CN114133888A - Heat-conducting composite material and plate - Google Patents
Heat-conducting composite material and plate Download PDFInfo
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- CN114133888A CN114133888A CN202111520878.4A CN202111520878A CN114133888A CN 114133888 A CN114133888 A CN 114133888A CN 202111520878 A CN202111520878 A CN 202111520878A CN 114133888 A CN114133888 A CN 114133888A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C09J161/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The application discloses heat conduction composite material and panel, heat conduction composite material includes by weight: 100 parts of adhesive, 10-3000 parts of heat-conducting filler and 2-50 parts of heat storage material; the heat-conducting filler comprises short wood fibers, heat-conducting inorganic materials and lignocellulose nanowhiskers. The heat-conducting composite material provided by the application well solves the problem of cigarette burning resistance, and does not cause other side effects such as high water absorption rate, crack resistance and the like. The plate comprises the heat-conducting composite material, the surface of the plate can comprise a decorative layer, and the decorative layer does not influence the heat-conducting, heat-storing and heat-dissipating functions of the heat-conducting composite material. In addition, the surface flatness of the heat conduction, heat dissipation and heat storage layer is higher than that of a single plate through mixed pressing, so that the surface of the decorative layer is more uniform, the uniformity of heat dissipation in the heating process is improved, and the cigarette burning resistance is met.
Description
Technical Field
The present disclosure relates to, but is not limited to, decorative materials, and more particularly, but not exclusively, to thermally conductive composites and their preparation and use.
Background
At present, the melamine decorative panel is widely applied and used in cabinets, wardrobes, office furniture and the like, the melamine decorative panel is mainly prepared by sticking melamine impregnated paper on the surface of an artificial board substrate through hot pressing, decorative boards with different effects can be obtained by changing the color, the pattern and the like of the melamine paper, and the decorative effect is extremely good. In order to meet different decorative effect requirements of customers, the highlight melamine veneer is produced at the same time. However, in the using process, the highlight melamine veneer material has poor high-temperature resistance effect and poor cigarette burning resistance, and the phenomena of serious cracks, yellowing, stains, foaming, bulging and the like can occur after the contact of cigarettes or objects with the high temperature of 300-600 ℃, so that the furniture decorative paper loses high gloss and high definition characteristics, and the service life of furniture is greatly shortened. Limited range of materials used.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the present application.
Aiming at the problem that the high-gloss melamine decorative board is poor in cigarette burning resistance, the application provides a novel composite board, the high-temperature-resistant high-gloss melamine decorative board is prepared by improving a melamine adhesive layer and adding a heat conduction, heat dissipation and heat storage layer, and the problem that the cigarette burning resistance is unqualified is solved; and the application range of the material is expanded.
The application provides a heat-conducting composite material, the heat-conducting composite material includes by weight: 100 parts of adhesive, 10-3000 parts of heat-conducting filler and 2-50 parts of heat storage material, wherein the heat-conducting filler comprises short wood fiber, heat-conducting inorganic material and lignocellulose nanowhiskers;
in one embodiment provided herein, the thermally conductive composite comprises, in parts by weight: 3 to 100 parts of adhesive, 10 to 3000 parts of heat-conducting filler and 2 to 50 parts of heat storage material.
In one embodiment provided herein, the adhesive is selected from any one or two of melamine resin and melamine modified urea formaldehyde resin.
In one embodiment provided herein, the weight ratio of the short wood fibers, the thermally conductive inorganic material, and the lignocellulose nanowhiskers is (10 to 100): (5 to 50).
In one embodiment provided herein, the surfaces of the short wood fibers, the thermally conductive inorganic material, and the lignocellulose nanowhiskers are modified;
in one embodiment provided herein, the modifying agent is selected from any one or more of an aminosilane coupling agent, a vinylsilane coupling agent, and propyltrimethoxysilane; preferably, the modifier is used in the form of a modifier solution having a concentration of 0.5 wt.% to 3 wt.%;
in one embodiment provided herein, the thermally conductive inorganic material surface modification comprises the steps of: wetting the surface of the heat-conducting inorganic material by a modifier, and then drying at 60-90 ℃, wherein the drying time is 10-30 min;
in one embodiment provided herein, the surface modification of the short wood fibers and the lignocellulose nanowhiskers comprises the steps of: firstly, mixing the short wood fibers and the lignocellulose nanowhiskers, wetting the surface of the mixture with a modifier after mixing, drying the mixture at the temperature of between 40 and 60 ℃ while stirring, and stirring and drying for 20 to 60 min;
in one embodiment provided herein, the short wood fibers have an average aspect ratio of 5 to 12; the short wood fibers have an average length of 0.3mm to 1.2 mm.
