CN108040377A - Transportable food hot plate - Google Patents
Transportable food hot plate Download PDFInfo
- Publication number
- CN108040377A CN108040377A CN201711465787.9A CN201711465787A CN108040377A CN 108040377 A CN108040377 A CN 108040377A CN 201711465787 A CN201711465787 A CN 201711465787A CN 108040377 A CN108040377 A CN 108040377A
- Authority
- CN
- China
- Prior art keywords
- glass
- plate
- ceramics heating
- heating plate
- backboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000013305 food Nutrition 0.000 title claims abstract description 70
- 238000010438 heat treatment Methods 0.000 claims abstract description 102
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 81
- 239000011521 glass Substances 0.000 claims description 27
- 239000002937 thermal insulation foam Substances 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 210000002683 foot Anatomy 0.000 claims description 4
- 239000005355 lead glass Substances 0.000 claims description 3
- 239000013081 microcrystal Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 17
- 229910000416 bismuth oxide Inorganic materials 0.000 description 14
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 14
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 239000008187 granular material Substances 0.000 description 7
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 229910000018 strontium carbonate Inorganic materials 0.000 description 7
- 229910052810 boron oxide Inorganic materials 0.000 description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 6
- 239000011787 zinc oxide Substances 0.000 description 6
- 229910000410 antimony oxide Inorganic materials 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910000464 lead oxide Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000000686 essence Substances 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 206010027439 Metal poisoning Diseases 0.000 description 1
- 208000005374 Poisoning Diseases 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000008242 dietary patterns Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 235000016709 nutrition Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- LEDMRZGFZIAGGB-UHFFFAOYSA-L strontium carbonate Chemical class [Sr+2].[O-]C([O-])=O LEDMRZGFZIAGGB-UHFFFAOYSA-L 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/02—Plates, dishes or the like
- A47G19/027—Plates, dishes or the like with means for keeping food cool or hot
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Cookers (AREA)
- Resistance Heating (AREA)
Abstract
The present invention is suitable for attemperator technical field, provide a kind of transportable food hot plate, for insulated food, including for glass-ceramics heating plate that is emitting far-infrared and being placed for food, the backboard being stacked with glass-ceramics heating plate, frame tightly in the edge of glass-ceramics heating plate and backboard to be electrically connected by the connection framework of glass-ceramics heating plate and backboard fixation and with glass-ceramics heating plate and for powering for glass-ceramics heating plate so that the emitting far-infrared electrically-controlled component of glass-ceramics heating plate.Transportable food hot plate provided by the invention is moved easily, light utilization is higher, and it is roughly the same in horizontal direction to place food its far infrared amount for receiving on glass-ceramics heating plate, therefore, is heated evenly.
Description
Technical field
The invention belongs to attemperator technical field, more particularly to a kind of transportable food hot plate.
Background technology
Microthermal climate when, food can gradually cool off during edible, and the taste bad of dish, is fried with electromagnetic oven
Pot heating heats food using micro-wave oven, is heated at high temperature the loss that food easily causes nutritional ingredient repeatedly, and more next
More Science Reports proposes the electromagnetic radiation produced in electromagnetic oven and micro-wave oven use, can cause eating patterns that essence occurs
Transformation, easily produces carcinogen, totally unfavorable to health.Therefore, in the market can heat food just there are a kind of
Formula food hot plate is taken, it mainly installs far infrared transmission pipe on transportable food hot plate, passes through far infrared transmission pipe
It is emitting far-infrared, to heat food, still, general far infrared transmission pipe all be bending be laid on transportable food hot plate
Below panel, and far infrared is dissipated around around the axis of far infrared transmission pipe, and only a small amount of light is vertical
The surface that food is held to transportable food hot plate is launched, and causes light utilization ratio low, and be placed on portable food
Food on thing hot plate is heated also uneven.
The content of the invention
It is an object of the invention to provide a kind of transportable food hot plate, it is intended to solves to be used to keep the temperature food in the prior art
The technical problem that the hot plate light utilization ratio of thing is low and food uneven heating is even.
