CN210429779U - Semiconductor packaging device - Google Patents
Semiconductor packaging device Download PDFInfo
- Publication number
- CN210429779U CN210429779U CN201921351686.3U CN201921351686U CN210429779U CN 210429779 U CN210429779 U CN 210429779U CN 201921351686 U CN201921351686 U CN 201921351686U CN 210429779 U CN210429779 U CN 210429779U
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- bowl
- cover plate
- chip
- sealed cavity
- semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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Abstract
The utility model provides a semiconductor packaging device, which comprises a flip semiconductor chip, a bowl cup and a cover plate; the flip-chip semiconductor chip is electrically connected with the bottom of the bowl cup, the cover plate is fixedly connected with the top of the bowl cup to form a closed sealing cavity, only rare gas consisting of group 0 elements is filled in the sealing cavity, and the pressure of the sealing cavity is lower than the pressure of the external environment; meanwhile, the rare gas can effectively protect the internal elements of the packaging device.
Description
Technical Field
The utility model relates to an application of semiconductor especially relates to a semiconductor package device.
Background
At present, a reflow soldering mode is generally adopted for mounting and soldering a semiconductor packaging device, the reflow soldering temperature can exceed 230 ℃, but a large amount of air exists in the semiconductor packaging device, and because the reflow soldering temperature is too high, the air in the semiconductor packaging device can expand rapidly along with the temperature rise in the reflow soldering process, so that the semiconductor packaging device is damaged.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor package device, the main technical problem who solves is: the problem of damage to the semiconductor packaging device caused by rapid expansion of air inside the semiconductor packaging device along with temperature in the reflow soldering process of the conventional semiconductor packaging device is solved.
In order to solve the above technical problem, the utility model provides a semiconductor package device, include: a semiconductor chip, a bowl and a cover plate are inverted;
the flip-chip semiconductor chip is electrically connected with the bottom of the bowl cup, the cover plate is fixedly connected with the top of the bowl cup to form a closed sealed cavity, only rare gas composed of group 0 elements is filled in the sealed cavity, and the pressure of the sealed cavity is lower than the pressure of the external environment.
Optionally, the connection area between the cover plate and the top of the bowl cup is a rough surface to increase the bonding force between the cover plate and the top of the bowl cup.
Optionally, the top of the bowl cup comprises an L-shaped step, and the cover plate is matched with the step.
Optionally, the cover plate is arranged on the top of the bowl cup and fixed with the bowl cup through a binder.
Optionally, the adhesive comprises an organic glue or a metal welding material.
Optionally, the rare gas composed of the group 0 element includes at least one of helium, neon, argon, krypton, xenon, and radon.
Optionally, the pressure of the sealed cavity comprises 0-900 pa.
Advantageous effects
The utility model provides a semiconductor packaging device, which comprises a flip semiconductor chip, a bowl cup and a cover plate; the flip semiconductor chip is electrically connected with the bottom of the bowl cup, the cover plate is fixedly connected with the top of the bowl cup to form a sealed cavity, only rare gas consisting of group 0 elements is filled in the sealed cavity, and the pressure of the sealed cavity is lower than the pressure of the external environment; the semiconductor packaging device provided by the utility model is internally sealed and is positioned in a low-pressure rare gas environment consisting of group 0 elements, so that the device can be prevented from being damaged by gas expansion in the reflow soldering process, and the influence of fillers or air holes on the device can also be avoided; meanwhile, the rare gas can effectively protect the internal elements of the packaging device.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor package device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another semiconductor package device according to an embodiment of the present invention;
fig. 3 is a schematic view of a conductive adhesive and a metal pad according to a first embodiment of the present invention;
fig. 4 is a schematic view illustrating a cover plate placed on the top of a bowl according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a semiconductor package device according to a second embodiment of the present invention.
The reference signs are interpreted as: 101 is a flip-chip semiconductor chip, 102 is a bowl, 103 is a cover plate, 104 is a sealed cavity, 105 is conductive adhesive, 1021 is a metal pad, 1011 is a positive electrode of the flip-chip semiconductor chip, and 1012 is a negative electrode of the flip-chip semiconductor chip.
