbonate is poor, the film forming effect is poor, and the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays can generate the phenomena of cracking, peeling and the like locally in the using process. Preferably, the particle size of the superfine mica powder is 500-600 meshes.
The far infrared ceramic powder is an indispensable infrared radiation material of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays. Specifically, the far infrared ceramic powder is far infrared ceramic powder containing nano titanium oxide. As a functional material of the graphite resistive film, the far infrared ceramic powder can be matched with the superfine mica powder to enrich the far infrared intensity effect, has a better catalytic oxidation function, is rich in far infrared rays, enhances the far infrared radiation rate by more than 15 percent, can effectively remove indoor benzene, formaldehyde, sulfide, ammonia and odor substances, and has a sterilization function. Preferably, the weight percentage of the nano titanium oxide is 8-12% based on 100% of the total weight of the far infrared ceramic powder, and if the weight percentage of the nano titanium oxide is too high, the defects of poor adhesion and easy delamination of the resistive film can be caused, and the film forming effect of the resistive film and the service life of the resistive film can be influenced; if the weight percentage of the nano titanium oxide is too low, substances such as indoor benzene, formaldehyde, sulfide, ammonia, odor and the like cannot be effectively removed, and the nano titanium oxide does not have a sterilization function, namely, the health effect cannot be particularly shown. The weight portion of the far infrared ceramic powder is 60-120, and specifically 60, 80, 100 and 120. Preferably, the far infrared ceramic powder accounts for 70-110 parts by weight. The nonmetal far infrared graphite resistive film of the embodiment of the invention has strict requirements on the granularity of far infrared ceramic powder, and particularly, the grain diameter of the far infrared ceramic powder is less than 500 meshes. If the granularity of the far infrared ceramic powder is larger than 500 meshes, the far infrared radiation intensity of the far infrared ceramic powder is weakened. Preferably, the particle size of the far infrared ceramic powder is 500-600 meshes.
In the embodiment of the invention, different from the technology that the superfine mica powder and the far infrared ceramic powder are respectively formed into films to play a role, the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays is prepared by adding the superfine mica powder and the far infrared ceramic powder simultaneously under the premise of taking bismuth oxide, zinc oxide, antimony trioxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate, basic copper carbonate and the like as film forming substances to form slurry under the action of a liquid medium, so that the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays in a single layer is prepared, the far infrared radiation intensity is favorably improved, and the excellent electrical comprehensive performance is further endowed to the resistive film.
As a preferred embodiment, the particle size of the graphite powder is 400-500 meshes; the particle size of the superfine mica powder is 500-600 meshes; the particle size of the far infrared ceramic powder is 500-600 meshes. Through the particle size of the substances, the resistance dispersion of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays is improved, and the repeatability of the sheet resistance is improved.
The inorganic non-metal far infrared graphite resistance film containing the graphite, the superfine mica powder and the far infrared ceramic powder and releasing far infrared rays generates far infrared rays with the main wavelength range of 8-14 mu m under the action of an electric field, and is also called as 'health rays' and 'life rays' in the medical field. It can activate the activity of biological macromolecule, and can excite the biological molecule to be in high vibration state, so that it can activate the activity of biological macromolecule such as nucleic acid protein, etc., so that it can play the function of regulating the metabolism and immunity of organism, and is favorable for recovering and balancing function, and can attain the goal of preventing and curing diseases, promoting and improving blood circulation, etc. Based on this, far infrared energy has transferability from high to low, that is, energy can be transferred from a strong party to a weak party, which is very important to adjust energy balance of each organ of a human body, so that the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays can be widely used in the fields of medical treatment, health care, physical recovery, rehabilitation, building heating, household appliances and the like.
In the embodiment of the invention, the bismuth oxide is a main material in the inorganic nonmetal far infrared graphite resistance film which releases far infrared rays and plays a role of an intermediate framework. Specifically, the bismuth oxide is 500 parts by weight, and the bismuth oxide can effectively play the role of the intermediate skeleton, and specifically can be 300 parts, 330 parts, 350 parts, 380 parts, 400 parts, 430 parts, 450 parts, 470 parts and 500 parts. Preferably, the weight portion of the bismuth oxide is 330-470 parts. The bismuth oxide provided by the embodiment of the invention is environment-friendly, has no damage to human health, and is beneficial to protecting the healthy development of ecological environment. However, compared with lead oxide, the bismuth oxide has higher softening temperature and environmental protection property, so that the film forming temperature and the use temperature of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays are greatly improved by using a large amount of bismuth oxide.
The inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays is required to be attached to a carrier, and is further prepared into various electronic elements. The slurry obtained by using the bismuth oxide in a large amount had poor adhesion ability to the carrier. In the embodiment of the invention, zinc oxide is added into the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays as a raw material component. The zinc oxide can effectively improve the expansion coefficient of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays, and prevent cracking; meanwhile, the zinc oxide also serves as a fluxing agent to promote rapid fusion of the components, so that a melt with uniform and stable performance is formed. The heat expansion coefficient of the inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays is consistent with that of the carrier through the fluxing action of the zinc oxide, the binding force and the adhesive force between the inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays and the carrier are effectively adjusted, and the binding force of the inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays on the carrier is better. The zinc oxide is 250-350 parts by weight, and specifically can be 250 parts, 280 parts, 300 parts, 320 parts, 340 parts and 350 parts. Preferably, the weight portion of the zinc oxide is 260-340 portions.
In the embodiment of the invention, on one hand, the bismuth oxide, the antimony trioxide and the zinc oxide are used in combination, so that the working temperature of the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays can be increased, the linear expansion coefficient can be reduced, the thermal shock resistance is high, and the thermal stability is improved, so that the application range and the product performance of the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays are expanded. On the other hand, the antimony trioxide is matched with the lithium carbonate, the boric acid and the strontium carbonate to jointly act, so that the adhesive force between the far infrared ceramic powder and the glass particles (including bismuth oxide and other metal oxides) and the carrier is improved, and the adhesive force between the far infrared ceramic powder and the glass particles is promoted; meanwhile, the antimony trioxide can also enhance the bonding performance between the far infrared ceramic powder, the glass particles and the graphite powder, so that the electrical performance of the obtained inorganic nonmetal far infrared graphite resistive film releasing far infrared rays is more stable. The antimony trioxide is in a weight portion of 100-150 parts, specifically 100 parts, 110 parts, 120 parts, 130 parts, 140 parts and 150 parts, preferably 110-130 parts.
In the embodiment of the invention, the boric acid is used as a supplementary ingredient of the bismuth oxide and is jointly used as a middle main material of the inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays. The boric acid can promote the rapid melting and fusion of materials in the manufacturing process, and ensure that the inorganic nonmetal far infrared graphite resistance film releasing far infrared rays cannot generate cracks and crazing phenomena in the using and manufacturing processes, thereby improving the product quality and stability. In addition, the boric acid, the antimony trioxide and the strontium carbonate improve the adhesion of far infrared ceramic powder and glass particles (comprising bismuth oxide and other metal oxides) to a carrier; meanwhile, the bonding performance between the far infrared ceramic powder, the glass particles and the graphite powder is enhanced. The boric acid is 180-250 parts by weight, specifically 180 parts, 200 parts, 220 parts and 250 parts by weight, preferably 190-230 parts by weight.
The strontium carbonate is used as a supplementary raw material, improves the adhesive force of far infrared ceramic powder and glass particles (including bismuth oxide and other metal oxides) and a carrier together with the antimony trioxide and the boric acid, and simultaneously enhances the bonding performance among the far infrared ceramic powder, the glass particles and the graphite powder. In addition, the strontium carbonate can be matched with the magnesium oxide to promote surface hardening of the graphite resistive film and prevent the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays from being scratched and contused in the running and storage processes. The weight portion of the strontium carbonate is 70-120, and concretely can be 70, 80, 90, 100, 110 and 120. Preferably, the weight portion of the strontium carbonate is 85-110 portions.
By using the antimony trioxide, the boric acid and the strontium carbonate in parts by weight, on one hand, the surface bonding force between ceramic and glass micro powder and between ceramic and glass particles and carbon powder is improved, and the bonding force inside the inorganic nonmetal far infrared graphite resistive film releasing far infrared rays and the adhesive force with a carrier are improved; on the other hand, the temperature application range and the material softening temperature point of the inorganic nonmetal far infrared graphite resistance film which releases far infrared rays can be improved. In addition, the components are mutually coordinated, the thermal expansion coefficient of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays can be effectively improved, and the thermal stability of the resistive film is improved.
