CN106981561A - Ultraviolet LED light source and preparation method thereof - Google Patents
Ultraviolet LED light source and preparation method thereof Download PDFInfo
- Publication number
- CN106981561A CN106981561A CN201710121642.0A CN201710121642A CN106981561A CN 106981561 A CN106981561 A CN 106981561A CN 201710121642 A CN201710121642 A CN 201710121642A CN 106981561 A CN106981561 A CN 106981561A
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- substrate
- light source
- chip
- led light
- ultraviolet
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention discloses a kind of ultraviolet LED light source and preparation method thereof.The ultraviolet LED light source includes substrate, UV LED chip and encapsulating structure.Wherein encapsulating structure is by multiple UV LED chips and corresponding circuit overall package.It is used to pass encapsulating structure with the connecting pin that external equipment is electrically connected on input circuit.The ultraviolet LED light source and preparation method thereof is by by UV LED chip and corresponding circuit overall package, UV LED chip is first packaged into the structure that single lamp bead is fixed on substrate again than traditional, ultraviolet radioactive angle is bigger, all-round radiation can be realized, thermal resistance is low simultaneously, can improve ultraviolet conversion efficiency and unfailing performance.The manufacture craft of the ultraviolet LED light source is simple, packaging cost is relatively low, and due to being overall package, when carrying out multiple UV LED chip connection in series-parallel, the problem of can avoiding causing bulky using many lamp bead connection in series-parallel, the volume of light source can be effectively reduced, and is developed with product to miniaturization.
Description
Technical field
The present invention relates to LED technology field, more particularly, to a kind of ultraviolet LED light source and preparation method thereof.
Background technology
Ultraviolet source is used for the fields such as photochemical reaction, product solidification, sterilizing and medical inspection.It is ultraviolet at present
Using the packing forms of single lamp bead more than LED/light source, need packaged uviol lamp bead weld being connected on progress on substrate when using
Fixed and electrical connection.The ultraviolet source power of this form is small, thermal resistance is high, angle of radiation is small and cost is of a relatively high, holds
The problems such as easily causing relatively low ultraviolet conversion efficiency, poor reliability, and when carrying out high-power many lamp bead strings simultaneously, bulky, limitation
Light source is flexibly used, thus have impact on using and promoting for ultraviolet LED light source, is especially difficult to replace traditional mercury vapour
Ultraviolet source.
The content of the invention
Based on this, it is necessary to provide that one kind can be applied to multi-chip high power encapsulation, light source thermal resistance is relatively low, angle of radiation
Larger, small volume ultraviolet LED light source and preparation method thereof.
A kind of ultraviolet LED light source, including substrate, UV LED chip and encapsulating structure；Wherein, at least the one of the substrate
Side surface is provided with multiple chip installation positions, and the substrate is provided with input circuit；The UV LED chip has multiple, multiple
UV LED chip respectively be located at multiple chip installation positions on, and multiple UV LED chips by connect circuit with it is described
Input circuit is electrically connected；The encapsulating structure is described defeated by multiple UV LED chips and corresponding circuit overall package
Enter is used to pass the encapsulating structure with the connecting pin that external equipment is electrically connected on circuit.
In one of the embodiments, the both side surface of the substrate is equipped with the chip installation position, and both side surface
The input circuit is correspondingly provided with respectively.
In one of the embodiments, the input circuit is the double-width grinding that two electrodes are located at the substrate two ends respectively
Circuit, or be respectively equipped with the two ends of the substrate bipolar electrode double-width grinding circuit and two ends bipolar electrode correspondence electrically connect
Connect, the counter electrode at the double-width grinding circuit two ends is respectively provided with the connecting pin.
In one of the embodiments, the input circuit is to be provided with the single ended input of bipolar electrode in one end of the substrate
Circuit and the counter electrode at the end have the connecting pin respectively, or to be respectively equipped with bipolar electrode contact at the two ends of the substrate
And only one end has the connecting pin that the bipolar electrode contact with the end is electrically connected respectively wherein.
In one of the embodiments, the UV LED chip is flip-chip, and the UV LED chip passes through direction
The side surface electrode of the substrate turns on the input circuit and the connection electrical contact and is fixed on the chip and pacifies
Fill on position.
In one of the embodiments, the UV LED chip is positive cartridge chip, and the UV LED chip passes through die bond
Glue or scolding tin are fixed on the chip installation position.
In one of the embodiments, multiple UV LED chips are connected on the substrate, adjacent ultraviolet LED
Between the different electrodes of chip be electrically connected, and positioned at two ends UV LED chip respective electrode respectively with the input
The two electrodes electrical connection of circuit.
In one of the embodiments, the transparent tubular container being encapsulated as filled with protective gas or vacuum, described
Substrate also is located in the transparent tubular container.