The present invention is achieved in that a kind of transportable food hot plate, remote red for insulated food, including for launching
The glass-ceramics heating plate of outside line and confession food placement, the backboard being stacked with the glass-ceramics heating plate, frame are tightly in institute
State connection frame of the edge of glass-ceramics heating plate and the backboard the glass-ceramics heating plate and the backboard to be fixed
Frame and with the glass-ceramics heating plate be electrically connected and for for the glass-ceramics heating plate power so that the crystallite
The emitting far-infrared electrically-controlled component of glass heating board.
Further, the transportable food hot plate, which further includes, is arranged at the backboard and the glass-ceramics heating plate
Between heat insulation foam.
Further, the glass-ceramics heating plate is identical with the backboard shape and is in polygon, the connection framework
Including multiple end to end and frame be arranged on the glass-ceramics heating plate and the backboard length of side direction section bar and will be adjacent
The connector that the section bar is fixedly connected, each section bar are included along the glass-ceramics heating plate and the backboard length of side direction
The rectangular square tube of extension, the rectangular square tube are equipped with the square hole extended along its length, the both ends point of the connector
In each square hole not by the end insertion of the adjacent rectangular square tube.
Further, each section bar, which further includes, is fixedly connected on the rectangular square tube side wall and for fixing the crystallite
The keeper of glass heating board, the keeper are equipped with the first slot being inserted into for the edge of the glass-ceramics heating plate.
Further, each section bar, which further includes, is close to the first slot inner wall setting and is used to support the crystallite glass
The heat insulating mattress of glass heating board.
Further, the rectangular square tube includes close to the glass-ceramics heating plate and is fixedly installed the keeper
The first side plate and be fixedly connected on first side plate and the second side plate on the inside of the connection framework, be fixedly connected
It is respectively fixedly connected with first side plate and the 3rd side plate being located on the outside of the connection framework and both sides in described second
Side plate and fourth side plate of the 3rd side plate away from the first side plate side, the section bar further include be fixedly connected on it is described
The outer wall of second side plate and the gusset being arranged in parallel with the glass-ceramics heating plate, the gusset, second side plate and
The glass-ceramics heating plate surrounds the second slot for heat insulation foam insertion.
Further, the gusset is formed positioned at the gusset backwards to second slot-side with second side plate
Step, the edge of the backboard are positioned on the step and are fixedly connected with the gusset.
Further, the shape of the glass-ceramics heating plate and the backboard is rectangle, and the connection framework includes four
The square hole in the adjacent rectangular square tube is inserted at a end to end section bar, the rectangular shape of the connector and both ends
It is interior.
Further, the higher high-temperature region of temperature and the relatively low low temperature of temperature are arranged with the glass-ceramics heating plate
Area.
Further, the transportable food hot plate further includes the multiple support feets being fixedly installed on the backboard.
Having the technical effect that relative to the prior art of the invention：Transportable food hot plate provided by the invention is by micro-
Crystal glass heating board is emitting far-infrared, and far infrared its direction of the launch launched by whole heating board is upward, i.e., to meal
The direction of dish, therefore, light utilization is higher, and places food its far infrared for receiving on glass-ceramics heating plate
Measure roughly the same in horizontal direction, therefore, be heated evenly.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to the embodiment of the present invention or the prior art
Attached drawing is briefly described needed in description, it should be apparent that, drawings described below is only the present invention's
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the stereogram of transportable food hot plate provided in an embodiment of the present invention；
Fig. 2 is the stereogram of transportable food hot plate provided in an embodiment of the present invention；
Fig. 3 is the partial enlarged view of transportable food hot plate provided in an embodiment of the present invention；
Fig. 4 is the exploded view at Fig. 3；
Fig. 5 is the partial enlarged view of transportable food hot plate provided in an embodiment of the present invention；
Fig. 6 is the partial enlarged view of transportable food hot plate provided in an embodiment of the present invention；
Fig. 7 is the top view of glass-ceramics heating plate provided in an embodiment of the present invention；
Fig. 8 is the side view of glass-ceramics heating plate provided in an embodiment of the present invention.
