CN107252988B - 焊点检查方法 - Google Patents
焊点检查方法 Download PDFInfo
- Publication number
- CN107252988B CN107252988B CN201710445973.XA CN201710445973A CN107252988B CN 107252988 B CN107252988 B CN 107252988B CN 201710445973 A CN201710445973 A CN 201710445973A CN 107252988 B CN107252988 B CN 107252988B
- Authority
- CN
- China
- Prior art keywords
- solder joint
- mentioned
- discreet area
- area
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0127238 | 2012-11-12 | ||
KR1020120127238A KR101501914B1 (ko) | 2012-11-12 | 2012-11-12 | 솔더 조인트 검사방법 |
CN201310552523.2A CN103808269A (zh) | 2012-11-12 | 2013-11-08 | 焊点检查方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310552523.2A Division CN103808269A (zh) | 2012-11-12 | 2013-11-08 | 焊点检查方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107252988A CN107252988A (zh) | 2017-10-17 |
CN107252988B true CN107252988B (zh) | 2019-10-01 |
Family
ID=50681745
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710445973.XA Active CN107252988B (zh) | 2012-11-12 | 2013-11-08 | 焊点检查方法 |
CN201310552523.2A Pending CN103808269A (zh) | 2012-11-12 | 2013-11-08 | 焊点检查方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310552523.2A Pending CN103808269A (zh) | 2012-11-12 | 2013-11-08 | 焊点检查方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9221128B2 (zh) |
JP (1) | JP5795046B2 (zh) |
KR (1) | KR101501914B1 (zh) |
CN (2) | CN107252988B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101614061B1 (ko) * | 2012-03-29 | 2016-04-20 | 주식회사 고영테크놀러지 | 조인트 검사 장치 |
JP6140891B2 (ja) * | 2013-05-20 | 2017-06-07 | コー・ヤング・テクノロジー・インコーポレーテッド | 周波数走査干渉計を用いた形状測定装置 |
JP6116710B2 (ja) * | 2014-01-08 | 2017-04-19 | ヤマハ発動機株式会社 | 外観検査装置および外観検査方法 |
CN105115980A (zh) * | 2015-09-10 | 2015-12-02 | 苏州威盛视信息科技有限公司 | 空焊aoi锡膏检测方法 |
US10338032B2 (en) * | 2016-11-22 | 2019-07-02 | Gm Global Technology Operations Llc. | Automated quality determination of joints |
CN109813728A (zh) * | 2019-03-01 | 2019-05-28 | 沈阳建筑大学 | 一种电路板焊点检测方法及系统 |
CN112453750A (zh) * | 2019-09-09 | 2021-03-09 | 英业达科技有限公司 | 依据标准值建立检测模型以确认焊接状态的系统及方法 |
CN111692990B (zh) * | 2020-05-12 | 2021-12-07 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 极耳焊点检测方法和装置 |
CN115922021A (zh) * | 2021-08-12 | 2023-04-07 | 台达电子工业股份有限公司 | 自动焊锡加工系统及自动焊锡加工方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183906A (ja) * | 1989-12-13 | 1991-08-09 | Matsushita Electric Ind Co Ltd | 半田の外観検査方法 |
US5064291A (en) * | 1990-04-03 | 1991-11-12 | Hughes Aircraft Company | Method and apparatus for inspection of solder joints utilizing shape determination from shading |
JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
CN101943571A (zh) * | 2009-07-03 | 2011-01-12 | 株式会社高永科技 | 电路板检查装置及检查方法 |
CN102538698A (zh) * | 2010-11-15 | 2012-07-04 | 株式会社高永科技 | 板检查方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291505A (ja) * | 1988-09-29 | 1990-03-30 | Omron Tateisi Electron Co | 回路基板の半田面検査装置 |
JP3189642B2 (ja) * | 1995-09-20 | 2001-07-16 | 松下電器産業株式会社 | リード先端部の位置検出方法 |
JPH09321500A (ja) | 1996-05-28 | 1997-12-12 | Oki Electric Ind Co Ltd | 半田付け状態の外観検査方法 |
JPH10141929A (ja) | 1996-11-12 | 1998-05-29 | Hitachi Ltd | はんだ付け検査装置 |
JP3411890B2 (ja) | 2000-07-03 | 2003-06-03 | アンリツ株式会社 | 印刷半田検査装置 |
CN101583249A (zh) * | 2008-05-15 | 2009-11-18 | 松下电器产业株式会社 | 印刷的软钎膏的检查方法以及装置 |
KR101251372B1 (ko) | 2008-10-13 | 2013-04-05 | 주식회사 고영테크놀러지 | 3차원형상 측정방법 |
DE102010064635B4 (de) | 2009-07-03 | 2024-03-14 | Koh Young Technology Inc. | Verfahren zum Untersuchen eines Messobjektes |
JP5290233B2 (ja) | 2010-04-13 | 2013-09-18 | Ckd株式会社 | 三次元計測装置及び基板検査装置 |
-
2012
- 2012-11-12 KR KR1020120127238A patent/KR101501914B1/ko active IP Right Grant
-
2013
- 2013-11-06 US US14/073,199 patent/US9221128B2/en active Active
- 2013-11-08 CN CN201710445973.XA patent/CN107252988B/zh active Active
- 2013-11-08 CN CN201310552523.2A patent/CN103808269A/zh active Pending
- 2013-11-12 JP JP2013233764A patent/JP5795046B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183906A (ja) * | 1989-12-13 | 1991-08-09 | Matsushita Electric Ind Co Ltd | 半田の外観検査方法 |
US5064291A (en) * | 1990-04-03 | 1991-11-12 | Hughes Aircraft Company | Method and apparatus for inspection of solder joints utilizing shape determination from shading |
JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
CN101943571A (zh) * | 2009-07-03 | 2011-01-12 | 株式会社高永科技 | 电路板检查装置及检查方法 |
CN102538698A (zh) * | 2010-11-15 | 2012-07-04 | 株式会社高永科技 | 板检查方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5795046B2 (ja) | 2015-10-14 |
KR101501914B1 (ko) | 2015-03-12 |
CN103808269A (zh) | 2014-05-21 |
KR20140060665A (ko) | 2014-05-21 |
CN107252988A (zh) | 2017-10-17 |
US20140133738A1 (en) | 2014-05-15 |
JP2014095711A (ja) | 2014-05-22 |
US9221128B2 (en) | 2015-12-29 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Patentee after: Gaoying Technology Co.,Ltd. Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Patentee before: KOH YOUNG TECHNOLOGY Inc. |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: Han Guoshouershi Patentee after: Gaoying Technology Co.,Ltd. Address before: 15 / F, 14 / F, No.53, Jiashan digital 2 Road, Jinchuan District, Seoul, Korea Patentee before: Gaoying Technology Co.,Ltd. |