CN107266067A - 一种层状复合陶瓷板、制作方法及移动终端设备 - Google Patents

一种层状复合陶瓷板、制作方法及移动终端设备 Download PDF

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CN107266067A
CN107266067A CN201710448892.5A CN201710448892A CN107266067A CN 107266067 A CN107266067 A CN 107266067A CN 201710448892 A CN201710448892 A CN 201710448892A CN 107266067 A CN107266067 A CN 107266067A
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CN107266067B (zh
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张宁
谢庆丰
彭毅萍
肖时超
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Janus Dongguan Precision Components Co Ltd
Dongguan Huajing Powder Metallurgy Co Ltd
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Abstract

本发明公开了一种层状复合陶瓷板及其制作方法，该层状复合陶瓷板包括由多层叠片的坯体经过等静压压制、脱脂、烧结形成的层状结构，所述多层叠片包括ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料所制成的两种以上的层。还公开了采用该层状复合陶瓷板的移动终端设备。本发明的层状复合陶瓷板产品的断裂韧性高，同时其制作工艺简便易行，周期短，成本低。

Description

一种层状复合陶瓷板、制作方法及移动终端设备
技术领域
本发明涉及一种层状复合陶瓷板、制作方法及移动终端设备。
背景技术
随着消费电子市场的飞速发展，手机产品除硬件大容量化、功能多样化外，其外观结构件材料也频繁推陈出新，其经历了塑料、玻璃、金属的发展过程，以及近来出现的氧化锆陶瓷手机背板。虽然氧化锆陶瓷具备耐磨、耐腐蚀、高强度、高韧性、热稳定性好等诸多优良特性，与金属、塑料相比，氧化锆陶瓷的莫氏硬度高、介电常数高、无信号屏蔽且生物相容性好等特点，但陶瓷材料在制备过程中容易产生一些缺陷，如孔洞、杂质、异常长大的晶粒，同时在加工过程中，造成一些缺角、暗裂等外在缺陷，这些都会不同程度造成陶瓷发生断裂的风险，严重制约陶瓷材料在智能终端等消费类电子行业的应用普及。
发明内容
本发明的主要目的在于克服现有技术的不足，提供一种层状复合陶瓷板、制作方法及移动终端设备。
为实现上述目的，本发明采用以下技术方案：
一种层状复合陶瓷板，包括由多层叠片的坯体经过等静压压制、脱脂、烧结形成的层状结构，所述多层叠片包括ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料所制成的两种以上的层。
进一步地：
所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、(20-25)wt％的SiC+(20-25)Al2O3wt％的+(50-60)wt％的AlN的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、ZrO2层。
所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的SiC的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、ZrO2层。
所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、(20-25)wt％的SiC+(20-25)wt％的AlN+(50-60)wt％的Al2O3的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、ZrO2层。
所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、AlN层、ZrO2层；或ZrO2层、AlN层、SiC层、ZrO2层；或ZrO2层、AlN层、SiC层、TiC层、ZrO2层。
一种所述的层状复合陶瓷板的制作方法，包括以下步骤：
S1.将研磨成颗粒的ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料经流延成型为两种以上的薄片状坯体；
