CN107177189A - 树脂组合物及其应用 - Google Patents
树脂组合物及其应用 Download PDFInfo
- Publication number
- CN107177189A CN107177189A CN201610149219.7A CN201610149219A CN107177189A CN 107177189 A CN107177189 A CN 107177189A CN 201610149219 A CN201610149219 A CN 201610149219A CN 107177189 A CN107177189 A CN 107177189A
- Authority
- CN
- China
- Prior art keywords
- resin
- resin combination
- group
- styrene
- metal salt
- Prior art date
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- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 172
- 239000011347 resin Substances 0.000 claims abstract description 172
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- -1 isocyanuric acid ester Chemical class 0.000 claims description 40
- 150000003839 salts Chemical class 0.000 claims description 35
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 32
- 229910052757 nitrogen Inorganic materials 0.000 claims description 29
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 27
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 22
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims description 21
- 239000003063 flame retardant Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 11
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 10
- 239000000806 elastomer Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 9
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000003786 synthesis reaction Methods 0.000 claims description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 5
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052788 barium Inorganic materials 0.000 claims description 5
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 5
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 5
- 239000011575 calcium Substances 0.000 claims description 5
- 229910052791 calcium Inorganic materials 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 239000011591 potassium Substances 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 229910052708 sodium Inorganic materials 0.000 claims description 5
- 239000011734 sodium Substances 0.000 claims description 5
- 229910052712 strontium Inorganic materials 0.000 claims description 5
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 5
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 5
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 3
- 150000003440 styrenes Chemical class 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 125000000623 heterocyclic group Chemical group 0.000 claims description 2
- 229960001545 hydrotalcite Drugs 0.000 claims description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 2