Description of reference numerals：
Embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or has the function of same or like element.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is necessary to illustrate, when element is referred to as " being fixed on " or " being arranged at " another yuan
Part, it directly on another element or can be connected on another element.It is known as and " connects when an element
In " another element, it can be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
For the ordinary skill in the art, it can understand above-mentioned term in the present invention as the case may be
Concrete meaning.
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.
Referring to Fig. 1 to Fig. 4, transportable food hot plate provided in an embodiment of the present invention is used for insulated food, including with
It is stacked in emitting far-infrared and glass-ceramics heating plate 10 that is being placed for food and the glass-ceramics heating plate 10
Backboard 20, frame are tightly in the edge of the glass-ceramics heating plate 10 and the backboard 20 with by 10 and of the glass-ceramics heating plate
Connection framework 30 that the backboard 20 is fixed and it is electrically connected with the glass-ceramics heating plate 10 and for being the crystallite
Glass heating board 10 is powered so that the emitting far-infrared electrically-controlled component 40 of the glass-ceramics heating plate 10.
Fig. 1 to Fig. 4 is referred to, transportable food hot plate provided in an embodiment of the present invention includes glass-ceramics heating plate 10
One is fixed on the backboard 20 being stacked with the glass-ceramics heating plate 10 and by glass-ceramics heating plate 10 and backboard 20
The connection framework 30 risen, the transportable food hot plate of this tabular compare transportable food hot plate, and space hold is small, is easy to
Move, the convenient place for being moved any one edible food keeps the temperature food, in addition, the embodiment of the present invention provides
Transportable food hot plate be emitting far-infrared by glass-ceramics heating plate 10, and launched by whole heating board remote
Upward, i.e., the direction to food, therefore, light utilization is higher for infrared ray its direction of the launch, and places glass-ceramics heating
Its far infrared amount for receiving of food on plate 10 is roughly the same in horizontal direction, therefore, is heated evenly.
Refer to Fig. 5, further, the transportable food hot plate further include be arranged at the backboard 20 with it is described micro-
Heat insulation foam 50 between crystal glass heating board 10.Heat insulation foam 50 can prevent glass-ceramics heating plate 10 from launching to 20 direction of backboard
Far infrared, causes the object such as tea table of support transportable food hot plate to generate heat, is conducive to heat to being placed on crystallite
Food aggregation on glass heating board 10, improves the utilization ratio of energy.
Fig. 3 to Fig. 6 is referred to, further, the glass-ceramics heating plate 10 is identical with 20 shape of backboard and is in
Polygon, the connection framework 30 are arranged on the glass-ceramics heating plate 10 and the backboard 20 including multiple end to end and frame
The section bar 31 in length of side direction and the connector 32 for being fixedly connected with the adjacent section bar 31, each section bar 31 are included along described
Glass-ceramics heating plate 10 and the rectangular square tube 311 of 20 length of side direction of backboard extension, the rectangular square tube 311 are equipped with edge
The square hole 3115 of its length direction extension, the both ends of the connector 32 are respectively by the end of the adjacent rectangular square tube 311
In each square hole 3115 of insertion.In assembling, first glass-ceramics heating plate 10 and backboard 20 are fixed on section bar 31,
Then the both ends of connector 32 are inserted into the direction hole in two neighboring rectangular square tube 311 and glass-ceramics heating can be achieved
Plate 10 is connected with the frame of backboard 20, and dismounting is very convenient, it is preferable that the connector 32 is inserted into the square hole 3115
Afterwards, connector 32 is fixedly connected with rectangular tube by screw, to avoid connector 32 departs from section bar 31 and causes connection framework
30 fall apart.