In one of the embodiments, the encapsulating structure is by uvioresistant characteristic and the material with UV-permeable
The UV LED chip is covered on the substrate and corresponding circuit is formed.
A kind of preparation method of ultraviolet LED light source described in any of the above-described embodiment, comprises the following steps：
Circuit structure is laid in the position of correspondence chip installation position on substrate；
UV LED chip is fixed on the chip installation position, and is electrically connected with corresponding circuit structure；
By the UV LED chip and corresponding circuit structure overall package formation encapsulating structure, and wear input circuit
Go out the encapsulating structure to be electrically connected with external equipment.
Above-mentioned ultraviolet LED light source and preparation method thereof is by by UV LED chip and corresponding circuit overall package, comparing
It is traditional UV LED chip is first packaged into the structure that single lamp bead is fixed on substrate again, ultraviolet radioactive angle is bigger, can
To realize all-round radiation, while thermal resistance is low, ultraviolet conversion efficiency and unfailing performance can be improved.The making of the ultraviolet LED light source
Technique is simple, and packaging cost is relatively low, and due to being overall package, when carrying out multiple UV LED chip connection in series-parallel, can be with
The problem of avoiding causing bulky using many lamp bead connection in series-parallel, can effectively reduce the volume of light source, and with product to miniaturization
Direction is developed.
Brief description of the drawings
Fig. 1 is the structural representation of the ultraviolet LED light source of an embodiment；
Fig. 2 is the structural representation of double-width grinding circuit on the substrate of ultraviolet LED light source shown in Fig. 1；
Fig. 3 is that the part-structure of the UV LED chip of the substrate of ultraviolet LED light source and flip chip structure shown in Fig. 1 shows
It is intended to；
Fig. 4 is the structural representation of double-width grinding circuit on the substrate of other embodiment；
Fig. 5 is the structural representation of the ultraviolet LED light source of other embodiment；
Fig. 6 is the structural representation of single ended input circuit on the substrate of ultraviolet LED light source shown in Fig. 5；
Fig. 7 is the structural representation of single ended input circuit on substrate in other embodiment；
Fig. 8 is the part-structure schematic diagram of the UV LED chip of substrate and formal dress chip structure in other embodiment；
Fig. 9 is the part-structure signal of UV LED chip of the substrate both sides provided with flip chip structure in other embodiment
Figure；
Figure 10 is the encapsulating structure schematic diagram of the ultraviolet LED light source of flip chip structure in other embodiment.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give presently preferred embodiments of the present invention.But, the present invention can be realized in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in figure 1, the ultraviolet LED light source 100 of an embodiment includes substrate 110, UV LED chip 120 and encapsulation knot
Structure 130.
Substrate 110 can be transparent or opaque material, and such as ceramics, sapphire, glass or metal are processed.Substrate
110 be that UV LED chip 120 provides support and electrical connection (electrically connecting).Transparent substrate 110 has light transmission function, main
It is used for the all-round ultraviolet radioactive for realizing device.Opaque substrate 110 can also realize the all-round light radiation of device.
Incorporated by reference to Fig. 2, a side surface of substrate 110 is provided with multiple chip installation positions 102, and is laid with input circuit
112 and connection circuit 114.The input circuit 112 of the present embodiment is two electrodes respectively positioned at the double-width grinding electricity at the two ends of substrate 110
Road.The input circuit 112 is respectively equipped with connecting pin at the two ends of substrate 110, for being electrically connected with external equipment.In this reality
Apply in example, connection circuit 114 is subsection setup, be mainly used in being electrically connected adjacent UV LED chip 120.
Incorporated by reference to Fig. 3, the UV LED chip 120 of the present embodiment is flip-chip.UV LED chip 120 is by towards base
Electrode 122 and 124 on one side surface of plate 110 contacts conducting with input circuit 112 and connection circuit 114 and is fixed on substrate
On chip installation position 102 on 110.The UV LED chip 120 of flip chip structure can pass through with the way of contact of substrate 110
It is not limited to the modes such as eutectic welding.
The substrate 110 of the present embodiment is provided with multiple chip installation positions 102, and correspondingly, UV LED chip 120 also has many
Individual, multiple UV LED chips 120 are respectively arranged on multiple chip installation positions 102.Further, in the present embodiment, Duo Gezi
Connected between outer LED chip 120, wherein, by connecting the electricity of circuit 114 between the Different electrodes of adjacent UV LED chip 120
Gas is connected, and the respective electrode positioned at the UV LED chip 120 at two ends is electrically connected with input circuit 112 respectively.
