CN107288371A - Optical wave house - Google Patents

Optical wave house Download PDF

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Publication number
CN107288371A
CN107288371A CN201710305287.2A CN201710305287A CN107288371A CN 107288371 A CN107288371 A CN 107288371A CN 201710305287 A CN201710305287 A CN 201710305287A CN 107288371 A CN107288371 A CN 107288371A
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CN
China
Prior art keywords
far
far infrared
infrared
compound resin
metallic
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Pending
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CN201710305287.2A
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Chinese (zh)
Inventor
陶志斌
居苏
吕雅华
周游
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Individual
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Individual
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Priority to CN201710305287.2A priority Critical patent/CN107288371A/en
Publication of CN107288371A publication Critical patent/CN107288371A/en
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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H1/00—Buildings or groups of buildings for dwelling or office purposes; General layout, e.g. modular co-ordination or staggered storeys
    • E04H1/12—Small buildings or other erections for limited occupation, erected in the open air or arranged in buildings, e.g. kiosks, waiting shelters for bus stops or for filling stations, roofs for railway platforms, watchmen's huts or dressing cubicles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C1/00—Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/70—Properties of coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/11—Deposition methods from solutions or suspensions
    • C03C2218/119—Deposition methods from solutions or suspensions by printing

Abstract

The invention provides a kind of optical wave house, including wooden room body, the wooden room body includes cap assembly, left side component, right side component, back board module, frame members, seat assemblies and base, the optical wave house also includes five groups of Far-infrared heating panels and two groups of far infrared compound resin heating base plates, Far-infrared heating panel described in five groups is separately positioned on top cover lower surface, between the left plate and the left side guardrail, between the right plate and the right side guardrail, between the backboard and the dorsal part guardrail, between the Door frame board and the doorframe guardrail, far infrared compound resin heating base plate is separately positioned on the seat support lower surface and the bedplate lower surface described in two groups.

Description

Optical wave house
Technical field
The invention belongs to optical wave house technical field, more particularly to a kind of optical wave house.
Background technology
With " Chinese dream " be done step-by-step and population structure change, China stepped into aging society, state Family is continued to increase to health industry input, and living standards of the people are improved constantly and the lifting to health perception, health industry phase Contain inside the Pass and enrich constantly, various healths, health care, medical supplies enjoy favor.The appearance of optical wave house has quietly changed people's Habits and customs, health, high-quality life pursuing a goal as common people, it is believed that in the near future, and optical wave house is bound to picture Refrigerator, washing machine are equally popularized and enter huge numbers of families.But, with development increase and each kind of optical wave house industry Continuously emerge, at present, its light wave plate of commercially available prod is primarily present following problem：Light wave plate heating board temperature tolerance is low, power Easily decay, the easy aging of product, linear fever, surface temperature are high, non-uniform temperature, and product has that aging is fast, power easily decays, beat It is fire, linear fever non-uniform temperature, temperature top heat and bottom cold in cabin, non-watertight (when humidity over limit in cabin or human sweat's drippage On light wave plate, certain damage can be caused to light wave plate for a long time, especially base light wave plate and sole light wave plate is more prominent Go out), the defect such as resistance to corrosion difference.In addition, lead oxide is largely used in existing optical wave house heating board, therefore, in preparation process The heavy metal lead shifted during the pollutants, and use such as substantial amounts of waste water, waste gas, waste material can be produced, can be to ecological environment Damage, while having a strong impact on health.
The content of the invention
It is an object of the invention to provide a kind of optical wave house, it is intended to which solving existing optical wave house electric stability can poor, temperature The problem of uneven, moistureproof damp proof corrosion resistance deficiency.
The present invention is achieved in that a kind of optical wave house, including wooden room body, the wooden room body include cap assembly, Left side component, right side component, back board module, frame members, seat assemblies and base, wherein, the cap assembly includes top cover, The left side component includes left plate, is arranged on the left side guardrail of left plate inner surface, the right side component include right plate, The right side guardrail of right plate inner surface is arranged on, the back board module includes backboard, is arranged on the backboard inner surface Dorsal part guardrail, the frame members include Door frame board, are arranged on the doorframe guardrail of the Door frame board inner surface, the seat support group Part includes seat support, and the base includes bedplate, and the optical wave house also includes five groups of Far-infrared heating panels and two groups of far infrareds are answered Resin heating base plate, Far-infrared heating panel described in five groups is respectively：It is arranged on the top far infrared hair of the top cover lower surface Left side Far-infrared heating panel, the right plate and the right side guardrail between hot plate, the left plate and the left side guardrail Between right side Far-infrared heating panel, the backboard and the dorsal part guardrail between dorsal part Far-infrared heating panel, the doorframe Doorframe Far-infrared heating panel between plate and the doorframe guardrail, far infrared compound resin heating base plate is respectively described in two groups： It is arranged on the seat support far infrared compound resin heating base plate of the seat support lower surface and is arranged on the bottom of the bedplate lower surface Seat far infrared compound resin heating base plate；
Wherein, the Far-infrared heating panel includes the inorganic non-metallic far infrared graphite of carrier and setting on the carrier Resistive film, the carrier is glass substrate, and the glass substrate includes high-boron-silicon glass substrate, crystallite glass substrate, tempering glass Glass substrate；
The far infrared compound resin heating base plate includes the first compound resin substrate, the metallic conduction paper tinsel core set gradually Lamella, resistive layer and the second compound resin substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, One insulating barrier, geometry resistance chip 222 and the second insulating barrier,
The resistive layer includes the resistive film of substrate and deposition on the substrate.
The optical wave house that the present invention is provided, first, is used with high-boron-silicon glass substrate, crystallite glass substrate, safety glass base Plate is used as heater as the inorganic non-metallic far infrared graphite resistive film of carrier, on the one hand, the inorganic non-metallic far infrared Graphite resistance film blends infrared radiant material, can produce the far infrared that wave-length coverage is 8-14 microns, and described inorganic non- Metal far infrared graphite resistive film compact structure, not stratified, the non-foaming, life-span is more permanent.On the other hand, the far infrared heating Plate is used as carrier, its heatproof, heat-resisting, shock resistance using high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate Good, after preparing inorganic non-metallic far infrared graphite resistive film through high temperature, the same intensity with safety glass is readily transported and made With safety, and it is cheap.Importantly, the high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate can Realize that low temperature plane is radiated, surface temperature≤100 DEG C, unit area power density is low, surface temperature is uniform, same functional area Interior, high-low temperature difference is only 5 DEG C.
Secondly, the present invention is provided with the heating of far infrared compound resin in the seat support lower surface and the bedplate lower surface Substrate.The far infrared compound resin heating base plate, the geometry resistance chip is encapsulated about 222 with dielectric film, so It is wrapped in two layers of compound resin substrate again afterwards to treat in the middle of finished product, and is handled through high temperature hot pressing and form an entirety.By Secondary reinforced insulation processing, its endurance quality, resistance and electric property are stable, and electrical strength is located under conditions of 3750V, 2MA 1 minute nothing of reason punctures flashover.The far infrared compound resin heating base plate has excellent moistureproof moisture-proof characteristic (through continuing Diving run, its classification of waterproof：IPX8), its anti-microbial effect and corrosion resistance are strong, can for a long time be placed in water and use, So as to solve the problem of seat support and base position are easily influenceed by water, corrosive liquids.And the far infrared compound resin hair Inorganic non-metallic far infrared graphite resistive film in hot substrate is made up of inorganic material, its maximum operation (service) temperature >=230 DEG C, and light Ripple room light wave plate operating temperature is only 100 DEG C, and in the absence of oxidation, aging phenomenon, product uses the longevity through national infrared Spot detection Life >=30000 hours.
In addition, the optical wave house that provides of the present invention is nontoxic, free from extraneous odour, formaldehydeless release, fire prevention, anti-aging, high mechanical strength, It is indeformable, using safety, meet environmental protection theory.
Brief description of the drawings
Fig. 1 is the explosive view of optical wave house provided in an embodiment of the present invention；
Fig. 2 is the multi-temperature zone design drawing of Far-infrared heating panel provided in an embodiment of the present invention；
Fig. 3 is the overlooking the structure diagram of packaged resistance chip layer provided in an embodiment of the present invention；
Fig. 4 is the overlooking the structure diagram of packaged resistance chip layer provided in an embodiment of the present invention.
Embodiment
In order that technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only to explain The present invention, is not intended to limit the present invention.