In one embodiment provided herein, the thermally conductive inorganic material is selected from any one or more of alumina, magnesia, zinc oxide, aluminum nitride, boron nitride, and silicon carbide;
in one embodiment provided herein, the thermally conductive inorganic material has an average particle size of 1 μm to 3 μm.
In one embodiment provided herein, the heat storage material is a core-shell structure, and the shell material is selected from any one or more of melamine, silica, polyurea, polyurethane and polymethyl methacrylate;
in one embodiment provided herein, the internal material of the heat storage material is selected from one or more of paraffin, polyol, fatty acid, cross-linked polyolefin, cross-linked polyacetal, and inorganic salt;
in one embodiment provided herein, the phase transition temperature of the interior material is 50 ℃ to 150 ℃.
In yet another aspect, the present application provides a panel comprising a functional layer comprising the thermally conductive composite described above.
In one embodiment provided herein, the functional layer includes a lower adhesive layer and a heat conducting, dissipating and storing layer; the lower adhesive layer is closer to the outer surface of the plate than the heat conduction, heat dissipation and heat storage layer;
in one embodiment provided herein, the lower adhesive layer is composed of the thermally conductive composite;
in one embodiment provided herein, the heat conducting, dissipating and storing layer is composed of a wood fiber material and the heat conducting composite material;
in one embodiment provided herein, the weight ratio of the wood fiber material to the thermally conductive composite material is 100 (5 to 45).
In one embodiment provided herein, the thickness ratio of the lower adhesive layer to the heat conducting, dissipating, and storing layer is (0.03 to 0.25): (0.5 to 2.5);
in one embodiment provided herein, the weight ratio of the adhesive, the heat conductive filler and the heat storage material in the lower adhesive layer is 100 (10 to 50): 2 to 20;
in one embodiment provided herein, the weight ratio of the adhesive, the heat conductive filler, and the heat storage material in the heat conductive, heat dissipating and thermal storage layer is 100 (500 to 1250): (20 to 40).
In one embodiment provided by the application, the panel further comprises a finishing layer, wherein the finishing layer comprises an upper adhesive layer and a decorative material layer, and the upper adhesive layer is made of a transparent material;
in one embodiment provided herein, the material of the upper adhesive layer is melamine;
in one embodiment provided herein, the material of the decorative material layer is plain base paper or printing decorative paper;
in one embodiment provided herein, the thickness ratio of the upper adhesive layer and the decorative material layer is (3 to 25): (5 to 25), preferably, the thickness ratio of the upper adhesive layer and the decorative material layer is (30 μm to 250 μm): (50 μm to 250 μm);
in one embodiment provided herein, the layer of decorative material has a grammage of 30g/m2To 150g/m2；
In one embodiment provided herein, the ratio of the thickness of the facing layer to the functional layer is (8 to 50): (53 to 2750); preferably, the thickness ratio of the finishing layer to the functional layer is (80 μm to 500 μm): 530 μm to 2750 μm.
In an embodiment that this application provided, panel is glue film, decorative material layer, lower glue film and heat conduction heat dissipation heat storage layer in proper order from outer to interior.
The heat-conducting composite material provided by the application well solves the problem of cigarette burning resistance, and does not cause other side effects such as high water absorption rate, crack resistance and the like. And the decorative layer does not influence the heat conduction, heat storage and heat dissipation functions of the heat-conducting composite material. In addition, the surface flatness of the heat conduction, heat dissipation and heat storage layer is higher than that of a single plate through mixed pressing, so that the surface of the decorative layer is more uniform, the uniformity of heat dissipation in the heating process is improved, and the cigarette burning resistance is met.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. Other advantages of the present application may be realized and attained by the invention in its aspects as described in the specification.
Drawings
The accompanying drawings are included to provide an understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the examples serve to explain the principles of the disclosure and not to limit the disclosure.
Fig. 1 is a structural diagram of a melamine decorative board prepared in example 1 of the present application, and the reference numerals are as follows: 1. an upper facing layer; 2. a first functional layer; 3. a plurality of laminated plywood layers; 4. a second functional layer; 5. a lower facing layer; 11. coating a glue layer; 12. a layer of decorative material; 13. a glue layer is arranged; 14. a heat conduction, heat dissipation and heat storage layer.
Fig. 2A, 2B and 2C are schematic views showing that a common melamine decorative board is not resistant to cigarette burn.