Fig. 3 to Fig. 6 is referred to, further, each section bar 31, which further includes, is fixedly connected on 311 side of rectangular square tube
Wall and the keeper 312 for fixing the glass-ceramics heating plate 10, the keeper 312, which is equipped with, supplies the devitrified glass
First slot 3121 of the edge insertion of heating board 10.Each section bar 31, which further includes, to be close to 3121 inner wall of the first slot and sets
Put and be used to support the heat insulating mattress 313 of the glass-ceramics heating plate 10.Specifically, by 3121 inner wall of the first slot and micro-
Heat insulating mattress 313 is set between crystal glass heating board 10, it is possible to reduce the heat on glass-ceramics heating plate 10 is transmitted to section bar 31,
The utilization ratio of heat is improved, in addition, the place of 10 most fragile of glass-ceramics heating plate is its edge and corner angle position,
And by setting heat insulating mattress 313 to avoid devitrified glass between 3121 inner wall of the first slot and glass-ceramics heating plate 10
The corner angle position of heating board 10 contacts with section bar 31 and causes the damage of glass-ceramics heating plate 10.
Refer to Fig. 4 to Fig. 6, further, the rectangular square tube 311 include close to the glass-ceramics heating plate 10 and
It is fixedly installed the first side plate 3111 of the keeper 312 and is fixedly connected on first side plate 3111 and is located at described
Second side plate 3112 of the inner side of connection framework 30, be fixedly connected on first side plate 3111 and outside the connection framework 30
3rd side plate 3113 of side and both sides are respectively fixedly connected with remote in second side plate 3112 and the 3rd side plate 3113
4th side plate 3114 of 3111 side of the first side plate, the section bar 31, which further includes, is fixedly connected on second side plate 3112
Outer wall and the gusset 314 that is arranged in parallel with the glass-ceramics heating plate 10, the gusset 314, second side plate 3112
And the glass-ceramics heating plate 10 surrounds the second slot 315 for the heat insulation foam 50 insertion.This structure is only in square
It is the fixation realized to heat insulation foam 50 that the side of shape square tube 311, which is provided with gusset 314, and structure very simple, advantageously reduces
The manufacture cost of section bar 31.
Fig. 4 to Fig. 6 is referred to, further, the gusset 314 is formed with second side plate 3112 is located at the gusset
314 backwards to 315 side of the second slot step 316, the edge of the backboard 20 be positioned on the step 316 and with institute
Gusset 314 is stated to be fixedly connected.It can be seen from the above that the setting of the gusset 314 not only realizes the positioning and fixation of heat insulation foam 50, and
Realize to the spacing of backboard 20 and fix, multi-purpose content, the structure for simplifying section bar 31 further, reduces section bar 31
Manufacture cost, also, be conducive to by transportable food hot plate to more flattening design.Preferably, the backboard 20 with
The gusset 314 is fixedly connected by screw.
Fig. 1 to Fig. 6 is referred to, further, the shape of the glass-ceramics heating plate 10 and the backboard 20 is rectangle,
The connection framework 30 includes four end to end section bars 31, and the 32 rectangular shape of connector and both ends are inserted into adjacent
In square hole 3115 in the rectangular square tube 311.It is more both artistic and practical that transportable food hot plate is arranged to rectangular shape,
And for the more polygons of relative edge, rectangular shape can be reduced cuts number to section bar 31, decreases connector
32 use, so as to reduce manufacture cost.
Fig. 1 is referred to, further, higher 101 He of high-temperature region of temperature is arranged with the glass-ceramics heating plate 10
The relatively low low-temperature space 102 of temperature.For different foods, optimum temperature when it is edible is also different, such as fried food
Eaten in higher temperature, there is preferable mouthfeel, and for general cooking, temperature is unsuitable excessive when eating, therefore, of the invention
The higher high-temperature region 101 of temperature and the relatively low low-temperature space 102 of temperature are arranged with the glass-ceramics heating plate 10 of embodiment, can be with
Corresponding food is placed on corresponding region, food can be maintained to optimal temperature, user experience is provided with this.
Fig. 2 is referred to, further, the transportable food hot plate, which further includes, to be fixedly installed on the backboard 20
Multiple support feets 60.Preferably, the quantity of the support feet 60 is four.
