CN114133888B - Heat-conducting composite material and plate - Google Patents

Heat-conducting composite material and plate Download PDF

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Publication number
CN114133888B
CN114133888B CN202111520878.4A CN202111520878A CN114133888B CN 114133888 B CN114133888 B CN 114133888B CN 202111520878 A CN202111520878 A CN 202111520878A CN 114133888 B CN114133888 B CN 114133888B
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heat
layer
conducting
thermally conductive
composite material
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CN114133888A (en
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林孝发
林孝山
李伟宇
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Jomoo Kitchen and Bath Co Ltd
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Jomoo Kitchen and Bath Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/26Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C09J161/28Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14Thermal energy storage

Abstract

The application discloses heat conduction composite material and panel, heat conduction composite material includes by weight: 100 parts of adhesive, 10-3000 parts of heat-conducting filler and 2-50 parts of heat storage material; the heat-conducting filler comprises short wood fibers, heat-conducting inorganic materials and lignocellulose nanowhiskers. The heat-conducting composite material provided by the application well solves the problem of cigarette burning resistance, and does not cause other side effects such as high water absorption rate, crack resistance, failure and the like. The plate comprises the heat-conducting composite material, the surface of the plate can comprise a decorative layer, and the decorative layer does not influence the heat-conducting, heat-storing and heat-dissipating functions of the heat-conducting composite material. In addition, the surface flatness of the heat conduction, heat dissipation and heat storage layer is higher than that of a single plate through mixed pressing, so that the surface of the decorative layer is more uniform, the uniformity of heat dissipation in the heating process is improved, and the cigarette burning resistance is met.