Fig. 3A and 3B are schematic views of the cigarette burning resistance of the sheet material prepared in embodiment 1 of the present application, where fig. 3A is a schematic view of the cigarette without any treatment after burning, and fig. 3B is a schematic view of the cigarette after burning and wiping, and it can be seen from the figures that the sheet material does not have the phenomenon of bubbles or cracks, and the sheet material provided in the present application, similar to stone material, only has yellow spots after burning.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application are described in detail below. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
Example 1
This embodiment provides a melamine decorative board, and the melamine decorative board basic structure does:
the main structure of the melamine veneer with high gloss and resistance to cigarette ignition prepared by the embodiment is divided into five layers as shown in fig. 1: from top to bottom do in proper order: 1. an upper facing layer; 2. a first functional layer; 3. a plurality of laminated plywood layers; 4. a second functional layer; 5. a lower facing layer;
the upper and lower finishing layers may be the same, and include an upper adhesive layer 11 and a decorative material layer 12, and the decorative material layer 12 may be plain base paper or printThe decorative paper is brushed, and the gram weight of the decorative material layer 12 is 100g/m in the embodiment2A thickness of about 90 μm to 110 μm; the upper adhesive layer 11 can be a common melamine resin layer, the used melamine resin is obtained from MF50 melamine dipping adhesive from Xinli industry Co Ltd of Xinxiang city, and the gram weight per square meter is 40g/m2A thickness of about 30 μm to 35 μm;
the first functional layer 2 and the second functional layer 4 can be the same, and comprise a lower adhesive layer 13 and a heat conduction, heat dissipation and storage layer 14;
the lower adhesive layer 13 is composed of melamine resin, heat-conducting filler and heat storage capsules, and the weight ratio of the melamine resin to the heat-conducting filler to the heat storage capsules is 100:15: 3; the thickness of the lower adhesive layer is 90 micrometers; the preparation method of the lower adhesive layer 13 is that the heat-conducting filler and the heat storage capsule are mechanically stirred and mixed, and then the mixture is stirred and mixed with the melamine resin for standby.
The heat-conducting filler in the lower adhesive layer 13 comprises modified short wood fibers, modified heat-conducting inorganic materials and modified wood fiber nano whiskers.
The modification method of the short wood fiber and the lignocellulose nanowhisker is as follows:
weighing short wood fibers and lignin nanowhiskers according to a proportion, mixing, wetting the surface of the mixture with a modifier after mixing, and then drying at 45 ℃ while stirring, wherein the stirring and drying time is 60 min; the modifier is vinyl silane coupling agent, and is purchased from Tianchang green auxiliary chemical plant company, A-172 brand; the concentration of the modifier is 0.5% wt.;
the lignocellulose nanowhiskers are purchased from Zhejiang Jinhao Green nanomaterial Co., Ltd, and the trade mark is CNC;
the short wood fibers have an average length of 0.3mm to 1.2mm and an average aspect ratio of 5 to 12.
The heat-conducting inorganic material modification method comprises the following steps: wetting the surface of the heat-conducting inorganic material by a modifier, and then drying at 65 ℃, wherein the drying time is 30 min; the modifier is vinyl silane coupling agent, and is purchased from Tianchang green auxiliary chemical plant company, A-172 brand; the concentration of the modifier is 0.6 wt.%, and the heat-conducting inorganic material is silicon carbide, and the average particle size of the silicon carbide is 1-3 μm.
And (3) putting the modified short wood fiber, the modified heat-conducting inorganic material and the modified wood fiber nano whisker prepared in the three steps into a high-speed stirrer according to the weight ratio of 100:15:5, and stirring at a high speed of 10000rpm for 3-5 minutes to prepare the heat-conducting filler.
The heat storage material is a paraffin heat storage capsule with a core-shell structure, the shell material is polyurea, the internal material is paraffin, and the phase change temperature of the internal material is 70 ℃; is purchased from the science and technology limited company of the phase change new material with the synthetic fertilizer core energy, and has the code number of PCM-70.
And respectively rolling, brushing or spraying an upper adhesive layer and a lower adhesive layer on the upper surface and the lower surface of the facing paper to perform hot press molding, so that the lower adhesive layer, the facing paper and the upper adhesive layer are prepared and molded at one time.
2. Heat conduction, heat dissipation and heat storage layer
The heat conduction, heat dissipation and heat storage layer 14 comprises wood fibers, heat conduction fillers, adhesives and heat storage capsules; the length of the wood fiber is 2mm to 6 mm. The thickness of the first heat conduction, heat dissipation and heat storage layer 2 is 1 mm.
