CN107209407A - 柔性显示模组的绑定方法 - Google Patents

柔性显示模组的绑定方法 Download PDF

Info

Publication number
CN107209407A
CN107209407A CN201580073407.XA CN201580073407A CN107209407A CN 107209407 A CN107209407 A CN 107209407A CN 201580073407 A CN201580073407 A CN 201580073407A CN 107209407 A CN107209407 A CN 107209407A
Authority
CN
China
Prior art keywords
display panels
flexible
flexible display
binding
mould group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201580073407.XA
Other languages
English (en)
Other versions
CN107209407B (zh
Inventor
朱剑磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN ROYOLE DISPLAY TECHNOLOGY Co.,Ltd.
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN107209407A publication Critical patent/CN107209407A/zh
Application granted granted Critical
Publication of CN107209407B publication Critical patent/CN107209407B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field
    • G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
    • G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)

Abstract

一种柔性显示模组的绑定方法，包括：制备具有第一绑定区(10)的柔性显示面板(1)；贴合中间基板(3)至柔性显示面板(1)的背离第一绑定区(10)的表面(12)；对位驱动集成电路(4)的第二绑定区(41)与第一绑定区(10)；在第一温度下，预压合第一绑定区(10)与第二绑定区(41)；剥离柔性显示面板(1)；展平柔性显示面板(1)；在第二温度下，压合第一绑定区(10)与第二绑定区(41)，形成柔性显示模组。通过柔性显示模组的绑定方法形成的柔性显示模组良品率高。