With reference to Fig. 1-3, the embodiments of the invention provide a kind of optical wave house, including wooden room body, the wooden room body includes Cap assembly 1, left side component 2, right side component 3, back board module 4, frame members 5, seat assemblies 6 and base 7, wherein, it is described Cap assembly 1 includes top cover 11, and the left side component 2 includes left plate 21, is arranged on the left side shield of the inner surface of left plate 21 Column 23, the right side component 3 includes right plate 31, is arranged on the right side guardrail 33 of the inner surface of right plate 31, the backboard group Part 4 includes backboard 41, is arranged on the dorsal part guardrail 43 of the inner surface of backboard 41, the frame members 5 include Door frame board 51, The doorframe guardrail 53 of the inner surface of Door frame board 51 is arranged on, the seat assemblies 6 include seat support 61, and the base 7 includes Bedplate 71, the optical wave house also includes five groups of Far-infrared heating panels and two groups of far infrared compound resin heating base plates, five groups of institutes Stating Far-infrared heating panel is respectively：It is arranged on the top Far-infrared heating panel 12, the left plate 21 and institute of the lower surface of top cover 11 The right side stated between left side Far-infrared heating panel 22, the right plate 31 and the right side guardrail 33 between the guardrail 23 of left side is remote Dorsal part Far-infrared heating panel 42, the Door frame board 51 between infrared heating plate 32, the backboard 41 and the dorsal part guardrail 43 Doorframe Far-infrared heating panel 52 between the doorframe guardrail 53, far infrared compound resin heating base plate described in two groups is distinguished For：It is arranged on the seat support far infrared compound resin heating base plate 62 of the lower surface of seat support 61 and is arranged under the bedplate 71 The base far infrared compound resin heating base plate 72 on surface；
Wherein, the Far-infrared heating panel includes the inorganic non-metallic far infrared graphite of carrier and setting on the carrier Resistive film, the carrier is glass substrate, and the glass substrate includes high-boron-silicon glass substrate, crystallite glass substrate, tempering glass Glass substrate；
The far infrared compound resin heating base plate includes the first compound resin substrate, the metallic conduction paper tinsel core set gradually Lamella, resistive layer and the second compound resin substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, One insulating barrier, geometry resistance chip 222 and the second insulating barrier,
The resistive layer includes the resistive film of substrate and deposition on the substrate.
Optical wave house provided in an embodiment of the present invention, the cap assembly 1, left side component 2, right side component 3, component 4, doorframe Component 5, seat assemblies 6 and base 7 can be arranged to an overall structure using the conventional method of this area optical wave house.Specifically , the top cover, left plate 21, right plate 31, backboard 41, Door frame board 51, seat support, bedplate 71 constitute the knot of the optical wave house Structure frame plate.On this architecture basics, the table in the top cover lower surface, the inner surface of the left plate 21, the right plate 31 Face, the inner surface of the backboard 41, the inner surface of the Door frame board 51 are respectively arranged with Far-infrared heating panel, i.e. top far infrared heating Plate 12, left side Far-infrared heating panel 22, right side Far-infrared heating panel 32, dorsal part Far-infrared heating panel 42, doorframe far infrared heating Plate 52.Further, respectively to be arranged on the left side Far-infrared heating panel 22, right side Far-infrared heating panel 32, dorsal part far red Be provided for protecting, support on outer heating board 42, doorframe Far-infrared heating panel 52 Far-infrared heating panel left side guardrail 23, Right side guardrail 33, the guardrail of backboard 41 and doorframe guardrail 53.Meanwhile, the embodiment of the present invention also is being easy to be influenceed by water, corrosive liquid The lower surface of the chair seat board 61 and the lower surface of the bedplate 71 set far infrared compound resin heating base plate：Seat support far infrared Compound resin heating base plate 62 and base far infrared compound resin heating base plate 72, the setting of the waterproof construction can anti-hidroschesis The erosion of the liquid such as liquid, tea, red wine, it is to avoid cause that damages or if things go on like this caused to heating base plate performance to break finished product It is bad.
It is preferred that, dorsal part Far-infrared heating panel 42 is arranged on the top of the seat assemblies 6, and is oppositely arranged including above and below The first dorsal part Far-infrared heating panel 421 and the second dorsal part Far-infrared heating panel 422.
It is further preferred that the optical wave house also includes being arranged on the backboard 41 and positioned at the lower section of seat support 61 Leg Far-infrared heating panel 63, and for protecting the leg guardrail 64 of the leg Far-infrared heating panel, the design can be adjusted Control the heated of leg.Further, the plate of leg far infrared heating 63 preferably includes the first leg that left and right is oppositely arranged The leg Far-infrared heating panel 632 of Far-infrared heating panel 631 and second.
It is preferred that, the heating region of Far-infrared heating panel described in each group is multi-temperature zone design in the embodiment of the present invention, Including high and low temperature region, i.e., described inorganic non-metallic far infrared graphite resistive film includes the first humidity province that there is temperature difference With second temperature area, and temperature is not gone here and there in first humidity province and second temperature area, is not interfere with each other.Pass through scientific warm area arrangement side Formula, the problem of solving temperature top heat and bottom cold in the light wave passenger's cabin in a ship, while orientation thermotherapy can be provided, more conforms to human body life Reason feature, beneficial health.The setting of first humidity province and second temperature area, can be by changing its connection in series-parallel electricity The modes such as road, adjustment film material sheet resistance are realized.As a specific embodiment, the multi-temperature zone of the Far-infrared heating panel is designed As shown in Figure 2.
The Far-infrared heating panel includes the inorganic non-metallic far infrared graphite resistance of carrier and setting on the carrier Film, the carrier is high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate.The setting of the Far-infrared heating panel, On the one hand, the inorganic non-metallic far infrared graphite resistive film blends infrared radiant material, can produce wave-length coverage for 8-14 The far infrared of micron, and the inorganic non-metallic far infrared graphite resistive film compact structure, not stratified, the non-foaming, life-span is more For a long time.On the other hand, the Far-infrared heating panel is made using high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate For carrier, its heatproof, heat-resisting, shock resistance are good, after preparing inorganic non-metallic far infrared graphite resistive film through high temperature, same tool There is the intensity of safety glass, be readily transported and using safety, and it is cheap.Importantly, the high-boron-silicon glass substrate, Crystallite glass substrate, reinforced glass substrate can realize that low temperature plane is radiated, and surface temperature≤100 DEG C, unit area power is close Degree is low, and surface temperature is uniform, and in same functional area, high-low temperature difference is only 5 DEG C.
It is further preferred that the thickness of the glass substrate is 4-6mm.
Of course it is to be understood that the Far-infrared heating panel also includes the conductive termination of conductive electrode, lead, it is described inorganic non- Metal far infrared graphite resistive film and conductive electrode overlap joint, conductive electrode film and the conductive termination film overlap joint of lead, lead conducting end Head film is connected with power supply, makes to carry as main heating using high-performance high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate The inorganic non-metallic far infrared graphite resistive film light wave plate of body is connected in circuit.
It is preferred that, the inorganic non-metallic far infrared graphite resistive film is made up of matrix material and liquid medium, the base Body material is made up of the following raw materials according of following parts by weight：
Wherein, nano-titanium oxide is contained in the far-infared ceramic powder.
In the embodiment of the present invention, described matrix material includes two parts, the glass that a part is made up of metal oxide Micro mist framework material, including bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, quartz sand, carbon Sour lithium, basic copper carbonate；The functional material that another part is made up of graphite powder, ultrafine mica powder, far-infared ceramic powder.Its In, the aggregate of the framework material charging resistor film, to support membrane structure；The functional material assigns resistive film practical work( Energy.
Specifically, the graphite powder is as one of major function raw material, in inorganic non-metallic far infrared graphite resistive film It is a kind of far infrared resistance material for playing electric action.Inorganic non-metallic far infrared graphite resistive film under electric field action, its In graphitic composition between carbon molecules between occur violent friction and shock, produce main with far infrared radiation and to manifold The heat energy that formula is externally transmitted.In the embodiment of the present invention, the parts by weight of the graphite powder are 150-300 parts, can be specially 150 Part, 180 parts, 200 parts, 220 parts, 250 parts, 280 parts, 300 parts, preferably 180-280 parts.Further, inventor is through excessive Quantity research is found, in the inorganic non-metallic far infrared graphite resistive film of specific composition of the embodiment of the present invention, the particle of the graphite Degree must be very strictly controlled.When the graphite powder particle is spent greatly, during more than 400 mesh, inorganic non-metallic far infrared graphite can be caused Resistive film heating is uneven and produces the excessive phenomenon of resistance dispersion.In view of this, granularity≤400 of the graphite powder Mesh.It is preferred that, the particle diameter of the graphite powder is 400-500 mesh.