- 125000001905 inorganic group Chemical group 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 235000012222 talc Nutrition 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000012745 toughening agent Substances 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 claims 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 229910052570 clay Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000005984 hydrogenation reaction Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 15
- 229930185605 Bisphenol Natural products 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 10
- 125000001841 imino group Chemical group [H]N=* 0.000 description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
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- 238000002360 preparation method Methods 0.000 description 8
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
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- 229920000642 polymer Polymers 0.000 description 6
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
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- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 4
- 150000000345 2,6-xylenols Chemical class 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 4
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- 235000010290 biphenyl Nutrition 0.000 description 4
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- 230000000052 comparative effect Effects 0.000 description 4
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- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
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- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 239000012779 reinforcing material Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003368 amide group Chemical group 0.000 description 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 229920005604 random copolymer Polymers 0.000 description 3
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Abstract
一种树脂组合物,包含:(a)一可热硬化树脂系统,其于10GHz的频率时,介电损耗(Df)不大于0.006;以及(b)一具式(I)结构的次磷酸金属盐,其中,a、R及Ma+系如本文中所定义,且以该树脂系统(a)及该次磷酸金属盐(b)的总重量计,该次磷酸金属盐(b)的含量为1重量%至30重量%。
Description
技术领域
本发明是关于一种树脂组合物,尤其是关于一种包含次磷酸金属盐(metalhypophosphite)的树脂组合物,及使用该树脂组合物所提供的半硬化片(prepreg)与积层板(laminate)。
背景技术
印刷电路板(printed circuit board,PCB)为电子装置的电路基板,其搭载其他电子构件并将该等构件电性连通,以提供安稳的电路工作环境。常见的PCB基板为铜箔披覆的积层板(copper clad laminate,CCL),其主要是由树脂、补强材与铜箔所组成。常见的树脂如环氧树脂、酚醛树脂、聚胺甲醛、硅酮及铁氟龙等;常用的补强材则如玻璃纤维布、玻璃纤维席、绝缘纸、亚麻布等。
一般而言,印刷电路板可以如下方法制得。将一如玻璃织物的补强材含浸于一树脂(例如环氧树脂)中,并将经含浸树脂的玻璃织物硬化至半硬化状态(即B-阶段(B-stage))以获得一半硬化片。随后,将预定层数的半硬化片层叠,并于该层叠半硬化片的至少一外侧层叠一金属箔以提供一层叠物,接着对该层叠物进行一热压操作(即C-阶段(C-stage))而得到一金属披覆积层板。蚀刻该金属披覆积层板表面的金属箔以形成特定的电路图案(circuit pattern)。而后,在该金属披覆积层板上凿出复数个孔洞,并在此等孔洞中镀覆导电材料以形成通孔(via holes),借此完成印刷电路板的制备。