In the embodiment of the invention, the alumina is used as another skeleton supporting raw material and is used for constructing a bridge formed by overlapping the graphite powder, the far infrared ceramic powder and the glass micro-aggregate (including other metal oxides), so that the components can be fully combined and fused, the compactness and stability of the resistive film are improved, and the electrical properties given by the graphite powder and the far infrared ceramic powder can be fully exerted. The weight portion of the alumina is 50-100, and specifically can be 50, 60, 70, 80, 90 and 100. Preferably, the weight part of the alumina is 55-80 parts.
In the embodiment of the invention, the magnesium oxide is used as an auxiliary functional raw material, can be matched with the strontium carbonate, and can be used for promoting the surface hardening of the graphite resistive film under the combined action to prevent the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays from being scratched and contused in the running and storage processes. In addition, the magnesium oxide is also matched with the boric acid to promote the full melting of various metal oxides and ensure the uniform fusion of various metal oxides. The weight portion of the magnesium oxide is 30-70 portions, and specifically 30 portions, 40 portions, 50 portions, 60 portions and 70 portions. Preferably, the weight part of the magnesium oxide is 35-60 parts.
The quartz sand is a substitute material of bismuth oxide, and forms a skeleton supporting structure of the resistance film together with the bismuth oxide. The content of bismuth oxide can be reduced by replacing quartz sand, so that the film forming temperature and the using temperature of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays are properly reduced. The bismuth oxide content cannot be replaced by excessive addition due to the property limitations of the silica sand. Specifically, the quartz sand is 25 to 70 parts by weight, and specifically may be 25 parts, 30 parts, 40 parts, 50 parts, 60 parts, or 70 parts. Preferably, the weight part of the quartz sand is 30-60 parts.
Due to the fact that the content of the bismuth oxide is high, the cohesiveness among all components of the inorganic nonmetal far infrared graphite resistive film releasing far infrared rays is greatly reduced. According to the embodiment of the invention, the bonding force between the bismuth oxide and other components is greatly increased by adding a small amount of lithium carbonate. Through the mutual matching between the strontium carbonate and the bismuth oxide, the binding force of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays is improved, and the problems of cracks, bursting, cracking, peeling and the like of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays in the sintering process of the preparation process are prevented. Meanwhile, the binding force between three framework materials of bismuth oxide and antimony trioxide zinc oxide is obviously increased by the regulating action of lithium carbonate, and a stable framework structure with enhanced mechanical strength is further formed. The lithium carbonate is 50-120 parts by weight, and specifically can be 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts and 120 parts. Preferably, the weight part of the lithium carbonate is 55-100 parts.
In the embodiment of the invention, the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays is added with basic copper carbonate as a raw material component. On one hand, the basic copper carbonate is used as a fluxing agent to promote the rapid fusion of all components, so that a melt with uniform and stable performance is formed; in another aspect, the basic copper carbonate has catalytic and leveling effects. The weight portion of the basic copper carbonate is 10-25, and specifically 10, 15, 20 and 25. Preferably, the weight portion of the basic copper carbonate is 12-20.
According to the embodiment of the invention, bismuth oxide, zinc oxide and antimony trioxide are used as main film forming substances, so that the film layer of the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays can form a continuous dry film with better strength; further, other metal oxides such as strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and basic copper carbonate are added into the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays. On the one hand, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and basic copper carbonate are taken as film forming substances to participate in film forming; on the other hand, the above substances as functional additives can cooperate with each other to make up for the functional deficiency of the resistive film using bismuth oxide, zinc oxide, and antimony trioxide as main film forming substances. Specifically, the bismuth oxide, the zinc oxide and the antimony trioxide are matched with each other, so that the working temperature of the graphite resistive film and the stability of the electrical performance can be improved; meanwhile, the strontium carbonate, the magnesium oxide, the quartz sand, the lithium carbonate and the basic copper carbonate have a synergistic effect, so that the adhesive force, the surface strength and the wear resistance of the resistive film are further improved, and the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays is prevented from cracking (cracking and peeling) in the sintering process and being scratched in the using or storing process. It should be understood that, in the embodiment of the present invention, each framework material does not individually exert its own function to exert the above-mentioned effect, but assists to improve the comprehensive performance of the inorganic non-metallic far infrared graphite resistive film releasing far infrared rays through the mutual and multi-directional cooperation and cooperation between the framework materials.