The ultrafine mica powder is the increasing of inorganic non-metallic far infrared graphite resistive film mid and far infrared line of the embodiment of the present invention Strong agent, meanwhile, it is also the stabilizer mutually overlapped in inorganic non-metallic far infrared graphite resistive film.The ultrafine mica powder adds Plus, the radiation of inorganic non-metallic far infrared graphite resistive film mid and far infrared line can not only be strengthened, moreover, the ultrafine mica powder The mutual fusion between each component can be promoted, particularly strengthen bismuth oxide, zinc oxide, antimony oxide and strontium carbonate, oxidation Mutual overlap joint between magnesium, quartz sand, lithium carbonate, basic copper carbonate, so as to improve film forming and inorganic non-metallic far infrared stone The mechanical strength of black resistive film, it is to avoid inorganic non-metallic far infrared graphite resistive film can locally produce in use cracking, The phenomenons such as peeling.The ultrafine mica powder parts by weight be 90-180 parts, concretely 90 parts, 100 parts, 120 parts, 150 parts, 180 parts.It is preferred that, the ultrafine mica powder parts by weight are 100-170 parts.Further, the embodiment of the present invention is to described super The particle diameter of thin mica powder also has strict control, specifically, (i.e. granularity is small below 500 mesh for the particle diameter of the ultrafine mica powder In 500 mesh).If the granularity of the ultrafine mica powder is more than between 500 mesh, each component, particularly strengthen bismuth oxide, oxidation Phase lap intensity between zinc, antimony oxide and strontium carbonate, magnesia, quartz sand, lithium carbonate, basic copper carbonate is deteriorated, into Film effect is poor, and inorganic non-metallic far infrared graphite resistive film can locally produce the phenomenons such as cracking, peeling in use.It is preferred that , the particle diameter of the ultrafine mica powder is 500-600 mesh.
The far-infared ceramic powder is that inorganic non-metallic far infrared graphite resistive film of the embodiment of the present invention is indispensable red External radiation material.Specifically, the far-infared ceramic powder is the far-infared ceramic powder containing nano-titanium oxide.It is used as graphite resistance The functional material of film, the far-infared ceramic powder can not only cooperate with the ultrafine mica powder enriches far infrared intensity work With, and with preferable catalysis oxidation function, rich in far infrared, its far-infrared radiation rate enhancing more than 15% can have Effect removes indoor benzene, formaldehyde, sulfide, ammonia and stink substance, and with sterilizing function.It is preferred that, made pottery with the far infrared The gross weight of porcelain powder is 100% meter, and the weight percentage of the nano-titanium oxide is 8-12%, if the nano-titanium oxide Weight percentage is too high, can cause resistive film poor adhesive force, the easily defect such as layering, influence resistive film film-formation result and resistive film Service life；If the weight percentage of the nano-titanium oxide is too low, its be can not effectively remove interior benzene, formaldehyde, The materials such as sulfide, ammonia and stink, and without sterilizing function, i.e. health effect can not spy show come.The far-infrared ceramic The parts by weight of powder are 60-120 parts, concretely 60 parts, 80 parts, 100 parts, 120 parts.It is preferred that, the far-infared ceramic powder Parts by weight be 70-110 parts.Particle of the nonmetallic far infrared graphite resistive film of machine of the embodiment of the present invention to far-infared ceramic powder Degree is by being strict with, specifically, the particle diameter of the far-infared ceramic powder should be less than 500 mesh.If of the far-infared ceramic powder Granularity is more than 500 mesh, and its far-infrared radiation intensity can weaken.It is preferred that, the particle diameter of the far-infared ceramic powder is 500-600 Mesh.
In the embodiment of the present invention, it is different from generally by ultrafine mica powder, far-infared ceramic powder that film forming plays a role respectively Technology it is different, inorganic non-metallic far infrared graphite resistive film of the present invention, with bismuth oxide, zinc oxide, antimony oxide, carbonic acid On the premise of strontium, magnesia, quartz sand, lithium carbonate, basic copper carbonate etc. are as film forming matter, by ultrafine mica powder, far infrared Added while ceramic powder, slurry is formed under liquid medium effect, and then prepare the nonmetallic far infrared graphite electricity of single-layer inorganic Film is hindered, is conducive to improving far infrared radiation intensity, and then assign resistive film excellent electric combination property.
As the presently preferred embodiments, the particle diameter of the graphite powder is 400-500 mesh；The particle diameter of the ultrafine mica powder is 500- 600 mesh；The particle diameter of the far-infared ceramic powder is 500-600 mesh.By the particle diameter of above-mentioned substance, improve inorganic non-metallic far red The resistance dispersion of outer graphite resistance film, improves its sheet resistance repeatability.
In the embodiment of the present invention, the bismuth oxide is the material of main part in inorganic non-metallic far infrared graphite resistive film, hair Wave middle skeleton function.Specifically, the parts by weight of the bismuth oxide are 300-500 parts, middle skeleton could be effectively played Effect, is specifically as follows 300 parts, 330 parts, 350 parts, 380 parts, 400 parts, 430 parts, 450 parts, 470 parts, 500 parts.It is preferred that, The parts by weight of the bismuth oxide are 330-470 parts.Bismuth oxide environmental protection described in the embodiment of the present invention, to health not damaged, Also the sound development beneficial to preserving the ecological environment.But relative to lead oxide, the bismuth oxide has higher softening temperature and ring Characteristic is protected, therefore, a large amount of of bismuth oxide use the film-forming temperature for significantly improving inorganic non-metallic far infrared graphite resistive film And temperature in use.
The inorganic non-metallic far infrared graphite resistive film needs to be attached on carrier, is further prepared into various electronics members Part.Adhesive ability of the slurry largely obtained using the bismuth oxide on carrier is poor.Inorganic non-metallic of the embodiment of the present invention In far infrared graphite resistive film, zinc oxide is with the addition of as material component.The zinc oxide can be effectively improved inorganic non-metallic The coefficient of expansion of far infrared graphite resistive film, prevents cracking；Meanwhile, the zinc oxide promotes each group to divide it also as fluxing agent Between rapid fusion so that the fused mass of forming properties stable homogeneous.By the fluxing action of the zinc oxide, make inorganic non-gold Belong to thermal coefficient of expansion and carrier (including mica substrate, reinforced glass substrate, the high-boron-silicon glass base of far infrared graphite resistive film Plate, crystallite glass substrate, reinforced glass substrate, quartz glass substrate, crystallite glass substrate, ceramic substrate, porcelain enamel substrate) one Cause, adhesion and adhesive force effectively between regulation inorganic non-metallic far infrared graphite resistive film and carrier make inorganic non-metallic Adhesion of the far infrared graphite resistive film on carrier is more preferably.The parts by weight of the zinc oxide are 250-350 parts, concretely 250 parts, 280 parts, 300 parts, 320 parts, 340 parts, 350 parts.It is preferred that, the parts by weight of the zinc oxide are 260-340 parts.
In the embodiment of the present invention, on the one hand, the bismuth oxide, the cooperation of the antimony oxide and the zinc oxide make With the operating temperature of inorganic non-metallic far infrared graphite resistive film can be improved, it is possible to decrease linear expansion coefficient, heat shock resistance is strong, heat Stability is improved, so as to expand the scope of application and properties of product of inorganic non-metallic far infrared graphite resistive film.On the other hand, The antimony oxide coordinates the lithium carbonate, boric acid and strontium carbonate, and collective effect improves far-infared ceramic powder, glass granules The adhesive force of (including bismuth oxide and other metal oxides) and carrier, promotes viscous between far-infared ceramic powder, glass granules Tie power；Meanwhile, the antimony oxide can also strengthen the associativity between far-infared ceramic powder, glass granules and the graphite powder Can, so that obtained inorganic non-metallic far infrared graphite resistive film electric property is more stablized.The antimony oxide Parts by weight are 100-150 parts, concretely 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, preferably 150 parts, 110-130 Part.
In the embodiment of the present invention, the boric acid as bismuth oxide complementary element, collectively as inorganic non-metallic far infrared The intermediate host material of graphite resistance film.The addition of the boric acid, can promote the Flashmelt of material in manufacturing process, melt Close, it is ensured that inorganic non-metallic far infrared graphite resistive film is being used and will not cracked and cracking phenomena in manufacturing process, from And improve product quality and stability.In addition, the boric acid also improves far infrared together with the antimony oxide, strontium carbonate The adhesive force of ceramic powder, glass granules (including bismuth oxide and other metal oxides) and carrier；Strengthen far-infrared ceramic simultaneously Binding ability between powder, glass granules and the graphite powder.The parts by weight of the boric acid are 180-250 parts, concretely 180 parts, 200 parts, 220 parts, 250 parts, preferably 190-230 parts (.
The strontium carbonate as supplement raw material, except improve together with the antimony oxide, boric acid far-infared ceramic powder, Glass granules (including bismuth oxide and other metal oxides) are with the adhesive force of carrier, while strengthening far-infared ceramic powder, glass Outside binding ability between particulate and the graphite powder, moreover it is possible to coordinate with the magnesia, promote the surface of graphite resistance film hard Change, prevention inorganic non-metallic far infrared graphite resistive film is scratched and dampened during operation, storage.The weight of the strontium carbonate Number is 70-120 parts, concretely 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts.It is preferred that, the weight of the strontium carbonate It is 85-110 parts to measure number.