在许多产品应用中,树脂材料必须具备良好难燃性。在某些情况下,可以借助使用本身具有阻燃效果的树脂,例如卤代聚合物来提供难燃性。若树脂本身难燃性不佳,则必须于树脂中添加阻燃剂。已知可作为阻燃剂的化合物包含无机氢氧化物、有机磷化合物、有机卤化合物、含卤素的有机磷化合物等。然而,含卤素的化合物在树脂成形时会产生热分解而生成会腐蚀模具的卤化氢,进而不利地影响树脂的性质并造成树脂变色,并且在回收处理(例如以焚化方式处理时)时,同样会产生如卤化氢等对生物有害的气体,并不符合现今的环保要求。因此,目前多采用不含卤素的阻燃剂。
不含卤素的阻燃剂以含磷化合物为大宗,其实例包括三苯基磷酸酯(triphenylphosphate,TPP)、三甲苯基磷酸酯(tricresyl phosphate,TCP)等。然而,此等含磷化合物在常温下一般为液体,或为低熔点的固体,挥发性高,使用上容易造成树脂成形温度降低或混炼时发生结块与渗液等问题。
有关含磷化合物作为阻燃剂的应用包括:US 3,900,444、US 4,036,811及US 6,207,736分别提出以经取代的磷酸的碱金属盐类或次磷酸盐作为热塑性聚合物(如聚酯类)的阻燃剂,然而此类含有磷的化合物应用于印刷电路板的树脂组合物中时,对于积层板的介电常数(Dk)与介电损耗(Df)等电气性质,以及耐热性、耐湿性与耐电蚀性等物化性质会有产生不良影响的倾向;以及US7,208,539揭露一种热硬化性树脂组合物,包含二取代的次膦酸金属盐及于1GHz以上的频率时介电常数在2.9以下的树脂。
发明内容
本发明的一目的在于提供一种树脂组合物,包含:
(a)一可热硬化树脂系统,其于10GHz的频率时,介电损耗(Df)不大于0.006;以及
(b)一具式(I)结构的次磷酸金属盐,
其中a为1至4的整数、R为H或不存在,且Ma+为一选自以下群组的金属离子:锂、钠、钾、镁、钙、锶、钡、铝、锗、锡、锑、锌、钛、锆、锰、铁、铜及铈,以及
其中,以该树脂系统(a)及该次磷酸金属盐(b)的总重量计,该次磷酸金属盐(b)的含量为1重量%至30重量%。
本发明的另一目的在于提供一种半硬化片,其借助将一基材含浸如上述的树脂组合物并进行干燥而制得。
本发明的再一目的在于提供一种积层板,包含一合成层及一金属层,该合成层由上述的半硬化片所提供。
为使本发明的上述目的、技术特征及优点能更明显易懂,下文以部分具体实施态样进行详细说明。
具体实施方式
以下将具体地描述根据本发明的部分具体实施态样;但是,在不背离本发明的精神下,本发明尚可以多种不同形式的态样来实践,不应将本发明保护范围解释为限于说明书所陈述者。此外,除非文中有另外说明,于本说明书中(尤其是在权利要求的范围中)所使用的“一”、“该”及类似用语应理解为包含单数及复数形式。且除非文中有另外说明,于本说明书中描述溶液、混合物或组合物中所含的成分时,以该成分所含的固形物计算,即,未纳入溶剂的重量。
本发明是关于一种具优异耐燃性的树脂组合物,其中以特定比例组合使用具特定电学性质的树脂系统及具特定结构的次磷酸金属盐,以制得在各项物化性质均可达到令人满意的程度且尤其具有优异的耐燃性、耐热性与抗撕强度的积层板材料,同时不会不利地影响积层板材料的电学性质。
特定言之,本发明树脂组合物包含一(a)可热硬化树脂系统及一(b)次磷酸金属盐,该(a)可热硬化树脂系统于10GHz的频率时介电损耗(Df)不大于0.006,且该(b)次磷酸金属盐具下式(I)的结构:
于式(I)中,a为1至4的整数、R为H或不存在,且Ma+为一选自以下群组的金属离子:锂、钠、钾、镁、钙、锶、钡、铝、锗、锡、锑、锌、钛、锆、锰、铁、铜及铈;较佳地,a为1至3的整数,且Ma+为一选自以下群组的金属离子:锂、钠、钾、镁、钙、锶、钡、及铝。于本发明的部分实施态样中,a为3,且Ma+为Al3+。
于本发明树脂组合物中,以树脂系统(a)及次磷酸金属盐(b)的总重量计,次磷酸金属盐(b)的含量为1重量%至30重量%,较佳为10重量%至22重量%。若次磷酸金属盐(b)的含量高于指定范围(高于30重量%),将不利地影响积层板材料的性质,尤其是抗撕强度;此外,若次磷酸金属盐(b)的含量低于指定范围(例如低于1重量%)或树脂组合物不包含次磷酸金属盐(b),则所制得的积层板的电气性质、物化性质及机械性质均将明显变差,尤其是抗撕强度及玻璃转移温度(Tg)。
皆知,可热硬化树脂是指在受热后能够形成网状结构而逐渐硬化的高分子。于本发明树脂组合物中,可热硬化树脂系统可由单一种可热硬化树脂来提供、或可通过混合多种可热硬化树脂来提供。不论在使用单一种可热硬化树脂或混合多种可热硬化树脂的情况下,最终所制得的可热硬化树脂成分必须符合在10GHz的频率时具有不大于0.006的介电损耗(Df)的条件。
具体而言,本发明树脂组合物中的可热硬化树脂系统(a)可通过使用选自以下群组的可热硬化树脂来提供:聚苯醚树脂、双马来酰亚胺树脂、含乙烯基及/或烯丙基的异氰脲酸酯、含丁二烯及/或苯乙烯的弹性体及环氧树脂;或者,可通过前述树脂的任意组合来提供;又或者,亦可通过将上述可热硬化树脂的至少一者进一步与其它已知可热硬化树脂混合使用来提供,但是,在此情况下须注意维持所得可热硬化树脂系统的Df值必须不大于0.006。于本发明的部分实施态样中,可热硬化树脂系统(a)包含选自以下群组的至少二者:聚苯醚树脂、双马来酰亚胺树脂、含乙烯基及/或烯丙基的异氰脲酸酯、含丁二烯及/或苯乙烯的弹性体及环氧树脂。
聚苯醚树脂可为具有反应性官能基的聚苯醚树脂,包括但不限于具有丙烯酸基的聚苯醚树脂、具有乙烯基的聚苯醚树脂、具有羟基的聚苯醚树脂等,所称“反应性官能基团“可为任何可供反应硬化的基团,例如羟基、羧基、烯基、胺基等,但不以此为限。具有反应性官能基的聚苯醚树脂包括但不限于具有下式(II)结构的聚苯醚树脂:
于式(II)中,X与Y各自独立为具有烯基的基团或不存在,且X与Y较佳为不存在、或者X具有下式(II-1)且Y具有下式(II-2)的结构:
于式(II-1)及式(II-2)中,
*表示与式(II)的氧(-O-)相接的一端;
B1与B2各自独立为
R5与R6各自独立为-O-、-SO2-或-C(CH3)2-,或不存在;以及
p与q各自独立为一整数,且1≦p+q<20,较佳为1≦p+q<10,更佳为1≦p+q<3;
R1至R4各自独立为H或经或未经取代的C1至C5烷基,例如甲基、乙基、正丙基、异丙基、正丁基等;m及n各自独立为0至100的整数,且m及n不同时为0,且其范围较佳为1≤(m+n)≤100,更佳为5≤(m+n)≤30;A1与A2各自独立为 以及Z为不存在、-O-、其中R7与R8各自独立为H或C1至C12烷基。
合适的双马来酰亚胺树脂可具有下式(III)的结构。
于式(III)中,M1为C2至C40的2价脂族、脂环族、芳族或杂环基团,较佳为经或未经取代的伸甲基(-CH2-)、 且Z1各自独立地为H、卤素或C1至C5烷基。于本发明的部分实施态样中,M1为且Z1为H。
双马来酰亚胺树脂的具体实例包括但不限于:1,2-双马来酰亚胺基乙烷、1,6-双马来酰亚胺基己烷、1,3-双马来酰亚胺基苯、1,4-双马来酰亚胺基苯、2,4-双马来酰亚胺基甲苯、4,4'-双马来酰亚胺基二苯基甲烷、4,4'-双马来酰亚胺基二苯基醚、3,3'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二环己基甲烷、3,5-双(4-马来酰亚胺基苯基)吡啶、2,6-双马来酰亚胺基吡啶、1,3-双(马来酰亚胺基甲基)环己烷、1,3-双(马来酰亚胺基甲基)苯、1,1-双(4-马来酰亚胺基苯基)环己烷、1,3-双(二氯马来酰亚胺基)苯、4,4'-双柠康酰亚胺基二苯基甲烷(4,4'-biscitraconimidodiphenylmethane)、2,2-双(4-马来酰亚胺基苯基)丙烷、1-苯基-1,1-双(4-马来酰亚胺基苯基)乙烷、α,α-双(4-马来酰亚胺基苯基)甲苯、3,5-双马来酰亚胺基-1,2,4-三唑、N,N'-伸乙基双马来酰亚胺、N,N'-六亚甲基双马来酰亚胺、N,N'-间-伸苯基双马来酰亚胺、N,N'-对-伸苯基双马来酰亚胺、N,N'-4,4'-二苯基甲烷双马来酰亚胺、N,N'-4,4'-二苯基醚双马来酰亚胺、N,N'-4,4'-二苯基砜双马来酰亚胺、N,N'-4,4'-二环己基甲烷双马来酰亚胺、N,N'-α,α'-4,4'-二亚甲基环己烷双马来酰亚胺、N,N'-间二甲苯双马来酰亚胺、N,N'-4,4'-二苯基环己烷双马来酰亚胺、N,N'-亚甲基双(3-氯-对-伸苯基)双马来酰亚胺及其组合。
合适的含乙烯基及/或烯丙基的异氰脲酸酯包括但不限于:三烯丙基异氰脲酸酯(triallyl isocyanurate,TAIC)、三烯丙基氰脲酸酯(triallyl cyanurate,TAC)及其组合。于本发明的部分实施态样中,采用三烯丙基异氰脲酸酯(TAIC)。
合适的含丁二烯及/或苯乙烯之弹性体包括但不限于:丁二烯均聚物、苯乙烯丁二烯共聚物(SBR)、苯乙烯丁二烯苯乙烯共聚物(SBS)、丙烯腈丁二烯共聚物、氢化苯乙烯丁二烯苯乙烯共聚物、苯乙烯异戊二烯苯乙烯共聚物(SIS)、氢化苯乙烯异戊二烯苯乙烯共聚物、氢化苯乙烯(丁二烯/异戊二烯)苯乙烯共聚物、聚苯乙烯及其组合。于本发明的部分实施态样中,采用丁二烯均聚物、苯乙烯丁二烯共聚物、苯乙烯丁二烯苯乙烯共聚物或其组合。
合适的环氧树脂可具有下式(IV)的结构。
于式(IV)中,A为n1价的有机或无机基团、R9为H或C1至C6烷基、X1为氧或氮、m1为1或2并符合X1的化学价、且n1为1至100的整数。较佳地,n1为2至8的整数,且n1最佳为2至4的整数。
合适的环氧树脂可包括经由表氯醇(epichlorohydrin)或表溴醇(epibromohydrin)与酚类化合物反应所得的产物。合适的酚类化合物例如包括间苯二酚(resorcinol)、儿茶酚、氢醌(hydroquinone)、2,6-二羟基萘、2,7-二羟基萘、2-(二苯基磷酰基)氢醌(2-(diphenylphosphoryl)hydroquinone)、双(2,6-二甲基苯酚)、2,2'-联苯酚(2,2'-biphenol)、4,4-联苯酚、2,2',6,6'-四甲基联苯酚、2,2',3,3',6,6'-六甲基联苯酚、3,3',5,5'-四溴-2,2',6,6'-四甲基联苯酚、3,3'-二溴-2,2',6,6'-四甲基联苯酚、2,2',6,6'-四甲基-3,3'-二溴联苯酚、4,4'-亚异丙基二苯酚(双酚A)(4,4'-isopropylidenediphenol(bisphenol A))、4,4'-亚异丙基双(2,6-二溴苯酚)(四溴双酚A)、4,4'-亚异丙基双(2,6-二甲基苯酚)(四甲基双酚A)、4,4'-亚异丙基双(2-甲基苯酚)、4,4'-亚异丙基双(2-烯丙基苯酚)、4,4'(1,3-伸苯基二亚异丙基)双酚(双酚M)、4,4'-亚异丙基双(3-苯基苯酚)、4,4'-(1,4-伸苯基二亚异丙基)双酚(双酚P)、4,4'-亚乙基二苯酚(双酚E)、4,4'-氧代二苯酚(4,4'-oxydiphenol)、4,4'-硫代二苯酚、4,4'-硫代双(2,6-二甲基苯酚)、4,4'-磺酰基二苯酚、4,4'-磺酰基双(2,6-二甲基苯酚)、4,4'-亚硫酰基二苯酚、4,4'-(六氟亚异丙基)双酚(双酚AF)、4,4'-(1-苯基亚乙基)双酚(双酚AP)、双(4-羟基苯基)-2,2-二氯乙烯(双酚C)、双(4-羟基苯基)甲烷(双酚-F)、双(2,6-二甲基-4-羟基苯基)甲烷、4,4'-(亚环戊基)二苯酚、4,4'-(亚环己基)二苯酚(双酚Z)、4,4'-(亚环十二烷基)二苯酚、4,4'-(双环[2.2.1]亚庚基)二苯酚、4,4'-(9H-茀-9,9-二基)二苯酚(4,4'-(9H-fluorene-9,9-diyl)diphenol)、3,3-双(4-羟基苯基)异苯并呋喃-1(3H)-酮(3,3-bis(4-hydroxyphenyl)isobenzofuran-1(3H)-one)、1-(4-羟基苯基)