CN107119255A - SiZrC/SiZrCN叠层涂层刀具及其制备工艺 - Google Patents

SiZrC/SiZrCN叠层涂层刀具及其制备工艺 Download PDF

Info

Publication number
CN107119255A
CN107119255A CN201710289471.2A CN201710289471A CN107119255A CN 107119255 A CN107119255 A CN 107119255A CN 201710289471 A CN201710289471 A CN 201710289471A CN 107119255 A CN107119255 A CN 107119255A
Authority
CN
China
Prior art keywords
coatings
sizrcn
sizrc
laminated
magnetron sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710289471.2A
Other languages
English (en)
Inventor
宋文龙
王首军
张璇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jining University
Original Assignee
Jining University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jining University filed Critical Jining University
Priority to CN201710289471.2A priority Critical patent/CN107119255A/zh
Publication of CN107119255A publication Critical patent/CN107119255A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0664—Carbonitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/347—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with layers adapted for cutting tools or wear applications
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)

Abstract

本发明属于机械制造切削刀具领域，特别是涉及一种SiZrC/SiZrCN叠层涂层刀具及其制备工艺，所述的SiZrC/SiZrCN叠层涂层刀具，刀具基体最外层为SiZrCN涂层，刀具基体与SiZrCN涂层之间有Ti过渡层，SiZrCN涂层与Ti过渡层之间为SiZrC涂层与SiZrCN涂层交替的复合叠层结构。本发明采用中频磁控溅射+电弧镀的复合镀膜方法，采用SiZrC复合靶作碳源，且沉积温度控制在300℃以下，可在更为广泛的刀具基体上制备。所制备的叠层涂层刀具综合了SiZrC涂层和SiZrCN涂层的优点，具备更优异的摩擦磨损性能，可显著提高刀具的切削寿命和加工效率，可广泛应用于各种淬硬钢及钛合金等难加工材料的切削加工，同时叠层复合结构的层间界面可阻止涂层柱状晶的生长，阻碍裂纹和缺陷的扩展，提高涂层的硬度、韧性和耐冲击性。