Fig. 7 and Fig. 8 are referred to, preferably：
Glass-ceramics heating plate 10 provided in an embodiment of the present invention includes crystallite glass substrate carrier 11, high temperature sintering in institute
State the planar inorganic thick film 13 on the surface 16 of crystallite glass substrate carrier 11, the inorganic thick film 13 is connected in circuit
Electrode 14 and for connect power supply lead wire lead ends 15 and be affixed on the crystallite glass substrate carrier 11 with described in covering
The mica insulation emulsion sheet 18 of inorganic thick film 13, the electrode 14 and the lead ends 15, the lead ends 15 with it is described
Electrode 14 is electrically connected, and the electrode 14 is electrically connected with the inorganic thick film 13, and 13 high temperature sintering of inorganic thick film is in institute
State on crystallite glass substrate carrier 11, the inorganic thick film 13 includes the component of following weight fraction：
The glass-ceramics heating plate 10 of the present invention at least has the following advantages that：
1st, for inorganic thick film 13 due to not leaded, material is not only environmentally friendly, and is rich in far infrared, reduces environmental pollution,
Beneficial to health, overcome product largely to produce the three wastes using harmful substances such as strong acid, lead oxide due to needing, have to human body
The defects of evil and environmental pollution are serious.
2nd, the material granule degree of inorganic thick film 13 is finer, and resistance dispersion is small, and material sheet resistance is reproducible, and product closes
Lattice rate is high, has saved the energy, has reduced production cost, has improved the quality and precision of product, improve product competitiveness in the market.
3rd, the inorganic thick film 13 applied of the present invention, by using bismuth oxide as framework material, then with the use of boron oxide,
The components such as silica, zinc oxide, antimony oxide and strontium carbonate, had both realized the performance of inorganic thick film 13, meanwhile, relative to
Existing inorganic thick film 13 realizes zero content of lead oxide, it is therefore prevented that people's lead poisoning and to environment when using inorganic thick film 13
Pollution；The use of bismuth oxide is additionally, since, greatly improves the temperature in use of inorganic thick film 13, expands inorganic thick film 13
Use scope.
4th, the inorganic thick film 13 of glass-ceramics heating plate 10 of the invention is " planar " heater, its heating area is tradition
The several times of " linear " the fever bulk area of product, reduce the specific power density of heater, that is, reduce crystallite glass substrate load
The coefficient of expansion of body 11, since product is " linear " heat source heating structure, unit cross-sectional area work(when working so as to avoid product
Rate density is big, surface temperature is high, the local coefficient of expansion is big, yielding, work when have sound, prepare have line with heating function it is local because
Temperature is very high and the problems such as cause excessive the brought heating wire short circuit of the heater part coefficient of expansion, sparking, too fast oxidation；
5th, the inorganic thick film 13 of glass-ceramics heating plate 10 of the present invention using silk-screen printing technique and imposes high temperature sintering work
Skill, and heater and crystallite glass substrate carrier 11 are permanently made integral structure, have not stratified, not blistering, heat transfer is fast,
Temperature uniformly, resistance stabilization the features such as, it is easy to aging to overcome the glue-line of traditional glass-ceramics heating plate 10, local blistering, point
The defects of layer, resistance decrement, non-uniform temperature.
6th, its framework material of the inorganic thick film of glass-ceramics heating substrate of the present invention and resistance material use general industry
Cheap nonmetallic materials are made by mixing by proportioning and form, its price is only the 1/10 of noble metal electrothermal film material.Therefore this hair
Bright to be especially susceptible to promote, social benefit is obvious.
The inorganic thick film 13 of the glass-ceramics heating plate 10 of the embodiment of the present invention, including two big components, when graphite powder, separately
One ceramics being made of metal oxide, glass granules.The ceramics, glass granules are by bismuth oxide, boron oxide, titanium dioxide
Formed after silicon, zinc oxide, antimony oxide and strontium carbonate melting.