S2.将经过步骤S1得到的两种以上的薄片状坯体上下层叠形成多层叠片的坯体；
S3.将经过步骤S2得到的多层叠片的坯体置于等静压机中压制成一个整体；
S4.将经过步骤S3等静压压制得到的坯体经脱脂、烧结成为具有层状结构的陶瓷板。
进一步地,步骤S1包括：称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
一种移动终端设备，所述移动终端设备的外壳背板采用所述的层状复合陶瓷板制成。
本发明的有益效果：
本发明通过将SiC、AlN、Al2O3、ZrO2等多种陶瓷材料各自成型为薄片状结构，通过等静压压制成薄片状并将其交替叠层，经过脱脂、烧结得到的层状复合陶瓷板提高了产品的断裂韧性，同时制作工艺简便易行，周期短，成本低，为陶瓷材料在手机背板上的应用提供强有力支撑。
本发明的具体优点有：
1.复合层状陶瓷材料的断裂韧性高，陶瓷板抗跌落性能强。
2.工艺过程简单可行，适合于大批量工业化生产，外观面均保留氧化锆陶瓷的高硬度及美观。
3.根据产品性能需求，通过配方及叠层次序的调整可满足多种需求，可实现梯度化生产，不同材料种类间的适应性好。
附图说明
图1为本发明实施例一至三的层状复合陶瓷板的层状结构示意图；
图2为本发明实施例四的层状复合陶瓷板的层状结构示意图；
图3为本发明实施例五的层状复合陶瓷板的层状结构示意图；
图4为本发明实施例六的层状复合陶瓷板的层状结构示意图。
具体实施方式
以下对本发明的实施方式作详细说明。应该强调的是，下述说明仅仅是示例性的，而不是为了限制本发明的范围及其应用。
参阅图1至图4，在一种实施例中，一种层状复合陶瓷板，包括由多层叠片的坯体经过等静压压制、脱脂、烧结形成的层状结构，所述多层叠片包括ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料所制成的两种以上的层。
在另一种实施例中，一种所述层状复合陶瓷板的制作方法，包括以下步骤：
S1.将研磨成颗粒的ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料经流延成型为两种以上的薄片状坯体；
S2.将经过步骤S1得到的两种以上的薄片状坯体上下层叠形成多层叠片的坯体；
S3.将经过步骤S2得到的多层叠片的坯体置于等静压机中压制成一个整体；
S4.将经过步骤S3等静压压制得到的坯体经脱脂、烧结成为具有层状结构的陶瓷板。
在又一种实施例中，一种移动终端设备，所述移动终端设备的外壳背板采用前述实施例的一种层状复合陶瓷板制成。在具体实施例中，层状复合陶瓷板的结构参阅图1至图4。
在具体实施例中，所述层状复合陶瓷板的制作方法可以包括以下过程：
1.分别将ZrO2、SiC、AlN、Al2O3、WC、TiC等原料颗粒球磨至一定细度；
2.以上几种单一陶瓷材料或几种混合陶瓷材料经流延成型为薄片状结构，并裁剪成同样大小的尺寸；
3.以上制备的薄片陶瓷坯体按照类似三明治结构进行交替叠放整齐；
4.将步骤3所制备的多层叠片坯体置于等静压机中压成一个整体；
5.等静压完成的坯体经脱脂、烧结成为具有层状结构的陶瓷坯体；
6.以上陶瓷坯体经过CNC、研磨、抛光等工序制成可用于移动终端设备的陶瓷背板；
实施例一
称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
将以上流延成型的膜片，裁成大小为180×90mm的坯体。
按照质量百分数(20-25)wt％的SiC+(20-25)wt％的Al2O3+(50-60)wt％的AlN称取共10Kg、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2称取共10Kg，分别按照相同的方法制成坯体。
将坯体按照从上到下为：
ZrO2层1、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层2、(20-25)wt％的SiC+(20-25)Al2O3wt％的+(50-60)wt％的AlN的混合材料层3、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层2、ZrO2层1的顺序依次叠层，如图1所示。
将叠层后的坯体经等静压制成一块厚度为1-1.5mm的块状坯体。
将块状坯体经脱脂，真空烧结完成后制成陶瓷片。
将制成的陶瓷片经CNC外形、研磨、抛光、等加工后，制成移动终端用的陶瓷背板。
测试以上方法制备的陶瓷背板的的断裂韧性并进行对比(见表1)。
实施例二
称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
以上流延成型的膜片，裁成大小为180×90mm的坯体。
按照质量百分数(50-60)wt％的SiC+(20-25)wt％的AlN+(20-25)wt％的Al2O3称取共10Kg、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2称取共10Kg，按照相同的方法分别制成坯体。
