CN107068576A - 制造柔性电子器件的方法 - Google Patents
制造柔性电子器件的方法 Download PDFInfo
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Abstract
一种制造柔性电子器件的方法,该方法包括:(a)在临时承载件(120)上布置电子部件(110);设置包括粘合层(132)的柔性层叠体(130);以粘合层(132)面向临时承载件(120)的方式将临时承载件(120)和柔性层叠体(130)按压在一起,以使得电子部件(110)被推入粘合层(132)中;以及移除临时承载件(120)。
Description
技术领域
本发明涉及柔性电子器件,尤其涉及一种制造柔性电子器件的方法。
背景技术
常规地,裸晶片以及其他电子部件被封装在由塑料或树脂制成的模制化合物中。随着对小形状因子和以较低的成本改进性能的持续需求,对于改进的封装方案仍然存在空间。
此外,已经出现对能够承载(deliver,递送、运载)包含非常薄的电子部件或芯片的柔性电子器件——例如供被携带在人的身体上的设备诸如传感器、手表等使用——的封装方案的需求。
尽管已经开发了用于制造柔性封装件的各种方法(参见例如US 2014/110859A1、DE 10 2014 116416 A1以及US 2007/059951 A1),但是还存在对允许以简单且成本效率的方式制造柔性电子器件的改进的方法的需求。
发明内容
为了满足上述需求,提供了一种根据独立权利要求的制造电子器件的方法。
根据本发明的一个示例性实施方案,提供了一种制造柔性电子器件的方法。该方法包括:(a)将电子部件布置在临时承载件上;(b)设置包括粘合层的柔性层叠体(laminate,层压体);(c)以所述粘合层面向所述临时承载件的方式将所述临时承载件和所述柔性层叠体按压在一起,以使得所述电子部件被推入所述粘合层中;以及(d)移除所述临时承载件。
在本申请的上下文中,术语“柔性层叠体”可以具体地表示包括层叠的不同材料和/或具有不同性质的层的柔性(即,可弯曲和/或可变形的)层叠结构。
在本申请的上下文中,术语“电子部件被推入粘合层中”可以具体地表示强迫电子部件进入粘合层中,该粘合层因此相应地变形以便为该电子部件留出空间。由此,除了电子部件的与临时承载件接触的一侧之外,电子部件的所有其他侧均与粘合层的材料接触并因而被粘合层的材料包围。
根据本发明的一个示例性实施方案,包括嵌入式电子部件尤其是超薄部件的柔性电子器件可以通过按压临时承载件(其上放置有电子部件)和柔性层叠体的粘合层彼此抵靠使得电子部件被推入粘合层中而以简单的方式被制造。在按压之后,移除临时承载件。在移除临时承载件之后,电子部件的先前与临时承载件接触的部分(例如该部件的表面)将被露出(即可访问),并且基本上与粘合层的表面平行。电子部件的其余部分将被埋置在粘合层中。因而,电子器件准备好供需要访问该电子部件的自由表面的应用使用。可替代地,可以实施另外的处理步骤,以形成覆盖电子部件的自由表面(或其部分)的附加结构。
在下文中,将说明该方法的另外的示例性实施方案。
在一个实施方案中,所述柔性层叠体还包括柔性层和导电层,所述柔性层被布置在所述导电层和所述粘合层之间。因而,在该实施方案中,柔性层叠体被形成为按照以下顺序布置的(至少)三个层的堆叠体:粘合层、柔性层和导电层。
在一个实施方案中,所述粘合层包括粘合材料,尤其是b阶环氧树脂,并且/或者柔性层包括树脂,尤其是聚酰亚胺,并且/或者导电层包括金属,尤其是选自由铜、铝以及镍组成的组中的金属。通过在粘合层中包括b阶环氧树脂,可以容易地将电子部件按压到粘合层中(在施加或不施加热的情况下)。聚酰亚胺树脂向供各种各样的应用使用的器件提供了优异的柔性特性以及足够的稳定性。导电金属诸如铜可以用于以本领域已知的各种方式形成导电结构。
在一个实施方案中,柔性层叠体包括R-FR10箔或片。更具体地,R-FR10是层叠材料,其包括聚酰亚胺层,在一侧具有铜层并且在另一侧具有b阶粘合层。