-3,3-二甲基-2,3-二氢-1H-茚-5-酚(1-(4-hydroxyphenyl)-3,3-dimethyl-2,3-dihydro-1H-inden-5-ol)、1-(4-羟基-3,5-二甲基苯基)-1,3,3,4,6-五甲基-2,3-二氢-1H-茚-5-酚、3,3,3',3'-四甲基-2,2',3,3'-四氢-1,1'-螺双[茚]-5,6'-二酚(螺二茚烷(Spirobiindane))、二羟基二苯基酮(双酚K)、三(4-羟基苯基)甲烷、三(4-羟基苯基)乙烷、三(4-羟基苯基)丙烷、三(4-羟基苯基)丁烷、三(3-甲基-4-羟基苯基)甲烷、三(3,5-二甲基-4-羟基苯基)甲烷、四(4-羟基苯基)乙烷、四(3,5-二甲基-4-羟基苯基)乙烷、双(4-羟基苯基)苯基氧化膦、二环戊二烯基二(2,6-二甲基苯酚)、二环戊二烯基二(2-甲基苯酚)、二环戊二烯基双酚(dicyclopentadienyl bisphenol)及其混合物。有关环氧树脂的具体合成方式乃本领域具通常知识者于观得本案说明书揭露后,可基于所具备的通常知识而视情况实施者,且非本发明的技术重点所在,于此不加赘述。
除上述例举的树脂种类外,树脂系统(a)亦可在不违反指定的介电损耗(Df)条件的前提下视需要进一步包含其他可热硬化树脂,诸如酚醛树脂(phenolic resin)、苯乙烯马来酸酐(styrene maleic anhydride,SMA)树脂或其组合,且该其他可热硬化树脂可进一步具有反应性基团。
树脂系统(a)尚可视需要添加硬化剂及/或催化剂,以改良硬化效果。以树脂系统(a)包含环氧树脂的情况为例,可采用的硬化剂包括但不限于:胺化合物、酸酐、苯二酚化合物、双酚树脂、多元酚树脂(polyhydric phenol resin)、酚醛树脂等。胺化合物的实例可包括:脂族胺化合物,如二伸乙基三胺(diethylene triamine,DETA)、三伸乙基四胺(triethylene tetramine,TETA)、四伸乙基五胺(tetraethylene pentamine,TEPA)、二乙基胺基丙基胺(diethylaminopropylamine,DEAPA)、亚甲基二胺、N-胺基乙基吡(N-aminoethylpyrazine,AEP)、间苯二甲基二胺(m-xylylene diamine,MXDA)等;芳族胺化合物,如间伸苯基二胺(m-phenylene diamine,MPDA)、4,4'-二胺基二苯基甲烷(4,4'-diaminodiphenylmethane,MDA)、二胺基二苯基砜(diaminodiphenylsulfone,DADPS)、二胺基二苯基醚等;二级胺化合物或三级胺化合物,如苯基甲基二甲基胺(phenylmethyldimethylamine,BDMA)、二甲基胺基甲基苯酚(dimethylaminomethylphenol,DMP-10)、三(二甲基胺基甲基)苯酚(tris(dimethylaminomethyl)phenol,DMP-30)、哌啶、4,4'-二胺基二环己基甲烷、1,4-二胺基环己烷、2,6-二胺基吡啶、间伸苯基二胺、对伸苯基二胺、4,4'-二胺基二苯基甲烷、2,2'-双(4-胺基苯基)丙烷、联苯胺、4,4'-二胺基苯基氧化物、4,4'-二胺基二苯基砜、双(4-胺基苯基)苯基氧化膦、双(4-胺基苯基)甲基胺、1,5-二胺基萘、间二甲苯二胺(m-xylenediamine)、对二甲苯二胺、六亚甲基二胺、6,6'-二胺-2,2'-吡啶基、4,4'-二胺基二苯甲酮、4,4'-二胺基偶氮苯、双(4-胺基苯基)苯基甲烷、1,1-双(4-胺基苯基)环己烷、1,1-双(4-胺基-3-甲基苯基)环己烷、2,5-双(间-胺基苯基)-1,3,4-二唑、2,5-双(对-胺基苯基)-1,3,4-二唑、2,5-双(间-胺基苯基)噻唑并(4,5-d)噻唑(2,5-bis(m-aminophenyl)thiazo(4,5-d)thiazole)、5,5'-二(间-胺基苯基)-(2,2')-双-(1,3,4-二唑基)、4,4'-二胺基二苯基醚、4,4'-双(对-胺基苯基)-2,2'-二噻唑、间-双(4-对-胺基苯基-2-噻唑基)苯、4,4'-二胺基苯甲酰苯胺(4,4'-diaminobenzanilide)、4,4'-二胺基苯基苯甲酸酯、N,N'-双(4-胺基苄基)-对-伸苯基二胺,及4,4'-亚甲基双(2-氯苯胺);三聚氰胺、2-胺基-s-三2-胺基-4-苯基-s-三2-胺基-4,6-二乙基-s-三2-胺基-4,6-二苯基-s-三2-胺基-4,6-双(对-甲氧基苯基)-s-三2-胺基-4-苯胺基-s-三2-胺基-4-苯氧基-s-三2-胺基-4-氯-s-三2-胺基-4-胺基甲基-6-氯-s-三2-(对-胺基苯基)-4,6-二氯-s-三2,4-二胺基-s-三2,4-二胺基-6-甲基-s-三2,4-二胺基-6-苯基-s-三2,4-二胺基-6-苄基-s-三2,4-二胺基-6-(对-胺基苯基)-s-三2,4-二胺基-6-(间-胺基苯基)-s-三4-胺基-6-苯基-s-三-2-酚及6-胺基-s-三-2,4-二酚等,及其混合物。至于催化剂,其实例包括但不限于:过氧化苯甲酰(benzoyl peroxide,BPO)、过氧化二异丙苯(dicumyl peroxide,DCP)、α,α'-双(三级丁基过氧)二异丙苯(α,α'-bis(t-butylperoxy)diisopropyl benzene)及其组合。
相关硬化剂/催化剂的选择及用量乃本领域具通常知识者于观得本案说明书揭露后,可基于所具备的通常知识而视情况选用者,且非本发明的技术重点所在,于此不加赘述。
本发明的树脂组合物除树脂系统(a)与次磷酸金属盐(b)外,可视需要进一步包含其他添加剂,如硬化促进剂、阻燃剂、填料、分散剂、增韧剂等。添加硬化促进剂可促进树脂组合物硬化;添加阻燃剂可提高所制材料的难燃性;且添加填料则可针对性地改良材料的物化性质。
