CN211045466U - Ultraviolet L ED packaging device - Google Patents
Ultraviolet L ED packaging device Download PDFInfo
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- CN211045466U CN211045466U CN201921351690.XU CN201921351690U CN211045466U CN 211045466 U CN211045466 U CN 211045466U CN 201921351690 U CN201921351690 U CN 201921351690U CN 211045466 U CN211045466 U CN 211045466U
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Abstract
The utility model discloses an ultraviolet L ED encapsulates device, including the support that has bowl form cavity, glass roof and ultraviolet L ED chip, the glass roof sets up on the support forms airtight cavity with sealed bowl form cavity, ultraviolet L ED chip sets up inside and be connected with the support electricity at the support, airtight cavity's atmospheric pressure is less than the ordinary pressure, and airtight cavity intussuseption is filled with inert gas, the inside atmospheric pressure of ultraviolet L ED encapsulates device is lower, it is gaseous few, thereby can avoid gas expansion in the high temperature to damage the device, and, the inside of ultraviolet L ED encapsulates device still fills has inert gas, can form the protection to internal component, thereby, the stability and the reliability of ultraviolet L ED encapsulates device have been promoted.
Description
Technical Field
The utility model relates to an L ED encapsulates the field, and more specifically says, relates to an ultraviolet L ED encapsulates device.
Background
With the development of UV-L ED (ultraviolet-L light Emitting Diode, i.e., ultraviolet L ED) packaged devices, the application environments of ultraviolet L ED packaged devices are more and more, and the market demand for UV-L ED packaged devices is higher and higher.
For example, the mounting and welding of the ultraviolet L ED packaging device generally adopts a reflow soldering mode, the temperature can exceed 230 ℃ in the reflow soldering process, and the high temperature causes the air in the ultraviolet L ED packaging device to expand rapidly, so that the device is damaged.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lie in the poor stability of current ultraviolet L ED, the problem that the reliability is low, to this technical problem, provide an ultraviolet L ED encapsulation device, include:
support, glass roof and ultraviolet L ED chip with bowl form cavity, the glass roof sets up in order to seal on the support bowl form cavity forms airtight cavity, ultraviolet L ED chip sets up inside the support and with the support electricity is connected, airtight cavity's atmospheric pressure is less than the ordinary pressure, just the airtight cavity intussuseption is filled with inert gas.
Optionally, the glass top plate is a transparent glass top plate or a translucent glass top plate.
Optionally, the ultraviolet L ED chip includes a positive electrode and a negative electrode, a pad is disposed on the support, and the positive electrode and the negative electrode of the ultraviolet L ED chip are respectively and fixedly connected to the positive electrode and the negative electrode of the pad of the support through a die bonding conductive material.
Optionally, the solid crystal conductive material is formed by combining a metal material and a non-metal material.
Optionally, the positive electrode and the negative electrode of the ultraviolet L ED chip are disposed on the same plane of the ultraviolet L ED chip.
Optionally, the positive electrode and the negative electrode of the ultraviolet L ED chip are respectively disposed on two different surfaces of the ultraviolet L ED chip that are parallel to each other.
Optionally, the wavelength of the ultraviolet light emitted by the ultraviolet L ED chip is 220nm-395 nm.
Optionally, the glass top plate or the bracket is provided with an air exhaust hole, and the glass top plate or the bracket is provided with an inert gas injection hole.
Optionally, the inert gas filled in the sealing cavity is a group 0 element gas.
Optionally, the group 0 element gas filled in the sealed cavity includes at least one of the following: helium, neon, argon, krypton, xenon, radon.