在一个实施方案中,粘合层的厚度在5μm至75μm的范围内、尤其是在10μm至60μm的范围内、尤其是在15μm至45μm的范围内、尤其是在20μm至30μm的范围内,并且/或者电子部件的厚度在2μm至50μm的范围内、尤其是在5μm至35μm的范围内、尤其是在10μm至20μm的范围内。可以看出,粘合层足够厚以容纳电子部件,但不显著厚于电子部件。由此,可以根据本发明的方法容易地制造非常薄的挠曲器件。
在一个实施方案中,所述方法还包括以下步骤:布置具有另外的粘合层的另外的柔性层叠体,使所述另外的粘合层面向所述柔性层叠体的粘合层以及所述电子部件。换言之,另外的柔性层叠体(其可以与上述柔性层叠体相同或相似)被布置为使其粘合层面向由上述粘合层和容纳在上述粘合层中的电子部件形成的表面。因而,另外的柔性层叠体被布置成使得其各层与上述柔性层叠体的各层的顺序相比处于相反的顺序。两个柔性层叠体可以被按压在一起(优选地通过施加热),以形成在其中嵌入有电子部件并且在两个外表面上均具有导电层的薄的、基本上平面的电子器件。
在一个实施方案中,所述方法还包括用保护层覆盖所述电子部件的未被所述柔性层叠体的粘合层覆盖的表面的至少一部分的步骤。换言之,电子部件的露出部分被保护层完全地或部分地覆盖。保护层甚至可以覆盖电子部件通过其露出的粘合层的整个表面。覆盖的步骤可以通过以下方式执行:施加足够大以覆盖电子部件和粘合层的整个表面的保护层;然后,如果需要,移除保护层的一部分(例如通过切割),使得粘合层和电子部件的仅期望部分被保护层覆盖。
在一个实施方案中,所述方法还包括形成与所述保护层相邻并且与所述保护层处于基本上相同的平面中的下部导电层的步骤。换言之,形成下部导电层,使得电子器件的下部表面层包括基本上两个部分:下部导电层和保护层。
在一个实施方案中,所述电子部件和所述柔性层叠体形成子组件,并且所述方法还包括:(a)通过(a1)将另外的电子部件布置在另外的临时承载件上;(a2)设置包括另外的粘合层的另外的柔性层叠体;(a3)以所述另外的粘合层面向所述另外的临时承载件的方式将另外的临时承载件和另外的柔性层叠体按压在一起,以使得所述另外的电子部件被推入所述另外的粘合层中;以及(a4)移除所述另外的临时承载件,来形成另外的子组件:以及(b)在所述子组件和所述另外的子组件之间布置释放层,使得第一子组件的粘合层接触所述释放层的一侧,并且所述另外的子组件的另外的粘合层接触所述释放层的另一侧。
简言之,形成与所述子组件相似或相同的另外的子组件。然后,在这两个子组件之间布置释放层,使得每个子组件的相应粘合层接触释放层的相应侧。
在一个实施方案中,所述方法还包括移除释放层的步骤。换言之,在可能的进一步适应(adaption,调整)或添加附加层(取决于待制造的特定电子器件)之后,可以移除释放层并且子组件由此彼此分离,使得最终形成两个电子器件(其可以互连或不互连)。
在一个实施方案中,所述方法还包括在所述粘合层的至少一部分上和/或所述电子部件的未被所述粘合层覆盖的部分上设置下部导电层的步骤。
通过在由电子部件的露出部分和粘合层构成的表面(至少一部分)上形成下部导电层,可以在电子器件中形成两层(通常被称为多层)导电结构。
在一个实施方案中,所述方法还包括布置导热材料层以使来自所述电子部件的热散发的步骤。导热材料可以例如形成在电子部件上或与电子部件热接触(经由上述露出的表面部分或电子器件的其他表面部分),使得电子部件在运行期间产生的热可以从电子器件耗散。
在一个实施方案中,所述方法还包括形成穿过所述柔性层叠体的至少一个孔以提供与所述电子部件的端子的电接触的步骤。孔可以通过钻孔、切割、激光、蚀刻或任何其他合适的技术形成。在一些情况下,随后可以用导电材料填充上述孔以建立电连接。
在一个实施方案中,所述方法还包括移除所述导电层的一部分以形成导电层结构的步骤。换言之,导电层被结构化,使得留下多个分离的(并且电隔离的)导电表面部分,诸如焊盘和迹线(trace)。该结构化可以通过任何合适的技术诸如蚀刻、光刻等来执行。
在一个实施方案中,所述电子部件是超薄柔性电子部件,尤其是有源或无源的超薄柔性电子部件或芯片。