By using the antimony oxide, boric acid and strontium carbonate of above-mentioned parts by weight, on the one hand, improve ceramics, glass micro- Surface adhesion between powder and between ceramics, glass granules and carbon dust, is improved in inorganic non-metallic far infrared graphite resistive film The adhesion in portion and with high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate adhesive force；On the other hand, can be with Improve the temperature applicable range and material softening temperature spot of inorganic non-metallic far infrared graphite resistive film.In addition, each component is mutual Coordinate, moreover it is possible to be effectively improved the thermal coefficient of expansion of inorganic non-metallic far infrared graphite resistive film, improve its heat endurance.
In the embodiment of the present invention, the aluminum oxide as another skeletal support raw material, for build the graphite powder and The bridge of mutual overlap joint between the micro- material of far-infared ceramic powder, glass (including other each metal oxides), so that each group Dividing can fully combine, merge, and improve the compactness and stability of resistive film, while so that graphite powder and far-infared ceramic powder are assigned The electric property given can give full play to.The parts by weight of the aluminum oxide be 50-100 parts, concretely 50 parts, 60 parts, 70 Part, 80 parts, 90 parts, 100 parts.It is preferred that, the parts by weight of the aluminum oxide are 55-80 parts.
In the embodiment of the present invention, the magnesia can coordinate as miscellaneous function raw material with the strontium carbonate, common to make With graphite resistance film Surface hardened layer is promoted, prevention inorganic non-metallic far infrared graphite resistive film is scratched during operation, storage And contusion.In addition, the magnesia also with the borate complex, promote various metal oxides fully to melt, make various metals Oxide fusion is uniform.The parts by weight of the magnesia be 30-70 parts, concretely 30 parts, 40 parts, 50 parts, 60 parts, 70 Part.It is preferred that, the parts by weight of the magnesia are 35-60 parts.
The quartz sand is the alternative materials of bismuth oxide, and bismuth oxide forms the framework supporting structure of resistive film together.It is logical The replacement of quartz sand is crossed, the content of bismuth oxide can be reduced, so that appropriateness reduction inorganic non-metallic far infrared graphite resistive film Film-forming temperature and temperature in use.Because the property of quartz sand is limited, it is impossible to be excessively added to replace the content of bismuth oxide.Specifically , the parts by weight of the quartz sand are 25-70 parts, concretely 25 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts.It is preferred that , the parts by weight of the quartz sand are 30-60 parts.
Because the content of the bismuth oxide is higher so that between each component of inorganic non-metallic far infrared graphite resistive film Caking property is substantially reduced.The lithium carbonate a small amount of by adding of the embodiment of the present invention, makes between the bismuth oxide and other components Adhesion is greatly increased.By the mutual cooperation between the strontium carbonate and the bismuth oxide, inorganic non-metallic is improved far red The adhesion of outer graphite resistance film, it is therefore prevented that inorganic non-metallic far infrared graphite resistive film goes out in the sintering process of preparation technology The problems such as existing crackle, explosion, cracking, peeling.Meanwhile, by the adjustment effect of lithium carbonate, make bismuth oxide, antimony oxide oxidation Adhesion between three kinds of framework materials of zinc is dramatically increased, and then forms the enhanced stable skeleton structure of mechanical strength.The carbon The parts by weight of sour lithium are 50-120 parts, concretely 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts. It is preferred that, the parts by weight of the lithium carbonate are 55-100 parts.
In inorganic non-metallic far infrared graphite resistive film of the embodiment of the present invention, basic copper carbonate is with the addition of as raw material group Point.On the one hand the basic copper carbonate as fluxing agent, promotes the rapid fusion between each component, so that forming properties are homogeneous steady Fixed fused mass；On the other hand, the basic copper carbonate plays catalysis and levelling.The parts by weight of the basic copper carbonate are 10-25 parts, concretely 10 parts, 15 parts, 20 parts, 25 parts.It is preferred that, the parts by weight of the basic copper carbonate are 12-20 parts.
In the embodiment of the present invention, the raw material of the inorganic non-metallic far infrared graphite resistive film also includes liquid medium, institute Stating liquid medium makes above-mentioned matrix material formation slurry, and then deposits film forming.It is preferred that, the liquid medium is organic media, And the weight ratio of described matrix raw material and the organic media is (1365-2355):(2320-4946).It is further preferred that institute It is the relatively low organic media of boiling point to state organic media, specifically, the boiling point of the organic media is at 180-250 DEG C, to ensure In follow-up drying process process, the organic media can be vaporized completely.
Specific preferred, the organic media includes the following component of following parts by weight：
700-950 parts of terpinol；
40-150 parts of ethyl cellulose；
50-100 parts of silane coupler.
Inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, first, with bismuth oxide, zinc oxide, three Two antimony are aoxidized as main film forming substance so that the film layer of inorganic non-metallic far infrared graphite resistive film can be formed with preferable The continuous dry film of intensity；Further, other metal oxides, such as carbon are also added in inorganic non-metallic far infrared graphite resistive film Sour strontium, magnesia, quartz sand, lithium carbonate and basic copper carbonate.On the one hand, such as strontium carbonate, magnesia, quartz sand, lithium carbonate and Basic copper carbonate participates in film forming as film forming matter；On the other hand, above-mentioned substance can be cooperateed with mutually, more as functional additive Mend using bismuth oxide, zinc oxide, antimony oxide as the resistive film of main film forming substance deficiency functionally.Specifically, institute State bismuth oxide, zinc oxide, antimony oxide cooperate, can improve graphite resistance film operating temperature and electric property it is steady It is qualitative；Meanwhile, the strontium carbonate, magnesia, quartz sand, lithium carbonate and basic copper carbonate mating reaction further increase electricity Hinder adhesive force, surface strength and the wearability of film, it is to avoid inorganic non-metallic far infrared graphite resistive film occurs in sintering process Cracking phenomena (cracking, peeling), and in the scuffing for using or storing process.
Secondly, inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, while with the addition of ultra-fine mica Powder, far-infared ceramic powder functional powder, assign resistive film excellent electric combination property and far infrared performance.Specifically, with The far-infared ceramic powder (containing nano-titanium oxide) that the ultrafine mica powder is used cooperatively, rich in far infrared, its far infrared spoke Penetrate rate enhancing more than 15%；It can make inorganic non-metallic far infrared graphite resistive film that there is preferable catalysis oxidation function simultaneously, Benzene, formaldehyde, sulfide, ammonia and the stink substance of interior can be effectively removed, and with sterilizing function.It is different from ultra-fine cloud generally Film forming is different come the technology played a role respectively for female powder, far-infared ceramic powder, inorganic non-metallic far infrared graphite resistance of the present invention Film, using bismuth oxide, zinc oxide, antimony oxide, strontium carbonate, magnesia, quartz sand, lithium carbonate, basic copper carbonate etc. as On the premise of film forming matter, added while ultrafine mica powder, far-infared ceramic powder can be achieved and then prepare the non-gold of single-layer inorganic Belong to far infrared graphite resistive film.
Again, inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, graphite resistance film main skeleton Material is that inorganic high-temp metal oxide materials make, and resistance, electric property are more stablized, it is easy to industrialize, large-scale production； Inorganic non-metallic far infrared graphite resistive film is using materials such as bismuth oxide, silica as framework material, and material softening point temperature is bright Aobvious to improve, the graphite resistance film prepared by it, application is more extensive.Simultaneously using antimony oxide, zinc oxide and carbonic acid Lithium is as raw material, and the antimony oxide and zinc oxide are used to effectively improve the adhesive force between product and carrier, and then improve With reference to effect, the amalgamation that the lithium carbonate can reconcile between antimony oxide, zinc oxide and other material compositions, so as to ensure The realization of the effect above.
Inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, high mechanical strength, with preferable increasing Obdurability, adhesive force, anti-ageing property, corrosion resistance, anti acid alkali performance, corrosion resistance, its thermal coefficient of expansion are small, will not produce tortoise Split, the phenomenon such as peeling.In addition, the inorganic non-metallic far infrared graphite resistive film constitutive material is free of precious metals species, even Without metallics, therefore, price is human-oriented, is conducive to graphite resistance film popularizing in civil area；Meanwhile, the present invention is real The inorganic non-metallic far infrared graphite resistive film of example offer is provided, leaded material is not contained, material environment friendly, production and using process without The three wastes are produced, and can avoid preparing the adverse effect that discarded object pollution on the environment and lead bring health, are combined Environmental protection theory.
Inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, can be prepared by following methods and obtained .
Corresponding, the embodiments of the invention provide a kind of preparation method of inorganic non-metallic far infrared graphite resistive film, bag Include following steps：
S01. each component is weighed according to the formula of above-mentioned inorganic non-metallic far infrared graphite resistive film；
S02. by bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, quartz sand, carbonic acid Lithium, basic copper carbonate heating melting, are ground after cooling, sieve, add graphite powder, ultrafine mica powder, far-infared ceramic powder Mixing, obtains base material mixture；
S03. it is (1365-2355) according to base material mixture and organic media weight ratio in the base material mixture: The ratio addition organic media of (2320-4946), is mixed to get mixed slurry；
S04., glass substrate is provided, the mixed slurry is printed on the glass substrate, is dried, at sintering Reason, obtains inorganic non-metallic far infrared graphite resistive film.
