CN107211500B - 有机el面板的制造方法 - Google Patents

有机el面板的制造方法 Download PDF

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Publication number
CN107211500B
CN107211500B CN201580072618.1A CN201580072618A CN107211500B CN 107211500 B CN107211500 B CN 107211500B CN 201580072618 A CN201580072618 A CN 201580072618A CN 107211500 B CN107211500 B CN 107211500B
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China
Prior art keywords
organic
substrate
air
base material
film
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Expired - Fee Related
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CN201580072618.1A
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English (en)
Chinese (zh)
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CN107211500A (zh
Inventor
松本康男
野田基央
壶内贤司
泽崎浩史
盐见秀数
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/02—Platens
    • B41J11/06—Flat page-size platens or smaller flat platens having a greater size than line-size platens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H10K50/171—Electron injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Handling Of Sheets (AREA)
  • Advancing Webs (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201580072618.1A 2015-01-07 2015-12-18 有机el面板的制造方法 Expired - Fee Related CN107211500B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015001579A JP6254108B2 (ja) 2015-01-07 2015-01-07 有機ｅｌパネルの製造方法
JP2015-001579 2015-01-29
PCT/JP2015/085557 WO2016111145A1 (ja) 2015-01-07 2015-12-18 有機ｅｌパネルの製造方法

Publications (2)

Publication Number Publication Date
CN107211500A CN107211500A (zh) 2017-09-26
CN107211500B true CN107211500B (zh) 2020-01-07

Family

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Family Applications (1)

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CN201580072618.1A Expired - Fee Related CN107211500B (zh) 2015-01-07 2015-12-18 有机el面板的制造方法

Country Status (6)

Country Link
US (1) US10686162B2 (https=)
EP (1) EP3244702A4 (https=)
JP (1) JP6254108B2 (https=)
KR (1) KR20170101295A (https=)
CN (1) CN107211500B (https=)
WO (1) WO2016111145A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5799181B1 (ja) 2015-01-07 2015-10-21 住友化学株式会社 有機電子素子の製造方法
CN110961320A (zh) * 2019-10-14 2020-04-07 信利光电股份有限公司 一种改善OC光阻mura的方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101733258A (zh) * 2008-11-14 2010-06-16 乐金显示有限公司 清洗装置
JP2010140705A (ja) * 2008-12-10 2010-06-24 Konica Minolta Holdings Inc 有機エレクトロルミネッセンスパネル及びその製造方法、該有機エレクトロルミネッセンスパネルを用いた照明装置、表示装置
CN102049901A (zh) * 2009-10-29 2011-05-11 株式会社日立工业设备技术 喷墨涂敷装置以及方法
CN102365712A (zh) * 2009-03-02 2012-02-29 维易科精密仪器国际贸易(上海)有限公司 幅材基板沉积系统
WO2012172919A1 (ja) * 2011-06-14 2012-12-20 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法
CN102848704A (zh) * 2011-06-30 2013-01-02 Sfa工程股份有限公司 印刷机
CN203241698U (zh) * 2013-05-03 2013-10-16 中山新诺科技有限公司 一种柔性面板连续无掩膜光刻装置
CN103764301A (zh) * 2011-08-01 2014-04-30 富士胶片株式会社 功能膜制造方法和功能膜
CN104015466A (zh) * 2013-02-28 2014-09-03 新日铁住金化学株式会社 层叠部件的制造方法
JP2014180603A (ja) * 2013-03-18 2014-09-29 Toray Ind Inc 塗布装置、塗布方法およびディスプレイ用部材の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4129861B2 (ja) 2002-08-02 2008-08-06 大日本印刷株式会社 塗工装置
JP2004131215A (ja) * 2002-10-09 2004-04-30 Ushio Inc 帯状ワークの搬送装置
US7966743B2 (en) * 2007-07-31 2011-06-28 Eastman Kodak Company Micro-structured drying for inkjet printers
US8967075B2 (en) 2009-10-29 2015-03-03 Hitachi, Ltd. Inkjet coating device and inkjet coating method
WO2012039218A1 (ja) 2010-09-25 2012-03-29 コニカミノルタホールディングス株式会社 塗布方法、有機エレクトロニクス素子の製造方法
JP2012192332A (ja) 2011-03-16 2012-10-11 Toray Ind Inc 塗布装置、塗布方法およびディスプレイ用部材の製造方法
JP5986490B2 (ja) * 2012-11-22 2016-09-06 住友化学株式会社 光学シートの製造方法
KR102851236B1 (ko) 2013-03-13 2025-08-26 카티바, 인크. 가스 인클로저 시스템 및 보조 인클로저를 이용하는 방법
JP6312959B2 (ja) * 2013-07-17 2018-04-18 セーレン株式会社 インクジェット記録装置
JP5799181B1 (ja) 2015-01-07 2015-10-21 住友化学株式会社 有機電子素子の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101733258A (zh) * 2008-11-14 2010-06-16 乐金显示有限公司 清洗装置
JP2010140705A (ja) * 2008-12-10 2010-06-24 Konica Minolta Holdings Inc 有機エレクトロルミネッセンスパネル及びその製造方法、該有機エレクトロルミネッセンスパネルを用いた照明装置、表示装置
CN102365712A (zh) * 2009-03-02 2012-02-29 维易科精密仪器国际贸易(上海)有限公司 幅材基板沉积系统
CN102049901A (zh) * 2009-10-29 2011-05-11 株式会社日立工业设备技术 喷墨涂敷装置以及方法
WO2012172919A1 (ja) * 2011-06-14 2012-12-20 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法
CN102848704A (zh) * 2011-06-30 2013-01-02 Sfa工程股份有限公司 印刷机
CN103764301A (zh) * 2011-08-01 2014-04-30 富士胶片株式会社 功能膜制造方法和功能膜
CN104015466A (zh) * 2013-02-28 2014-09-03 新日铁住金化学株式会社 层叠部件的制造方法
JP2014180603A (ja) * 2013-03-18 2014-09-29 Toray Ind Inc 塗布装置、塗布方法およびディスプレイ用部材の製造方法
CN203241698U (zh) * 2013-05-03 2013-10-16 中山新诺科技有限公司 一种柔性面板连续无掩膜光刻装置

Also Published As

Publication number Publication date
CN107211500A (zh) 2017-09-26
US10686162B2 (en) 2020-06-16
JP6254108B2 (ja) 2017-12-27
US20180269432A1 (en) 2018-09-20
KR20170101295A (ko) 2017-09-05
EP3244702A1 (en) 2017-11-15
EP3244702A4 (en) 2018-09-05
JP2016126963A (ja) 2016-07-11
WO2016111145A1 (ja) 2016-07-14

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Granted publication date: 20200107