阻燃剂的实例包括但不限于:含磷阻燃剂、含溴阻燃剂或其组合。含磷阻燃剂的实例包括磷酸脂类、磷腈类、聚磷酸铵类、磷酸三聚氰胺类、氰尿酸三聚氰胺类及其组合。含溴阻燃剂的实例包括四溴双酚A(tetrabromobisphenol A)、十溴二苯基氧化物(decabromodiphenyloxide)、十溴化二苯基乙烷(decabrominated diphenyl ethane)、1,2-二(三溴苯基)乙烷(1,2-bis(tribromophenyl)ethane)、溴化环氧寡聚合物(brominatedepoxy oligomer)、八溴三甲基苯基茚烷(octabromotrimethylphenyl indane)、二(2,3-二溴丙醚)(bis(2,3-dibromopropyl ether))、三(三溴苯基)三(tris(tribromophenyl)triazine)、溴化脂肪碳氢化合物、溴化芳香碳氢化合物(brominated aliphatic oraromatic hydrocarbon)及其组合。
填料的实例包括但不限于:二氧化硅、氧化铝、氧化镁、氢氧化镁、碳酸钙、滑石、粘土、氮化铝、氮化硼、氢氧化铝、碳化铝硅、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石英、钻石、类钻石、石墨、煅烧高岭土、白岭土、云母、水滑石、中空二氧化硅、聚四氟乙烯(PTFE)粉末、玻璃珠、陶瓷晶须、纳米碳管、纳米级无机粉体及其组合。
前述各种添加剂的含量,乃本发明所属技术领域中具有通常知识者于观得本说明书的揭露内容后,可依其通常知识视需要调整,并无特殊限制。
关于本发明树脂组合物的制备,可借助将树脂组合物各成分,包括树脂系统(a)、次磷酸金属盐(b)及其他视需要的添加剂,以搅拌器均匀混合并溶解或分散于溶剂中而制成清漆状的形式,供后续加工利用。所述溶剂可为任何可溶解或分散树脂组合物各成分、但不与该等成分反应的惰性溶剂。举例言之,可用以溶解或分散本发明树脂组合物的溶剂包含但不限于:甲苯、γ-丁内酯、甲乙酮、环己酮、丁酮、丙酮、二甲苯、甲基异丁基酮、N,N-二甲基甲酰胺(N,N-dimethyl formamide,DMF)、N,N-二甲基乙酰胺(N,N-dimethylacetamide,DMAc)、N-甲基吡咯烷酮(N-methyl-pyrolidone,NMP)或前述的混合物。溶剂的用量并无特殊限制,原则上只要能使树脂组合物各组分均匀溶解或分散于其中即可。于本发明的部分实施态样中,使用甲苯、甲乙酮及γ-丁内酯的混合物作为溶剂。
本发明另提供一种半硬化片,其借助将一基材含浸如上述的树脂组合物,并进行干燥而制得。常用的基材包含玻璃纤维布(玻璃织物、玻璃纸、玻璃毡等)、牛皮纸、短绒棉纸、天然纤维布、有机纤维布等。于本发明的部分实施态样中,使用2116强化玻璃纤维布作为补强材,并在175℃下加热干燥2至15分钟(B-阶段),从而制得半硬化状态的半硬化片。
本发明另提供一种积层板,其包含一合成层及一金属层,其中该合成层由如上述的半硬化片所提供。其中,可层叠复数层的上述半硬化片,且于层叠该半硬化片所构成的合成层的至少一外侧表面层叠一金属箔(如铜箔)以提供一层叠物,并对该层叠物进行一热压操作而得到该积层板。此外,可经由进一步图案化该积层板的外侧金属箔,而制得印刷电路板。
兹以下列具体实施态样进一步例示说明本发明,其中,所采用的量测仪器及方法分别如下:
[吸水性测试]
进行压力锅蒸煮试验(pressure cooker test,PCT)试验,将积层板置于压力容器中,在121℃、饱和相对湿度(100%R.H.)及1.2大气压的环境下2小时,测试积层板的耐湿能力。
[耐浸焊性测试]
将干燥过的积层板在288℃的锡焊浴中浸泡一定时间后,观察是否出现爆板情形,例如观察积层板是否产生分层或胀泡情形。
[抗撕强度测试]
抗撕强度是指金属箔对经层合的半硬化片的附着力而言,通常以1/8英寸宽度的铜箔自板面上垂直撕起,以其所需力量的大小来表达附着力的强弱。
[玻璃转移温度(Tg)测试]
利用动态机械分析仪(Differential Scanning Calorimeter,DSC)量测玻璃转移温度(Tg)。玻璃转移温度的测试规范为电子电路互联与封装学会(The Institute forInterconnecting and Packaging Electronic Circuits,IPC)之IPC-TM-650.2.4.25C及24C号检测方法。
[难燃性测试]
利用UL94V:垂直燃烧测试方法,将积层板以垂直位置固定,以本生灯燃烧,比较其自燃熄灭与助燃特性。
[介电常数(Dk)与散逸因子(Df)量测]
根据ASTM D150规范,在工作频率10GHz下,计算介电常数(Dk)与散逸因子(Df)。
实施例
<树脂系统(a)的制备>
<树脂系统一>
以表1所示的比例,将具式(II)结构的聚苯醚树脂(X具式(II-1)的结构,Y具式(II-2)的结构,其中B 1与B2为R5与R6为不存在、及1≦p+q<3,R1、R2、R3及R4为甲基,A1与A2为Z为不存在,且20≤(m+n)≤25;型号PP807,购自晋一公司)、TAIC(购自Evonik公司)、及作为催化剂的二苯甲酰过氧化物(BPO,购自Fluka公司)于室温下使用搅拌器混合,并加入甲苯、甲乙酮及γ-丁内酯(皆购自Fluka公司)。将所得混合物于室温下搅拌约60至120分钟后,制得树脂系统一。
<树脂系统二>
以与制备树脂系统一相同的方式来制备树脂系统二,但是另添加购自Sabic公司的聚苯醚树脂(型号SA9000)及具式(III)结构的双马来酰亚胺树脂(M1为且Z1为H;型号BMI,购自K·I CHEMICAL公司),并调整聚苯醚树脂PP807的用量,如表1所示。
<树脂系统三>
以与制备树脂系统一相同的方式来制备树脂系统三,但是以购自Mitsubishi GasChemical公司的聚苯醚树脂(型号OPE-2st)取代聚苯醚树脂PP807,并另添加作为弹性体的丁二烯均聚物(homopolymer of butadiene)(型号Ricon 130及Ricon 150;皆购自CRAYVALLEY公司),如表1所示。
<树脂系统四>