Description

柔性显示模组的绑定方法 技术领域
本发明涉及柔性显示模组技术领域，特别涉及一种柔性显示模组的绑定方法。
背景技术
随着显示技术的发展，柔性显示模组将得到越来越多的应用。现今柔性显示模组主要包括柔性显示面板和对应的驱动电路，当柔性显示面板制作完成后，需要在柔性显示面板上通过导电介质连接外部驱动芯片，这个过程一般称之为绑定(bonding)。绑定工艺中用于实现连接的导电介质一般为ACF(Anisotropic Conductive Film，各向异性导电膜)，其特点是只在受到压力的方向上实现电性导通，在没有受到压力的其他方向不导通。然而如果直接在柔性显示面板上进行绑定，由于绑定工艺中的高温热压环境，容易使柔性显示面板发生变形，也就会导致出现绑定对位不准的现象，严重影响产品的质量。
为解决上述问题，业内人士通常先将柔性显示面板通过胶体贴合在刚性承载板上，然后再进行绑定，最后采用激光扫描的方法将柔性显示面板从刚性承载板上剥离下来。但是在剥离柔性显示面板时出现了新的问题：由于绑定工艺中本压的温度大多在150度～200度之间，会对现有设置在柔性显示面板和刚性承载板之间的胶体产生影响，使得位于绑定区域的胶体的固化状态发生变化，在后续使用激光剥离产生困难。此时需要加大激光量以促进胶体分解，但是加大激光照射量和时间会使得柔性显示面板的柔性基板发生碳化和形变，产生大量微粒，甚至影响柔性显示面板上的TFT(Thin Film Transistor，薄膜晶体管)器件和电路的性能，最终导致柔性显示模组的良品率偏低。
发明内容
本发明的实施例提供了一种良品率高的柔性显示模组的绑定方法。
为了实现上述目的，本发明实施方式采用如下技术方案：
提供一种柔性显示模组的绑定方法，所述绑定方法包括：
制备具有第一绑定区的柔性显示面板；
贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面；
对位驱动集成电路的第二绑定区与所述第一绑定区；
在第一温度下，预压合所述第一绑定区与所述第二绑定区；
剥离所述柔性显示面板；
展平所述柔性显示面板；
在第二温度下，压合所述第一绑定区与所述第二绑定区。
优选的，所述制备具有第一绑定区的柔性显示面板包括：
清洗玻璃基板；
在所述玻璃基板的一侧涂覆聚酰亚胺薄膜，固化后形成柔性基板；
在所述柔性基板上制备显示层；
利用激光将所述柔性基板自所述玻璃基板上剥离。
优选的，所述在所述柔性基板上制备显示层包括：
在所述柔性基板表面沉积SiNx钝化层；
在所述SiNx钝化层上制作薄膜晶体管驱动矩阵；
切割所述柔性基板，以形成多个显示区；
在每个所述显示区上蒸镀发光层，并在所述发光层上形成保护层。
优选的，所述贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面包括：
均匀涂覆胶体至所述中间基板；
贴合所述中间基板上涂覆所述胶体的一侧至所述柔性显示面板的背离所述第一绑定区的表面。
优选的，所述胶体为水溶胶。
优选的，所述中间基板为刚性基板，所述柔性显示面板被展平后与所述中间基板相贴合。
优选的，所述剥离所述柔性显示面板包括：
通过强力粘结剂贴附抓取件至所述柔性显示面板的周边；
抓住所述抓取件、并逐渐将所述柔性显示面板从所述中间基板上剥离。
优选的，所述强力粘结剂的粘结力大于所述胶体的粘结力。
优选的，所述抓取件的数量为一个，所述抓取件贴附在所述柔性显示面板的周边的一角；或者所述抓取件的数量为至少两个，所述抓取件贴附在所述柔 性显示面板的周边的同一侧。
优选的，所述剥离所述柔性显示面板包括：
通过强力粘结剂贴附所述柔性显示面板周边的一角或者一侧边至滚动件；
滚动所述滚动件以逐渐自所述中间基板上剥离所述柔性显示面板。
相较于现有技术，通过本发明所述绑定方法制备柔性显示模组时：所述柔性显示面板通过贴合紧固在所述中间基板，使得所述第一绑定区保持平整，从而不会出现所述柔性显示面板固有的因尺寸延展而导致对位困难的问题，能够有效保障在此基础上进行预压合时，所述第一绑定区与所述第二绑定区的对位精确。完成预压合后，即将所述柔性显示面板自所述中间基板上剥离，由于预压合是低温工艺，因此所述柔性显示面板可以容易地自所述中间基板上剥离，避免产生所述柔性显示面板内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。最后，展平所述柔性显示面板后进行压合，以形成柔性显示模组，被展平的所述柔性显示面板保持有良好的平整度，因此所述柔性显示面板上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，从而在本压过程中均匀受热，进一步保障了所述第一绑定区与所述第二绑定区的对位精度和绑定质量。因此，通过本发明所述绑定方法绑定完成的所述柔性显示模组良品率高。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1至图5为本发明柔性显示模组的绑定方法中各个步骤对应的制程的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图5，本发明实施例提供一种柔性显示模组的绑定方法，主要包括如下步骤：
Step1：制备柔性显示面板1，所述柔性显示面板1的第一表面11上设置有第一绑定区10，如图1所示。
Step2：在所述柔性显示面板1的相对于所述第一表面11设置的第二表面12上贴合中间基板3，使得所述第一绑定区保持平整，如图2所示。
Step3：提供驱动集成电路4，所述驱动集成电路4包括有第二绑定区41，将所述第二绑定区41与所述第一绑定区10对位，并在第一温度下预压合所述第一绑定区10与所述第二绑定区41，如图3所示。
Step4：将所述柔性显示面板1自所述中间基板3上剥离，如图4所示。
Step5：展平所述柔性显示面板1，并在第二温度下压合所述第一绑定区10与所述第二绑定区41，如图5所示，以形成柔性显示模组。在此步骤中完成了将所述驱动集成电路4绑定至所述柔性显示面板1的过程，从而形成柔性显示模组。