As a preferred embodiment, the weight portion of the graphite powder is 180-280; the weight portion of the superfine mica powder is 90-180; 70-110 parts of far infrared ceramic powder; the weight portion of the bismuth oxide is 330-470 portions; the weight fraction of the zinc oxide is 260-340 parts; the antimony trioxide is in a weight portion of 110-130; the boric acid accounts for 200-240 parts by weight; the weight portion of the alumina is 55-80; the weight portion of the strontium carbonate is 85-110 portions; 35-60 parts of magnesium oxide; the weight portion of the quartz sand is 30-60; the lithium carbonate accounts for 55-100 parts by weight.
In an embodiment of the invention, the raw material of the inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays further comprises a liquid medium, and the liquid medium enables the base raw material to form slurry and further deposit to form a film. Preferably, the liquid medium is an organic medium, and the weight ratio of the matrix raw material to the organic medium is (1365): (2320) -. If the amount of the organic medium used is too high or too low, screen printing may not be able to form a film, and the thickness of the printed resistive film may not be controllable. Further preferably, the organic medium is an organic medium with a lower boiling point, and specifically, the boiling point of the organic medium is 180-250 ℃, so as to ensure that the organic medium can be completely evaporated in the subsequent drying treatment process.
Particularly preferably, the organic medium comprises the following components in parts by weight:
1972 part and 4204 parts of terpineol;
445 parts of ethyl cellulose 209-;
139 portions and 298 portions of silane coupling agent.
The far infrared composite resin heating substrate contains an inorganic nonmetal far infrared resistance layer which releases far infrared rays, is made of carbon rich in far infrared rays and inorganic materials, has stable performance, generates far infrared rays with uniform heating temperature, is rich in the far infrared rays with the diameter of 8-14 microns (also called as 'health rays' and 'life rays' in medical science), and is beneficial to human health.
As a best embodiment, the far infrared composite resin heating substrate comprises a first composite resin substrate 1, a metal conductive foil chip layer 2, an inorganic nonmetal far infrared resistance layer 3 for releasing far infrared rays and a second composite resin substrate 4 which are arranged in sequence, wherein,
the metal conductive foil chip layer 2 comprises a reflective aluminum foil 21, a PI or PET insulating layer 221, a geometric resistance chip 222 and a PI or PET insulating layer 223 which are sequentially arranged on the first composite resin substrate 1, the geometric resistance chip 222 and PI films (polyimide) or PET (polyester) insulating layers on the upper surface and the lower surface of the geometric resistance chip are hot-pressed to form a packaging resistance chip layer 22, and in the region where the geometric resistance chip 222 is not arranged on the packaging resistance chip layer 22, every 10cm of the region is2At least 2 through holes 220 with the diameter of 6-8mm are arranged;
the inorganic nonmetal far infrared resistance layer 3 for releasing far infrared rays comprises a mica substrate and an inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays, wherein the inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays is deposited on the substrate and is made of a base material and a liquid medium, and the base material is composed of the following raw materials in parts by weight:
wherein, the far infrared ceramic powder contains nano titanium oxide.
Furthermore, the far infrared composite resin heating substrate further comprises a power line and a waterproof and moistureproof high-temperature-resistant plastic shield, wherein the power line is arranged on the surface of the far infrared composite resin heating substrate.
The far infrared composite resin heating substrate provided by the embodiment of the invention has the following advantages:
1. the geometric resistance chip of the far infrared composite resin heating substrate is subjected to two times of reinforced insulation treatment, and has stable resistance, good electrical stability and good durability.
2. The far infrared composite resin heating substrate is provided with two layers of composite resin substrates, can prevent the metal conductive foil chip layer and the inorganic nonmetal far infrared resistance layer which releases far infrared rays from being influenced in adverse environment, has high mechanical strength, can not deform, and is environment-friendly and free from peculiar smell. In addition, the far infrared composite resin heating substrate has strong moisture-proof and moisture-proof performance and has good antimicrobial effect and the capability of resisting acid, alkali, organic solvent and seawater corrosion. The far infrared composite resin heating substrate provided by the invention has very low water permeability, water absorbability and moisture absorbability, and the waterproof grade is as follows: IPX8 (continuous diving test), even water impermeable, can be buried directly in water for long periods of time.