Encapsulating structure 130 is by multiple UV LED chips 120 and corresponding circuit overall package, after to die bond bonding wire
UV LED chip 120 carries out sealing protection with corresponding circuit.In the present embodiment, encapsulating structure 130 is full of protectiveness gas
The tubular container of body (such as nitrogen, argon gas or helium) or vacuum.The tubular container can be tubular glass container or tubulose
Quartz container etc., thus, the one package structual 130 of the present embodiment is multiple ultraviolet by substrate 110 and on substrate 110
LED chip and corresponding circuit entirely encase to form sealing structure.Connecting pin on input circuit 112 passes encapsulating structure 130
For being electrically connected with external equipment.
The input circuit 112 of the present embodiment is the double-width grinding circuit that two electrodes are located at the two ends of substrate 110 respectively, can be managed
Solution, in other embodiments, as shown in figure 4, the input circuit 112 on substrate 110 can also be the two ends difference in substrate 110
Double-width grinding circuit provided with bipolar electrode, and the bipolar electrode correspondence electrical connection at two ends, and the double-width grinding circuit two ends
Counter electrode is respectively provided with connecting pin.In addition, in other embodiments, input circuit 112 can also be single ended input circuit, such as scheme
Shown in 5 and Fig. 6, the input circuit 112 on substrate 110 can be in single ended input electricity of the one end of substrate 110 provided with bipolar electrode
The counter electrode at road and the end has connecting pin respectively, or as shown in fig. 7, to be respectively equipped with bipolar electrode at the two ends of substrate 110
Contact 115 and only one end has a connecting pin being electrically connected respectively with the bipolar electrode contact 115 at the end wherein, two ends it is identical
Electrode contacts 115 between be electrically connected.
The connection circuit 114 of the present embodiment is located on substrate 110, and UV LED chip 120 is flip-chip, it is appreciated that
In other embodiment, UV LED chip 120 can also be positive cartridge chip, as shown in figure 8, correspondingly, the purple of formal dress chip structure
Outer LED chip 120 can be fixed on the chip installation position 102 of substrate 110 by crystal-bonding adhesive or scolding tin etc., UV LED chip 120
Between connection circuit can pass through metal wire (such as gold thread) welding conducting.
One side surface of the substrate 110 of the present embodiment is provided with multiple chip installation positions 102 (not indicated in figure), and one
Side surface is laid with input circuit 112 and connection circuit 114, it is appreciated that in other embodiments, as shown in figure 9, substrate 110
Chip installation position 102 can also be respectively provided with both side surface, correspondingly, input circuit is equipped with the both side surface of substrate 110
112 with being connected circuit 114, and multiple UV LED chips are laid on the chip installation position 102 of the both side surface of substrate 110 respectively.
The present embodiment is that encapsulating structure 130 is the tubular container full of protective gas or vacuum, it is appreciated that at other
In embodiment, especially flip-chip as shown in Figure 10, can be used by uvioresistant characteristic and the material with UV-permeable
Covering UV LED chip and corresponding circuit formation encapsulating structure 130 on substrate, the preferably small material of rate of absorbing UV, such as
Parylene (Parylene).Covering process includes being not limited to spray, be deposited and sinter.
Further, the present embodiment additionally provides a kind of preparation method of above-mentioned ultraviolet LED light source, and it comprises the following steps：
Step one：Circuit structure is laid in the position of correspondence chip installation position on substrate.
Circuit structure is primarily referred to as input circuit, in the ultraviolet LED light source of flip-chip, in addition to connection circuit.
Step 2：UV LED chip is fixed on chip installation position, and is electrically connected with corresponding circuit structure.
Step 3：By UV LED chip and corresponding circuit structure overall package formation encapsulating structure, and make input circuit
Encapsulating structure is passed to be electrically connected with external equipment.
Above-mentioned ultraviolet LED light source 100 and preparation method thereof is by the way that UV LED chip 120 and corresponding circuit are integrally sealed
Dress, first the structure that single lamp bead is fixed on substrate again, ultraviolet radioactive angle are packaged into than traditional by UV LED chip
It is bigger, it is possible to achieve all-round radiation, while thermal resistance is low, ultraviolet conversion efficiency and unfailing performance can be improved.The ultraviolet LED light source
100 manufacture craft is simple, and packaging cost is relatively low, and due to being overall package, is carrying out multiple UV LED chips 120
During connection in series-parallel, the problem of can avoiding causing bulky using many lamp bead connection in series-parallel can effectively reduce the volume of light source, and with
Product develops to miniaturization.