在本实施例中，所述柔性显示面板1通过贴合紧固在所述中间基板3上，使所述第一绑定区10保持平整，从而不会出现所述柔性显示面板1固有的因尺寸延展而导致对位困难的问题，能够有效保障在此基础上进行预压合时，所述第一绑定区10与所述第二绑定区41的对位精确。完成预压合后，即将所述柔性显示面板1自所述中间基板3上剥离，由于预压合是在第一温度下进行的，定义所述第一温度为低温温度，包括但不限于60°至90°范围内的温度，因此所述柔性显示面板1可以容易地自所述中间基板3上剥离，避免产生所述柔性显示面板1内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。最后，展平所述柔性显示面板1后进行压合，以形成柔性显示模组，被展平的所述柔性显示面板1保持有良好的平整度，因此所述柔性显示面板1上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区10和所述第二绑定区41可以在压合过程中均匀受热，进一步保障了所述第一绑定区10与所述第二绑定区41的对位精度和绑定质量。因此，通过上述绑定方法绑定完成的所述柔性显示模组良品率高。
应当理解的是，本实施例所述展平，包括但不限于以张开、展开、拉开等 方式使被展平的结构(例如所述柔性显示面板1)实现平整状态。
进一步的，所述柔性显示模组的绑定方法的步骤Step1中的所述柔性显示面板1的制备包括：
Step11：清洗玻璃基板；
Step12：在所述玻璃基板的一侧涂覆聚酰亚胺薄膜，固化后形成柔性基板；
Step13：在所述柔性基板上制备显示层；
Step14：利用激光将所述柔性基板自所述玻璃基板上剥离，以形成柔性显示面板1。
在上述柔性显示面板1的制备过程中，由于所述柔性基板在激光剥离之前是紧固结合在所述玻璃基板表面上的，因此所述柔性基板表面平整，可以高质量地在所述柔性基板上形成显示层，实现所述柔性显示面板1的高分辨率显示功能。同时，由于所述柔性基板在未进行驱动集成电路的绑定工序之间即从所述玻璃基板上剥离，因此连接所述柔性基板和玻璃基板的胶体并不会发生固化状态的变化，简单的激光照射过程即可顺利地剥离所述柔性基板，并且不会损坏所述柔性基板及所述显示层。
进一步的，所述柔性显示面板1的制备过程的步骤S13可以进一步细化为：
步骤S131：在所述柔性基板表面沉积SiNx钝化层；
步骤S132：在所述SiNx钝化层上制作薄膜晶体管(Thin Film Transistor，TFT)驱动矩阵；
步骤S133：切割所述柔性基板，以形成多个显示区；
步骤S134：在每个所述显示区上蒸镀发光层，并在所述发光层上形成保护层。
优选的，所述发光层可以是电子墨水显示层，以使所述显示层具有超低耗电量，有利于降低所述柔性显示模组的能耗。
进一步的，在所述柔性显示模组的绑定方法的步骤Step2中，可以通过胶体2贴合所述柔性显示面板与所述中间基板，也即可以均匀涂覆胶体至所述中间基板，然后贴合所述中间基板上涂覆所述胶体的一侧至所述柔性显示面板的背离所述第一绑定区的表面。在所述柔性显示模组的绑定方法中，由于在完成预压合后即将所述柔性显示面板1自所述中间基板3上剥离，且预压合是低温工艺(预压合温度一般处于60°到90°范围之间)，因此连接在所述柔性显 示面板1和所述中间基板3之间的所述胶体2的固化状态不会发生变化，所述柔性显示面板1可以容易地自所述中间基板3上剥离，避免产生所述柔性显示面板1内的柔性基板、电子器件和电路因加大激光照射量和时间而发生损伤的问题。
进一步的，采用的所述胶体2是一种可实现过渡性粘贴功能的胶体。优选的，所述胶体2为水溶胶。
进一步的，所述中间基板3为刚性基板，所述柔性显示面板1被展平后与所述刚性基板相贴合，由此使得所述第一绑定区10保持平整，能够有效保障在此基础上进行预压合时，所述第一绑定区10与所述第二绑定区41的对位精确。所述刚性基板优选玻璃基板。
进一步的，所述柔性显示模组的绑定方法的步骤Step3中，首先在所述第一绑定区10的绑定表面或者在所述第二绑定区41的绑定表面上贴附各向异性导电膜(Anisotropic Conductive Film，ACF)，然后再进行所述第一绑定区10和所述第二绑定区41的对位和预压合。所述各向异性导电膜用以实现所述第一绑定区10和所述第二绑定区41的电连接。
作为本发明的一种优选实施例，在所述柔性显示模组的绑定方法的步骤Step4中，可以先通过强力粘结剂在所述柔性显示面板1的周边贴附抓取件，然后通过抓住所述抓取件逐渐将所述柔性显示面板1从所述中间基板3上剥离。应当理解的是，所述强力粘结剂并不特指某一种粘结剂，只要其的粘结力比所述胶体2的粘结力大，能够将所述柔性显示面板1从所述中间基板3上剥离即可。所述柔性显示面板1的周边，是所述柔性显示面板1的显示区的周边区域，这些周边区域在所述柔性显示模组制备完成后通常会被切割掉，因此所述抓取件最终会脱离所述柔性显示面板1，不会对所述柔性显示面板1的使用造成影响。
优选的，可以仅设置一个所述抓取件，并贴附在所述柔性显示面板1的周边的一处；也可以同时设置至少两个所述抓取件，并贴附在所述柔性显示面板1的周边的同一侧。所述抓取件的数量以及贴附位置可以依据所述柔性显示面板1的大小和形状灵活设定。
作为本发明的另一种优选实施例，在所述柔性显示模组的绑定方法的步骤Step4中，可以通过强力粘结剂将所述柔性显示面板1周边的一角或者一侧边 贴附在滚动件上，然后滚动所述滚动件以逐渐将所述柔性显示面板从所述中间基板上剥离。应当理解的是，所述强力粘结剂并不特指某一种粘结剂，只要其的粘结力比所述胶体2的粘结力大，能够将所述柔性显示面板1从所述中间基板3上剥离即可。所述柔性显示面板1的周边，是所述柔性显示面板1的显示区的周边区域，这些周边区域在所述柔性显示模组制备完成后通常会被切割掉，因此所述滚动件最终会脱离所述柔性显示面板1，不会对所述柔性显示面板1的使用造成影响。
优选的，在所述柔性显示模组的绑定方法的步骤Step5中，如图5所示，展平所述柔性显示面板1时，可以在所述柔性显示面板1的四个角上施加张紧力F，按照箭头指向的方向(也即背离所述柔性显示面板1中心的方向)张紧所述柔性显示面板1。被展平的所述柔性显示面板1保持有良好的平整度，因此所述柔性显示面板1上需要进行压合的区域可以完整地紧贴在用以进行压合的平台上，使所述第一绑定区10和所述第二绑定区41可以在压合过程中均匀受热，进一步保障了所述第一绑定区10与所述第二绑定区41的对位精度和绑定质量。
以上对本发明实施例所提供的所述柔性显示模组的绑定方法进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (10)