Advantageous effects
The utility model provides an ultraviolet L ED encapsulation device, to the inside a large amount of air that exists of current ultraviolet L ED encapsulation device, when receiving high temperature, the inside air rapid inflation of ultraviolet L ED encapsulation device, lead to the device to damage, cause ultraviolet L ED poor stability, the defect that the reliability is low, the utility model provides an ultraviolet L ED encapsulation device is including the support that has bowl form cavity, glass roof and ultraviolet L ED chip, the glass roof sets up on the support with sealed bowl form cavity formation airtight cavity, ultraviolet L ED chip sets up inside and be connected with the support electricity at the support, airtight cavity's atmospheric pressure is less than the ordinary pressure, and airtight cavity intussuseption is filled with inert gas, that is to say, the utility model provides an ultraviolet L ED encapsulation device's inside atmospheric pressure is lower, and is gaseous few to can avoid gas inflation in the high temperature to damage the device, and, the utility model discloses in, the inside of ultraviolet L ED encapsulation device still is filled with inert gas, can form the protection to internal component, thereby, promoted ultraviolet L ED encapsulation device's stability and reliability.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic structural diagram of an ultraviolet L ED packaged device according to a first embodiment of the present invention;
fig. 2 is a schematic view of the connection between the ultraviolet L ED chip and the bracket according to the first embodiment of the present invention;
fig. 3 is a schematic structural diagram of an ultraviolet L ED packaged device according to a second embodiment of the present invention;
in fig. 1, 11 is a support, 12 is a glass top plate, 13 is an ultraviolet L ED chip, 14 is a sealed cavity, 111 is a support positive electrode, 112 is a support negative electrode, 131 is an ultraviolet L ED chip positive electrode, and 132 is an ultraviolet L ED chip negative electrode.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
First embodiment
In order to solve the above problems, the present embodiment provides an ultraviolet L ED package device, as shown in fig. 1, fig. 1 is a schematic structural view of the ultraviolet L ED package device provided in the present embodiment, the ultraviolet L ED package device includes a support 11 having a bowl-shaped cavity, a glass top plate 12 and an ultraviolet L ED chip 13, the glass top plate 12 is disposed on the support 11 to seal the bowl-shaped cavity, so that the support 11 and the glass top plate 12 form a sealed cavity 14, and the ultraviolet L ED chip 13 is disposed inside the support 11 and electrically connected to the support 11.
In the present embodiment, in order to realize the sealed chamber 14 which is less than normal pressure and filled with inert gas, an extraction hole may be formed in the holder 11 or the glass top plate 12, and an inert gas injection hole may be formed in the holder 11 or the glass top plate 12, after the holder 11, the uv L ED chip 13 and the glass top plate 12 are connected, respectively, to extract and inject inert gas through the extraction hole and the inert gas injection hole, after the extraction hole and the inert gas injection hole are sealed, to form the sealed chamber 14 which is less than normal pressure and filled with inert gas, wherein the extraction hole and the inert gas injection hole may be the same hole or different holes, or, the uv L ED chip 13 may be fixed on the holder 11 and electrically connected to the holder 11, and the manufactured semi-manufactured product may be placed in a glove box, and the glove box may be placed in a glove box 12, and the glove box may be sealed with inert gas, and the glove box may be sealed with a high pressure, and the glove box may be sealed with inert gas injection hole or glove box 12, and the glove box may be sealed with a high pressure, and the glove box may be sealed.
Wherein, the air pressure of the closed cavity 14 can be 0-900 pa. The inert gas filled in the closed cavity 14 may be helium, nitrogen, or the like, or may be a group 0 element gas. For group 0 elemental gases, it includes, but is not limited to, He2 (helium), Ne2 (neon), Ar2 (argon), Kr2 (krypton), Xe2 (xenon), Rn2 (radon). In this embodiment, the inert gas filled in the closed cavity 14 may be one or more, for example, if the inert gas filled in the closed cavity 14 is a group 0 element gas, it may include at least one of the following: helium, neon, argon, krypton, xenon, radon. In this embodiment, the inside of the sealed cavity 14 may be entirely filled with an inert gas, or may be a combination of an inert gas and a non-inert gas.
In this embodiment, the support 11 is made of an insulating material as a substrate, and metal pads are disposed on the insulating material, and when the ultraviolet L ED package device operates, the ultraviolet L ED package device is connected to an external power source through the metal pads, the support 11 may be made of a transparent material (i.e., a transparent support), or may be made of an opaque material (i.e., an opaque support), the ultraviolet L ED chip 13 may be composed of a chip substrate, a P-type semiconductor, an N-type semiconductor, a positive electrode and a negative electrode, and the ultraviolet L ED chip 13 may absorb electric energy and emit ultraviolet light.
In this embodiment, in order to electrically connect the ultraviolet L ED chip 13 and the bracket 11, the positive electrode and the negative electrode of the ultraviolet L ED chip 13 may be respectively fixed on the positive electrode and the negative electrode of the pad of the bracket 11 by a die bonding conductive material, so as to achieve the fixation of the ultraviolet L ED chip 13 and the electrical connection of the ultraviolet L ED chip 13 and the bracket 11, wherein the die bonding conductive material may be a conductive material formed by combining metal and nonmetal, which may be a gel-like, paste-like, or liquid-like material, or the positive electrode and the negative electrode of the ultraviolet L ED chip 13 may be respectively connected with the positive electrode and the negative electrode of the bracket 11 by metal bonding wires, wherein at least 1 metal bonding wire connects the positive electrode 131 of the ultraviolet ED chip L ED chip 13 with the positive electrode 111 of the bracket 11, at least 1 metal bonding wire connects the negative electrode of the ultraviolet L ED chip 13 with the negative electrode of the bracket 11, for example, as shown in fig. 2, the positive electrode 131 of the ultraviolet L ED chip 13 and the bracket 11 may be electrically connected with the inorganic chip 13 by a metal bonding material, or a glue, wherein the metal bonding material is an inorganic glue, such as a glue, or a glue, which is used for forming an inorganic glue, or a glue.