在一个实施方案中,所述电子部件选自由下述组成的组中:有源电子部件、无源电子部件、电子芯片、存储设备、滤波器、集成电路、信号处理部件、功率管理部件、光电接口元件、电压转换器、加密部件、发射器和/或接收器、机电换能器、传感器、致动器、微机电系统、微处理器、电容器、电阻器、电感、电池、开关、相机、天线、磁性元件以及逻辑芯片。然而,其他电子部件可以被嵌入在电子器件中。例如,可以使用磁性元件作为电子部件。这样的磁性元件可以是永磁性元件(诸如铁磁元件、反铁磁性元件或铁磁性元件,例如铁氧体磁芯),或者可以是顺磁性元件。这样的电子部件可以被表面安装在部件承载件上,和/或可以嵌入在部件承载件的内部。
在一个实施方案中,所述柔性电子器件被成形为板的形式。这有助于电子器件的紧凑设计,不过其中部件承载件(即,在其中封装或嵌入有电子部件的层状结构)提供用于在其上安装电子部件的大基底。此外,由于裸晶片的厚度小,可以方便地将尤其是作为嵌入式电子部件的优选示例的裸晶片嵌入到薄板诸如印刷电路板中。
在一个实施方案中,所述柔性电子器件被配置为由印刷电路板和基板组成的组中之一。
在本申请的上下文中,术语“印刷电路板”(PCB)可以具体地表示通过将若干导电层结构与若干电绝缘层结构层叠所形成的板形部件承载件,上述形成过程例如通过施加压力进行,如果需要的话伴随有热能的供应。作为用于PCB技术的优选材料,导电层结构由铜制成,而电绝缘层结构可以包括树脂和/或玻璃纤维、所谓的预浸料或FR4材料。通过形成穿过层叠体的通孔(例如通过激光钻孔或机械钻孔),并且通过用导电材料(尤其是铜)填充这些通孔由此形成作为通孔连接件的过孔,各个导电层结构可以以期望的方式彼此连接。除了可以嵌入在印刷电路板中的一个或多个电子部件之外,印刷电路板通常被配置用于在板形印刷电路板的一个表面或两个相反表面上容纳一个或多个电子部件。它们可以通过焊接连接到相应的主表面。
在本申请的上下文中,术语“基板”可以具体地表示与要安装在其上的电子部件具有基本上相同的尺寸的小部件承载件。
本发明的以上限定的方面和其他方面从下文将要描述的实施方案的示例将是明了的,并且被参照实施方案的这些示例进行说明。
附图说明
图1A至图1D示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
图2A至图2E示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
图3A至图3C示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
图4A至图4E示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
图5A至图5D示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
图6A和图6B示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
附图中的图示是示意性的。在不同的附图中,相似或同样的元件被提供有相同的附图标记。
具体实施方式
图1A至图1D示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。
更具体地,图1A示出了开始制造柔性电子器件的方法所需的单个项,即电子部件110、临时承载件120以及柔性层叠体130。电子部件110优选地是厚度(即,沿图的竖向方向的尺度)在2μm至50μm之间、优选在10μm至20μm之间的柔性裸晶片或柔性芯片。电子部件110在其一个或多个侧面上包括接触端子(未示出)。临时承载件120由合适的刚性承载件材料制成,上述材料诸如为丙烯酸酯、聚乙烯或聚酰亚胺,优选具有硅涂层。柔性层叠体130优选为一块或一片R-FR10或类似材料,并且包括:粘合层132,诸如b阶环氧树脂层;柔性层134,诸如硬化的聚酰亚胺层;以及导电层136,诸如铜层。粘合层的厚度优选在5μm至75μm之间,诸如在30μm至50μm之间。