3. The far infrared composite resin heating substrate contains an inorganic nonmetal far infrared resistance layer which releases far infrared rays, has uniform heating temperature and is rich in 8-14 microns of far infrared rays, and is beneficial to human health.
4. The far infrared composite resin heating substrate is a planar heating body, the power density per unit area is low, the surface temperature is uniform, and the temperature difference between high and low is only 2 ℃.
5. The upper part and the lower part of the geometric resistance chip of the far infrared composite resin heating substrate are encapsulated by PI (polyimide) films or PET (polyester) insulating films, then the geometric resistance chip is wrapped between two layers of composite resin substrates to be finished products, and the finished products are subjected to high-temperature hot-pressing treatment to form a whole, so that the obtained product has stable resistance and good durability. And the resistance materials are made of metal and inorganic materials, oxidation and aging phenomena do not exist, and the service life of the product is longer than or equal to 50000 hours through detection of the national infrared center.
6. The far infrared composite resin heating substrate has beautiful appearance, rich colors, perfect individuality and various appearances; the product can be made into the special-shaped appearance such as flat plate shape, circular arc shape and the like without secondary decoration. It has good decorative effect and smooth surface, can be made into various bright colors, also can be made into different patterns, and is suitable for making various decorative plates, large-scale relief and artistic sculptures, etc.
7. The far infrared composite resin heating substrate provided by the invention has the advantages of low cost, good fatigue resistance, strong ultraviolet resistance, corrosion resistance, low density, unique material designability and the like, and the product has wide application.
The far infrared composite resin heating substrate provided by the embodiment of the invention can be prepared by the following method.
And, a preparation method of the far infrared composite resin heating substrate, comprising the following steps:
s01, attaching a metal conductive foil to an insulating carrier film, carrying out patterning treatment to form a geometric resistance chip, and carrying out packaging treatment on the geometric resistance chip by using the insulating carrier film to obtain a semi-finished product of a metal conductive foil chip layer;
specifically, in step S01, the method for forming the geometric resistor chip by patterning the metal conductive foil is preferably a photolithography or etching method. Specifically, the surface of the metal conductive foil attached to the insulating carrier film is oiled, and the geometric shape is prepared through the steps of baking, exposure and development in sequence, and further, the developed product can be subjected to inspection, repair and etching treatment.
And then, carrying out packaging treatment on the geometric resistance chip by using an insulating carrier film, wherein the packaging treatment can be formed by adopting a hot-pressing process.
S02, attaching a resistive film substrate deposited with an inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays to one surface of the semi-finished metal conductive foil chip layer, and attaching a reflective aluminum foil to the other surface of the semi-finished metal conductive foil chip layer;
in the step S02, the resistive film substrate with the inorganic non-metallic far-infrared graphite resistive film for releasing far-infrared rays deposited thereon is attached to one surface of the semi-finished metal conductive foil chip layer, and the method preferably includes:
s21, weighing the components according to the formula of the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays;
s22, heating and melting bismuth oxide, zinc oxide, antimony trioxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate and basic copper carbonate, cooling, grinding, sieving, adding graphite powder, superfine mica powder and far infrared ceramic powder, and mixing to obtain a base material mixture;
s23, in the base material mixture, according to the weight ratio of the base material mixture to the organic medium of (1365-: (2320) -4946) adding an organic medium, and mixing to obtain mixed slurry;
and S24, providing a substrate, printing the mixed slurry on the substrate, and drying and sintering to obtain the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays.
Specifically, in the step S21, the formulation of the inorganic non-metallic far-infrared graphite resistive film for releasing far-infrared rays and the preferred conditions thereof are not described herein again for the sake of brevity.
In step S22, bismuth oxide, zinc oxide, antimony trioxide, boric acid, aluminum oxide, strontium carbonate, magnesium oxide, quartz sand, lithium carbonate, and basic copper carbonate are heated and melted to form a first eutectic body. Preferably, the temperature for heating and melting is 800-1250 ℃, so as to ensure that the raw material components are fully and rapidly fused together. If the heating and melting temperature is too low, each metal oxide cannot be sufficiently and efficiently melted; if the temperature is too high, the softening point of the base material mixture will be increased, which may affect the film forming effect and film forming sintering temperature of the resistive film.