Alternatively, the two connection modes may be combined, for example, the ultraviolet L ED chip 13 is connected to one electrode of the support 11 through the die bond conductive material, the ultraviolet L ED chip 13 is connected to the other electrode of the support 11 through the metal bonding wire, for example, the ultraviolet L ED chip 13 may be connected to the positive electrode of the support 11 through the die bond conductive material, and the ultraviolet L ED chip 13 may be connected to the negative electrode of the support 11 through the metal bonding wire.
In this embodiment, the bracket 11 may be integrally formed. Alternatively, the support 11 may be formed by splicing a bottom plate and a wall body.
In this embodiment, the glass top plate 12 may be a translucent glass top plate or a transparent glass top plate. The glass top plate can be an organic glass top plate, an inorganic glass top plate or a glass top plate made of organic materials and inorganic materials in a mixed mode. The glass top plate 12 may be fixed to the bracket 11 by an adhesive C. The adhesive C can be conductive glue, insulating glue or metal welding material, wherein the glue can be organic glue, inorganic glue or glue formed by mixing at least 2 types of organic materials, inorganic non-metallic materials and metal materials. In this embodiment, the materials of the adhesives A, C may be the same or different.
The ultraviolet L ED encapsulated device that this embodiment provided, including the support that has bowl form cavity, glass roof and ultraviolet L ED chip, the glass roof sets up and forms airtight cavity with sealed bowl form cavity on the support, ultraviolet L ED chip sets up inside and be connected with the support electricity at the support, airtight cavity's atmospheric pressure is less than the ordinary pressure, and airtight cavity intussuseption is filled with inert gas, that is to say, the inside atmospheric pressure of the ultraviolet L ED encapsulated device that this embodiment provided is lower, it is gaseous few, thereby can avoid gas expansion to damage the device in the high temperature, and, in this embodiment, the inside of ultraviolet L ED encapsulated device still is filled with inert gas, can form the protection to internal component, thereby ultraviolet L ED encapsulated device's stability and reliability have been promoted.
Second embodiment
Referring to fig. 3, fig. 3 is a schematic structural diagram of an ultraviolet L ED package device provided in this embodiment, the ultraviolet L ED package device includes a bracket 11 having a bowl-shaped cavity, a glass top plate 12, and an ultraviolet L ED chip 13, the glass top plate 12 is fixed above the bracket 11 by an adhesive C to seal the bowl-shaped cavity to form a sealed cavity 14, the adhesive C may be a metal welding material, and of course, in other embodiments, the adhesive C may be other materials, wherein the pressure of the sealed cavity 14 is 0-900pa, and the gas filled in the sealed cavity 14 is a group 0 element gas including at least one of helium, neon, argon, krypton, xenon, and radon.
In this embodiment, the ultraviolet L ED chip 13 is a flip-chip ultraviolet L ED chip 13, a positive electrode 131 and a negative electrode 132 of the flip-chip ultraviolet L ED chip are located on the same surface of the chip, the electrode material is a metal simple substance, the ultraviolet L ED chip 13 can absorb electric energy and emit ultraviolet light with a wavelength of 220nm to 395nm, the ultraviolet L ED chip 13 is disposed in the sealed cavity 14 and is welded on an electrode area of the bracket 11 through a die bond conductive material, so that the positive electrode 131 of the ultraviolet L ED chip is connected with the positive electrode 111 of the bracket 11, the negative electrode 132 of the ultraviolet L ED chip is connected with the negative electrode 112 of the bracket 11, the ultraviolet L ED chip 13 is fixed, and the ultraviolet L ED chip 13 is electrically connected with the bracket 11.
In this embodiment, after the ultraviolet L ED chip 13 is fixed in the bracket 11, the semi-finished product is transferred into a glove box, and the glass top plate 12 is fixed on the bracket 11 in the glove box to form a sealed cavity 14, wherein the pressure of the gas in the glove box is 800pa, and the gas in the glove box includes at least one of helium, neon, argon, krypton, xenon, and radon, so that the pressure of the sealed cavity 14 is 800pa, and the gas filled in the sealed cavity 14 includes at least one of helium, neon, argon, krypton, xenon, and radon, wherein the glass top plate 12 is a transparent glass top plate 12, and the glass top plate 12 is made of an organic material, i.e., the transparent glass top plate 12 is a transparent organic glass top plate 12.