作为该方法的第一步骤,如图1B所示,将电子部件110布置在临时承载件120上。以粘合层132面向临时承载件120的方式将柔性层叠体130设置在临时承载件120和电子部件110上方。然后,按压临时承载件120和柔性层叠体彼此抵靠,使得电子部件110被推入柔性层叠体130的粘合层132中。这里,可以向临时承载件120和柔性层叠体130中的任一个或两个施加按压力。图1C示出了由按压产生的结构。可以看出,电子部件110现在在除了面向临时承载件120的侧之外的所有侧上均被粘合层132包围。此后,如图1D所示,临时承载件120被移除,即,其与柔性层叠体130和电子部件110分离。由此,电子部件110的下侧112露出,而电子器件的所有的剩余侧均被粘合层132的材料包围。产生的结构138,即柔性层叠体130与容纳在粘合层132中的电子部件110,现在可以以各种各样的方式被进一步处理,诸如通过添加另外的层、结构化导电层136、提供与电子部件110的端子的电接触等。以下对示例性实施方案的描述提供了对这样的进一步处理的示例的非穷尽选择。
图2A至图2E示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。如图2A所示,本示例性实施方案的起始点是上面结合图1D讨论的结构138和另外的柔性层叠体140。该另外的柔性层叠体140包括粘合层142、柔性层144以及导电层146。换言之,另外的柔性层叠体140的大体结构类似于柔性层叠体130。因而,另外的柔性层叠体可以与柔性层叠体130相同,或者其可以由类似的材料制成但具有不同的尺度,诸如层厚度。具体地,另外的柔性层叠体140可以比柔性层叠体130薄。
如图2B所示,另外的柔性层叠体140被布置成使得粘合层142面向粘合层132和电子部件110。然后,按压这两个柔性层叠体彼此抵靠,并且优选地施加热以将这两个层叠体结合在一起从而形成如图2B所示的整体结构。
接下来,如图2C所示,通过在期望位置处钻孔或蚀刻出孔并用导电材料——优选地为铜——填充这些孔来制备过孔150、152以及154。更具体地,过孔150一直延伸穿过柔性器件,即在各个导电层136和146之间。过孔152延伸穿过器件的对应于另外的柔性层叠体140的部分,即在导电层146和电子部件110之间,并且过孔152用于在导电层146和电子部件110之间提供电接触和/或热接触。类似地,过孔154延伸穿过器件的对应于柔性层叠体130的部分,即在导电层136和电子部件110之间,并且过孔154用于提供导电层136和电子部件110之间的电接触和/或热接触。
此后,移除导电层136和146的选定部分以形成对应的导电结构136’和146’,如图2D所示。最后,将结构的最外部分(朝向图中的两侧)切除或锯除以形成图2E所示的柔性电子器件,其中层叠层的剩余材料被标记为132’、134’、136’、142’、144’以及146’。
图3A至图3C示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。本示例性实施方案的起始点是上面结合图1D讨论的结构138。如图3A所示,在结构138的表面上施加保护材料(诸如塑料)层150,以覆盖电子部件110的露出部分和粘合层132。然后,如图3B所示,移除(例如切除或蚀刻掉)保护材料的一部分,使得仅保留在电子部件的露出表面112上的保护层151。接下来,如图3C所示,在被移除的保护材料先前所在的地方形成下部导电层152。此外,为了完成柔性电子器件,可以如上面结合图2C至图2E所讨论的执行使导电层136和152互连并结构化以及切割或切削的类似步骤。本实施方案尤其适合于电子部件110是传感器并且传感器的露出表面112应当与外部表面(诸如人的皮肤)接触的应用。