Specifically, in above-mentioned steps S01, the formula and its preferred feelings of the inorganic non-metallic far infrared graphite resistive film Condition, as described above, in order to save length, here is omitted.
In above-mentioned steps S02, by bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, stone Sand, lithium carbonate, basic copper carbonate heating melting, form the first eutectic.It is preferred that, the temperature of the heating melting is 800- 1250 DEG C, so as to ensure that each raw material components are fully quickly merged.If the heating melting temperature is too low, it can not fill Divide and effectively melt each metal oxide；If the temperature is too high, the softening point of base material mixture will be improved, and can influence resistance The film-formation result and film forming sintering temperature of film.
The first eutectic after cooling is ground, sieving is handled, the relatively uniform particulate of particle diameter is formed, so that favorably In the electric property for obtaining stabilization.Then graphite powder, ultrafine mica powder, far-infared ceramic powder mixing are added, base material mixing is obtained Thing.In order to be sufficiently mixed uniformly with the graphite powder, ultrafine mica powder, far-infared ceramic powder, and obtain the mixing of uniform particle diameter System, and then formation even compact, the film layer of performance temperature after follow-up film forming, it is preferred that the sieving processing will be cooled down, ground Fused mass after mill crosses the screen cloth of the mesh of mesh number >=500.By controlling the particle diameter of fused mass, improve inorganic non-metallic far infrared graphite The resistance dispersion of resistive film, improves its sheet resistance repeatability.
In above-mentioned steps S03, mixed slurry of the organic media formation suitable for film forming is added in the base material mixture, its In, the base material mixture is (1365-2355) with organic media weight ratio：The ratio addition organic media of (2320-4946), It is mixed to get mixed slurry.
There is provided glass substrate in above-mentioned steps S04, the glass substrate includes high-boron-silicon glass substrate, devitrified glass base Plate, reinforced glass substrate.The mixed slurry is printed on the glass substrate, is dried successively, sintering processes, is obtained Inorganic non-metallic far infrared graphite resistive film.Wherein, the printing is preferred to use silk-screen printing, wherein, the mesh of silk screen is 40- 300 mesh, more elect 100-300 mesh as.
It is preferred that, the drying mode is drying, and drying temperature is 120-280 DEG C, and drying time is preferably 10-20min, Fully to remove the organic media in film layer, dense film is formed.The drying temperature is unsuitable too high or too low, if temperature mistake Height, then can cause obtained film layer because internal-external temperature difference is big, be heated uneven and produce cracking；If the temperature is too low, it is difficult to Organic media is effectively removed, and then during follow-up sintering, volatilization forms stomata influence film quality.It is preferred that, it is described to burn The temperature of knot is 480-680 DEG C, so as to form the stable uniform film layer of electric property.
The preparation method of inorganic non-metallic far infrared graphite resistive film provided in an embodiment of the present invention, only need to be by each oxide Graphite powder, ultrafine mica powder, far-infared ceramic powder are added after melt process, then adds organic media slurry film forming is made, not only Method is simple, and obtained excellent product performance.In addition, breakthrough of the embodiment of the present invention is traditional by the ultra-fine cloud of functional powder The technique of female powder, far-infared ceramic powder difference film forming formation surface far-infrared radiation coating, by the ultrafine mica powder, remote red Outer ceramic powder is added simultaneously, one-pass film-forming, on the premise of performance stabilization, particularly far-infrared radiation intensity is ensured, is shortened The production duration, production cost is reduced, it is more suitable for civilian resistive film field.
As shown in Figure 3,4, in the embodiment of the present invention, (seat support far infrared is combined the far infrared compound resin heating base plate Resin heating base plate 62 and base far infrared compound resin heating base plate 72) effect be auxiliary transmission far infrared, specifically adopt With the first compound resin substrate 81, the second compound resin substrate 84, the metal is led by heat pressing process pressing Electric paper tinsel chip layer 82 and releasing far infrared inorganic non-metallic Far infrared electric resistance layer 83 are encapsulated in centre.The design can be avoided The metallic conduction paper tinsel chip layer 82, the releasing far infrared inorganic non-metallic Far infrared electric resistance layer 83 being disposed there between are being answered From adverse effect in heterocycle border.Specifically, the far infrared compound resin heating base plate include set gradually first be combined Resin substrate 81, metallic conduction paper tinsel chip layer 82, inorganic non-metallic Far infrared electric resistance layer 83 and the second compound resin substrate 84, institute State the first compound resin substrate 81, the setting of the second compound resin substrate 84 so that obtained far infrared compound resin hair Hot substrate protection against the tide moisture-proof characteristic is strong, the energy for having good anti-microbial effect and acid and alkali resistance, organic solvent and seawater corrosion effect Power.Far infrared compound resin heating base plate that the present invention is provided is permeable, water imbibition and hygroscopicity are very low, classification of waterproof：IPX8 (is held Continuous diving run), in addition it is waterproof, it can directly be embedded in water and use for a long time.In addition, the first compound resin substrate 81, institute State the second compound resin substrate 84 assign obtain product high mechanical strength, be not deformed, fatigue resistance is good, uviolresistance Strong, the corrosion-resistant, density of energy is low, environment-protective no-smell, low cost and other advantages.
Wherein, the metallic conduction paper tinsel chip layer 82 is included in set gradually on the first compound resin substrate 81 anti- Penetrate aluminium foil 821, the first insulating barrier 8221, geometry resistance chip 8222 and the second insulating barrier 8223.
It is remote that the inorganic non-metallic Far infrared electric resistance layer 83 includes the inorganic non-metallic of substrate and deposition on the substrate Infrared graphite resistance film.
The embodiment of the present invention is provided with the compound tree of far infrared in the lower surface of seat support 61 and the lower surface of the bedplate 71 Fat heating base plate (seat support far infrared compound resin heating base plate 62 and base far infrared compound resin heating base plate 72).It is described remote Infrared compound resin heating base plate, the geometry resistance chip is encapsulated about 8222 with dielectric film, is then wrapped again It is rolled in two layers of compound resin substrate to treat in the middle of finished product, and is handled through high temperature hot pressing and form an entirety.Strengthen exhausted by secondary Edge processing, its endurance quality, resistance and electric property are stable, and electrical strength handles 1 minute nothing under conditions of 3750V, 2MA and hit Wear flashover.The far infrared compound resin heating base plate have excellent moistureproof moisture-proof characteristic (through continuing diving run, its Classification of waterproof：IPX8), its anti-microbial effect and corrosion resistance are strong, can for a long time be placed in water and use, so as to solve chair The problem of seat 61 and the position of bedplate 71 are easily influenceed by water, corrosive liquids.And the far infrared compound resin heating base plate In inorganic non-metallic far infrared graphite resistive film be made up of inorganic material, its maximum operation (service) temperature >=230 DEG C, and optical wave house light Ripple plate operating temperature is only 100 DEG C, in the absence of oxidation, aging phenomenon, product through national infrared Spot detection, service life >= 30000 hours.It is further preferred that the thickness of the far infrared compound resin heating base plate is 4-8mm.
Specifically, in the embodiment of the present invention, the metallic conduction paper tinsel chip layer 82 is included in the first compound resin base Reflective aluminium foil 821, the first insulating barrier 8221, geometry resistance chip 8222 and the second insulating barrier set gradually on piece 81 8223.In addition, the metallic conduction paper tinsel chip layer 82 is additionally provided with lead ends (not marked in figure) and lead terminal (in figure not Mark), the geometry resistance chip 8222, lead ends, lead terminal are collectively forming chip assembly.Wherein, first is exhausted Edge layer 8221, the second insulating barrier 8223 wrap up geometry resistance chip 8222 or chip assembly (lead ends are exposed outside) In centre, insulating encapsulation process is carried out to geometry resistance chip 8222 or chip assembly, packaged resistance chip layer is formed 822.The thus obtained far infrared compound resin heating base plate, its geometry resistance chip 8222 or chip assembly pass through Reinforced insulation processing (double hyer insulation of insulating barrier and compound resin substrate) twice, its resistance stabilization, electric stability energy and resistance to Long performance is good, and its 1 minute nothing under conditions of electrical strength 3750V, 2MA punctures flashover.Wherein, first insulating barrier 8221st, the second insulating barrier 8223 is PI insulating barriers or PET insulating barriers.It is preferred that insulating materials, not only insulation effect is good, and tool There is preferable resistance to elevated temperatures, so as to be conducive to the insulating barrier after hot pressing forms packaging effect.