The ultraviolet L ED packaged device that this embodiment provided, including the support that has bowl form cavity, glass roof and ultraviolet L ED chip, the glass roof sets up and forms airtight cavity with sealed bowl form cavity on the support, ultraviolet L ED chip sets up inside and be connected with the support electricity at the support, airtight cavity's atmospheric pressure is less than the ordinary pressure, and airtight cavity intussuseption is filled with 0 group's element gas, that is to say, the inside atmospheric pressure of the ultraviolet L ED packaged device that this embodiment provided is lower, it is gaseous few, thereby can avoid gas inflation in the high temperature to damage the device, and, in this embodiment, the inside of ultraviolet L ED packaged device still is filled with 0 group's element gas, can form the protection to internal component, thereby ultraviolet L ED packaged device's stability and reliability have been promoted.
The ultraviolet L ED packaging device provided in the foregoing embodiments can be applied to various fields, such as illumination, sterilization, medical treatment, printing, biochemical detection, high-density information storage, and secure communication, etc. for example, the ultraviolet L ED can be provided in refrigerators, home appliances, etc. for sterilization, deodorization, etc. it should be noted that the above applications are only exemplary applications of the present embodiment, and it should be understood that the application of the ultraviolet L ED in the present embodiment is not limited to the exemplary fields.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (10)
1. The ultraviolet L ED packaging device is characterized by comprising a support with a bowl-shaped cavity, a glass top plate and an ultraviolet L ED chip, wherein the glass top plate is arranged on the support to seal the bowl-shaped cavity to form a closed cavity, the ultraviolet L ED chip is arranged inside the support and electrically connected with the support, the air pressure of the closed cavity is less than the normal pressure, and the closed cavity is filled with inert gas.
2. The ultraviolet L ED packaging device of claim 1, wherein the glass top plate is a transparent glass top plate or a translucent glass top plate.
3. The ultraviolet L ED package device of claim 1, wherein the ultraviolet L ED chip includes a positive electrode and a negative electrode, the support is provided with bonding pads, and the positive electrode and the negative electrode of the ultraviolet L ED chip are respectively fixed on the positive electrode and the negative electrode of the bonding pads of the support through a die bonding conductive material.
4. The ultraviolet L ED package device of claim 3, wherein the die attach conductive material is a combination of metallic and non-metallic materials.
5. The ultraviolet L ED packaged device of claim 3, wherein positive and negative electrodes of the ultraviolet L ED chip are disposed on a same plane of the ultraviolet L ED chip.
6. The ultraviolet L ED packaged device of claim 3, wherein the positive and negative electrodes of the ultraviolet L ED chip are disposed on two different parallel sides of the ultraviolet L ED chip, respectively.
7. The ultraviolet L ED packaged device of claim 1, wherein the ultraviolet L ED chip emits ultraviolet light at a wavelength of 220nm-395 nm.
8. The ultraviolet L ED package device of claim 1, wherein the glass top plate or the frame is provided with a suction hole, and the glass top plate or the frame is provided with an inert gas injection hole.
9. The ultraviolet L ED package device of any one of claims 1-8, wherein the inert gas filled in the sealed cavity is a group 0 element gas.
10. The ultraviolet L ED package device of claim 9, wherein the group 0 element gas filled in the sealed cavity comprises at least one of helium, neon, argon, krypton, xenon, radon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921351690.XU CN211045466U (en) | 2019-08-15 | 2019-08-15 | Ultraviolet L ED packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921351690.XU CN211045466U (en) | 2019-08-15 | 2019-08-15 | Ultraviolet L ED packaging device |
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| Publication Number | Publication Date |
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| CN211045466U true CN211045466U (en) | 2020-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921351690.XU Active CN211045466U (en) | 2019-08-15 | 2019-08-15 | Ultraviolet L ED packaging device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563388A (en) * | 2020-12-08 | 2021-03-26 | 宁波群芯微电子有限责任公司 | Ceramic LED negative pressure packaging process |
| CN113451479A (en) * | 2021-06-11 | 2021-09-28 | 西安瑞芯光通信息科技有限公司 | Packaging structure and preparation method of ultraviolet LED photoelectric chip |
-
2019
- 2019-08-15 CN CN201921351690.XU patent/CN211045466U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563388A (en) * | 2020-12-08 | 2021-03-26 | 宁波群芯微电子有限责任公司 | Ceramic LED negative pressure packaging process |
| CN113451479A (en) * | 2021-06-11 | 2021-09-28 | 西安瑞芯光通信息科技有限公司 | Packaging structure and preparation method of ultraviolet LED photoelectric chip |
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