  1. 一种柔性显示模组的绑定方法，其特征在于，所述绑定方法包括：
    制备具有第一绑定区的柔性显示面板；
    贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面；
    对位驱动集成电路的第二绑定区与所述第一绑定区；
    在第一温度下，预压合所述第一绑定区与所述第二绑定区；
    剥离所述柔性显示面板；
    展平所述柔性显示面板；
    在第二温度下，压合所述第一绑定区与所述第二绑定区。
  2. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述制备具有第一绑定区的柔性显示面板包括：
    清洗玻璃基板；
    在所述玻璃基板的一侧涂覆聚酰亚胺薄膜，固化后形成柔性基板；
    在所述柔性基板上制备显示层；
    利用激光将所述柔性基板自所述玻璃基板上剥离。
  3. 如权利要求2所述的柔性显示模组的绑定方法，其特征在于，所述在所述柔性基板上制备显示层包括：
    在所述柔性基板表面沉积SiNx钝化层；
    在所述SiNx钝化层上制作薄膜晶体管驱动矩阵；
    切割所述柔性基板，以形成多个显示区；
    在每个所述显示区上蒸镀发光层，并在所述发光层上形成保护层。
  4. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述贴合中间基板至所述柔性显示面板的背离所述第一绑定区的表面包括：
    均匀涂覆胶体至所述中间基板；
    贴合所述中间基板上涂覆所述胶体的一侧至所述柔性显示面板的背离所述第一绑定区的表面。
  5. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述胶体为水溶胶。
  6. 如权利要求1所述的柔性显示模组的绑定方法，其特征在于，所述中 间基板为刚性基板，所述柔性显示面板被展平后与所述中间基板相贴合。
  7. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述剥离所述柔性显示面板包括：
    通过强力粘结剂贴附抓取件至所述柔性显示面板的周边；
    抓住所述抓取件、并逐渐将所述柔性显示面板从所述中间基板上剥离。
  8. 如权利要求7所述的柔性显示模组的绑定方法，其特征在于，所述强力粘结剂的粘结力大于所述胶体的粘结力。
  9. 如权利要求7所述的柔性显示模组的绑定方法，其特征在于，所述抓取件的数量为一个，所述抓取件贴附在所述柔性显示面板的周边的一角；或者所述抓取件的数量为至少两个，所述抓取件贴附在所述柔性显示面板的周边的同一侧。
  10. 如权利要求4所述的柔性显示模组的绑定方法，其特征在于，所述剥离所述柔性显示面板包括：
    通过强力粘结剂贴附所述柔性显示面板周边的一角或者一侧边至滚动件；
    滚动所述滚动件以逐渐自所述中间基板上剥离所述柔性显示面板。
CN201580073407.XA 2015-12-11 2015-12-11 柔性显示模组的绑定方法 Active CN107209407B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/097207 WO2017096628A1 (zh) 2015-12-11 2015-12-11 柔性显示模组的绑定方法

