CN107167424A - A kind of device for preparing two-dimensional layer material automatically based on shearing force - Google Patents
A kind of device for preparing two-dimensional layer material automatically based on shearing force Download PDFInfo
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- CN107167424A CN107167424A CN201710432011.0A CN201710432011A CN107167424A CN 107167424 A CN107167424 A CN 107167424A CN 201710432011 A CN201710432011 A CN 201710432011A CN 107167424 A CN107167424 A CN 107167424A
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- layer material
- dimensional layer
- objective table
- pressure detecting
- dynamometer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a kind of device for preparing two-dimensional layer material automatically based on shearing force, including pressure detecting part, automatically control released part and detection display portion;The adhesive force that the present invention is surveyed between two-dimensional layer material and silicon chip substrate by pressure detecting portion go-on-go, three-D displacement platform is manipulated by the integrated control cabinet for automatically controlling released part, and then the dissection scope between control two-dimensional layer material and silicon chip substrate, by detecting that display portion is shown to the preparation process examinations of two-dimensional layer material, so as to be automatically performed the preparation of two-dimensional layer material, ensure to prepare area and prepare thickness to complete under stable and controllable process conditions, with easy to operate, preparation efficiency is high, final product quality height and the good advantage of quality stability.
Description
Technical field
It is especially a kind of to prepare two-dimensional layer material automatically based on shearing force the present invention relates to technical field of material
Device.
Background technology
In recent years, be directed to every superiority Quality Research of various two-dimensional layer materials always, two-dimensional layer material by
In with excellent carrier mobility and huge specific surface area, it has good in terms of electronic device, energy storage material
Application prospect.The micromechanics stripping means of prior art is to be peeled off based on liquid phase and improved use adhesive tape stripping means mostly,
The method that high-quality two-dimensional layer material can be obtained at present is initiated by preparing the micromechanics stripping method of graphene --- by using
Few layer of two-dimensional layer material is peeled off and obtained repeatedly in the two sides that adhesive tape sticks two-dimensional layer material mother metal.The problem of existing
It is, due to there is the in-plane strength of two-dimensional layer material far below graphene, it is difficult to which that bears to produce in stripping process repeatedly cuts
Shear force, the two-dimensional layer material area for finally resulting in acquisition is small and the number of plies is more, it is impossible to meet research to two-dimensional layer material with
Using.Because the Their Exotic Properties such as many superconduction phase transformations, the charge density wave phase transformation of two-dimensional layer material are only when its thickness is small
It can just show under conditions of certain value, so area is big and preparation of the two-dimensional layer material of thickness of thin is particularly important.
Such as patent " preparation method of two-dimentional telluride gallium material "(The patent No. 201410819701.8).However, this kind of method is due to technique
There is uncertain and poor controllability in condition, cause area and thickness to be difficult to ensure, influence finished product quality and quality it is steady
It is qualitative.To effectively push the research to two-dimensional layer material and application, high-precision, programmable, automatical and efficient two-dimensional layer is made
The stripping off device of shape material is particularly important.
The content of the invention
One kind that the purpose of the present invention is in view of the shortcomings of the prior art and provided prepares two-dimensional layer automatically based on shearing force
The device of shape material, the adhesive force that the present invention is surveyed between two-dimensional layer material and silicon chip substrate by pressure detecting portion go-on-go leads to
Cross the integrated control cabinet manipulation three-D displacement platform for automatically controlling released part, so control two-dimensional layer material and silicon chip substrate it
Between dissection scope, by detecting that display portion is shown to the preparation process examinations of two-dimensional layer material, so that automatic complete
Into the preparation of two-dimensional layer material, it is ensured that prepare area and prepare thickness completion under stable and controllable process conditions, have
Easy to operate, preparation efficiency is high, final product quality height and the good advantage of quality stability.