The substrate 110 of the ultraviolet LED light source 100 can be fabricated to single-ended or both-end conducting function substrate, thus can be with
Suitable for a variety of applicable situations, to replace traditional mercury vapour ultraviolet source.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of ultraviolet LED light source, it is characterised in that including substrate, UV LED chip and encapsulating structure；Wherein, the substrate
An at least side surface be provided with multiple chip installation positions, and the substrate be provided with input circuit；The UV LED chip has many
Individual, multiple UV LED chips are located on multiple chip installation positions respectively, and multiple UV LED chips are by connecting electricity
Road is electrically connected with the input circuit；The encapsulating structure integrally seals multiple UV LED chips and corresponding circuit
It is used to pass the encapsulating structure with the connecting pin that external equipment is electrically connected on dress, the input circuit.
2. ultraviolet LED light source as claimed in claim 1, it is characterised in that the single side surface or both side surface of the substrate
Provided with the chip installation position, and the input circuit is correspondingly provided with respectively.
3. ultraviolet LED light source as claimed in claim 1, it is characterised in that the input circuit is located at institute respectively for two electrodes
The double-width grinding circuit at substrate two ends is stated, or is the double-width grinding circuit and two that bipolar electrode is respectively equipped with the two ends of the substrate
The bipolar electrode correspondence at end is electrically connected, and the counter electrode at the double-width grinding circuit two ends is respectively provided with the connecting pin.
4. ultraviolet LED light source as claimed in claim 1, it is characterised in that the input circuit is in one end of the substrate
The counter electrode of single ended input circuit and the end provided with bipolar electrode has the connecting pin respectively, or for the two of the substrate
The company that end is respectively equipped with bipolar electrode contact and only there is the bipolar electrode contact with the end to be electrically connected respectively for one end wherein
Pin.
5. ultraviolet LED light source as claimed in claim 1, it is characterised in that the UV LED chip is flip-chip, described
UV LED chip is turned on by the side surface electrode towards the substrate and the input circuit and the connection electrical contact
And be fixed on the chip installation position.
6. ultraviolet LED light source as claimed in claim 1, it is characterised in that the UV LED chip is positive cartridge chip, described
UV LED chip is fixed on the chip installation position by crystal-bonding adhesive or scolding tin.
7. such as ultraviolet LED light source according to any one of claims 1 to 6, it is characterised in that multiple UV LED chips
Connect, be electrically connected between the different electrodes of adjacent UV LED chip on the substrate, and positioned at the ultraviolet of two ends
The respective electrode of LED chip is electrically connected with two electrodes of the input circuit respectively.
8. such as ultraviolet LED light source according to any one of claims 1 to 6, it is characterised in that described to be encapsulated as filled with protectiveness
The transparent tubular container of gas or vacuum, the substrate also is located in the transparent tubular container.
9. such as ultraviolet LED light source according to any one of claims 1 to 6, it is characterised in that the encapsulating structure is by anti-purple
Outside line characteristic and the UV LED chip and corresponding circuit shape are covered on the substrate with the material of UV-permeable
Into.
10. a kind of preparation method of ultraviolet LED light source according to any one of claims 1 to 9, it is characterised in that including such as
Lower step：
Circuit structure is laid in the position of correspondence chip installation position on substrate；
UV LED chip is fixed on the chip installation position, and is electrically connected with corresponding circuit structure；
By the UV LED chip and corresponding circuit structure overall package formation encapsulating structure, and input circuit is set to pass institute
Encapsulating structure is stated to be electrically connected with external equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121642.0A CN106981561A (en) | 2017-03-02 | 2017-03-02 | Ultraviolet LED light source and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121642.0A CN106981561A (en) | 2017-03-02 | 2017-03-02 | Ultraviolet LED light source and preparation method thereof |
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| Publication Number | Publication Date |
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| CN106981561A true CN106981561A (en) | 2017-07-25 |
Family
ID=59338732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201710121642.0A Pending CN106981561A (en) | 2017-03-02 | 2017-03-02 | Ultraviolet LED light source and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113161469A (en) * | 2021-03-23 | 2021-07-23 | 聿耒科技(天津)有限公司 | Tubular packaging-free ultraviolet LED light source module and processing method |
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| CN205452355U (en) * | 2016-03-25 | 2016-08-10 | 武汉优炜星科技有限公司 | High -power flip -chip structure ultraviolet LED solidification light source |
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| CN101701684A (en) * | 2009-11-16 | 2010-05-05 | 南京工业大学 | LED lamp based on blue light and red light chips and manufacturing method thereof |
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| CN113161469A (en) * | 2021-03-23 | 2021-07-23 | 聿耒科技(天津)有限公司 | Tubular packaging-free ultraviolet LED light source module and processing method |
| CN113161469B (en) * | 2021-03-23 | 2023-12-01 | 聿耒科技(天津)有限公司 | Tubular packaging-free ultraviolet LED light source module and processing method |
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Application publication date: 20170725 |