Description

Heat-conducting composite material and plate
Technical Field
The present disclosure relates to, but is not limited to, decorative materials, and more particularly, but not exclusively, to thermally conductive composites and their preparation and use.
Background
At present, the melamine decorative panel is widely applied and used in cabinets, wardrobes, office furniture and the like, the melamine decorative panel is mainly prepared by sticking melamine impregnated paper on the surface of an artificial board substrate through hot pressing, decorative boards with different effects can be obtained by changing the color, the pattern and the like of the melamine paper, and the decorative effect is extremely good. In order to meet different decorative effect requirements of customers, the highlight melamine veneer is produced at the same time. However, in the using process, the highlight melamine veneer material has poor high-temperature resistance effect and poor cigarette burning resistance, and the phenomena of serious cracks, yellowing, stains, foaming, bulging and the like can occur after the contact of cigarettes or objects with the high temperature of 300-600 ℃, so that the furniture decorative paper loses high gloss and high definition characteristics, and the service life of furniture is greatly shortened. Limited range of materials used.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the present application.
Aiming at the problem that a high-gloss melamine decorative plate is poor in cigarette burning resistance, the application provides a novel composite plate, the high-temperature-resistant high-gloss melamine decorative plate is prepared by improving a melamine adhesive layer and adding a heat-conducting, heat-dissipating and heat-storing layer, and the problem that the cigarette burning resistance is unqualified is solved; and the application range of the material is expanded.
The application provides a heat-conducting composite material, the heat-conducting composite material includes by weight: 100 parts of adhesive, 10-3000 parts of heat-conducting filler and 2-50 parts of heat storage material, wherein the heat-conducting filler comprises short wood fiber, heat-conducting inorganic material and lignocellulose nanowhiskers;
in one embodiment provided herein, the thermally conductive composite comprises, in parts by weight: 3 to 100 parts of adhesive, 10 to 3000 parts of heat-conducting filler and 2 to 50 parts of heat storage material.
In one embodiment provided herein, the adhesive is selected from any one or two of melamine resin and melamine modified urea formaldehyde resin.
In one embodiment provided herein, the weight ratio of the short wood fibers, the thermally conductive inorganic material, and the lignocellulose nanowhiskers is (10 to 100): (5 to 50).
In one embodiment provided herein, the surfaces of the short wood fibers, the thermally conductive inorganic material, and the lignocellulose nanowhiskers are modified;
in one embodiment provided herein, the modifying agent is selected from any one or more of an aminosilane coupling agent, a vinylsilane coupling agent, and propyltrimethoxysilane; preferably, the modifier is used in the form of a modifier solution having a concentration of 0.5wt.% to 3wt.%;
in one embodiment provided herein, the thermally conductive inorganic material surface modification comprises the steps of: wetting the surface of the heat-conducting inorganic material by a modifier, and then drying at 60-90 ℃, wherein the drying time is 10-30 min;
in one embodiment provided herein, the surface modification of the short wood fibers and the lignocellulose nanowhiskers comprises the steps of: firstly, mixing the short wood fibers and the lignocellulose nanowhiskers, wetting the surface of the mixture with a modifier after mixing, drying the mixture at the temperature of between 40 and 60 ℃ while stirring, and stirring and drying for 20 to 60min;
in one embodiment provided herein, the short wood fibers have an average aspect ratio of 5 to 12; the short wood fibers have an average length of 0.3mm to 1.2mm.
In one embodiment provided herein, the thermally conductive inorganic material is selected from any one or more of alumina, magnesia, zinc oxide, aluminum nitride, boron nitride, and silicon carbide;
in one embodiment provided herein, the thermally conductive inorganic material has an average particle size of 1 μm to 3 μm.
In one embodiment provided herein, the heat storage material is a core-shell structure, and the shell material is selected from any one or more of melamine, silica, polyurea, polyurethane and polymethyl methacrylate;
in one embodiment provided herein, the internal material of the heat storage material is selected from one or more of paraffin, polyol, fatty acid, cross-linked polyolefin, cross-linked polyacetal, and inorganic salt;
in one embodiment provided herein, the phase transition temperature of the interior material is 50 ℃ to 150 ℃.
In yet another aspect, the present application provides a panel comprising a functional layer comprising the thermally conductive composite described above.
In one embodiment provided herein, the functional layer includes a lower adhesive layer and a heat conducting, dissipating and storing layer; the lower adhesive layer is closer to the outer surface of the plate than the heat conduction, heat dissipation and heat storage layer;
in one embodiment provided herein, the lower adhesive layer is composed of the thermally conductive composite;
in one embodiment provided herein, the heat conducting, dissipating and storing layer is composed of a wood fiber material and the heat conducting composite material;
in one embodiment provided herein, the weight ratio of the wood fiber material to the thermally conductive composite material is 100 (5 to 45).
In one embodiment provided in the present application, the thickness ratio of the lower adhesive layer to the heat conducting, dissipating and storing layer is (0.03 to 0.25): (0.5 to 2.5);
in one embodiment provided herein, the weight ratio of the adhesive, the heat conductive filler and the heat storage material in the lower adhesive layer is 100 (10 to 50): 2 to 20;
in one embodiment provided herein, the weight ratio of the adhesive, the heat conductive filler, and the heat storage material in the heat conductive, heat dissipating and thermal storage layer is 100 (500 to 1250): (20 to 40).