Specifically, the graphite is a kind of non-metallic conducting material, it is one kind of carbon simple substance, and inorganic thick film 13 is made in electric field
Under, carbon molecules group produces " Brownian movement " in inorganic thick film 13, and violent friction and shock occurs between carbon molecules, generation
Thermal energy is mainly externally transmitted in the form of far infrared radiation and convection current.Therefore the inorganic thick film 13 of glass-ceramics heating plate 10 of the present invention,
With where the feature rich in far infrared.The weight fraction of the graphite powder is 15-30 parts, is preferably 20-30 parts.The graphite powder
Particle diameter (be less than 200 mesh) below 200 mesh.
The weight fraction of the bismuth oxide is 60-75 parts, is preferably 70-75 parts, which is the skeleton of inorganic thick film 13
Material.Since bismuth oxide has higher softening point temperature (relative to lead oxide), a large amount of of bismuth oxide are used so that inorganic thickness
The film-forming temperature of film 13, coating maximum operation (service) temperature all obtain larger raising, the use scope of inorganic thick film 13 is obtained significantly
Widen.
The weight fraction of the boron oxide is 5-15 parts, and supplement of the boron oxide as bismuth oxide, plays inorganic thick film 13
Skeleton function；
The weight fraction of the silica is 0.5-2 parts, which is also the supplement of bismuth oxide, plays inorganic thick film 13
Skeleton function.
The bismuth oxide, boron oxide and silica are all framework material in inorganic thick film 13, and three cooperates, in nothing
Play a supporting role in machine thick film 13.Meanwhile by the adjustment effect of strontium carbonate, show the combination power between three kinds of framework materials
Write increase.
The weight fraction of the strontium carbonate is 3-5 parts, since the content of bismuth oxide is higher so that 13 each component of inorganic thick film
Between caking property substantially reduce, by adding a small amount of strontium carbonate, make combination power between bismuth oxide and other components significantly
Increase；By cooperating between the strontium carbonate and bismuth oxide, the combination power of inorganic thick film 13 is improved, it is therefore prevented that inorganic thick film
The problems such as 13 is cracked in the calcination process of preparation process, explosion.
The parts by weight of the zinc oxide are 3-6 parts.The addition of zinc oxide, can improve the coefficient of expansion of inorganic thick film 13, make
The coefficient of expansion of inorganic thick film 13 is consistent with glass, adjusts the combination power between inorganic thick film 13 and glass, makes inorganic thick film 13
Combination power on glass is more preferably.
The weight fraction of the antimony oxide is 3-5 parts.The antimony oxide coordinates the effect of strontium carbonate and zinc oxide, changes
The adhesive force of kind ceramics, glass granules and substrate, promotes the cohesive force between ceramics, glass granules, while strengthens ceramics, glass
Binding ability between particulate and carbon dust.
By using the various metal oxides of above-mentioned weight fraction, on the one hand improve temperature applicable range, on the other hand
Improve the surface between ceramics, glass granules and between ceramics, glass granules and carbon dust and combined power, improve inside semiconductor thick film
Combination power and adhesive force with carrier.Meanwhile each component is mutually coordinated, improves the thermal coefficient of expansion of inorganic thick film, improve
Its heat endurance.
In existing resistive coating material, lead occupies very big amount, and lead has very important meaning as the skeleton of material
Justice.But lead can produce very big influence to human body, environment.Those skilled in the art are attempting to drop the content of lead always
It is low, substituted with other materials, but prepared resistive coating its electric stability energy out, heat tolerance can etc. not
It is preferable.Especially with new material as framework material, the adhesive force and heat endurance of resistive coating can not be good
Solve.