Description

SiZrC/SiZrCN叠层涂层刀具及其制备工艺
技术领域
本发明属于机械制造切削刀具领域，特别是涉及一种SiZrC/SiZrCN叠层涂层刀具及其制备工艺。
背景技术
涂层刀具的广泛应用促进了高速切削技术的发展，涂层刀具具有硬度高，耐热性、耐磨性能好，化学稳定性、抗粘结性能强，摩擦系数低，刀具寿命更高等优点。目前涂层刀具已广泛应用于航天航空材料加工、汽车零部件制造、模具成型制造、机床制造等行业中。TiCN是目前最广泛使用的三元碳氮化合物涂层，TiCN涂层由于兼具TiC的高硬度和TiN的良好韧性，显著提高了其摩擦磨损性能(Jinlong Li,Shihong Zhang,Mingxi Li.Influenceofthe C2H2flow rate on gradient TiCN films deposited by multi-arc ion plating[J].Applied Surface Science,2013(283):134-144.)，已广泛应用于铣削、攻牙、冲压、成型及滚齿的加工，在高速切削时比普通硬质合金刀具的耐磨性高5-8倍。中国专利“汽轮机转子轮槽铣刀表面TiCN多层复合涂层制备工艺”(专利号201510564738.5)利用Ti、氮气(N2)与乙炔气体(C2H2)在450℃沉积温度下合成了TiCN涂层铣刀，解决了26NiCrMov145材料转子加工难题。
TiCN涂层虽然具有高硬度、低摩擦系数的优点，但同时因其热稳定性和红硬性较差，仅适合应用于低速切削或具有良好冷却条件的场合，需要对传统TiCN涂层结构和制备工艺进行改进。目前，多元化是材料改善力学性能、耐蚀性和耐磨性的有效途径，通过制备多元复合涂层，既可提高涂层与基体的结合强度，又兼顾多种单涂层的综合性能，显著提高涂层刀具的性能。
目前TiCN等碳氮化合物主要通过化学气相沉积技术(CVD)等技术制备，即通过TiCl4(或Ti靶)、CH4(或C2H2)以及N2等气体反应生成，沉积温度通常超过400℃，对基体产生不利影响，同时气体碳源容易对涂层设备造成污染，制约了其广泛应用。
层状复合材料是近几年发展起来的材料增强增韧新技术，这种结构是通过模仿贝壳而来，因此又叫仿生叠层复合材料。自然界中贝壳的珍珠层是一种天然的层状结构材料，其断裂韧性却比普通单一均质结构高出3000倍以上。因此，通过模仿生物材料结构形式的层间设计，制备出的叠层复合涂层可以提高目前碳氮化合物涂层的韧性、稳定性及减摩耐磨性等综合性能。
发明内容
针对现有碳氮化合物涂层刀具性能及制备方法的不足，结合层状复合材料结构的优点本发明目的在于提供一种SiZrC/SiZrCN叠层涂层刀具及其制备工艺。
本发明所述的SiZrC/SiZrCN叠层涂层刀具，刀具基体最外层为SiZrCN涂层，刀具基体与SiZrCN涂层之间有Ti过渡层，SiZrCN涂层与Ti过渡层之间为SiZrC涂层与SiZrCN涂层交替的复合叠层结构。
所述刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石或立方氮化硼中的一种。
本发明所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，沉积方式为采用中频磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合SiZrC中频磁控溅射靶，2个电弧Ti靶：首先采用电弧镀沉积Ti过渡层，然后采用中频中频磁控溅射方法交替沉积SiZrC涂层与SiZrCN涂层，最外层为SiZrCN涂层；其中：SiZrC中频磁控溅射靶中包含重量分数为40％-70％的Si、20％-45％的Zr和10％-15％的C。
具体包括以下步骤：
(1)对刀具基体表面前处理；
(2)对刀具基体表面离子清洗；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层；
(4)采用中频磁控溅射在Ti过渡层上沉积SiZrC涂层；
(5)采用中频磁控溅射在SiZrC涂层上沉积SiZrCN涂层；
(6)采用中频磁控溅射在SiZrCN涂层上沉积SiZrC涂层；
(7)重复(5)、(6)、(5)……(5)，交替沉积SiZrCN涂层、SiZrC涂层、SiZrCN涂层……SiZrCN涂层共75min；
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
其中：
步骤(1)中首先将刀具基体表面抛光，然后依次放入酒精和丙酮中，超声清洗各30min，干燥充分后放入镀膜机，抽真空至8.0×10-3Pa，加热至280℃，保温30min。
步骤(2)中通Ar气，其压力为1.5Pa，开启偏压电源，电压500V，占空比0.2，辉光放电清洗30min；降低偏压至400V，占空比0.3，开启离子源离子清洗20min，开启电弧Ti靶电源，Ti靶电流55A，偏压300V，离子轰击1～2min。
步骤(3)中调Ar气压0.6～0.7Pa，偏压降至250V，Ti靶电流70A，沉积温度250℃，电弧镀Ti过渡层4～5min。
步骤(4)中调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min。
步骤(5)中开启N2，N2气压为1.2Pa，Ar气压0.7Pa，偏压200V，SiZrC中频磁控溅射靶电流40A，沉积温度200℃，复合沉积SiZrCN涂层4～5min，沉积完成后关闭N2。
步骤(6)中调Ar气压0.5～0.6Pa，偏压调至220V，调SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min。
本发明所述SiZrC中频磁控溅射靶采用真空热压法制备，即将装有Si粉末、Zr粉末、C粉末混合粉的模具置入真空热压炉，经热压烧结后成型所得。
本发明所制备的SiZrC/SiZrCN叠层涂层刀具，刀具表面为SiZrCN涂层，刀具基体与SiZrCN涂层间有Ti过渡层，SiZrCN涂层与Ti过渡层之间是SiZrC涂层和SiZrCN涂层交替的复合叠层结构。刀具基体上的Ti过渡层主要作用是减缓因涂层成分突变造成的层间应力，提高了涂层与刀具基体间的结合性能，涂层中的Si元素提高了涂层的硬度和抗化学扩散能力，Zr元素提高了涂层的耐磨性能，同时该叠层复合结构的层间界面可阻止涂层柱状晶的生长，阻碍裂纹和缺陷的扩展，提高涂层的硬度、韧性和耐冲击性。