In one embodiment provided by the application, the panel further comprises a finishing layer, wherein the finishing layer comprises an upper adhesive layer and a decorative material layer, and the upper adhesive layer is made of a transparent material;
in one embodiment provided herein, the material of the upper adhesive layer is melamine;
in one embodiment provided herein, the material of the decorative material layer is plain base paper or printing decorative paper;
in one embodiment provided herein, the thickness ratio of the upper adhesive layer and the decorative material layer is (3 to 25): (5 to 25), preferably, the thickness ratio of the upper adhesive layer and the decorative material layer is (30 μm to 250 μm): (50 μm to 250 μm);
in one embodiment provided herein, the layer of decorative material has a grammage of 30g/m 2 To 150g/m 2
In one embodiment provided herein, the ratio of the thickness of the facing layer to the functional layer is (8 to 50): (53 to 2750); preferably, the ratio of the thickness of the finishing layer to the functional layer is (80 μm to 500 μm): (530 μm to 2750 μm).
In an embodiment that this application provided, panel is glue film, decorative material layer, lower glue film and heat conduction heat dissipation heat storage layer in proper order from outer to interior.
The heat-conducting composite material provided by the application well solves the problem of cigarette burning resistance, and does not cause other side effects such as high water absorption rate, crack resistance, failure and the like. And the decorative layer does not influence the heat conduction, heat storage and heat dissipation functions of the heat-conducting composite material. In addition, the surface flatness of the heat conduction, heat dissipation and heat storage layer is higher than that of a single plate through mixed pressing, so that the surface of the decorative layer is more uniform, the uniformity of heat dissipation in the heating process is improved, and the cigarette burning resistance is met.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. Other advantages of the present application may be realized and attained by the invention in its aspects as described in the specification.
Drawings
The accompanying drawings are included to provide an understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the examples serve to explain the principles of the disclosure and not to limit the disclosure.
Fig. 1 is a structural view of a melamine decorative laminated sheet prepared in example 1 of the present application, and the reference numerals: 1. a finishing coat is arranged; 2. a first functional layer; 3. a plurality of laminated plywood layers; 4. a second functional layer; 5. a lower facing layer; 11. coating a glue layer; 12. a layer of decorative material; 13. a glue layer is arranged; 14. a heat conduction, heat dissipation and heat storage layer.
Fig. 2A, 2B and 2C are schematic views illustrating that a general melamine decorative board is not resistant to cigarette burn.
Fig. 3A and 3B are schematic views illustrating the cigarette ignition resistance of the sheet material prepared in example 1 of the present application, wherein fig. 3A is a schematic view illustrating the cigarette without any treatment after ignition, and fig. 3B is a schematic view illustrating the cigarette after ignition and wiping, and it can be seen from the figures that the sheet material does not generate bubbles or cracks, and the sheet material provided in the present application, like stone, only generates yellow spots after ignition.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application are described in detail below. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
Example 1
This embodiment provides a melamine decorative board, and the melamine decorative board basic structure does:
the main structure of the melamine veneer with high gloss and resistance to cigarette ignition prepared by the embodiment is divided into five layers as shown in fig. 1: from top to bottom in proper order: 1. an upper facing layer; 2. a first functional layer; 3. a plurality of laminated plywood layers; 4. a second functional layer; 5. a lower facing layer;
the upper finishing layer and the lower finishing layer may be the same, and include an upper glue layer 11 and a decorative material layer 12, the decorative material layer 12 may be plain base paper or printing decorative paper, and the grammage of the decorative material layer 12 is 100g/m in this embodiment 2 A thickness of about 90 μm to 110 μm; the upper adhesive layer 11 can be a common melamine resin layer, the used melamine resin is obtained from new force industry Co., ltd in New countryside, MF50 melamine dipping adhesive, and the gram weight per square meter is 40g/m 2 A thickness of about 30 μm to 35 μm;
the first functional layer 2 and the second functional layer 4 can be the same, and comprise a lower adhesive layer 13 and a heat conduction, heat dissipation and storage layer 14;
the lower adhesive layer 13 is composed of melamine resin, heat-conducting filler and heat storage capsules, and the weight ratio of the melamine resin to the heat-conducting filler to the heat storage capsules is 100; the thickness of the lower adhesive layer is 90 micrometers; the preparation method of the lower adhesive layer 13 is that the heat-conducting filler and the heat storage capsule are mechanically stirred and mixed, and then the mixture is stirred and mixed with the melamine resin for standby.
The heat-conducting filler in the lower adhesive layer 13 comprises modified short wood fibers, modified heat-conducting inorganic materials and modified wood fiber nano whiskers.
The method for modifying the short wood fiber and the lignocellulose nano whisker comprises the following steps:
weighing short wood fibers and lignin nanowhiskers according to a proportion, mixing, wetting the surface of the mixture with a modifier after mixing, and then drying at 45 ℃ while stirring, wherein the stirring and drying time is 60min; the modifier is vinyl silane coupling agent, and is purchased from Tianchang city green chemical auxiliary agent factory company, A-172; the concentration of modifier was 0.5% wt. -%;
the lignocellulose nanowhiskers are purchased from Zhejiang gold Hao green nano material GmbH, and the trade mark is CNC;
the short wood fibers have an average length of 0.3mm to 1.2mm and an average aspect ratio of 5 to 12.