The inorganic thick film 13 of glass-ceramics heating plate 10 of the present invention, as framework material, then is coordinated and made by using bismuth oxide
With components such as boron oxide, silica, zinc oxide, antimony oxide and strontium carbonates, the performance of inorganic thick film 13 was both realized, together
When, the content of lead oxide is greatly reduced relative to existing inorganic thick film 13, it is therefore prevented that people's lead when using inorganic thick film 13
Poisoning；The use of bismuth oxide is additionally, since, greatly improves the temperature in use of inorganic thick film 13, expands inorganic thick film 13
Use scope.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of transportable food hot plate, for insulated food, it is characterised in that including for emitting far-infrared and confession food
The glass-ceramics heating plate that thing is placed and the backboard that the glass-ceramics heating plate is stacked, frame are tightly in the devitrified glass
The edge of heating board and the backboard with by the glass-ceramics heating plate and the backboard fixation connection framework and with institute
Glass-ceramics heating plate is stated to be electrically connected and for powering so that the glass-ceramics heating plate for the glass-ceramics heating plate
Emitting far-infrared electrically-controlled component.
2. transportable food hot plate as claimed in claim 1, it is characterised in that the transportable food hot plate further includes
The heat insulation foam being arranged between the backboard and the glass-ceramics heating plate.
3. transportable food hot plate as claimed in claim 2, it is characterised in that the glass-ceramics heating plate and the back of the body
Plate shape is identical and is in polygon, the connection framework include multiple end to end and frame be arranged on the glass-ceramics heating plate and
The section bar in the backboard length of side direction and the connector for being fixedly connected with the adjacent section bar, each section bar are included along described
Glass-ceramics heating plate and the rectangular square tube of backboard length of side direction extension, the rectangular square tube are equipped with along its length
The square hole of extension, each square hole that the both ends of the connector are inserted into by the end of the adjacent rectangular square tube respectively
It is interior.
4. transportable food hot plate as claimed in claim 3, it is characterised in that each section bar, which further includes, to be fixedly connected on
The rectangular square tube side wall and the keeper for fixing the glass-ceramics heating plate, the keeper is equipped with for described micro-
First slot of the edge insertion of crystal glass heating board.
5. transportable food hot plate as claimed in claim 4, it is characterised in that each section bar, which further includes, is close to described
One slot inner wall sets and is used to support the heat insulating mattress of the glass-ceramics heating plate.
6. transportable food hot plate as claimed in claim 4, it is characterised in that the rectangular square tube is included close to described micro-
Crystal glass heating board and it is fixedly installed the first side plate of the keeper and is fixedly connected on first side plate and is located at
The second side plate on the inside of the connection framework, be fixedly connected on first side plate and on the outside of the connection framework the 3rd
Side plate and both sides are respectively fixedly connected with of second side plate and the 3rd side plate away from the first side plate side
Four side plates, the section bar further include the outer wall that is fixedly connected on second side plate and parallel with the glass-ceramics heating plate set
The gusset put, the gusset, second side plate and the glass-ceramics heating plate surround for heat insulation foam insertion
Two slots.
7. transportable food hot plate as claimed in claim 6, it is characterised in that the gusset is formed with second side plate
Step positioned at the gusset backwards to second slot-side, the edge of the backboard be positioned on the step and with it is described
Gusset is fixedly connected.
8. the transportable food hot plate as described in claim 3-7 any one, it is characterised in that the glass-ceramics heating
The shape of plate and the backboard is rectangle, and the connection framework includes four end to end section bars, and the connector is in
Rectangular-shaped and both ends are inserted into the square hole in the adjacent rectangular square tube.
9. the transportable food hot plate as described in claim 1-7 any one, it is characterised in that the glass-ceramics heating
The higher high-temperature region of temperature and the relatively low low-temperature space of temperature are arranged with plate.
10. the transportable food hot plate as described in claim 1-7 any one, it is characterised in that the transportable food
Hot plate further includes the multiple support feets being fixedly installed on the backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711465787.9A CN108040377B (en) | 2017-12-28 | Portable food thermal insulation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711465787.9A CN108040377B (en) | 2017-12-28 | Portable food thermal insulation plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108040377A true CN108040377A (en) | 2018-05-15 |
| CN108040377B CN108040377B (en) | 2024-07-02 |
Family
ID=
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