First insulating barrier 8221, geometry resistance chip 8222 and the second insulating barrier 8223 formation packaged resistance chip layer 822, can by it is cold mount, seal, hot pressing is realized.It is preferred that, geometry resistance chip 8222 and the first of its upper and lower surface Insulating barrier 8221, the second insulating barrier 8223 form a packaged resistance chip layer 822 through hot pressing, so as to obtain packaging effect more Good, resistance and the more stable packaged resistance chip layer 822 of electric property.It is further preferred that in the packaged resistance chip layer 822 do not set the region of geometry resistance chip 8222, per 10cm2At least provided with 2 a diameter of 6-8mm through hole 8220, To prevent product to be layered, the overlooking structure figure of packaged resistance chip layer is as shown in Figure 4.
In the embodiment of the present invention, the inorganic non-metallic Far infrared electric resistance layer 83 includes substrate and deposition on the substrate Inorganic non-metallic far infrared graphite resistive film.The substrate is not limited clearly, including but not limited to mica substrate, tempering glass Glass substrate, high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate, quartz glass substrate, crystallite glass substrate, pottery Porcelain substrate, porcelain enamel substrate, it is preferred to use performance more preferably mica substrate.
Further, the far infrared compound resin heating base plate also includes the power line set, and further comprises It is arranged on the waterproof and dampproof high-temperature resistance plastice shield on its surface.
It is preferred that, the formula of the releasing far infrared inorganic non-metallic far infrared graphite resistive film constitutes as above institute State, in order to save length, here is omitted.
The far infrared compound resin heating base plate contains releasing far infrared inorganic non-metallic Far infrared electric resistance layer, by Carbon and inorganic material rich in far infrared are made, and performance is highly stable, and the far infrared heating temperature of generation is uniform, rich in 8- 14 microns of far infrared (medical field also appellation its " healthy light " and " life light "), is conducive to health.
Far infrared compound resin heating base plate provided in an embodiment of the present invention, with advantages below：
1st, the geometry resistance chip of the far infrared compound resin heating base plate is handled by reinforced insulation twice, its Resistance stabilization, electric stability energy and excellent in durability.
2nd, the far infrared compound resin heating base plate is provided with two layers of compound resin substrate, during can preventing from being arranged on The metallic conduction paper tinsel chip layer, releasing far infrared inorganic non-metallic Far infrared electric resistance layer in adverse environment by shadow Ring, and high mechanical strength, will not be deformed, and environment-protective no-smell.In addition, the far infrared compound resin heating base plate is moistureproof Moisture-proof characteristic is strong, the ability for having good anti-microbial effect and acid and alkali resistance, organic solvent and seawater corrosion effect.The present invention The far infrared compound resin heating base plate of offer is permeable, water imbibition and hygroscopicity are very low, classification of waterproof：IPX8 (lasting diving examinations Test), in addition it is waterproof, it can directly be embedded in water and use for a long time.
3rd, the far infrared compound resin heating base plate contains releasing far infrared inorganic non-metallic Far infrared electric resistance layer, Heating temp is uniform, rich in 8-14 microns of far infrareds, is conducive to health.
4th, the far infrared compound resin heating base plate is planar heat producing body, and unit area power density is low, surface temperature Uniformly, high-low temperature difference is only 2 DEG C.
5th, the far infrared compound resin heating base plate, its geometry resistance chip uses PI films (polyimides) up and down Or the encapsulation of PET (polyester) dielectric film, two layers of compound resin substrate are then wrapped in again to be treated in the middle of finished product, and through high temperature hot pressing Handle and form an entirety, obtained product resistance stabilization, excellent in durability.And its resistance material is metal and inorganic material Material is made, and in the absence of oxidation, aging phenomenon, product is through national infrared Spot detection, service life >=50000 hour.
6th, the far infrared compound resin heating base plate, specious, rich color, full of unifications, profile is different；Product The special-shaped outward appearance such as tabular, arc-shaped can be made, and without secondary decoration.Its good decorative property, any surface finish can be configured to each Gay colours is planted, different decorative patterns and pattern can also be produced, various decorative panels, large-scale embossment and technique is suitably manufactured beautiful Art sculpture etc..
7th, the far infrared compound resin heating base plate that the present invention is provided, with cost is low, fatigue resistance is good, uviolresistance Can strong, corrosion-resistant, density low and unique material designability the advantages of, product purpose is extensive.
And, the embodiments of the invention provide a kind of preparation method of far infrared compound resin heating base plate, including it is following Step：
Q01. metallic conduction paper tinsel is fitted on insulating carrier film, carries out patterned process formation geometry resistor core Piece, processing is packaged with insulating carrier film to the geometry resistance chip, obtains metallic conduction paper tinsel chip layer semi-finished product；
Specifically, in above-mentioned steps Q01, patterned process formation geometry resistor core is carried out to the metallic conduction paper tinsel The method of piece is preferably photoetching or engraving method.Specifically, in the metallic conduction paper tinsel oil surface being fitted on insulating carrier film, Baking, exposure, development step preparation geometry are sequentially passed through, further, the product after development can also be tested, repaiied Benefit, etching process.
Then processing is packaged to the geometry resistance chip with insulating carrier film, encapsulation process can be using heat Press technological forming.
Q02. in the surface laminating deposited resistive layer of the metallic conduction paper tinsel chip layer semi-finished product, in the metallic conduction Another surface laminating reflective aluminium foil of paper tinsel chip layer semi-finished product；
, can be with the surface laminating deposited resistive layer of the metallic conduction paper tinsel chip layer semi-finished product in above-mentioned steps Q02 Realized by this area conventional method.Further, it is anti-in another surface laminating of the metallic conduction paper tinsel chip layer semi-finished product Penetrate aluminium foil.
Q03. answered respectively in the reflective aluminium foil and the first compound resin of resistive film substrate surface hot pressing substrate, second Resin substrate, obtains far infrared compound resin heating base plate.
Optical wave house provided in an embodiment of the present invention, first, is used with high-boron-silicon glass substrate, crystallite glass substrate, tempering Glass substrate is used as heater as the inorganic non-metallic far infrared graphite resistive film of carrier, on the one hand, the inorganic non-metallic Far infrared graphite resistive film blends infrared radiant material, can produce the far infrared that wave-length coverage is 8-14 microns, and described Inorganic non-metallic far infrared graphite resistive film compact structure, not stratified, the non-foaming, life-span is more permanent.On the other hand, it is described remote red Outer heating board is used as carrier, its heatproof, heat-resisting, anti-impact using high-boron-silicon glass substrate, crystallite glass substrate, reinforced glass substrate Hit performance good, after preparing inorganic non-metallic far infrared graphite resistive film through high temperature, the same intensity with safety glass is easy to fortune Defeated and use safety, and it is cheap.Importantly, the high-boron-silicon glass substrate, crystallite glass substrate, safety glass base Plate can realize that low temperature plane is radiated, and surface temperature≤100 DEG C, unit area power density is low, and surface temperature is uniform, same work( In energy region, high-low temperature difference is only 5 DEG C.
Secondly, the embodiment of the present invention is provided with the compound tree of far infrared in the seat support lower surface and the bedplate lower surface Fat heating base plate.The far infrared compound resin heating base plate, the geometry resistance chip is sealed about 222 with dielectric film Dress, is then wrapped in two layers of compound resin substrate and is treated in the middle of finished product again, and is handled through high temperature hot pressing and formed an entirety. Handled by secondary reinforced insulation, its endurance quality, resistance and electric property are stable, condition of the electrical strength in 3750V, 2MA 1 minute nothing of lower processing punctures flashover.The far infrared compound resin heating base plate has excellent moistureproof moisture-proof characteristic (warp Continue diving run, its classification of waterproof：IPX8), its anti-microbial effect and corrosion resistance are strong, and can be placed in water for a long time makes With so as to solve the problem of seat support and bedplate position are easily influenceed by water, corrosive liquids.And the compound tree of the far infrared Inorganic non-metallic far infrared graphite resistive film in fat heating base plate is made up of inorganic material, its maximum operation (service) temperature >=230 DEG C, And optical wave house light wave plate operating temperature is only 100 DEG C, in the absence of oxidation, aging phenomenon, product makes through national infrared Spot detection With life-span >=30000 hour.
In addition, optical wave house provided in an embodiment of the present invention is nontoxic, free from extraneous odour, formaldehydeless release, fire prevention, it is anti-aging, machinery Intensity is high, indeformable, using safety, meets environmental protection theory.
Illustrated with reference to specific embodiment.