图4A至图4E示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。如图4A所示,本实施方案的起始点是上面结合图1D讨论的结构138的两个样本138a和138b以及释放层170。更具体地,结构138a和138b被布置成使它们各自的粘合层132面向彼此,并且在它们之间插入释放层170。如图4B所示,将两个结构或子组件138a和138b以及释放层170按压在一起,优选地还施加有热,以形成整体单元。然后,如图4C所示,以与上面结合图2C所讨论的类似的方式,在各个导电层136和电子部件110之间形成下部互连过孔152和上部互连过孔154。接下来,如图4D所概述的并类似于以上结合图2D和图2E的描述,通过移除层136的选定部分形成导电结构136’,并且移除在右手侧和左手侧的多余材料。然后,移除释放层170,并且获得两个分离的结构138a’和138b’。
图5A至图5D示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。如图5A所示,本示例性实施方案的起始点是如上面结合图1D所讨论的结构138和导电层180,诸如铜层。然后,如图5B所示,在结构138的粘合层132上形成导电层180(例如,使用化学和电镀(galvanic)工艺、丝网印刷、喷墨、分配、PVT或涂覆),使得导电层与电子部件110的露出表面直接接触。由此,导电层180可以另外用于传导热离开电子部件110。导电层还可以被按压或胶合到结构138的粘合层132上,在这种情况下,将在导电材料和电子部件110的表面之间插入薄的介电材料层,使得导热性能可能有所降低。此外,形成类似于上面结合图2C所述的那些过孔的互连过孔150和154。接下来,如图5C所示,通过移除导电材料的多个部分形成上部导电结构136’和下部导电结构181,并且切除两侧的多余材料。可选地(在执行图5C所示的步骤之前或之后),如图5D所示,可以使用粘合层182将导热材料(诸如铜)层185胶合到导电层180上。导热层185可以用于耗散由电子部件110在运行期间产生的热。
图6A和图6B示出了在实施根据本发明的一个示例性实施方案的制造柔性电子器件的方法期间获得的结构的截面图。在该实施方案中,如图6A中所示,如上面结合图1D所讨论的两个结构138被配备有相应的下部导电结构181(还参见图5C)以及过孔150和154,然后在它们之间布置有接合层(bonding layer,粘结层)190使得两个子组件的粘合层132均面向接合层190。然后,如图6B所示,使用接合层190将两个结构接合在一起以形成整体单元。还如图6B所示,形成外部导电结构136’和一直延伸穿过该结构的附加过孔156,并且移除朝向两侧的多余材料。
如上所讨论和例示的,根据本发明的方法提供了一种制造其中嵌入有薄电子部件的柔性电子器件的简单且高度可变的方法。
应当注意,术语“包括”并不排除其他元件或步骤,并且“一个”或“一”并不排除多个。与不同实施方案相关联地描述的元件也可以进行组合。
还应当注意,权利要求中的附图标记不应被解释为限制权利要求的范围。
本发明的实施不限于附图中所示和上述的优选实施方案。相反,使用所示出的方案和根据本发明的原理的多种变型都是可能的,即使在根本不同的实施方案的情况下也如此。
Claims (19)
1.一种制造柔性电子器件的方法,所述方法包括:
将电子部件(110)布置在临时承载件(120)上;
设置包括粘合层(132)的柔性层叠体(130);
以所述粘合层(132)面向所述临时承载件(120)的方式将所述临时承载件(120)和所述柔性层叠体(130)按压在一起,以使得所述电子部件(110)被推入所述粘合层(132)中;以及
移除所述临时承载件(120)。
2.根据权利要求1所述的方法,其中,所述柔性层叠体(130)还包括柔性层(134)和导电层(136),所述柔性层(134)布置在所述导电层(136)和所述粘合层(132)之间。
3.根据权利要求2所述的方法,其中,所述粘合层(132)包括粘合材料,尤其是b阶环氧树脂,并且/或者其中,所述柔性层(134)包括树脂,尤其是聚酰亚胺,并且/或者其中,所述导电层(136)包括金属,尤其是选自由铜、铝以及镍组成的组中的金属。