本发明与现有技术相比，具有以下有益效果。
本发明采用中频磁控溅射+电弧镀的复合镀膜方法，直接采用SiZrC复合靶作碳源，且沉积温度控制在300℃以下，可在更为广泛的刀具或工具基体上制备，所制备的SiZrC/SiZrCN叠层涂层刀具综合了SiZrCN超硬碳氮化合物涂层、SiZrC超硬碳化物涂层及叠层结构的优点，可明显改善传统TiCN涂层刀具的物理机械性能。该SiZrC/SiZrCN叠层刀具可降低高速干切削过程中的氧化磨损和扩散磨损，提高涂层刀具热稳定性，减少切屑的粘结和摩擦，降低刀具磨损量40％以上，提高涂层刀具使用寿命和加工效率50％以上。同时，SiZrC/SiZrCN叠层复合结构通过叠层之间的界面可减缓涂层裂纹扩展，该叠层复合涂层刀具可广泛应用于各种淬硬钢及钛合金等难加工材料的切削加工。
附图说明
图1、本发明的SiZrC/SiZrCN叠层涂层刀具的涂层结构示意图。
图中：1、刀具基体2、Ti过渡层3、SiZrC涂层4、SiZrCN涂层5、SiZrC涂层与SiZrCN涂层交替的叠层复合结构。
具体实施方式
下面给出本发明的二个最佳实施例：
实施例1
一种SiZrC/SiZrCN叠层涂层刀具及其制备工艺，该刀具为普通的铣刀片，其刀具基体材料为：硬质合金YT15，刀具基体最外层为SiZrCN涂层，刀具基体与SiZrCN涂层之间有Ti过渡层，SiZrCN涂层与Ti过渡层之间为SiZrC涂层与SiZrCN涂层交替的复合叠层结构。。沉积方式为采用中频磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合SiZrC中频磁控溅射靶，2个电弧Ti靶。首先采用电弧镀沉积Ti过渡层，然后采用中频磁控溅射方法交替沉积SiZrC涂层与SiZrCN涂层，最外层为SiZrCN复合涂层；其中：SiZrC中频磁控溅射靶中包含重量分数为70％的Si、20％的Zr和10％的C。
其具体制备工艺包括以下步骤：
(1)对刀具基体表面前处理：首先将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至8.0×10-3Pa，加热至280℃，保温30min；
(2)对刀具基体表面离子清洗：通Ar气，其压力为1.5Pa，开启偏压电源，电压500V，占空比0.2，辉光放电清洗30min；降低偏压至400V，占空比0.3，开启离子源离子清洗20min，开启电弧Ti靶电源，Ti靶电流55A，偏压300V，离子轰击1～2min；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层：调Ar气压0.6～0.7Pa，偏压降至250V，Ti靶电流70A，沉积温度250℃，电弧镀Ti过渡层4～5min；
(4)采用中频磁控溅射在Ti过渡层上沉积SiZrC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min；
(5)采用中频磁控溅射在SiZrC涂层上沉积SiZrCN涂层：开启N2，N2气压为1.2Pa，Ar气压0.7Pa，偏压200V，SiZrC中频磁控溅射靶电流40A，沉积温度200℃，复合沉积SiZrCN涂层4～5min，沉积完成后关闭N2；
(6)采用中频磁控溅射在SiZrCN涂层上沉积SiZrC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min；
(7)重复(5)、(6)、(5)……(5)，交替沉积SiZrCN涂层、SiZrC涂层、SiZrCN涂层……SiZrCN涂层共75min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
实施例2
一种SiZrC/SiZrCN叠层涂层刀具及其制备工艺，该刀具为普通麻花钻，其刀具基体材料为：高速钢W18Cr4V，刀具基体最外层为SiZrCN涂层，刀具基体与SiZrCN涂层之间有Ti过渡层，SiZrCN涂层与Ti过渡层之间为SiZrC涂层与SiZrCN涂层交替的复合叠层结构。。沉积方式为采用中频磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合SiZrC中频磁控溅射靶，2个电弧Ti靶。首先采用电弧镀沉积Ti过渡层，然后采用中频磁控溅射方法交替沉积SiZrC涂层与SiZrCN涂层，最外层为SiZrCN复合涂层；其中：SiZrC中频磁控溅射靶中包含重量分数为40％的Si、45％的Zr和15％的C。
其具体制备工艺包括以下步骤：
(1)对刀具基体表面前处理：首先将刀具基体表面抛光，去除表面油污、锈迹等杂质，然后依次放入酒精和丙酮中，超声清洗各30min，去除刀具表面油污和其它附着物，电吹风干燥充分后迅速放入镀膜机，抽真空至8.0×10-3Pa，加热至280℃，保温30min；
(2)对刀具基体表面离子清洗：通Ar气，其压力为1.5Pa，开启偏压电源，电压500V，占空比0.2，辉光放电清洗30min；降低偏压至400V，占空比0.3，开启离子源离子清洗20min，开启电弧Ti靶电源，Ti靶电流55A，偏压300V，离子轰击1～2min；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层：调Ar气压0.6～0.7Pa，偏压降至250V，Ti靶电流70A，沉积温度250℃，电弧镀Ti过渡层4～5min；
(4)采用中频磁控溅射在Ti过渡层上沉积SiZrC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min；
(5)采用中频磁控溅射在SiZrC涂层上沉积SiZrCN涂层：开启N2，N2气压为1.2Pa，Ar气压0.7Pa，偏压200V，SiZrC中频磁控溅射靶电流40A，沉积温度200℃，复合沉积SiZrCN涂层4～5min，沉积完成后关闭N2；
(6)采用中频磁控溅射在SiZrCN涂层上沉积SiZrC涂层：调Ar气压0.5～0.6Pa，偏压调至220V，调SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min；
(7)重复(5)、(6)、(5)……(5)，交替沉积SiZrCN涂层、SiZrC涂层、SiZrCN涂层……SiZrCN涂层共75min：
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。

