CN107078124B - 用于具有半导体芯片的电子系统的封装 - Google Patents

用于具有半导体芯片的电子系统的封装 Download PDF

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CN107078124B
CN107078124B CN201580059417.8A CN201580059417A CN107078124B CN 107078124 B CN107078124 B CN 107078124B CN 201580059417 A CN201580059417 A CN 201580059417A CN 107078124 B CN107078124 B CN 107078124B
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chip
plane
semiconductor
slab
terminals
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CN107078124A (zh
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O·J·洛佩兹
J·A·纳奎尔
T·E·葛瑞布斯
S·J·莫洛伊
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Texas Instruments Inc
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Texas Instruments Inc
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    • H01L2924/1515—Shape
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    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
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