And grinding and sieving the cooled first eutectic to form particles with relatively uniform particle size, thereby being beneficial to obtaining stable electrical performance. Then adding graphite powder, superfine mica powder and far infrared ceramic powder and mixing to obtain a base material mixture. In order to fully and uniformly mix the graphite powder, the superfine mica powder and the far infrared ceramic powder to obtain a mixed system with uniform particle size and further form a uniform, compact and temperature-performance film after subsequent film formation, preferably, the cooled and ground melt is screened by a screen with the mesh number of more than or equal to 500. By controlling the particle size of the melt, the resistance dispersion of the inorganic nonmetal far infrared graphite resistive film which releases far infrared rays is improved, and the repeatability of the sheet resistance is improved.
In the step S23, an organic medium is added to the substrate mixture to form a mixed slurry suitable for film formation, wherein the weight ratio of the substrate mixture to the organic medium is (1365-: (2320) -4946) and mixing to obtain a mixed slurry.
In the step S24, a substrate is provided, which includes a mica substrate, a tempered glass substrate, a high borosilicate glass substrate, a quartz glass substrate, a non-glass substrate, an alumina ceramic substrate, and an enamel substrate, but is not limited thereto. And printing the mixed slurry on the substrate, and sequentially drying and sintering to obtain the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays. The printing is preferably screen printing, wherein the mesh of the screen is 40-300 meshes, and more preferably 100-300 meshes.
Preferably, the drying mode is drying, the drying temperature is 120-280 ℃, and the drying time is preferably 10-20min, so as to sufficiently remove the organic medium in the film layer and form a compact film. The drying temperature is not suitable to be too high or too low, and if the drying temperature is too high, the obtained film layer can be cracked, layered, foamed and burst due to uneven heating caused by large internal and external temperature difference; if the temperature is too low, the organic medium is difficult to be effectively removed, and further, in the subsequent sintering process, pores are formed by volatilization to influence the quality of the film layer. Preferably, the sintering temperature is 480-680 ℃, so that a uniform film layer with stable electrical performance is formed.
According to the preparation method of the inorganic nonmetal far infrared graphite resistive film capable of releasing far infrared rays, provided by the embodiment of the invention, graphite powder, superfine mica powder and far infrared ceramic powder are added after all oxides are subjected to melting treatment, and then an organic medium is added to prepare slurry for forming a film, so that the method is simple, and the obtained product has excellent performance. In addition, the embodiment of the invention breaks through the traditional process of respectively forming films by functional powder ultrafine mica powder and far infrared ceramic powder to form a surface far infrared radiation coating, and the ultrafine mica powder and the far infrared ceramic powder are added simultaneously to form a film at one time, so that the production period is shortened, the production cost is reduced on the premise of ensuring the stable performance, particularly the far infrared radiation intensity, and the invention is more suitable for the field of civil resistance films.
Furthermore, a reflective aluminum foil is attached to the other surface of the semi-finished metal conductive foil chip layer.
And S03, respectively hot-pressing a first composite resin substrate and a second composite resin substrate on the surfaces of the reflective aluminum foil and the resistive film substrate to obtain the far infrared composite resin heating substrate.
The preparation method of the far infrared composite resin heating substrate provided by the embodiment of the invention is simple and easy to control, and can realize large-scale production.
The embodiment of the invention also provides an application of the far infrared composite resin heating substrate, wherein the far infrared composite resin heating substrate is the far infrared composite resin heating substrate, and the application fields comprise the fields of integrated wall roofs, shower rooms, light wave rooms, sweat steaming rooms, roof snow melting, pet products, fish pond heating plates, livestock breeding industry, fruit tree cultivation, heating bed plates, medical appliances, health care products, building heating and household appliances.
The application of the far infrared composite resin heating substrate provided by the embodiment of the invention can radiate 8-14 microns of far infrared rays, has uniform heating and good thermal stability, and can be suitable for damp-proof and damp-proof occasions.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A far infrared composite resin heating base plate is characterized by comprising a first composite resin substrate, a metal conductive foil chip layer, an inorganic nonmetal far infrared resistance layer for releasing far infrared rays and a second composite resin substrate which are sequentially arranged, wherein,
the metal conductive foil chip layer comprises a reflective aluminum foil, a first insulating layer, a geometric resistance chip and a second insulating layer which are sequentially arranged on the first composite resin substrate, and the geometric resistance chip and the first insulating layer and the second insulating layer on the upper surface and the lower surface of the geometric resistance chip are hot-pressed to form a packaged resistance chip layer;
the inorganic nonmetal far infrared resistance layer for releasing far infrared rays comprises a substrate and an inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays, wherein the inorganic nonmetal far infrared resistance layer for releasing far infrared rays is deposited on the substrate; the inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays is prepared from a base material and a liquid medium, wherein the base material is prepared from the following raw materials in parts by weight:
wherein, the far infrared ceramic powder contains nano titanium oxide.