Publications (2)

Publication Number Publication Date
CN107209407A true CN107209407A (zh) 2017-09-26
CN107209407B CN107209407B (zh) 2020-06-23

Family

ID=59013676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580073407.XA Active CN107209407B (zh) 2015-12-11 2015-12-11 柔性显示模组的绑定方法

Country Status (6)

Country Link
US (1) US10115931B2 (zh)
EP (1) EP3388888A4 (zh)
JP (1) JP2018531411A (zh)
KR (1) KR101925743B1 (zh)
CN (1) CN107209407B (zh)
WO (1) WO2017096628A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111201482A (zh) * 2017-11-30 2020-05-26 深圳市柔宇科技有限公司 显示屏保护结构、显示组件及切割方法、贴膜方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010051840A1 (en) * 2000-05-31 2001-12-13 Shinichi Sugimoto Mounting apparatus and mounting method
JP2004029576A (ja) * 2002-06-27 2004-01-29 Toshiba Corp 平面表示装置の製造方法、及びこれに用いる異方性導電膜の貼り付け用熱圧着装置
TW200849582A (en) * 2007-06-14 2008-12-16 Samsung Sdi Co Ltd Flexible substrate bonding and debonding apparatus
JP2009098625A (ja) * 2007-09-28 2009-05-07 Epson Imaging Devices Corp 電気光学装置及びその製造方法並びに電子機器
CN101458414A (zh) * 2007-12-13 2009-06-17 比亚迪股份有限公司 显示面板电极的防腐蚀方法和防腐蚀热烫装置
CN102768419A (zh) * 2011-12-05 2012-11-07 北京京东方光电科技有限公司 一种cog绑定工艺方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3364081B2 (ja) * 1995-02-16 2003-01-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6556268B1 (en) * 1999-03-31 2003-04-29 Industrial Technology Research Institute Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB
KR20060122491A (ko) * 2005-05-27 2006-11-30 삼성전자주식회사 가요성 표시 장치의 제조 방법
CN100414419C (zh) 2005-12-16 2008-08-27 群康科技(深圳)有限公司 驱动元件贴附方法及贴附设备
JP4292424B2 (ja) * 2006-11-15 2009-07-08 セイコーエプソン株式会社 配線基板およびその製造方法、並びに電子機器
JP2010225845A (ja) * 2009-03-24 2010-10-07 Seiko Epson Corp 基板の接続構造、電気光学装置、および電子機器
JP5285144B2 (ja) 2009-03-26 2013-09-11 シャープ株式会社 チップ部品実装構造、チップ部品実装方法および液晶表示装置
JP5434242B2 (ja) * 2009-05-11 2014-03-05 株式会社リコー 可撓性電子回路基板およびその製造方法、並びに画像表示装置
KR101263339B1 (ko) * 2011-09-23 2013-05-16 주식회사 에스에프에이 구동용 회로기판의 본딩장치
US8658444B2 (en) * 2012-05-16 2014-02-25 International Business Machines Corporation Semiconductor active matrix on buried insulator
US8816578B1 (en) * 2012-07-16 2014-08-26 Rockwell Collins, Inc. Display assembly configured for reduced reflection
CN103592785B (zh) 2012-08-13 2016-07-06 北京京东方光电科技有限公司 一种cog绑定方法及温度控制设备
CN104081552B (zh) 2012-12-28 2016-08-10 深圳市柔宇科技有限公司 柔性电子器件的制作方法和制作柔性电子器件的基板
JP2015072362A (ja) * 2013-10-03 2015-04-16 株式会社ジャパンディスプレイ 表示装置及びその製造方法
CN104166491B (zh) * 2014-08-11 2017-06-16 深圳市宇顺电子股份有限公司 触控屏的制作方法及触控屏
CN104377118B (zh) 2014-09-29 2017-08-29 京东方科技集团股份有限公司 柔性显示基板的制作方法及柔性显示基板母板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010051840A1 (en) * 2000-05-31 2001-12-13 Shinichi Sugimoto Mounting apparatus and mounting method
JP2004029576A (ja) * 2002-06-27 2004-01-29 Toshiba Corp 平面表示装置の製造方法、及びこれに用いる異方性導電膜の貼り付け用熱圧着装置
TW200849582A (en) * 2007-06-14 2008-12-16 Samsung Sdi Co Ltd Flexible substrate bonding and debonding apparatus
JP2009098625A (ja) * 2007-09-28 2009-05-07 Epson Imaging Devices Corp 電気光学装置及びその製造方法並びに電子機器
CN101458414A (zh) * 2007-12-13 2009-06-17 比亚迪股份有限公司 显示面板电极的防腐蚀方法和防腐蚀热烫装置
CN102768419A (zh) * 2011-12-05 2012-11-07 北京京东方光电科技有限公司 一种cog绑定工艺方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111201482A (zh) * 2017-11-30 2020-05-26 深圳市柔宇科技有限公司 显示屏保护结构、显示组件及切割方法、贴膜方法