以与制备树脂系统一相同的方式来制备树脂系统四,惟以聚苯醚树脂SA9000取代聚苯醚树脂PP807,并另添加作为弹性体的丁二烯-苯乙烯无规共聚物(型号Ricon 181,购自CRAY VALLEY公司)与苯乙烯-丁二烯-苯乙烯聚合物(型号D1118K,购自KRATON公司)、双酚A型环氧树脂(型号BE-188EL,购自CCP公司)、及作为硬化剂的亚甲基双(2-乙基-6-甲苯胺)(Methylenebis(2-ethyl-6-methylaniline),MED)(购自IHARA CHEMICAL Ind.),如表1所示。
<树脂系统五>
以与制备树脂系统二相同的方式来制备树脂系统五,但是以聚苯醚树脂OPE-2st取代聚苯醚树脂SA9000,并另添加作为弹性体的丁二烯均聚物Ricon 130、二环戊二烯型环氧树脂(型号HP-7200H,购自DIC公司)、及作为硬化剂的苯酚(Phenol)(购自长春化工公司),且不添加催化剂,如表1所示。
<树脂系统六>
以与制备树脂系统二相同的方式来制备树脂系统六,但是以聚苯醚树脂OPE-2st取代聚苯醚树脂PP807,另添加作为弹性体的丁二烯均聚物Ricon 150、丁二烯-苯乙烯无规共聚物Ricon 181、与苯乙烯-丁二烯-苯乙烯聚合物D1118K,并调整双马来酰亚胺树脂BMI的用量,如表1所示。
<树脂系统七>
以表1所示的比例,将双马来酰亚胺树脂BMI、异氰脲酸酯TAIC、弹性体(丁二烯均聚物Ricon 130、丁二烯-苯乙烯无规共聚物Ricon 181、与苯乙烯-丁二烯-苯乙烯聚合物D1118K)、环氧树脂HP-7200H、及作为硬化剂的苯酚于室温下使用搅拌器混合,并加入甲苯、甲乙酮及γ-丁内酯。将所得混合物于室温下搅拌约60至120分钟后,制得树脂系统七。
<树脂系统八>
以与制备树脂系统五相同的方式来制备树脂系统八,但是不添加TAIC、环氧树脂及硬化剂,以丁二烯-苯乙烯无规共聚物Ricon181与苯乙烯-丁二烯-苯乙烯聚合物D1118K来取代丁二烯均聚物Ricon 130,并调整双马来酰亚胺树脂BMI的用量,如表1所示。
为测试树脂系统的Df值,分别使用树脂系统一至八来制备电测样品。将树脂系统一至八借助水平涂布机的水平刮刀分别涂布于铜箔上,再将经涂布的铜箔置于175℃的烘箱中加热干燥2至10分钟,借此制得半硬化状态的背胶铜箔。接着将半硬化状态背胶铜箔与另一张0.5盎司的铜箔进行热压,其热压条件为:以3.0℃/分钟的升温速度升温至200至220℃,并于该温度下,以全压15公斤/平方公分(初压8公斤/平方公分)的压力热压180分钟。随后在频率10GHz下量测树脂系统一至八的Df值。如表1所示,树脂系统一至八在频率为10GHz时的Df值皆小于0.006。
表1:树脂系统的组成
<树脂组合物之制备>
<实施例1>
依据表2所示的比例,将树脂系统一、具式(I)的次磷酸金属盐(a为3,且Ma+为Al3+;型号HPX360,购自兰斯化学公司)、及作为填料的二氧化硅粉末(购自Sibelco公司)于室温下使用搅拌器混合约120分钟,制得树脂组合物1。
<实施例2>
以与实施例1相同的方式制备树脂组合物2,但是另添加阻燃剂SPB100(购自Otsuka Chemical公司),并调整次磷酸金属盐的用量,如表2所示。
<实施例3>
以与实施例1相同的方式制备树脂组合物3,但是改以树脂系统二作为树脂系统(a),如表2所示。
<实施例4>
以与实施例3相同的方式制备树脂组合物4,但是另添加SPB100,并调整次磷酸金属盐的用量,如表2所示。
<实施例5>
以与实施例1相同的方式制备树脂组合物5,但是改以树脂系统三作为树脂系统(a),并调整次磷酸金属盐及填料的用量,如表2所示。
<实施例6>
以与实施例5相同的方式制备树脂组合物6,但是改以树脂系统四作为树脂系统(a),并添加SPB100,如表2所示。
<实施例7>
以与实施例6相同的方式制备树脂组合物7,但是改以树脂系统五作为树脂系统(a),并调整次磷酸金属盐及SPB100的用量,如表2所示。
<实施例8>
以与实施例5相同的方式制备树脂组合物8,但是调整次磷酸金属盐的用量,如表2所示。
<实施例9>
以与实施例6相同的方式制备树脂组合物9,但是改以树脂系统六作为树脂系统(a),并调整次磷酸金属盐及SPB100的用量,如表2所示。
<实施例10>
以与实施例1相同的方式制备树脂组合物10,但是改以树脂系统七作为树脂系统(a),并调整次磷酸金属盐的用量,如表2所示。
<实施例11>
以与实施例10相同的方式制备树脂组合物11,但是改以树脂系统八作为树脂系统(a),如表2所示。
<比较例1>
以与实施例5相同的方式制备比较树脂组合物1,但是调整次磷酸金属盐及填料的用量,如表2所示。
<比较例2>
以与实施例6相同的方式制备比较树脂组合物2,但是不添加次磷酸金属盐,并调整SPB100的用量,如表2所示。
表2:树脂组合物的组成
[积层板的制备]
分别使用树脂组合物1至11与比较树脂组合物1及2来制备积层板1至11与比较积层板1及2。首先,经由辊式涂布机,分别将该等树脂组合物涂布于2116强化玻璃纤维布上,再将经涂布的强化玻璃纤维布置于175℃的干燥机中加热干燥2至15分钟,借此制得半硬化状态的半硬化片(半硬化片的树脂含量约53%)。接着将四片半硬化片层合,并在其二侧的最外层各层合一张0.5盎司的铜箔。然后对其进行热压,其热压条件为:以3.0℃/分钟的升温速度升温至约200℃至220℃,并在该温度下,以全压15公斤/平方公分(初压8公斤/平方公分)的压力热压180分钟。
测量积层板1至11与比较积层板1及2的吸水性、耐浸焊性、抗撕强度、玻璃转移温度(Tg)、难燃性、散逸因子(Df)及介电常数(Dk),并将结果纪录于表3中。
表3:积层板性质
如表3所示,采用本发明树脂组合物所制得的积层板1至11,在所有物化性质(如吸水性、难燃性、Dk、Df等)上均可达到令人满意的程度,且具有优异的耐热性质(高Tg及优异耐浸焊性),可应用范围广泛。尤其,使用本发明树脂组合物所制得的积层板可具有优异的抗撕强度(达3.35磅/英寸以上),特别是当次磷酸金属盐(b)的含量于10重量%至22重量%的较佳范围时,例如实施例1、3至7、及9至11,所制得积层板的抗撕强度特别优异(达3.81磅/英寸以上)。相较于此,如比较例1所示,若次磷酸金属盐(b)的用量超出本发明指定范围外,即使是增加次磷酸金属盐(b)的用量,所制得的积层板的抗撕强度意外地将大幅下降(仅2.52磅/英寸);此外,如比较例2所示,当树脂组合物中不添加次磷酸金属盐(b)时,则所制得的积层板的各项物化性质均明显变差,虽然可借助加入其他阻燃剂使得所制得的积层板的难燃性达到V-0等级,但是其玻璃转移温度与抗撕强度仍明显下降。