The heat conducting filler of the first heat conducting, radiating and storing layer 2 is the same as the heat conducting filler in the lower adhesive layer 13; the adhesive of the first heat-conducting, radiating and heat-storing layer 2 is melamine resin, and the melamine resin in the lower adhesive layer 13 has the same numerical value; the heat storage capsules used in the first heat conduction, radiation and heat storage layer 2 are the same as those used in the lower adhesive layer.
The melamine resin, the wood fiber, the heat-conducting filler and the heat storage capsule are placed into a high-speed stirrer for high-speed stirring according to the weight ratio of 5:100:30:2, the stirring speed is 10000rpm, the time is 5-10 minutes, so that the heat-conducting filler is uniformly attached to the surface of the wood fiber, the wood fiber and the heat-conducting filler are combined together through an adhesive, and a better heat-conducting and heat-dissipating effect is achieved through a hot-pressing process;
3. multi-layer laminated board
The multilayer laminated board layer 3 is an odd number of layers of wood boards, the number of the layers is determined by the thickness of a final product, and the number of the layers can be 3, 5 or 7;
the multi-layer plywood layer 3 is an artificial board which is made by using multi-layer plywood arranged in a criss-cross mode as a base material through several processes of cold pressing, hot pressing, sanding, curing and the like, and has the characteristics of difficult deformation and strong pressure resistance. The main tree species include Cinnamomum camphora, willow bark, poplar, eucalyptus, etc.
The adhesion between each layer can be carried out by the melamine resin contained in each layer, and the layer materials are only partially cured and not completely cured although being subjected to hot pressing during the preparation of each layer material, so that the function of bonding each layer can also be achieved.
Comparative example 1
The comparative example used a 16mm specification melamine faced multi-layer panel from hey china mo-color decorative materials ltd.
The structure of the composite board is that an upper outer adhesive layer, upper decorative paper, an upper inner adhesive layer, a composite board plain board, a lower inner adhesive layer, lower decorative paper and a lower outer adhesive layer are arranged from top to bottom; the decorative paper is dipped with melamine glue by a dipping process and then is molded with a multilayer plain board to form a final product; wherein, the upper and the lower glue layers are: and (3) finishing paper coating: the thickness ratio of the upper inner glue layer is 50 mu m to 70 mu m to 50 mu m.
The product is composed of organic substances, so that on one hand, the thermal conductivity is poor, and on the other hand, the high organic substance content causes more micromolecular decomposition products generated at high temperature, and the phenomena of swelling and cracking are easily caused as shown in figure 2C.
Comparative example 2
In this comparative example, hollow glass microspheres were purchased from New materials of hollow microspheres, St.Latt, Zheng, under the brand name HS70, with particle size parameters D50 of 10 μm and D90 of 15 μm.
According to the comparison example, the hollow glass beads are adopted in the lower adhesive layer of the facing paper as heat insulation functional components to play a role in heat insulation and heat resistance, wherein the upper adhesive layer is the hollow glass beads without heat insulation, which ensure the transparency and stability of the appearance, the thickness ratio of the upper adhesive layer, the facing paper and the lower adhesive layer is 50 micrometers to 100 micrometers to 200 micrometers, and the weight ratio of the hollow glass beads to the melamine glue in the lower adhesive layer is 20 to 100. The following drawbacks and limitations exist: the hollow glass beads can play a role in heat insulation and heat resistance, but also cause heat to be accumulated on the upper glue layer and the decorative paper layer; meanwhile, the hollow glass beads can reduce the toughness of the glue line, so that the phenomena of slight swelling and collapse appear, as shown in fig. 2A and 2B.
Although the embodiments disclosed in the present application are described above, the descriptions are only for the convenience of understanding the present application, and are not intended to limit the present application. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.
Claims (10)
1. A thermally conductive composite, wherein the thermally conductive composite comprises, in parts by weight: 100 parts of adhesive, 10-3000 parts of heat-conducting filler and 2-50 parts of heat storage material;
the heat-conducting filler comprises short wood fibers, heat-conducting inorganic materials and lignocellulose nanowhiskers.
2. The composite material according to claim 1, wherein the adhesive is selected from any one or two of melamine resin and melamine modified urea formaldehyde resin.
3. The composite material of claim 1, wherein the weight ratio of the short wood fibers, the thermally conductive inorganic material, and the lignocellulosic nanowhiskers is (10 to 100): (5 to 50).