Realizing the concrete technical scheme of the object of the invention is:
A kind of device for being prepared two-dimensional layer material automatically based on shearing force, its feature is included pressure detecting part, automatically controlled
Released part and detection display portion;The pressure detecting part by optics anti-vibration platform, screw rod testing jig, digital display dynamometer,
Mother metal objective table is constituted;Wherein, force application rod of the screw rod testing jig provided with handwheel and screw drive, force application rod is provided with dynamometer
Seat;Digital display dynamometer is provided with dynamometry touch head;The mother metal objective table is on the dynamometry touch head of digital display dynamometer, digital display
Dynamometer is on the dynamometer seat of screw rod testing jig, and screw rod testing jig is on optics anti-vibration platform;
The released part that automatically controls is made up of substrate objective table, electrothermal tube, tracheae, three-D displacement platform and integrated control cabinet;
Wherein, substrate objective table is provided with electric heating interface tube and gas seat;Three-D displacement platform is provided with driver and Mobile base;
The substrate objective table is on the Mobile base of three-D displacement platform, and electrothermal tube, tracheae are respectively arranged on the electricity of substrate objective table
On heat pipe interfaces and gas seat, integrated control cabinet is electrically connected with the driver of electrothermal tube and three-D displacement platform, integrated control cabinet and gas
Pipe gas is connected;
The three-D displacement platform for automatically controlling released part is on the optics anti-vibration platform of pressure detecting part, and automatic control
The substrate objective table of released part processed is located at the lower section of the mother metal objective table of pressure detecting part;
The detection display portion is made up of digit microscope and display screen;The digit microscope is two pieces, respectively along dynamometry
On the optics anti-vibration platform for laterally and longitudinally setting and being fixed on pressure detecting part for counting seat, display screen is located at pressure detecting portion
On the optics anti-vibration platform divided, digit microscope and display screen are connected with automatically controlling the integrated control cabinet photoelectricity of released part.
Described integrated control cabinet is the interior control for setting power supply and heater switch, source of the gas and air pump switch and program controller
Cabinet.
The adhesive force that the present invention is surveyed between two-dimensional layer material and silicon chip substrate by pressure detecting portion go-on-go, by automatic
The integrated control cabinet manipulation three-D displacement platform of released part is controlled, and then controls the stripping between two-dimensional layer material and silicon chip substrate
From scope, by detecting that display portion is shown to the preparation process examinations of two-dimensional layer material, so as to be automatically performed two dimension
The preparation of stratified material, it is ensured that prepare area and prepare thickness completion under stable and controllable process conditions, with operation letter
Just, preparation efficiency is high, final product quality height and the good advantage of quality stability.
Brief description of the drawings
Fig. 1 is structural representation of the invention;
Fig. 2 is use state schematic diagram of the invention.
Embodiment
Refering to Fig. 1, the present invention includes pressure detecting part 1, automatically controls released part 2 and detection display portion 3.
The pressure detecting part 1 is by optics anti-vibration platform 11, screw rod testing jig 12, digital display dynamometer 13, mother metal loading
Platform 14 is constituted;Wherein, the force application rod 122 that screw rod testing jig 12 drives provided with handwheel and screw rod 121, force application rod 122 is provided with
Dynamometer seat 123;Digital display dynamometer 13 is provided with dynamometry touch head 131;The mother metal objective table 14 is located at digital display dynamometer 13
Dynamometry touch head 131 on, digital display dynamometer 13 located at screw rod testing jig 12 dynamometer seat 123 on, screw rod testing jig 12 is set
In on optics anti-vibration platform 11.
The released part 2 that automatically controls is by substrate objective table 21, electrothermal tube 22, tracheae 23, three-D displacement platform 24 and comprehensive
Switch board 25 is closed to constitute;Wherein, substrate objective table 21 is provided with electric heating interface tube and gas seat;Three-D displacement platform 24 is provided with driving
Device and Mobile base 241.
The substrate objective table 21 is on the Mobile base 241 of three-D displacement platform 24, and electrothermal tube 22, tracheae 23 are respectively arranged on
On electric heating interface tube and the gas seat of substrate objective table 21, integrated control cabinet 25 and electrothermal tube 22 and the driver of three-D displacement platform 24
Electrical connection, integrated control cabinet 25 is connected with the gas of tracheae 23.
The three-D displacement platform 24 for automatically controlling released part 2 is located at the optics anti-vibration platform 11 of pressure detecting part 1
On, and automatically control the lower section that the substrate objective table 21 of released part 2 is located at the mother metal objective table 14 of pressure detecting part 1.
The detection display portion 3 is made up of digit microscope 31 and display screen 32;The digit microscope 31 is two pieces,
Respectively along along the optics anti-vibration platform 11 for laterally and longitudinally setting and being fixed on pressure detecting part 1 of dynamometer seat 123, display
Screen 32 is located on the optics anti-vibration platform 11 of pressure detecting part 1, and digit microscope 31 and display screen 32 are with automatically controlling stripping
The photoelectricity of integrated control cabinet 25 connection of part 2.
Described integrated control cabinet 25 is the interior control for setting power supply and heater switch, source of the gas and air pump switch and program controller
Cabinet.
Embodiment
Refering to Fig. 1, Fig. 2, the process that the present invention prepares two-dimensional layer material is as follows:Need to prepare two-dimensional layer material before preparation
Mother metal 5 and silicon chip substrate 4.
Step 1:Silicon chip substrate 4 Jing Guo oxygen plasma hydrophilicity-imparting treatment is covered in the hole on substrate objective table 21
On, the air pump switch in integrated control cabinet 25 is opened, is firmly adsorbed silicon chip substrate 4 in substrate loading by tracheae 23 and gas seat
On platform 21.
