CN107112658B - 各向异性导电膜和连接方法 - Google Patents

各向异性导电膜和连接方法 Download PDF

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Publication number
CN107112658B
CN107112658B CN201680005263.9A CN201680005263A CN107112658B CN 107112658 B CN107112658 B CN 107112658B CN 201680005263 A CN201680005263 A CN 201680005263A CN 107112658 B CN107112658 B CN 107112658B
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CN
China
Prior art keywords
anisotropic conductive
conductive film
layer
circuit member
terminal
Prior art date
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Active
Application number
CN201680005263.9A
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English (en)
Chinese (zh)
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CN107112658A (zh
Inventor
大关裕树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
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Publication of CN107112658A publication Critical patent/CN107112658A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN201680005263.9A 2015-01-22 2016-01-06 各向异性导电膜和连接方法 Active CN107112658B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-010310 2015-01-22
JP2015010310A JP6474620B2 (ja) 2015-01-22 2015-01-22 異方性導電フィルム、及び接続方法
PCT/JP2016/050191 WO2016117350A1 (ja) 2015-01-22 2016-01-06 異方性導電フィルム、及び接続方法

Publications (2)

Publication Number Publication Date
CN107112658A CN107112658A (zh) 2017-08-29
CN107112658B true CN107112658B (zh) 2019-07-12

Family

ID=56416899

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680005263.9A Active CN107112658B (zh) 2015-01-22 2016-01-06 各向异性导电膜和连接方法

Country Status (5)

Country Link
JP (1) JP6474620B2 (https=)
KR (1) KR102006090B1 (https=)
CN (1) CN107112658B (https=)
TW (1) TWI681694B (https=)
WO (1) WO2016117350A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6798165B2 (ja) 2016-07-06 2020-12-09 スズキ株式会社 車両用排気管のマウント装置
WO2018225191A1 (ja) * 2017-06-07 2018-12-13 日立化成株式会社 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置
WO2019050006A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
KR102569980B1 (ko) * 2017-09-11 2023-08-24 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
JP6939542B2 (ja) * 2017-12-28 2021-09-22 株式会社オートネットワーク技術研究所 電気接続装置
CN112210321A (zh) * 2019-07-12 2021-01-12 臻鼎科技股份有限公司 导电粘着剂以及使用其的电磁波屏蔽膜和电路板
WO2023276792A1 (ja) * 2021-07-01 2023-01-05 日東電工株式会社 接合シートおよび電子部品の製造方法
JP7552782B1 (ja) 2023-04-24 2024-09-18 株式会社レゾナック 半導体用フィルム状接着剤、半導体用フィルム状接着剤の製造方法、接着剤テープ、半導体装置の製造方法及び半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103819A (ja) * 1992-09-21 1994-04-15 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH08148211A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材及び該接続部材を用いた電極の接続構造・接続方法
JP2006318990A (ja) * 2005-05-10 2006-11-24 Hitachi Chem Co Ltd 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
WO2008023670A1 (fr) * 2006-08-22 2008-02-28 Hitachi Chemical Company, Ltd. matériau de connexion de circuits, structure de connexion d'un élément de circuit et procédés de fabrication de ladite structure
CN103748744A (zh) * 2011-08-23 2014-04-23 迪睿合电子材料有限公司 各向异性导电膜、各向异性导电膜的制造方法、连接方法及接合体
WO2014156930A1 (ja) * 2013-03-28 2014-10-02 デクセリアルズ株式会社 回路部材の接続方法、及び接合体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100009562A (ko) * 2004-06-09 2010-01-27 히다치 가세고교 가부시끼가이샤 회로접속재료, 필름상 회로접속재, 및 회로부재의 접속 구조
US20100221533A1 (en) * 2007-10-15 2010-09-02 Hitachi Chemical Company, Ltd. Circuit connecting adhesive film and circuit connecting structure
JP2009277769A (ja) 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103819A (ja) * 1992-09-21 1994-04-15 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH08148211A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材及び該接続部材を用いた電極の接続構造・接続方法
JP2006318990A (ja) * 2005-05-10 2006-11-24 Hitachi Chem Co Ltd 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
WO2008023670A1 (fr) * 2006-08-22 2008-02-28 Hitachi Chemical Company, Ltd. matériau de connexion de circuits, structure de connexion d'un élément de circuit et procédés de fabrication de ladite structure
CN103748744A (zh) * 2011-08-23 2014-04-23 迪睿合电子材料有限公司 各向异性导电膜、各向异性导电膜的制造方法、连接方法及接合体
WO2014156930A1 (ja) * 2013-03-28 2014-10-02 デクセリアルズ株式会社 回路部材の接続方法、及び接合体

Also Published As

Publication number Publication date
TWI681694B (zh) 2020-01-01
KR20170083113A (ko) 2017-07-17
KR102006090B1 (ko) 2019-07-31
JP2016134366A (ja) 2016-07-25
JP6474620B2 (ja) 2019-02-27
TW201633863A (zh) 2016-09-16
WO2016117350A1 (ja) 2016-07-28
CN107112658A (zh) 2017-08-29

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