4. The thermally conductive composite of any one of claims 1 to 3, wherein the short wood fibers, the thermally conductive inorganic material, and the lignocellulosic nanowhiskers have been surface-modified;
optionally, the modifier is selected from any one or more of an amino silane coupling agent, a vinyl silane coupling agent and propyltrimethoxysilane;
optionally, the surface modification of the heat-conducting inorganic material comprises the following steps: wetting the surface of the heat-conducting inorganic material by a modifier, and then drying at 60-90 ℃, wherein the drying time is 10-30 min;
optionally, the surface modification of the short wood fibers and the lignocellulose nanowhiskers comprises the steps of: firstly, mixing the short wood fibers and the lignocellulose nanowhiskers, wetting the surface of the mixture with a modifier after mixing, drying the mixture at the temperature of between 40 and 60 ℃ while stirring, and stirring and drying for 20 to 60 min;
optionally, the short wood fibers have an average aspect ratio of 5 to 12; the short wood fibers have an average length of 0.3mm to 1.2 mm.
5. The thermally conductive composite of any one of claims 1-3, wherein the thermally conductive inorganic material is selected from any one or more of alumina, magnesia, zinc oxide, aluminum nitride, boron nitride, and silicon carbide;
optionally, the thermally conductive inorganic material has an average particle size of 1 μm to 3 μm.
6. The thermally conductive composite of any of claims 1-3, wherein the heat storage material is a core-shell structure and the shell material is selected from any one or more of melamine, silica, polyurea, polyurethane, and polymethylmethacrylate;
the inner material of the heat storage material is selected from any one or more of paraffin, polyhydric alcohol, fatty acid, cross-linked polyolefin, cross-linked polyacetal and inorganic salt; optionally, the phase transition temperature of the interior material is 50 ℃ to 150 ℃.
7. A panel comprising a functional layer comprising the thermally conductive composite of any one of claims 1 to 6.
8. The panel according to claim 7, wherein the functional layer comprises an under glue layer and a heat conducting, dissipating and storing layer; the lower adhesive layer is closer to the outer surface of the plate than the heat conduction, heat dissipation and heat storage layer;
the lower adhesive layer is made of the heat-conducting composite material;
the heat conduction, heat dissipation and heat storage layer is made of wood fiber materials and the heat conduction composite materials;
optionally, the weight ratio of the wood fiber material to the thermally conductive composite material is 100 (5 to 45).
9. A panel according to claim 8, wherein the thickness ratio of said lower adhesive layer to said thermal and heat conducting and dissipating layer is (0.03 to 0.25): (0.5 to 2.5);
optionally, the weight ratio of the adhesive, the heat-conducting filler and the heat storage material in the lower adhesive layer is 100 (10 to 50): 2 to 20;
optionally, the weight ratio of the adhesive, the heat-conducting filler and the heat storage material in the heat-conducting, heat-dissipating and heat-storing layer is 100 (500-1250): 20-40.
10. The panel according to claim 7 or 8, wherein the panel further comprises a finishing layer, the finishing layer comprises a glue coating layer and a decorative material layer, and the glue coating layer is a transparent material;
optionally, the material of the upper glue layer is melamine; optionally, the decorative material layer is made of plain base paper or printing decorative paper;
optionally, the thickness ratio of the supersize layer to the decorative material layer is (3 to 25): (5 to 25);
optionally, the layer of decorative material has a grammage of 30g/m2To 150g/m2；
Optionally, the ratio of the thickness of the facing layer to the functional layer is (8 to 50): (53 to 2750);
optionally, the plate sequentially comprises an upper adhesive layer, a decorative material layer, a lower adhesive layer and a heat conduction, heat dissipation and heat storage layer from outside to inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111520878.4A CN114133888B (en) | 2021-12-13 | 2021-12-13 | Heat-conducting composite material and plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111520878.4A CN114133888B (en) | 2021-12-13 | 2021-12-13 | Heat-conducting composite material and plate |
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| CN114133888A true CN114133888A (en) | 2022-03-04 |
| CN114133888B CN114133888B (en) | 2023-04-07 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN117565416A (en) * | 2024-01-15 | 2024-02-20 | 中南大学 | Method for preparing adhesive structure by adopting secondary adhesive process and composite adhesive structure |
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| CN116061279A (en) * | 2022-12-30 | 2023-05-05 | 山东农业大学 | Modification treatment agent for in-situ reinforcing and toughening of wood and modification method thereof |
| CN116061279B (en) * | 2022-12-30 | 2024-05-14 | 山东农业大学 | Modification treatment agent for in-situ reinforcing and toughening of wood and modification method thereof |
| CN117565416A (en) * | 2024-01-15 | 2024-02-20 | 中南大学 | Method for preparing adhesive structure by adopting secondary adhesive process and composite adhesive structure |
| CN117565416B (en) * | 2024-01-15 | 2024-03-19 | 中南大学 | Method for preparing adhesive structure by adopting secondary adhesive process and composite adhesive structure |
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| CN114133888B (en) | 2023-04-07 |
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