Step 2:Choose that surface is smooth and two-dimensional layer material mother metal 5 of corrugationless with sticking double faced adhesive tape in mother metal objective table
On 14.
Step 3:Start the driver of the driving three-D displacement of integrated control cabinet 25 platform 24, make three-D displacement platform 24 anti-in optics
Moved in the plane for shaking platform 11 along X-axis and Y-axis, silicon chip substrate 4 is located at the underface of two-dimensional layer material mother metal 5.
Step 4:Handwheel on rotary screw testing jig 12, force application rod 122, digital display dynamometer 13 are driven by screw rod 121
And mother metal objective table 14 is descending so that two-dimensional layer material mother metal 5 touches silicon chip substrate 4, by the number for being arranged on two orientation
Vertical range between the code monitoring mother metal of microscope 31 objective table 14 and substrate objective table 21, and silicon chip is shown on the display screen 32
Substrate 4 touches the image of state with two-dimensional layer material mother metal 5, and it is 0.002 to read positive pressure value on digital display dynamometer 13
N。
Step 5:Start the driver of the program controller driving three-D displacement platform 24 of integrated control cabinet 25, make three-D displacement platform 24
Moved towards the vertical direction of the plane of optics anti-vibration platform 11 along Z axis, adjustment two-dimensional layer material mother metal 5 and silicon chip substrate 4 it
Between contact force, and on digital display dynamometer 13 read positive pressure value be 0.3N.
Movement locus of the three-D displacement platform 24 in X-axis and Y direction is set by the program controller of integrated control cabinet 25, and will
Movement velocity is set to 2 mm/s.
Step 6:The heater switch in integrated control cabinet 25 is opened, the temperature of electrothermal tube 22 is set as 100 DEG C, during holding
Between be 5 minutes so that peeled off between two-dimensional layer material mother metal 5 and silicon chip substrate 4 in shearing shape, realize that area is big and thickness of thin
Two-dimensional layer material preparation.
Step 7:Handwheel on rotary screw testing jig 12, force application rod 122, digital display dynamometer 13 are driven by screw rod 121
And mother metal objective table 14 is up so that two-dimensional layer material mother metal 5 departs from silicon chip substrate 4, is monitored by digit microscope 31
Vertical range between mother metal objective table 14 and substrate objective table 21, and silicon chip substrate 4 and two-dimensional layer are shown on the display screen 32
The image of the disengaged position of shape material mother metal 5;The air pump switch closed in integrated control cabinet 25, substrate objective table 21 is to silicon chip substrate
4 lose absorption, and silicon chip substrate 4 is removed from substrate objective table 21, complete the preparation of two-dimensional layer material.
To improve the adhesive force between two-dimensional layer material and silicon chip substrate 4, the present invention is set on substrate objective table 21
Electrothermal tube 22, passes through the heater switch in integrated control cabinet 25, the operating temperature of electrothermal tube 22 is controlled, beneficial to two-dimensional layer material
The preparation of material, it prepares area and prepares thickness and is completed under stable and controllable process conditions, it is ensured that the quality and product of finished product
The stability of matter.
Claims (2)
1. a kind of device for preparing two-dimensional layer material automatically based on shearing force, it is characterised in that it includes pressure detecting part
(1), automatically control released part(2)And detection display portion(3);The pressure detecting part(1)By optics anti-vibration platform
(11), screw rod testing jig(12), digital display dynamometer(13)And mother metal objective table(14)Constitute;Wherein, screw rod testing jig(12)On
Provided with handwheel and screw rod(121)The force application rod of driving(122), force application rod(122)Provided with dynamometer seat(123);Digital display dynamometry
Meter(13)It is provided with dynamometry touch head(131);The mother metal objective table(14)Located at digital display dynamometer(13)Dynamometry touch head
(131)On, digital display dynamometer(13)Located at screw rod testing jig(12)Dynamometer seat(123)On, screw rod testing jig(12)It is located at
Optics anti-vibration platform(11)On;
It is described to automatically control released part(2)By substrate objective table(21), electrothermal tube(22), tracheae(23), three-D displacement platform
(24)And integrated control cabinet(25)Constitute;Wherein, substrate objective table(21)Provided with electric heating interface tube and gas seat;Three-D displacement platform
(24)It is provided with driver and Mobile base(241);The substrate objective table(21)Located at three-D displacement platform(24)Mobile base
(241)On, electrothermal tube(22), tracheae(23)It is respectively arranged on substrate objective table(21)Electric heating interface tube and gas seat on, comprehensive control
Cabinet processed(25)With electrothermal tube(22)And three-D displacement platform(24)Driver electrical connection, integrated control cabinet(25)With tracheae(23)Gas
Connection;
It is described to automatically control released part(2)Three-D displacement platform(24)Located at pressure detecting part(1)Optics anti-vibration platform
(11)On, automatically control released part(2)Substrate objective table(21)Positioned at pressure detecting part(1)Mother metal objective table(14)
Lower section;
The detection display portion(3)By digit microscope(31)And display screen(32)Constitute;The digit microscope(31)For
Two pieces, respectively along dynamometer seat(123)Laterally and longitudinally setting and be fixed on pressure detecting part(1)Anti-vibration platform(11)
On, display screen(32)It is located at pressure detecting part(1)Optics anti-vibration platform(11)On, digit microscope(31)And display screen
(32)With automatically controlling released part(2)Integrated control cabinet(25)Connection.
