JP5795046B2 - ソルダージョイントの検査方法 - Google Patents
ソルダージョイントの検査方法 Download PDFInfo
- Publication number
- JP5795046B2 JP5795046B2 JP2013233764A JP2013233764A JP5795046B2 JP 5795046 B2 JP5795046 B2 JP 5795046B2 JP 2013233764 A JP2013233764 A JP 2013233764A JP 2013233764 A JP2013233764 A JP 2013233764A JP 5795046 B2 JP5795046 B2 JP 5795046B2
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- JP
- Japan
- Prior art keywords
- solder joint
- height
- solder
- region
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
120:ソルダージョイント
130:印刷回路基板
140:予想領域
Claims (4)
- 半導体部品のリードを印刷回路基板のパッドに結合させるソルダージョイントを検査する方法において、
前記半導体部品のリード端部の外側にのみソルダージョイント予想領域を設定する段階と、
前記ソルダージョイント予想領域の画像を獲得する段階と、
前記ソルダージョイント予想領域の画像を用いて前記ソルダージョイント予想領域内のソルダージョイントの高さを算出する段階と、
前記ソルダージョイント予想領域内のソルダージョイントの平均高さと既設定された前記ソルダージョイントの基準高さとを比較してソルダージョイントの良否を判別する段階と、
を含むことを特徴とする、ソルダージョイント検査方法。 - 前記ソルダージョイント予想領域は、
前記リードのキャドデータ上の厚さ領域内で設定されることを特徴とする、
請求項1に記載のソルダージョイント検査方法。 - 前記ソルダージョイントの良否の判別は、
前記既設定された前記ソルダージョイントの基準高さに対する前記ソルダージョイント予想領域内のソルダージョイントの平均高さが占める比率を算出する段階と、
前記ソルダージョイントの平均高さが占める比率が既設定された基準比率以上であるかの可否を判別する段階と、
を含むことを特徴とする、請求項1記載のソルダージョイント検査方法。 - 前記ソルダージョイントの基準高さは、
前記ソルダージョイント予想領域の高さであることを特徴とする、
請求項1または請求項3に記載のソルダージョイント検査方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0127238 | 2012-11-12 | ||
KR1020120127238A KR101501914B1 (ko) | 2012-11-12 | 2012-11-12 | 솔더 조인트 검사방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014095711A JP2014095711A (ja) | 2014-05-22 |
JP5795046B2 true JP5795046B2 (ja) | 2015-10-14 |
Family
ID=50681745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013233764A Active JP5795046B2 (ja) | 2012-11-12 | 2013-11-12 | ソルダージョイントの検査方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9221128B2 (ja) |
JP (1) | JP5795046B2 (ja) |
KR (1) | KR101501914B1 (ja) |
CN (2) | CN103808269A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101614061B1 (ko) * | 2012-03-29 | 2016-04-20 | 주식회사 고영테크놀러지 | 조인트 검사 장치 |
JP6140891B2 (ja) * | 2013-05-20 | 2017-06-07 | コー・ヤング・テクノロジー・インコーポレーテッド | 周波数走査干渉計を用いた形状測定装置 |
JP6116710B2 (ja) * | 2014-01-08 | 2017-04-19 | ヤマハ発動機株式会社 | 外観検査装置および外観検査方法 |
CN105115980A (zh) * | 2015-09-10 | 2015-12-02 | 苏州威盛视信息科技有限公司 | 空焊aoi锡膏检测方法 |
US10338032B2 (en) * | 2016-11-22 | 2019-07-02 | Gm Global Technology Operations Llc. | Automated quality determination of joints |
CN109813728A (zh) * | 2019-03-01 | 2019-05-28 | 沈阳建筑大学 | 一种电路板焊点检测方法及系统 |
CN112453750A (zh) * | 2019-09-09 | 2021-03-09 | 英业达科技有限公司 | 依据标准值建立检测模型以确认焊接状态的系统及方法 |
CN111692990B (zh) * | 2020-05-12 | 2021-12-07 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 极耳焊点检测方法和装置 |
CN115922021A (zh) * | 2021-08-12 | 2023-04-07 | 台达电子工业股份有限公司 | 自动焊锡加工系统及自动焊锡加工方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291505A (ja) * | 1988-09-29 | 1990-03-30 | Omron Tateisi Electron Co | 回路基板の半田面検査装置 |
JPH0794972B2 (ja) | 1989-12-13 | 1995-10-11 | 松下電器産業株式会社 | 半田の外観検査方法 |
US5064291A (en) * | 1990-04-03 | 1991-11-12 | Hughes Aircraft Company | Method and apparatus for inspection of solder joints utilizing shape determination from shading |
JP3189642B2 (ja) * | 1995-09-20 | 2001-07-16 | 松下電器産業株式会社 | リード先端部の位置検出方法 |
JPH09321500A (ja) | 1996-05-28 | 1997-12-12 | Oki Electric Ind Co Ltd | 半田付け状態の外観検査方法 |
JPH10141929A (ja) | 1996-11-12 | 1998-05-29 | Hitachi Ltd | はんだ付け検査装置 |
JP3411890B2 (ja) | 2000-07-03 | 2003-06-03 | アンリツ株式会社 | 印刷半田検査装置 |
JP2002107311A (ja) * | 2000-09-28 | 2002-04-10 | Mitsubishi Heavy Ind Ltd | 実装基板検査装置及び方法 |
CN101583249A (zh) * | 2008-05-15 | 2009-11-18 | 松下电器产业株式会社 | 印刷的软钎膏的检查方法以及装置 |
KR101251372B1 (ko) | 2008-10-13 | 2013-04-05 | 주식회사 고영테크놀러지 | 3차원형상 측정방법 |
DE102010030883B4 (de) * | 2009-07-03 | 2018-11-08 | Koh Young Technology Inc. | Vorrichtung zur Prüfung einer Platte und Verfahren dazu |
US8369603B2 (en) | 2009-07-03 | 2013-02-05 | Koh Young Technology Inc. | Method for inspecting measurement object |
JP5290233B2 (ja) | 2010-04-13 | 2013-09-18 | Ckd株式会社 | 三次元計測装置及び基板検査装置 |
KR101657952B1 (ko) * | 2010-11-15 | 2016-09-20 | 주식회사 고영테크놀러지 | 기판 검사방법 |
-
2012
- 2012-11-12 KR KR1020120127238A patent/KR101501914B1/ko active IP Right Grant
-
2013
- 2013-11-06 US US14/073,199 patent/US9221128B2/en active Active
- 2013-11-08 CN CN201310552523.2A patent/CN103808269A/zh active Pending
- 2013-11-08 CN CN201710445973.XA patent/CN107252988B/zh active Active
- 2013-11-12 JP JP2013233764A patent/JP5795046B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN103808269A (zh) | 2014-05-21 |
JP2014095711A (ja) | 2014-05-22 |
CN107252988A (zh) | 2017-10-17 |
KR101501914B1 (ko) | 2015-03-12 |
KR20140060665A (ko) | 2014-05-21 |
US20140133738A1 (en) | 2014-05-15 |
CN107252988B (zh) | 2019-10-01 |
US9221128B2 (en) | 2015-12-29 |
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