Also Published As

Publication number Publication date
EP3388888A1 (en) 2018-10-17
KR101925743B1 (ko) 2018-12-05
KR20170139630A (ko) 2017-12-19
US10115931B2 (en) 2018-10-30
WO2017096628A1 (zh) 2017-06-15
EP3388888A4 (en) 2019-07-03
JP2018531411A (ja) 2018-10-25
CN107209407B (zh) 2020-06-23
US20180151847A1 (en) 2018-05-31

Similar Documents

Publication Publication Date Title
CN110416264B (zh) 显示装置的绑定方法及显示装置
WO2020258459A1 (zh) 显示面板及其制备方法
CN1570718A (zh) 接合芯片与其它装置于液晶显示面板上的方法及显示装置
JP2005026682A (ja) Ｃｏｇ実装方式の構造
WO2020103292A1 (zh) 液晶显示装置
JP6006955B2 (ja) 接続体の製造方法、接続方法
CN107111170A (zh) 柔性显示模组的绑定方法
CN210073288U (zh) 显示面板与显示装置
CN107283989B (zh) 压合装置及在显示面板上压合胶体的方法
CN107209407A (zh) 柔性显示模组的绑定方法
WO2020087771A1 (zh) 一种显示面板的修复方法及显示面板
CN108957872A (zh) 显示装置
CN101013236A (zh) 黏贴结构及其制造方法
CN209343102U (zh) 一种覆晶薄膜和显示面板
CN103906357A (zh) 显示模组的印刷电路板及其固定方法、显示装置
CN203521391U (zh) 一种柔性基板预制组件
CN110267433A (zh) 一种电路板补强工艺及电路板
CN101141027A (zh) 平面显示器基板的电路连接结构与其连接方法
CN207927008U (zh) Fpc的连接结构
CN104157250B (zh) 显示装置及其制作方法
JP2018531411A6 (ja) フレキシブルディスプレイモジュールのボンディング方法
CN206906759U (zh) 一种液晶显示模组
TW201219895A (en) Liquid crystal display device with crack-proof connection terminals on flexible printed circuit board
CN105572929A (zh) 显示面板及其制备方法、显示装置
CN110461131A (zh) 散热板组件、显示模组及其组装方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Shenzhen City, Guangdong province 518052 Keyuan Road, Nanshan District science and Technology Park No. 15 Science Park Sinovac A4-1501

Patentee after: Shenzhen Ruoyu Technology Co.,Ltd.

Address before: Shenzhen City, Guangdong province 518052 Keyuan Road, Nanshan District science and Technology Park No. 15 Science Park Sinovac A4-1501

Patentee before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20210812

Address after: 518100 Rouyu international flexible display base, No. 18 dingshanhe Road, Pingdi street, Longgang District, Shenzhen, Guangdong Province

Patentee after: SHENZHEN ROYOLE DISPLAY TECHNOLOGY Co.,Ltd.

Address before: A4-1501, Kexing Science Park, 15 Keyuan Road, Science Park, Nanshan District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen Ruoyu Technology Co.,Ltd.

TR01 Transfer of patent right