Embodiment 1
A kind of optical wave house, including wooden room body, the wooden room body include cap assembly, left side component, right side component, the back of the body Board component, frame members, seat assemblies and base, wherein, the cap assembly includes top cover, and the left side component includes left side Plate, the left side guardrail for being arranged on left plate inner surface, the right side component include right plate, are arranged on right plate inner surface Right side guardrail, the back board module includes backboard, is arranged on the dorsal part guardrail of the backboard inner surface, the frame members Including Door frame board, the doorframe guardrail of the Door frame board inner surface is arranged on, the seat assemblies include seat support, the base bag Bedplate is included, the optical wave house also includes five groups of Far-infrared heating panels and two groups of far infrared compound resin heating base plates, five groups of institutes State Far-infrared heating panel be separately positioned between top cover lower surface, the left plate and the left side guardrail, the right plate and Between the right side guardrail, between the backboard and the dorsal part guardrail, between the Door frame board and the doorframe guardrail, two groups The far infrared compound resin heating base plate is separately positioned on the seat support lower surface and the bedplate lower surface；
Wherein, the Far-infrared heating panel includes the inorganic non-metallic far infrared graphite of carrier and setting on the carrier Resistive film, the carrier is high-boron-silicon glass substrate；
The far infrared compound resin heating base plate includes the first compound resin substrate, the metallic conduction paper tinsel core set gradually Lamella, resistive layer and the second compound resin substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, One insulating barrier, geometry resistance chip 222 and the second insulating barrier,
The resistive layer includes the resistive film of substrate and deposition on the substrate.
The inorganic non-metallic far infrared graphite resistive film (2000 grams), is made up of matrix material and liquid medium, described Matrix material is made up of the following raw materials according of following weight：
The liquid organic medium that the organic media is made up of the following component of following weight percentage：
Weight terpinol 85%；
Weight diethylene cellulose 9%；
Weight silane coupler 6%.
The preparation method of the inorganic non-metallic far infrared graphite resistive film, comprises the following steps：
S11. each component is weighed according to the formula of above-mentioned inorganic non-metallic far infrared graphite resistive film；
S12. by bismuth oxide, zinc oxide, antimony oxide, boric acid, aluminum oxide, strontium carbonate, magnesia, quartz sand, carbonic acid Lithium, basic copper carbonate stir in mixer, by this mixture in being melted 60 minutes at 1280 DEG C, by the mixture obtained Crushed, then ground 2 hours with sand mill after material block cooling, particle diameter is less than the micro mist of 500 mesh, then be charged with stone Ink powder, ultrafine mica powder, far-infared ceramic powder, obtain base material mixture；
S13. in the base material mixture, organic media is added, uniform mixed slurry is modulated into；
S14. a block length 1000mm, width 500mm, thickness 4mm rectangle microcrystal glass plate are taken, is then existed with conductive silver slurry Each printing one long 470mm, wide 10mm conduction are distinguished on the same side of two short sides of the rectangle crystallite glass substrate Electrode, it is lead ends then to print 12*12 squares in the middle part of two conductive electrodes respectively again, by this bottom plate together with conductive electrode Dry for standby；Inorganic non-metallic far infrared graphite resistive film, the inorganic non-metallic far infrared are printed using silk-screen printing technique 2/3 part of the width of graphite resistance film covering conductive electrode pole body 3, lead ends should cover the 1/4 of conductive electrode pole body, to prevent Loose contact.It is dried 20 minutes at 120 DEG C, then sintered 20 minutes at 630 DEG C, that is, inorganic non-gold of the invention has been made Belong to far infrared graphite resistive film.
It is consequently formed the tabular crystallite glass substrate far-infrared radiation that one piece of area is 93.2 × 47=4380.4C ㎡ Resistive element.
Two interelectrode resistance are measured with ohmmeter for 96 Ω, its square resistance should be 48 Ω/.
Embodiment 2
A kind of optical wave house, including wooden room body, the wooden room body include cap assembly, left side component, right side component, the back of the body Board component, frame members, seat assemblies and base, wherein, the cap assembly includes top cover, and the left side component includes left side Plate, the left side guardrail for being arranged on left plate inner surface, the right side component include right plate, are arranged on right plate inner surface Right side guardrail, the back board module includes backboard, is arranged on the dorsal part guardrail of the backboard inner surface, the frame members Including Door frame board, the doorframe guardrail of the Door frame board inner surface is arranged on, the seat assemblies include seat support, the base bag Bedplate is included, the optical wave house also includes five groups of Far-infrared heating panels and two groups of far infrared compound resin heating base plates, five groups of institutes State Far-infrared heating panel be separately positioned between top cover lower surface, the left plate and the left side guardrail, the right plate and Between the right side guardrail, between the backboard and the dorsal part guardrail, between the Door frame board and the doorframe guardrail, two groups The far infrared compound resin heating base plate is separately positioned on the seat support lower surface and the bedplate lower surface；
Wherein, the Far-infrared heating panel includes the inorganic non-metallic far infrared graphite of carrier and setting on the carrier Resistive film, the carrier is high-boron-silicon glass substrate；
The far infrared compound resin heating base plate includes the first compound resin substrate, the metallic conduction paper tinsel core set gradually Lamella, resistive layer and the second compound resin substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, One insulating barrier, geometry resistance chip 222 and the second insulating barrier,
The resistive layer includes the resistive film of substrate and deposition on the substrate.
Wherein, far infrared compound resin heating base plate is prepared by following methods described in two groups：
Q11. by 1 block length 700mm, width 350mm, thickness 0.05mm rectangle metallic conduction foil substrate be fitted in long 700mm, On wide 350mm, thickness 0.125mm rectangle PET or PI hot melt adhesive film, patterned process formation geometry resistance chip is carried out 222, with another block length 700mm, width 350mm, thickness 0.125mm rectangle PET or PI hot melt adhesive film film to the geometry Resistance chip 222 is packaged processing, obtains metallic conduction paper tinsel chip layer semi-finished product；
Q12. in the surface laminating resistive layer of the metallic conduction paper tinsel chip layer semi-finished product, in the metallic conduction paper tinsel core The long 700mm of another surface laminating, width 350mm, the thickness 0.1mm rectangle minute surface aluminium foil of lamella semi-finished product；
Q13. respectively the reflective aluminium foil and each block length 700mm of hot pressing one of the resistive film substrate surface, width 350mm, Thick 3mm rectangle compound resin substrate, obtains far infrared compound resin heating base plate.
The optical wave house that above-described embodiment 1-2 is obtained carries out performance test, and method of testing and result are as follows：
Stability test 1 (storage stability)：
A kind of light wave plate and high property using high-performance high-boron-silicon glass substrate as heating carrier that above-described embodiment is obtained Each 10 pieces of energy far infrared far infrared compound resin heating base plate sole light wave plate is placed on (relative humidity in the experimental box of humidity 80%-90%) store 1 year, as a result do not find any one resistive element moisture absorption or go mouldy.Resistance value testing result shows, Rate of change≤1% of its resistance value.
Stability test 2 (heat endurance)：
A kind of above-mentioned light wave plate two ends lead ends using high-performance high-boron-silicon glass substrate as heating carrier it Between apply 220V alternating voltage 1.15 times of (virtual voltages：253V), its current strength reaches 3 amperes, its general power reaches 660W, its thermal equilibrium temperature reaches 120 DEG C or slightly higher.It is continuous under extra-heavy working condition herein to work 5000 hours.Then Stop being powered, resistance measurement is carried out when it is cooled to after room temperature.As a result show, rate of change≤1% of its resistance value.
Temperature homogeneity experiment 3 (determines a kind of light wave using high-performance high-boron-silicon glass substrate as heating carrier in operation Plate and high-performance far infrared far infrared compound resin heating base plate sole light wave plate, surface temperature are uniformly distributed, i.e. square electricity The uniformity of resistance)：
This test good wooden optical wave house of one peripheral sealing.It is hair by above-mentioned high-performance high-boron-silicon glass substrate The light wave plate of heat carrier is arranged on wooden frame, is being fixed on the rear wall of wooden optical wave house, and 6 TEMPs are visited Head is fixed on heatproof gummed paper on the diverse location for the same warm area of light wave plate surface that high-boron-silicon glass substrate is heating carrier.Electricity Resistance element is run 300 minutes with 120 DEG C, the temperature value of average 30 minutes record temperature sensing probes.Its temperature high-low temperature difference should Within 5 DEG C.In addition, the surface temperature of conductive electrode and lead ends should not be greater than the temperature of resistance element face coating.Knot Fruit shows that the temperature of resistance element face coating is uniform, and high-low temperature difference is within 5 DEG C, its high-performance far infrared far infrared Compound resin heating base plate sole light wave plate high-low temperature difference can be obtained within 2 DEG C by above-mentioned experiment：Resistance element face coating Square resistance is uniform.
Far infrared performance test 4：
Above-mentioned high-performance high-boron-silicon glass substrate is combined for the light wave plate and high-performance far infrared far infrared of heating carrier Each 10 of resin heating base plate sole light wave plate is delivered to：National infrared and industrial electroheat product quality supervision and inspection center foundation GB/T4654-2008《Nonmetal basal body infrared radiation heater generic specifications》And GB/T7287-2008《Infra-red radiation adds Hot device test method》Detect, the indices such as its relative radiation power spectrum, electric-thermal emission conversion efficiency, normal direction total emissivity are accorded with Close or more than above-mentioned standard requirement.