将坯体按照从上到下为：
ZrO2层1、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层2、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的SiC的混合材料层3＇、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层2、ZrO2层1的顺序依次叠层，如图1所示。
将叠层后的坯体经等静压制成一块厚度为1-1.5mm的块状坯体。
将块状坯体经脱脂，真空烧结完成后制成陶瓷片。
将制成的陶瓷片经CNC外形、研磨、抛光、等加工后，制成移动终端用的陶瓷背板。
测试以上方法制备的陶瓷背板的的断裂韧性并进行对比(见表1)。
实施例三
称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
以上流延成型的膜片，裁成大小为180×90mm的坯体。
按照质量百分数(20-25)wt％的SiC+(20-25)wt％的AlN+(50-60)wt％的Al2O3称取共10Kg、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2称取共10Kg，按照相同的方法分别制成坯体。
将坯体按照从上到下为：
ZrO2层1、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层2、(20-25)wt％的SiC+(20-25)wt％的AlN+(50-60)wt％的Al2O3的混合材料层3＇＇、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层2、ZrO2层1的顺序依次叠层，如图1所示。
将叠层后的坯体经等静压制成一块厚度为1-1.5mm的块状坯体。
将块状坯体经脱脂，真空烧结完成后制成陶瓷片。
将制成的陶瓷片经CNC外形、研磨、抛光、等加工后，制成移动终端用的陶瓷背板。
测试以上方法制备的陶瓷背板的的断裂韧性并进行对比(见表1)。
表1层状陶瓷材料性能对比
通过以上实施例做制备的层状陶瓷的性能对比可以看出，通过层状结构的设计陶瓷密度减小的同时断裂韧性均有提高，实施例1实现的断裂韧性的提高幅度最大。
实施例四
称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
以上流延成型的膜片，裁成大小为180×90mm的坯体。
AlN、SiC、TiC三种粉料各称取10Kg，按照相同的方法，制成单一组分的坯体。
将所制备的坯体按照从上到下ZrO2层1、AlN层4、ZrO2层1的顺序叠层，参见图2。
分别将叠层后的坯体经等静压制成一块厚度为1-1.5mm的块状坯体。
将块状坯体经脱脂，真空烧结完成后制成陶瓷片。
将制成的陶瓷片经CNC外形、研磨、抛光、等加工后，制成移动终端用的陶瓷背板。
测试以上方法制备的陶瓷背板的的断裂韧性并进行对比(见表2)。
实施例五
称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
以上流延成型的膜片，裁成大小为180×90mm的坯体。
AlN、SiC、TiC三种粉料各称取10Kg，按照相同的方法，制成单一组分的坯体。
将所制备的坯体按照从上到下ZrO2层1、AlN层4、SiC层5、ZrO2层1的顺序叠层，参见图3。
分别将叠层后的坯体经等静压制成一块厚度为1-1.5mm的块状坯体。
将块状坯体经脱脂，真空烧结完成后制成陶瓷片。
将制成的陶瓷片经CNC外形、研磨、抛光、等加工后，制成移动终端用的陶瓷背板。
测试以上方法制备的陶瓷背板的的断裂韧性并进行对比(见表2)。
实施例六
称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
以上流延成型的膜片，裁成大小为180×90mm的坯体。
AlN、SiC、TiC三种粉料各称取10Kg，按照相同的方法，制成单一组分的坯体。
将所制备的坯体按照从上到下ZrO2层1、AlN层4、SiC层5、TiC层6、ZrO2层1的顺序叠层，参见图4。
分别将叠层后的坯体经等静压制成一块厚度为1-1.5mm的块状坯体。
将块状坯体经脱脂，真空烧结完成后制成陶瓷片。
将制成的陶瓷片经CNC外形、研磨、抛光、等加工后，制成移动终端用的陶瓷背板。
测试以上方法制备的陶瓷背板的的断裂韧性并进行对比(见表2)。
表2层状陶瓷材料性能对比
以上内容是结合具体/优选的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，其还可以对这些已描述的实施方式做出若干替代或变型，而这些替代或变型方式都应当视为属于本发明的保护范围。