The heat-conducting inorganic material modification method comprises the following steps: wetting the surface of the heat-conducting inorganic material by a modifier, and then drying at 65 ℃, wherein the drying time is 30min; the modifier is vinyl silane coupling agent, and is purchased from Tianchang city green chemical auxiliary agent factory company, A-172; the concentration of the modifier is 0.6wt.%, and the thermally conductive inorganic material is silicon carbide having an average particle size of 1 to 3 μm.
And (2) putting the modified short wood fiber, the modified heat-conducting inorganic material and the modified wood fiber nanowhisker prepared in the three steps into a high-speed stirrer for high-speed stirring at the stirring speed of 10000rpm for 3 to 5 minutes according to the weight ratio of 100.
The heat storage material is a paraffin heat storage capsule with a core-shell structure, the shell material is polyurea, the internal material is paraffin, and the phase change temperature of the internal material is 70 ℃; is purchased from the science and technology limited company of the phase change new material with the synthetic fertilizer core energy, and has the code number of PCM-70.
And respectively rolling, brushing or spraying an upper adhesive layer and a lower adhesive layer on the upper surface and the lower surface of the facing paper to perform hot press molding, so that the lower adhesive layer, the facing paper and the upper adhesive layer are prepared and molded at one time.
2. Heat conduction, heat dissipation and heat storage layer
The heat conduction, heat dissipation and heat storage layer 14 comprises wood fibers, heat conduction fillers, adhesives and heat storage capsules; the length of the wood fiber is 2mm to 6mm. The thickness of the first heat-conducting, heat-dissipating and heat-storing layer 14 is 1mm.
The heat conducting filler of the first heat conducting, radiating and storing layer 14 is the same as the heat conducting filler in the lower adhesive layer 13; the adhesive of the first heat-conducting, heat-dissipating and heat-storing layer 14 is melamine resin, and the melamine resin in the lower adhesive layer 13 has the same value; the heat storage capsules used in the first heat conduction, dissipation and storage layer 14 are the same as those used in the lower adhesive layer.
The melamine resin, the wood fiber, the heat-conducting filler and the heat storage capsule are put into a high-speed stirrer for high-speed stirring according to the weight ratio of 5 to 2, wherein the stirring speed is 10000rpm, and the time is 5 to 10 minutes, so that the heat-conducting filler is uniformly attached to the surface of the wood fiber, and the heat-conducting filler, the wood fiber, the heat-conducting filler and the heat storage capsule are combined together through an adhesive, and a better heat-conducting and heat-dissipating effect is achieved through a hot-pressing process;
3. multi-layer laminated board
The multilayer laminated board layer 3 is an odd number of layers of wood boards, the number of the layers is determined by the thickness of a final product, and the number of the layers can be 3, 5 or 7;
the multilayer laminated board layer 3 is an artificial board which is made by using multilayer plywood arranged in a criss-cross manner as a base material through several processes of cold pressing, hot pressing, sanding, curing and the like, and has the characteristics of difficult deformation and strong compressive resistance. The main tree species include Cinnamomum camphora, willow bark, poplar, eucalyptus, etc.
The adhesion between each layer can be carried out by the melamine resin contained in each layer, and the layer materials are only partially cured and not completely cured although being subjected to hot pressing during the preparation of each layer material, so that the function of bonding each layer can also be achieved.
Comparative example 1
The comparative example used a 16mm specification melamine faced multi-layer panel from hey china mo-color decorative materials ltd.
The structure of the composite board is that an upper outer adhesive layer, upper decorative paper, an upper inner adhesive layer, a composite board plain board, a lower inner adhesive layer, lower decorative paper and a lower outer adhesive layer are arranged from top to bottom; the decorative paper is dipped with melamine glue by a dipping process and then is molded with a multilayer plain board to form a final product; wherein, the upper and the lower glue layers are: and (3) finishing paper coating: the thickness ratio of the upper inner glue layer to the lower inner glue layer is 50 mu m to 70 mu m to 50 mu m.
Since the product is composed of organic substances, on one hand, the thermal conductivity is poor, and on the other hand, the high organic substance content causes more micromolecular decomposition products generated at high temperature, so that the phenomena of swelling and cracking are easily caused as shown in fig. 2C.
Comparative example 2
In this comparative example, hollow glass microspheres were purchased from New Material Corp, st.Latt hollow Microbeads, zheng, HS70, with particle size parameters of D50 of 10 μm and D90 of 15 μm.
According to the comparative example, hollow glass beads are adopted in the lower adhesive layer of the facing paper as heat insulation functional components to play a role in heat insulation and heat resistance, wherein the upper adhesive layer is hollow glass beads without heat insulation for ensuring the transparency and stability of the appearance, the thickness ratio of the upper adhesive layer, the facing paper and the lower adhesive layer is 50 micrometers to 100 micrometers to 200 micrometers, and the weight ratio of the hollow glass beads to the melamine glue in the lower adhesive layer is 20. The following drawbacks and limitations exist: the hollow glass beads can play a role in heat insulation and heat resistance, but also cause heat to be accumulated on the upper glue layer and the decorative paper layer; meanwhile, the hollow glass beads can reduce the toughness of the glue line, so that the phenomena of slight swelling and collapse appear, as shown in fig. 2A and 2B.
Although the embodiments disclosed in the present application are described above, the descriptions are only for the purpose of facilitating understanding of the present application, and are not intended to limit the present application. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.