Claims (10)

1.一种SiZrC/SiZrCN叠层涂层刀具，其特征在于：刀具基体最外层为SiZrCN涂层，刀具基体与SiZrCN涂层之间有Ti过渡层，SiZrCN涂层与Ti过渡层之间为SiZrC涂层与SiZrCN涂层交替的复合叠层结构。
2.根据权利要求1所述的SiZrC/SiZrCN叠层涂层刀具，其特征在于：刀具基体材料为高速钢、工具钢、模具钢、硬质合金、陶瓷、金刚石或立方氮化硼中的一种。
3.一种SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：沉积方式为采用中频磁控溅射+电弧镀的复合镀膜方法，沉积时使用2个复合SiZrC中频磁控溅射靶，2个电弧Ti靶：首先采用电弧镀沉积Ti过渡层，然后采用中频磁控溅射方法交替沉积SiZrC涂层与SiZrCN涂层，最外层为SiZrCN涂层；其中：SiZrC中频磁控溅射靶中包含重量分数为40％-70％的Si、20％-45％的Zr和10％-15％的C。
4.根据权利要求3所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：具体包括以下步骤：
(1)对刀具基体表面前处理；
(2)对刀具基体表面离子清洗；
(3)采用电弧镀在刀具基体表面沉积Ti过渡层；
(4)采用中频磁控溅射在Ti过渡层上沉积SiZrC涂层；
(5)采用中频磁控溅射在SiZrC涂层上沉积SiZrCN涂层；
(6)采用中频磁控溅射在SiZrCN涂层上沉积SiZrC涂层；
(7)重复(5)、(6)、(5)……(5)，交替沉积SiZrCN涂层、SiZrC涂层、SiZrCN涂层……SiZrCN涂层共75min；
(8)后处理：关闭各靶电源、离子源及气体源，涂层结束。
5.根据权利要求4所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：步骤(1)中首先将刀具基体表面抛光，然后依次放入酒精和丙酮中，超声清洗各30min，干燥充分后放入镀膜机，抽真空至8.0×10-3Pa，加热至280℃，保温30min。
6.根据权利要求4所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：步骤(2)中通Ar气，其压力为1.5Pa，开启偏压电源，电压500V，占空比0.2，辉光放电清洗30min；降低偏压至400V，占空比0.3，开启离子源离子清洗20min，开启电弧Ti靶电源，Ti靶电流55A，偏压300V，离子轰击1～2min。
7.根据权利要求4所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：调Ar气压0.6～0.7Pa，偏压降至250V，Ti靶电流70A，沉积温度250℃，电弧镀Ti过渡层4～5min。
8.根据权利要求4所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：步骤(4)中调Ar气压0.5～0.6Pa，偏压调至220V，关闭电弧Ti靶电源，开启SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min。
9.根据权利要求4所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：步骤(5)中开启N2，N2气压为1.2Pa，Ar气压0.7Pa，偏压200V，SiZrC中频磁控溅射靶电流40A，沉积温度200℃，复合沉积SiZrCN涂层4～5min，沉积完成后关闭N2。
10.根据权利要求4所述的SiZrC/SiZrCN叠层涂层刀具的制备工艺，其特征在于：步骤(6)中调Ar气压0.5～0.6Pa，偏压调至220V，调SiZrC中频磁控溅射靶电流35A，沉积SiZrC涂层4～5min。
CN201710289471.2A 2017-04-27 2017-04-27 SiZrC/SiZrCN叠层涂层刀具及其制备工艺 Pending CN107119255A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710289471.2A CN107119255A (zh) 2017-04-27 2017-04-27 SiZrC/SiZrCN叠层涂层刀具及其制备工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710289471.2A CN107119255A (zh) 2017-04-27 2017-04-27 SiZrC/SiZrCN叠层涂层刀具及其制备工艺