4.根据权利要求1所述的方法,其中,所述柔性层叠体(130)包括R-FR10箔。
5.根据权利要求1所述的方法,其中,所述粘合层(132)的厚度在5μm至75μm的范围内,并且/或者其中,所述电子部件(110)的厚度在2μm至50μm的范围内。
6.根据权利要求1至5中任一项所述的方法,还包括:
布置具有另外的粘合层(142)的另外的柔性层叠体(140),使所述另外的粘合层面向所述柔性层叠体(130)的所述粘合层(132)以及所述电子部件(110)。
7.根据权利要求1至5中任一项所述的方法,还包括:
用保护层(161)覆盖所述电子部件(110)的未被所述柔性层叠体(130)的所述粘合层(132)覆盖的表面(112)的至少一部分。
8.根据权利要求7所述的方法,还包括:
形成与所述保护层(161)相邻并且与所述保护层处于基本上相同的平面中的下部导电层(152)。
9.根据权利要求1至5中任一项所述的方法,其中,所述电子部件(110)和所述柔性层叠体(130)形成子组件(138a、138b),所述方法还包括:
通过以下步骤形成另外的子组件(138b、138a):
将另外的电子部件(110)布置在另外的临时承载件(120)上;
设置包括另外的粘合层(132)的另外的柔性层叠体(130);
以所述另外的粘合层(132)面向所述另外的临时承载件(120)的方式将所述另外的临时承载件(120)和所述另外的柔性层叠体(130)按压在一起,以使得所述另外的电子部件(110)被推入所述另外的粘合层(132)中;以及
移除所述另外的临时承载件(120);并且
在所述子组件(138a、138b)和所述另外的子组件(138b、138a)之间布置释放层(170),以使得所述子组件(138a、138b)的所述粘合层(132)接触所述释放层(170)的一侧,并且使得所述另外的子组件(138b、138a)的所述另外的粘合层(132)接触所述释放层(170)的另一侧。
10.根据权利要求9所述的方法,还包括:
移除所述释放层(170)。
11.根据权利要求1至5中任一项所述的方法,还包括:
在所述粘合层(132)的至少一部分上和/或所述电子部件(110)的未被所述粘合层(132)覆盖的部分上设置下部导电层(180)。
12.根据权利要求1所述的方法,还包括:
布置导热材料层(185)以使来自所述电子部件(110)的热散发。
13.根据权利要求1所述的方法,还包括:
形成穿过所述柔性层叠体(130)的至少一个孔(150、152、154、156),以提供与所述电子部件(110)的端子的电接触。
14.根据权利要求2所述的方法,还包括:
移除所述导电层(136)的一部分以形成导电层结构(136’)。
15.根据权利要求1所述的方法,其中,所述电子部件(110)是超薄柔性电子部件。
16.根据权利要求1所述的方法,其中,所述电子部件(110)选自由下述组成的组中:有源电子部件、无源电子部件、电子芯片、存储设备、滤波器、集成电路、信号处理部件、功率管理部件、光电接口元件、电压转换器、加密部件、发射器和/或接收器、机电换能器、传感器、致动器、微机电系统、微处理器、电容器、电阻器、电感、电池、开关、相机、天线、磁性元件以及逻辑芯片。
17.根据权利要求1所述的方法,其中,所述柔性电子器件被成形为板的形式。
18.根据权利要求1所述的方法,其中,所述柔性电子器件被配置为由印刷电路板和基板组成的组中之一。
19.一种柔性电子器件,包括:
电子部件(110),以及
包括粘合层(132)的柔性层叠体(130),
其中,所述柔性电子器件已通过以下步骤制造:
将所述电子部件(110)布置在临时承载件(120)上;
设置包括粘合层(132)的所述柔性层叠体(130);
以所述粘合层(132)面向所述临时承载件(120)的方式将所述临时承载件(120)和所述柔性层叠体(130)按压在一起,以使得所述电子部件(110)被推入所述粘合层(132)中;以及
移除所述临时承载件(120)。
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