2. the device according to claim 1 for preparing two-dimensional layer material automatically based on shearing force, it is characterised in that comprehensive
Switch board(25)For the interior switch board for setting power supply and heater switch, source of the gas and air pump switch and program controller.
Priority Applications (1)
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CN201710432011.0A CN107167424A (en) | 2017-06-09 | 2017-06-09 | A kind of device for preparing two-dimensional layer material automatically based on shearing force |
Applications Claiming Priority (1)
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CN201710432011.0A CN107167424A (en) | 2017-06-09 | 2017-06-09 | A kind of device for preparing two-dimensional layer material automatically based on shearing force |
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CN107167424A true CN107167424A (en) | 2017-09-15 |
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CN201710432011.0A Pending CN107167424A (en) | 2017-06-09 | 2017-06-09 | A kind of device for preparing two-dimensional layer material automatically based on shearing force |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108896374A (en) * | 2018-08-16 | 2018-11-27 | 华东师范大学 | A kind of stripping off device of two-dimensional layer thin-film material |
CN110763714A (en) * | 2019-11-11 | 2020-02-07 | 华东师范大学 | Device for stripping two-dimensional material grown on sapphire substrate by temperature control bubbling |
CN112762835A (en) * | 2021-01-18 | 2021-05-07 | 华东师范大学 | Micro-control platform for non-destructive fixed-point transfer of two-dimensional material by solid-liquid method |
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ES2492041A1 (en) * | 2013-03-07 | 2014-09-08 | Universitat De Valéncia | Dry micromechanical exfoliation method and system of two-dimensional laminar materials (Machine-translation by Google Translate, not legally binding) |
CN104528664A (en) * | 2014-12-25 | 2015-04-22 | 西北工业大学 | Preparation method of two-dimensional gallium telluride material |
CN205463422U (en) * | 2016-03-04 | 2016-08-17 | 西北大学 | Prepare liquid phase stripping off device of two -dimentional nanometer piece |
CN206891938U (en) * | 2017-06-09 | 2018-01-16 | 华东师范大学 | A kind of device for preparing two-dimensional layer material automatically based on shearing force |
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Patent Citations (5)
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ES2492041A1 (en) * | 2013-03-07 | 2014-09-08 | Universitat De Valéncia | Dry micromechanical exfoliation method and system of two-dimensional laminar materials (Machine-translation by Google Translate, not legally binding) |
CN103350554A (en) * | 2013-06-17 | 2013-10-16 | 南京科孚纳米技术有限公司 | Method for shearing stripping of two-dimensional layered material by convection gas |
CN104528664A (en) * | 2014-12-25 | 2015-04-22 | 西北工业大学 | Preparation method of two-dimensional gallium telluride material |
CN205463422U (en) * | 2016-03-04 | 2016-08-17 | 西北大学 | Prepare liquid phase stripping off device of two -dimentional nanometer piece |
CN206891938U (en) * | 2017-06-09 | 2018-01-16 | 华东师范大学 | A kind of device for preparing two-dimensional layer material automatically based on shearing force |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108896374A (en) * | 2018-08-16 | 2018-11-27 | 华东师范大学 | A kind of stripping off device of two-dimensional layer thin-film material |
CN110763714A (en) * | 2019-11-11 | 2020-02-07 | 华东师范大学 | Device for stripping two-dimensional material grown on sapphire substrate by temperature control bubbling |
CN112762835A (en) * | 2021-01-18 | 2021-05-07 | 华东师范大学 | Micro-control platform for non-destructive fixed-point transfer of two-dimensional material by solid-liquid method |
CN112762835B (en) * | 2021-01-18 | 2021-10-15 | 华东师范大学 | Micro-control platform for non-destructive fixed-point transfer of two-dimensional material by solid-liquid method |
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Application publication date: 20170915 |