CN107272352B - 目标处理单元 - Google Patents

目标处理单元 Download PDF

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Publication number
CN107272352B
CN107272352B CN201710637657.2A CN201710637657A CN107272352B CN 107272352 B CN107272352 B CN 107272352B CN 201710637657 A CN201710637657 A CN 201710637657A CN 107272352 B CN107272352 B CN 107272352B
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China
Prior art keywords
vacuum chamber
housing
processing unit
lines
target processing
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CN201710637657.2A
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English (en)
Chinese (zh)
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CN107272352A (zh
Inventor
J.J.科宁
D.J.范登伯根
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ASML Netherlands BV
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ASML Netherlands BV
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/023Means for mechanically adjusting components not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975Assembly, maintenance, transport or storage of apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10Lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/20Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
CN201710637657.2A 2013-09-07 2014-09-08 目标处理单元 Active CN107272352B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361875016P 2013-09-07 2013-09-07
US61/875,016 2013-09-07
CN201480061165.8A CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480061165.8A Division CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Publications (2)

Publication Number Publication Date
CN107272352A CN107272352A (zh) 2017-10-20
CN107272352B true CN107272352B (zh) 2021-02-02

Family

ID=51492355

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710637657.2A Active CN107272352B (zh) 2013-09-07 2014-09-08 目标处理单元
CN201480061165.8A Active CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201480061165.8A Active CN105745577B (zh) 2013-09-07 2014-09-08 目标处理单元

Country Status (6)

Country Link
US (2) US9263234B2 (https=)
JP (2) JP6224252B2 (https=)
KR (2) KR101784752B1 (https=)
CN (2) CN107272352B (https=)
NL (2) NL2013437B1 (https=)
WO (1) WO2015032955A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9703213B2 (en) * 2011-09-12 2017-07-11 Mapper Lithography Ip B.V. Substrate processing apparatus
US9349567B2 (en) * 2013-05-10 2016-05-24 Hitachi High-Technologies Corporation Charged particle beam device
DE102016217285A1 (de) * 2016-09-12 2018-03-15 Carl Zeiss Smt Gmbh Vorrichtung zur übertragung von elektrischen signalen sowie lithographieanlage
WO2018074306A1 (ja) * 2016-10-17 2018-04-26 株式会社ニコン 露光システム及びリソグラフィシステム
US10905025B1 (en) * 2019-06-12 2021-01-26 Facebook, Inc. Interconnection module and server rack
CN111239916B (zh) * 2020-02-12 2021-05-18 烽火通信科技股份有限公司 光纤背板上光纤连接器用的清洁工具及清洁方法
KR102467191B1 (ko) * 2020-03-11 2022-11-16 주식회사 포스코 광 점퍼 코드 안전 장치 및 그를 이용한 전력 계통 시스템
CN113495436B (zh) * 2021-07-13 2023-12-29 江门市和盈新材料科技有限公司 一种光电子元件智能制造的光刻机
EP4290550A1 (en) * 2022-06-10 2023-12-13 ASML Netherlands B.V. Electron-optical device
CN121816638A (zh) * 2023-09-12 2026-04-07 朗姆研究公司 在气体输送系统中暴露于大气的防止

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250808A (en) * 1987-05-21 1993-10-05 Electroscan Corporation Integrated electron optical/differential pumping/imaging signal system for an environmental scanning electron microscope
US4831270A (en) * 1987-05-21 1989-05-16 Ion Implant Services Ion implantation apparatus
AU3794097A (en) 1996-06-10 1998-01-07 Holographic Lithography Systems, Inc. Holographic patterning method and tool for production environments
US6714278B2 (en) * 1996-11-25 2004-03-30 Nikon Corporation Exposure apparatus
TW591694B (en) * 2001-02-13 2004-06-11 Nikon Corp Specification determining method, making method and adjusting method of projection optical system, exposure apparatus and making method thereof, and computer system
US6756706B2 (en) 2002-01-18 2004-06-29 Nikon Corporation Method and apparatus for cooling power supply wires used to drive stages in electron beam lithography machines
JP2004055933A (ja) 2002-07-22 2004-02-19 Advantest Corp 電子ビーム露光装置、及び電子ビーム計測モジュール
JP2005106166A (ja) 2003-09-30 2005-04-21 Nikon Corp アクティブ除振装置及び露光装置
JP2005209702A (ja) * 2004-01-20 2005-08-04 Fujitsu Access Ltd 電子機器用キャビネット
JP4405867B2 (ja) * 2004-06-29 2010-01-27 キヤノン株式会社 電子線露光装置、および、デバイス製造方法
JP2006079911A (ja) * 2004-09-09 2006-03-23 Hitachi High-Technologies Corp 電子ビーム電流計測方法、電子ビーム描画装置および電子ビーム検出器
JP5408674B2 (ja) 2008-02-26 2014-02-05 マッパー・リソグラフィー・アイピー・ビー.ブイ. 投影レンズ構成体
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
NL1036912C2 (en) * 2009-04-29 2010-11-01 Mapper Lithography Ip Bv Charged particle optical system comprising an electrostatic deflector.
US8362441B2 (en) * 2009-10-09 2013-01-29 Mapper Lithography Ip B.V. Enhanced integrity projection lens assembly
NL2003619C2 (en) * 2009-10-09 2011-04-12 Mapper Lithography Ip Bv Projection lens assembly.
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
CN102834777B (zh) 2010-02-23 2016-03-09 Asml荷兰有限公司 光刻设备和器件制造方法
US20120069317A1 (en) * 2010-09-20 2012-03-22 Jerry Peijster Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
EP2681624B1 (en) * 2010-12-14 2016-07-20 Mapper Lithography IP B.V. Lithography system and method of processing substrates in such a lithography system
JP6038882B2 (ja) * 2011-04-20 2016-12-07 マッパー・リソグラフィー・アイピー・ビー.ブイ. 光ファイバの構成体及びこのような構成体を形成する方法
NL2007392C2 (en) 2011-09-12 2013-03-13 Mapper Lithography Ip Bv Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly.
US9703213B2 (en) * 2011-09-12 2017-07-11 Mapper Lithography Ip B.V. Substrate processing apparatus
CN103797420A (zh) 2011-09-12 2014-05-14 迈普尔平版印刷Ip有限公司 具有基底板的真空腔室
KR101945964B1 (ko) * 2012-05-14 2019-02-11 마퍼 리쏘그라피 아이피 비.브이. 하전 입자 다중-빔렛 리소그래피 시스템 및 냉각 장치 제조 방법
JP5936484B2 (ja) * 2012-08-20 2016-06-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び試料観察方法

Also Published As

Publication number Publication date
JP2016530728A (ja) 2016-09-29
KR101784752B1 (ko) 2017-11-06
US20150090895A1 (en) 2015-04-02
NL2013437A (en) 2015-03-10
US9941093B2 (en) 2018-04-10
JP6224252B2 (ja) 2017-11-01
KR102124913B1 (ko) 2020-06-22
NL2013438B1 (en) 2016-05-18
US20160126055A1 (en) 2016-05-05
CN105745577B (zh) 2018-01-23
NL2013437B1 (en) 2016-05-18
CN107272352A (zh) 2017-10-20
CN105745577A (zh) 2016-07-06
WO2015032955A1 (en) 2015-03-12
JP6580634B2 (ja) 2019-09-25
KR20170087970A (ko) 2017-07-31
US9263234B2 (en) 2016-02-16
KR20160055852A (ko) 2016-05-18
NL2013438A (en) 2015-03-10
JP2017224828A (ja) 2017-12-21

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