Publications (1)

Publication Number Publication Date
CN107119255A true CN107119255A (zh) 2017-09-01

Family

ID=59725516

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710289471.2A Pending CN107119255A (zh) 2017-04-27 2017-04-27 SiZrC/SiZrCN叠层涂层刀具及其制备工艺

Country Status (1)

Country Link
CN (1) CN107119255A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1935999A2 (en) * 2006-12-15 2008-06-25 Sandvik Intellectual Property AB Coated cemented carbide endmill
CN106086787A (zh) * 2016-06-15 2016-11-09 济宁学院 Ti‑TiN+MoS2/Ti叠层复合涂层刀具及其制备工艺
CN106163708A (zh) * 2014-04-10 2016-11-23 株式会社图格莱 包覆工具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1935999A2 (en) * 2006-12-15 2008-06-25 Sandvik Intellectual Property AB Coated cemented carbide endmill
CN106163708A (zh) * 2014-04-10 2016-11-23 株式会社图格莱 包覆工具
CN106086787A (zh) * 2016-06-15 2016-11-09 济宁学院 Ti‑TiN+MoS2/Ti叠层复合涂层刀具及其制备工艺

Similar Documents

Publication Publication Date Title
CN105624618B (zh) TiAlSiZrN基复合涂层、具有该复合涂层的梯度超细硬质合金刀具及其制备方法
CN102277554B (zh) 梯度叠层涂层刀具及其制备方法
CN105586572A (zh) (Ti,Al,Zr)N多组元复合涂层、具有该复合涂层的梯度超细硬质合金刀具及其制备方法
CN105671551A (zh) 金刚石复合涂层、具有该复合涂层的梯度超细硬质合金刀具及其制备方法
CN106893987A (zh) 一种物理气相沉积Ta‑C涂层的制备方法及Ta‑C涂层
CN107338411B (zh) AlNbCN多元梯度复合涂层刀具及其制备方法
CN103084600A (zh) 超硬TiN-TiSiN-CN多层交替复合梯度涂层硬质合金刀片及制备方法
CN108118301A (zh) 一种具有Si含量梯度变化的中间层的AlCrSiN涂层、制备方法
CN107190233A (zh) 一种具有超高硬度的Si掺杂纳米复合涂层的制备工艺
CN107177827B (zh) SiNbC/SiNbCN叠层复合涂层刀具及其制备工艺
CN106893975B (zh) AlC/AlCN叠层涂层刀具及其制备工艺
CN103938157B (zh) 一种ZrNbAlN超晶格涂层及制备方法
CN107177828B (zh) SiZrCN梯度复合涂层刀具及其制备方法
CN107099778B (zh) 一种铝合金干式加工用非晶刀具涂层及其制备方法
CN107354431A (zh) TiMoCN梯度复合涂层刀具及其制备方法
CN107177825B (zh) ZrNbC/ZrNbCN叠层涂层刀具及其制备工艺
CN107338412A (zh) CrNbC/CrNbCN叠层复合涂层刀具及其制备工艺
CN107177826B (zh) MoNbC/MoNbCN叠层复合涂层刀具及其制备工艺
CN107354432A (zh) ZrCrCN梯度复合涂层刀具及其制备方法
CN207176061U (zh) 一种物理气相沉积Ta‑C涂层及设有该涂层的工件
CN107119255A (zh) SiZrC/SiZrCN叠层涂层刀具及其制备工艺
CN107419229A (zh) CrMoC/CrMoCN叠层涂层刀具及其制备工艺
CN107400864A (zh) AlMoC/AlMoCN叠层涂层刀具及其制备工艺
CN107058951B (zh) ZrAlC/ZrAlCN叠层复合涂层刀具及其制备工艺
CN107119275B (zh) ZrCrC/ZrCrCN叠层复合涂层刀具及其制备工艺

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170901