2. The far infrared composite resin heat generating substrate as set forth in claim 1, wherein a region where no geometric shape resistance chip is provided in said encapsulating resistance chip layer is every 10cm2At least 2 through holes with the diameter of 6-8mm are arranged.
3. The far infrared composite resin heating substrate as set forth in claim 1, wherein the first and second insulating layers are PI insulating layers or PET insulating layers.
4. A far infrared composite resin heat generating substrate as set forth in claim 1, wherein said metal conductive foil chip layer is further provided with a lead terminal and a lead terminal.
5. A far infrared composite resin heat generating substrate as set forth in claim 1, wherein said substrate is a mica substrate.
6. The far infrared composite resin heat generating substrate as set forth in claim 1, comprising a first composite resin substrate, a metal conductive foil core layer, an inorganic non-metal far infrared resistance layer for releasing far infrared rays, and a second composite resin substrate, which are disposed in this order,
the metal conductive foil chip layer comprises a reflective aluminum foil, a PI film or a PET insulating layer, a geometric resistance chip and a PI or PET insulating layer which are sequentially arranged on the first composite resin substrate, the geometric resistance chip and the PI or PET insulating layers on the upper surface and the lower surface of the geometric resistance chip are hot-pressed to form a packaged resistance chip layer, and the packaged resistance chip layer is not provided with the regions of the geometric resistance chip every 10cm2At least 2 through holes with the diameter of 6-8mm are arranged;
the inorganic nonmetal far infrared resistance layer for releasing far infrared rays comprises a mica substrate and an inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays, wherein the inorganic nonmetal far infrared graphite resistance film for releasing far infrared rays is deposited on the substrate and is made of a base material and a liquid medium, and the base material is composed of the following raw materials in parts by weight:
wherein, the far infrared ceramic powder contains nano titanium oxide.
7. A preparation method of a far infrared composite resin heating substrate comprises the following steps:
attaching a metal conductive foil to an insulating carrier film, carrying out patterning treatment to form a geometric resistance chip, and carrying out packaging treatment on the geometric resistance chip by using the insulating carrier film to obtain a semi-finished product of a metal conductive foil chip layer;
attaching a resistive film substrate deposited with an inorganic nonmetal far infrared graphite resistive film for releasing far infrared rays to one surface of the semi-finished metal conductive foil chip layer, and attaching a reflective aluminum foil to the other surface of the semi-finished metal conductive foil chip layer;
and respectively carrying out hot pressing on the surfaces of the reflective aluminum foil and the resistive film substrate to obtain a first composite resin substrate and a second composite resin substrate so as to obtain the far infrared composite resin heating substrate.
8. The application of the far infrared composite resin heating substrate is characterized in that the far infrared composite resin heating substrate is the far infrared composite resin heating substrate as claimed in any one of claims 1 to 5, and the application fields comprise the fields of integrated wall roofs, shower rooms, light wave rooms, sweat steaming rooms, roof snow melting, pet products, fish pond heating plates, livestock breeding industry, fruit tree cultivation, heating bed plates, medical instruments, health care products, building heating and household appliances.
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| CN107708234B (en) * | 2017-10-25 | 2020-07-03 | 厦门宝益科技有限公司 | Flexible electric heating plate and preparation method thereof |
| WO2019180010A1 (en) | 2018-03-19 | 2019-09-26 | Plastic Omnium Advanced Innovation And Research | Vehicle system for injecting an aqueous solution in the combustion chamber of the internal combustion engine and method for injecting an aqueous solution in the combustion chamber of the internal combustion |
| CN109526074A (en) * | 2019-01-09 | 2019-03-26 | 河南问暖电子科技有限公司 | Electric-heating thin film component and preparation method thereof |
| CN113357696A (en) * | 2021-05-26 | 2021-09-07 | 佛山巧鸾科技有限公司 | Intermediate infrared heating wall cloth and heating method |
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