Environmental-protecting performance experiment 5：
Above-mentioned high-performance high-boron-silicon glass substrate is combined for the light wave plate and high-performance far infrared far infrared of heating carrier Each 10 of resin heating base plate sole light wave plate is delivered to：Tongbiao Standard Technology Service Co., Ltd, in accordance with European Union 2011/65/EU (ROHS) instruct, carry out detection lead (pb), cadmium (cd), mercury (Hg), Cr VI (Cr6+), PBBs (PBBs), PBBs The indices such as the content of ether (PBDEs) are detected that testing result meets above-mentioned ROHS instructions and required.
(high-performance that measurement is exposed under high temperature is high for inorganic non-metallic far infrared graphite resistive film resistivity measurement experiment 6 Pyrex glass substrate is the resistance of the light wave plate of heating carrier)：
Under the conditions of 25 DEG C, resistance of the above-mentioned high-performance high-boron-silicon glass substrate for the light wave plate of heating carrier is tested.Will It is 220 DEG C that sample, which is placed in temperature, and humidity is more than in 50 ﹪ baking oven 1000 hours.After baking, its resistance value variations is not to be exceeded The ﹪ to+10 of resistance value -5 ﹪ measured before baking scope.Test result in prescribed limit, extension exposed to high temperature when Between, resistance value will not be impacted.
High-performance high-boron-silicon glass substrate (tests the operation of its light wave plate for the light wave plate accelerated aging test 7 of heating carrier Afterwards, test is exposed to the ageing-resistant performance of inorganic non-metallic far infrared graphite resistive film in wet environment)：
By above-mentioned high-performance high-boron-silicon glass substrate for heating carrier light wave plate 10, respectively through stability test, Far infrared performance test, environmental-protecting performance experiment, temperature homogeneity, resistivity measurement experiment carry out inorganic non-metallic far infrared again Graphite resistance film accelerated aging test.
Experimental condition：Carried out in 40 DEG C ± 2 DEG C of temperature and the ﹪ of relative humidity 80 ± 5 in test box.
Specific method is as follows：Light wave plate 10 by high-performance high-boron-silicon glass substrate for heating carrier is placed in 40 DEG C of temperature In ± 2 DEG C and the ﹪ of relative humidity 80 ± 5 in optical wave house, 2000 circulation work operations are carried out to sample, 220V power voltage supplies lead to It one hour is a circulation that electricity is closed for one hour.Complete after loop test, power, visual examination are carried out respectively to sample, its work( Rate deviation is not above the ﹪ to+10 of power -5 ﹪ measured before test scope, and its high-performance high-boron-silicon glass substrate is heating Inorganic non-metallic far infrared graphite resistive film surface on the light wave plate of carrier does not find the defects such as peeling, foaming, cracking.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.

Claims (10)

1. a kind of optical wave house, including wooden room body, the wooden room body include cap assembly, left side component, right side component, backboard Component, frame members, seat assemblies and base, wherein, the cap assembly includes top cover, and the left side component includes left side Plate, the left side guardrail for being arranged on left plate inner surface, the right side component include right plate, are arranged on right plate inner surface Right side guardrail, the back board module includes backboard, is arranged on the dorsal part guardrail of the backboard inner surface, the frame members Including Door frame board, the doorframe guardrail of the Door frame board inner surface is arranged on, the seat assemblies include seat support, the base bag Include bedplate, it is characterised in that the optical wave house also includes five groups of Far-infrared heating panels and two groups of far infrared compound resin heatings Substrate, Far-infrared heating panel described in five groups is respectively：It is arranged on the top Far-infrared heating panel of the top cover lower surface, the left side The right side between left side Far-infrared heating panel, the right plate and the right side guardrail between side plate and the left side guardrail is remote Dorsal part Far-infrared heating panel, the Door frame board and the doorframe between infrared heating plate, the backboard and the dorsal part guardrail Doorframe Far-infrared heating panel between guardrail, far infrared compound resin heating base plate is respectively described in two groups：It is arranged on the chair The seat support far infrared compound resin heating base plate of seat lower surface is combined with the base far infrared for being arranged on the bedplate lower surface Resin heating base plate；
Wherein, the Far-infrared heating panel includes the inorganic non-metallic far infrared graphite resistance of carrier and setting on the carrier Film, the carrier is glass substrate, and the glass substrate includes high-boron-silicon glass substrate, crystallite glass substrate, safety glass base Plate；
The far infrared compound resin heating base plate includes the first compound resin substrate, the metallic conduction paper tinsel chip set gradually Layer, resistive layer and the second compound resin substrate, wherein,
The metallic conduction paper tinsel chip layer is included in the reflective aluminium foil set gradually on the first compound resin substrate, first exhausted Edge layer, geometry resistance chip 222 and the second insulating barrier,
The resistive layer includes the resistive film of substrate and deposition on the substrate.
2. optical wave house as claimed in claim 1, it is characterised in that the inorganic non-metallic far infrared graphite resistive film is by matrix Material and liquid medium are made, and described matrix material is made up of the following raw materials according of following parts by weight：
Wherein, nano-titanium oxide is contained in the far-infared ceramic powder.
3. optical wave house as claimed in claim 2, it is characterised in that the particle diameter of the graphite powder is 400-500 mesh；It is described ultra-fine The particle diameter of mica powder is 500-600 mesh；The particle diameter of the far-infared ceramic powder is 500-600 mesh.
4. the optical wave house as described in claim 1-3 is any, it is characterised in that the geometry resistance chip 222 with thereon First insulating barrier of lower surface and the second insulating barrier hot pressing form packaged resistance chip layer.
5. optical wave house as claimed in claim 4, it is characterised in that do not have setting geometry electricity in the packaged resistance chip layer The region of chip 222 is hindered, per 10cm2At least provided with 2 a diameter of 6-8mm through hole.
6. the optical wave house as described in claim 1-3 is any, it is characterised in that the thickness of the glass substrate is 4-6mm；With/ Or
The thickness of the far infrared compound resin heating base plate is 4-8mm.
7. the optical wave house as described in claim 1-3 is any, it is characterised in that the institute between the backboard and the dorsal part guardrail State the top that Far-infrared heating panel is arranged on the seat assemblies, and the first dorsal part far infrared heating including being oppositely arranged up and down Plate and the second dorsal part Far-infrared heating panel.
8. the optical wave house as described in claim 1-3 is any, it is characterised in that also including being arranged on the backboard and being located at Leg Far-infrared heating panel below the seat support, and for protecting the leg guardrail of the leg Far-infrared heating panel.
9. optical wave house as claimed in claim 8, it is characterised in that the leg Far-infrared heating panel includes left and right and is oppositely arranged The first leg Far-infrared heating panel and the second leg Far-infrared heating panel.
10. the optical wave house as described in claim 1-3 is any, it is characterised in that the inorganic non-metallic far infrared graphite resistance Film includes the first humidity province and second temperature area that there is temperature difference.
CN201710305287.2A 2017-05-03 2017-05-03 Optical wave house Pending CN107288371A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108040377A (en) * 2017-12-28 2018-05-15 祥利电器制品(深圳)有限公司 Transportable food hot plate
CN108814070A (en) * 2018-07-13 2018-11-16 广东阳光倍健健康科技股份有限公司 A kind of far infrared physical therapy seat couch
CN109680990A (en) * 2019-01-02 2019-04-26 武威市凉州区星艺欧式装饰工程中心 A kind of pavilion EPS and preparation method thereof

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CN103489550A (en) * 2013-09-13 2014-01-01 李琴 Inorganic resistor thick film and preparing method and application of inorganic resistor thick film
CN204590664U (en) * 2015-02-15 2015-08-26 刘翠兰 A kind of optical wave house with color lamp device
CN106310535A (en) * 2016-08-27 2017-01-11 西安门捷列夫新材料科技有限公司 Graphene far-infrared intelligent physiotherapy room

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US4691483A (en) * 1984-12-31 1987-09-08 Craig Systems Corporation Shelter
CN201011743Y (en) * 2007-02-07 2008-01-23 吉林大学 Electric heating plate for folding type infrared bath case
CN201599864U (en) * 2009-03-09 2010-10-06 马必委 Nanometer negative-ion far infrared electric geothermal board
CN103476156A (en) * 2013-09-13 2013-12-25 简伟雄 Glass ceramic heating substrate coated with inorganic thick film, preparing method and heating assembly
CN103489550A (en) * 2013-09-13 2014-01-01 李琴 Inorganic resistor thick film and preparing method and application of inorganic resistor thick film
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CN108040377A (en) * 2017-12-28 2018-05-15 祥利电器制品(深圳)有限公司 Transportable food hot plate
CN108814070A (en) * 2018-07-13 2018-11-16 广东阳光倍健健康科技股份有限公司 A kind of far infrared physical therapy seat couch
CN109680990A (en) * 2019-01-02 2019-04-26 武威市凉州区星艺欧式装饰工程中心 A kind of pavilion EPS and preparation method thereof

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