上述实施例仅为例示性说明本发明的原理及其功效,并阐述本发明的技术特征,而非用于限制本发明的保护范畴。任何熟悉本技术者在不违背本发明的技术原理及精神下,可轻易完成的改变或安排,均属本发明所主张的范围。因此,本发明的权利保护范围如权利要求书范围所列。
Claims (16)
1.一种树脂组合物,包含:
(a)一可热硬化树脂系统,其于10GHz的频率时,介电损耗(Df)不大于0.006;以及
(b)一具式(I)结构的次磷酸金属盐,
其中a为1至4的整数、R为H或不存在,且Ma+为一选自以下群组的金属离子:锂、钠、钾、镁、钙、锶、钡、铝、锗、锡、锑、锌、钛、锆、锰、铁、铜及铈,
其中,以该树脂系统(a)及该次磷酸金属盐(b)的总重量计,该次磷酸金属盐(b)的含量为1重量%至30重量%。
2.如权利要求1所述的树脂组合物,其中以该树脂系统(a)及该次磷酸金属盐(b)的总重量计,该次磷酸金属盐(b)的含量为10重量%至22重量%。
3.如权利要求1所述的树脂组合物,其中a为1至3的整数,且Ma+为一选自以下群组的金属离子:锂、钠、钾、镁、钙、锶、钡及铝。
4.如权利要求3所述的树脂组合物,其中a为3,Ma+为Al3+。
5.如权利要求1至4中任一项所述的树脂组合物,其中该树脂系统(a)包含选自以下群组的至少一种可热硬化树脂:聚苯醚树脂、双马来酰亚胺树脂、含乙烯基及/或烯丙基的异氰脲酸酯、含丁二烯及/或苯乙烯之弹性体及环氧树脂。
6.如权利要求1所述的树脂组合物,其中该聚苯醚树脂具下式(II)的结构:
其中X与Y各自独立为具有烯基的基团或不存在;
R1至R4各自独立为H或经或未经取代的C1至C5烷基;
m及n各自独立为0至100的整数,且m及n不同时为0;
A1与A2各自独立为 以及
Z为不存在、-O-、或其中R7与R8各自独立为H或C1至C12烷基。
7.如权利要求5所述的树脂组合物,其中该双马来酰亚胺树脂具下式(III)的结构:
其中M1为含有C2至C40的2价脂族、脂环族、芳族或杂环基团,且Z1各自独立为H、卤素或C1至C5烷基。
8.如权利要求5所述的树脂组合物,其中该含乙烯基及/或烯丙基的异氰脲酸酯为三烯丙基异氰脲酸酯(triallyl isocyanurate,TAIC)、三烯丙基氰脲酸酯(triallylcyanurate,TAC)或其组合。
9.如权利要求5所述的树脂组合物,其中该弹性体选自以下群组:丁二烯均聚物、苯乙烯丁二烯共聚物(SBR)、苯乙烯丁二烯苯乙烯共聚物(SBS)、丙烯腈丁二烯共聚物、氢化苯乙烯丁二烯苯乙烯共聚物、苯乙烯异戊二烯苯乙烯共聚物(SIS)、氢化苯乙烯异戊二烯苯乙烯共聚物、氢化苯乙烯(丁二烯/异戊二烯)苯乙烯共聚物、聚苯乙烯及其组合。
10.如权利要求5所述的树脂组合物,其中该环氧树脂具下式(IV)的结构:
其中A为n1价的有机或无机基团、R9为H或C1至C6烷基、X1为氧或氮、m1为1或2并符合X1的化学价、且n1为1至100的整数。
11.如权利要求1至4中任一项所述的树脂组合物,其中该树脂系统(a)更包含一选自以下群组的催化剂:过氧化二异丙苯(dicumyl peroxide,DCP)、α,α'-双(三级丁基过氧)二异丙苯(α,α'-bis(t-butylperoxy)diisopropyl benzene)、二苯甲酰过氧化物(BenzoylPeroxide,BPO)及其组合。
12.如权利要求1至4中任一项所述的树脂组合物,更包含选自以下群组的一或多种添加剂:硬化促进剂、阻燃剂、填料、分散剂、增韧剂及其组合。
13.如权利要求12所述的树脂组合物,其中该阻燃剂是含磷阻燃剂、含溴阻燃剂或其组合。
14.如权利要求12所述的树脂组合物,其中该填料选自以下群组:二氧化硅、氧化铝、氧化镁、氢氧化镁、碳酸钙、滑石、粘土、氮化铝、氮化硼、氢氧化铝、碳化铝硅、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石英、钻石、类钻石、石墨、煅烧高岭土、白岭土、云母、水滑石、中空二氧化硅、聚四氟乙烯(PTFE)粉末、玻璃珠、陶瓷晶须、纳米碳管、纳米级无机粉体及其组合。
15.一种半硬化片(prepreg),其借助将一基材含浸如权利要求1至14中任一项所述的树脂组合物,并进行干燥而制得。
16.一种积层板,其包含一合成层及一金属层,其中该合成层由如权利要求15所述的半硬化片所提供。
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CN110815980A (zh) * | 2018-08-10 | 2020-02-21 | 台燿科技股份有限公司 | 介电复合物及其应用 |
CN111491968A (zh) * | 2017-12-28 | 2020-08-04 | 松下知识产权经营株式会社 | 聚苯醚树脂组合物、以及使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板 |
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CN113969051A (zh) * | 2020-07-23 | 2022-01-25 | 南亚塑胶工业股份有限公司 | 高频基板用树脂组合物及金属积层板 |
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CN113969051A (zh) * | 2020-07-23 | 2022-01-25 | 南亚塑胶工业股份有限公司 | 高频基板用树脂组合物及金属积层板 |
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