Claims (8)

1.一种层状复合陶瓷板，其特征在于,包括由多层叠片的坯体经过等静压压制、脱脂、烧结形成的层状结构，所述多层叠片包括ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料所制成的两种以上的层。
2.如权利要求1所述的层状复合陶瓷板，其特征在于,所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、(20-25)wt％的SiC+(20-25)Al2O3wt％的+(50-60)wt％的AlN的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、ZrO2层。
3.如权利要求1所述的层状复合陶瓷板，其特征在于,所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的SiC的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、ZrO2层。
4.如权利要求1所述的层状复合陶瓷板，其特征在于,所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、(20-25)wt％的SiC+(20-25)wt％的AlN+(50-60)wt％的Al2O3的混合材料层、(20-25)wt％的AlN+(20-25)wt％的Al2O3+(50-60)wt％的ZrO2的混合材料层、ZrO2层。
5.如权利要求1所述的层状复合陶瓷板，其特征在于,所述多层叠片包括按照从上到下的顺序依次层叠的：ZrO2层、AlN层、ZrO2层；或ZrO2层、AlN层、SiC层、ZrO2层；或ZrO2层、AlN层、SiC层、TiC层、ZrO2层。
6.一种如权利要求1至5任一项所述的层状复合陶瓷板的制作方法，其特征在于,包括以下步骤：
S1.将研磨成颗粒的ZrO2、SiC、AlN、Al2O3、WC、TiC中的单一材料或几种混合的材料经流延成型为两种以上的薄片状坯体；
S2.将经过步骤S1得到的两种以上的薄片状坯体上下层叠形成多层叠片的坯体；
S3.将经过步骤S2得到的多层叠片的坯体置于等静压机中压制成一个整体；
S4.将经过步骤S3等静压压制得到的坯体经脱脂、烧结成为具有层状结构的陶瓷板。
7.如权利要求6所述的制作方法，其特征在于,步骤S1包括：称取ZrO2粉10Kg投入到球磨机中，锆球作为研磨介质，丁酮作为溶剂，其中料：球：溶剂(质量百分比)＝1：(1.5-2)：(0.5-0.8)，球磨20-22h后，加入聚乙烯醇缩丁醛(PVB)作为粘结剂，邻苯二甲酸二甲酯作增塑剂，丙三基油酸作为分散剂，球磨2-3h，经真空脱泡和过滤后经流延成型，制成厚度为0.2-0.3mm的膜片。
8.一种移动终端设备，其特征在于,所述移动终端设备的外壳背板采用如权利要求1至5任一项所述的层状复合陶瓷板制成。
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CN110323383A (zh) * 2019-06-24 2019-10-11 Oppo广东移动通信有限公司 电池盖及其制备方法和移动终端
CN111362692A (zh) * 2020-04-15 2020-07-03 常州联德电子有限公司 高强度多层陶瓷共烧结构及其制备方法
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CN110092645B (zh) * 2019-05-24 2021-07-13 广东工业大学 一种复合陶瓷基板及其制备方法
CN110323383A (zh) * 2019-06-24 2019-10-11 Oppo广东移动通信有限公司 电池盖及其制备方法和移动终端
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CN112028638A (zh) * 2020-07-31 2020-12-04 深圳陶陶科技有限公司 一种陶瓷材料及其制备方法和应用
CN112919912A (zh) * 2021-04-23 2021-06-08 西安航空学院 一种SiC/TiC层状复合材料及其制备方法
TWI806482B (zh) * 2022-03-10 2023-06-21 誠創科技股份有限公司 陶瓷基板及其製造方法

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