Claims (19)

1. A thermally conductive composite, wherein the thermally conductive composite comprises, in parts by weight: 100 parts of adhesive, 10-3000 parts of heat-conducting filler and 2-50 parts of heat storage material;
the heat-conducting filler comprises short wood fibers, heat-conducting inorganic materials and lignocellulose nanowhiskers;
the adhesive is selected from any one or two of melamine resin and melamine modified urea resin;
the weight ratio of the short wood fibers, the heat-conducting inorganic material and the lignocellulose nano-whiskers is (10-100): (5-50);
the surfaces of the short wood fibers, the heat-conducting inorganic material and the lignocellulose nanowhiskers are modified;
the modifier is selected from any one or more of amino silane coupling agent, vinyl silane coupling agent and propyl trimethoxy silane;
the heat storage material is of a core-shell structure, and the shell material is selected from any one or more of melamine, silicon dioxide, polyurea, polyurethane and polymethyl methacrylate;
the inner material of the heat storage material is selected from any one or more of paraffin, polyhydric alcohol, fatty acid, cross-linked polyolefin, cross-linked polyacetal and inorganic salt; the phase transition temperature of the internal material is 50 ℃ to 150 ℃.
2. The composite material of claim 1, wherein the thermally conductive inorganic material surface modification comprises the steps of: wetting the surface of the heat-conducting inorganic material by a modifier, and then drying at 60-90 ℃, wherein the drying time is 10-30 min.
3. The composite material according to claim 1, wherein the surface modification of the short wood fibers and the lignocellulosic nanowhiskers comprises the steps of: firstly, mixing the short wood fibers and the lignocellulose nanowhiskers, wetting the surface of the mixture with a modifier after mixing, then drying and stirring at the temperature of 40-60 ℃, wherein the stirring and drying time is 20-60 min.
4. The composite material according to claim 1, wherein the short wood fibers have an average aspect ratio of 5 to 12; the short wood fibers have an average length of 0.3mm to 1.2mm.
5. The thermally conductive composite of claim 1, wherein the thermally conductive inorganic material is selected from any one or more of alumina, magnesia, zinc oxide, aluminum nitride, boron nitride, and silicon carbide.
6. The thermally conductive composite of claim 1, wherein the average particle size of the thermally conductive inorganic material is 1 to 3 μ ι η.
7. A panel comprising a functional layer comprising the thermally conductive composite of any one of claims 1 to 6.
8. The sheet material according to claim 7, wherein the functional layer comprises an under glue layer and a heat conduction and dissipation layer; the lower adhesive layer is closer to the outer surface of the plate than the heat conduction, heat dissipation and heat storage layer;
the lower adhesive layer is made of the heat-conducting composite material;
the heat conduction, heat dissipation and heat storage layer is composed of a wood fiber material and the heat conduction composite material.
9. A panel according to claim 8, wherein the weight ratio of the wood fibre material to the thermally conductive composite material is 100 (5 to 45).
10. A panel according to claim 8, wherein the ratio of the thickness of the lower adhesive layer to the thickness of the heat conducting, dissipating and storing layer is (0.03 to 0.25): (0.5 to 2.5).
11. The plate according to claim 8, wherein the weight ratio of the adhesive, the heat conductive filler and the heat storage material in the lower adhesive layer is 100 (10-50): 2-20.
12. A plate according to claim 8, wherein the weight ratio of the adhesive, the heat-conducting filler and the heat storage material in the heat-conducting, heat-dissipating and heat-storing layer is 100 (500-1250) to (20-40).
13. The panel as claimed in claim 7 or 8, wherein the panel further comprises a finishing layer, the finishing layer comprises a glue coating layer and a decorative material layer, and the glue coating layer is a transparent material.
14. A panel according to claim 13, wherein the material of the size layer is melamine.
15. The panel according to claim 14, wherein the material of the decorative material layer is plain base paper or printed decorative paper.
16. A panel according to claim 14, wherein the thickness ratio of the supersize layer to the decorative material layer is (3 to 25) to (5 to 25).
17. A panel according to claim 14, wherein the layer of decorative material has a grammage of 30g/m 2 To 150g/m 2
18. A panel according to claim 14, wherein the ratio of the thickness of the facing layer to the functional layer is (8 to 50): (53 to 2750).
19. The plate according to claim 14, wherein the plate comprises an upper adhesive layer, a decorative material layer, a lower adhesive layer and a heat conducting, dissipating and storing layer from outside to inside.
CN202111520878.4A 2021-12-13 2021-12-13 Heat-conducting composite material and plate Active CN114133888B (en)

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