Detailed Description
In order that the contents of the present invention may be more readily understood, the present invention will now be described in further detail with reference to the following detailed description taken in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
the semiconductor packaging device has a large amount of air inside, and the air can expand rapidly along with the temperature rise in the reflow soldering process to cause the device to be damaged, and in order to avoid the phenomenon, the current semiconductor packaging device adopts two schemes: (1) and filling organic materials in the inner space of the device to exhaust or reduce air in the device. (2) The device shell is provided with air holes, and the air is exhausted along with the air vent when heated and expanded. However, both the two schemes have certain limitations, and by adopting the scheme (1), the internal organic filler has poor environmental adaptability, is easy to age and influence the performance of devices under the influence of external substances and the environment; in the scheme (2), the device is in a non-sealed state, and external environmental pollutants easily enter the device to affect the operation of the device, in order to solve the above problems, the embodiment provides a semiconductor package device, please refer to fig. 1, the semiconductor package device can realize the interconversion between two or more of optical, electrical, acoustic, magnetic, thermal and force signals, and the semiconductor package device includes: a flip-chip semiconductor chip 101, a bowl 102, a cover plate 103; the cover plate 103 is fixedly connected to the top of the bowl 102 to form a sealed cavity 104, and the flip-chip semiconductor chip 101 is electrically connected with the bottom of the bowl 102 in the sealed cavity 104 in a flip-chip manner; wherein the sealed cavity 104 is filled with rare gas consisting of group 0 elements only, and the pressure of the sealed cavity 104 is lower than the external environment pressure; the flip-chip semiconductor chip 101 is in a sealed state by using the sealed cavity 104, so that external environmental pollutants are prevented from entering the device, and the electrical insulation between the flip-chip semiconductor chip 101 and the bowl 102 is enhanced; through the sealed cavity 104 filled with rare gas, the flip-chip semiconductor chip 101 is not directly contacted with the bowl 102, so that the device can be prevented from being damaged by gas expansion, and the flip-chip semiconductor chip 101 is effectively protected.
In the embodiment, the inside of the sealed cavity 104 formed by combining the cover plate 103 and the bowl 102 is filled with a rare gas, and a certain amount of rare gas is filled in the sealed vacuum environment, that is, the sealed cavity 104 does not include other gases, and the pressure of the rare gas in the sealed cavity 104 is lower than the atmospheric pressure of the external environment; notably, the rare gas composed of the group 0 element includes helium He2And neon gas Ne2Ar2Kr gas Kr2Xe, xenon2Rn, Radon gas2E.g. the interior of the capsule 104 comprises He2、Ar2And Ne2Mixing the formed gases; since the pressure of the sealed cavity 104 is lower than the normal pressure, preferably, the pressure of the sealed cavity 104 includes 0-900pa, for example, He is in the sealed cavity2、Ar2And Ne2The pressure of the mixed composition is 500pa of the rare gas environment.
The overall shape of the bowl 102 includes, but is not limited to, a bowl shape, a regular polygonal shape (e.g., a quadrangular shape), and the like. The bowl cup 102 comprises a base located at the bottom and a shell located at the top, wherein the base uses an insulating material as a base body and comprises a metal bonding pad 1021 on the insulating material, the base and the shell are integrally formed to form the bowl cup 102, in other embodiments, the bowl cup 102 can also be formed by independently forming the shell and then fixing the shell on the base to form the bowl cup 102, at the moment, a gap is formed inside the shell, the bottom and the top of the shell are in an open shape and are respectively hermetically combined with a base and a cover plate 103, for example, a binder is coated around the base, the bottom of the shell is placed on the binder of the base, so that the shell is fixed on the base, the bottom of the shell is hermetically combined with the base, and the top opening of the protective shell. The conductive electrode of the flip-chip semiconductor chip 101 is located at the bottom, and further the positive electrode 1011 and the negative electrode 1012 at the bottom of the flip-chip semiconductor chip 101 are electrically connected with the metal pads 1021 on the base respectively, as shown in fig. 2, the two metal pads 1021 are located at the center of the base, and the area of the metal pads 1021 is larger than that of the flip-chip semiconductor chip 101, so as to ensure that the conductor chip is completely contacted with the base; in the present embodiment, as shown in fig. 3, the conductive electrode of the flip-chip semiconductor chip 101 is electrically connected to the metal pad 1021 through the conductive adhesive 105, the conductive adhesive 105 is a conductive paste formed by combining metal and nonmetal, one end of the conductive adhesive 105 is connected to the electrode of the semiconductor photoelectric chip, and the other end is connected to the metal pad 1021 of the base, so that the flip-chip semiconductor chip 101 and the metal pad 1021 of the base are electrically connected, wherein the area of the conductive adhesive 105 is smaller than that of the metal pad 1021, and the conductive adhesive 105 is prevented from overflowing the metal pad 1021. In other embodiments, the conductive electrodes of the flip-chip semiconductor chip 101 may also be connected to the metal pads 1021 through metal leads.
In the embodiment, the shape and size of the cover plate 103 are matched with the shape of the opening at the top of the bowl 102, for example, the opening of the bowl 102 is rectangular, and then the cover plate 103 is also rectangular; it should be noted that the connection area between the cover plate 103 and the top of the bowl 102 in this embodiment is a rough surface, i.e. a part of the area of the cover plate 103 and a part of the area of the top of the bowl 102 are both rough surfaces, so as to increase the combining force between the cover plate 103 and the top of the bowl 102. Because the bowl 102 has a certain thickness, the length of the cover plate 103 can be greater than the minimum length of the bowl 102 and less than the maximum length of the bowl 102, in order to ensure the complete closure of the sealing cavity 104, the height of the cover plate 103 in this embodiment is equal to the height of the bowl 102, as shown in fig. 1, the top of the bowl includes an "L" shaped step, and the cover plate cooperates with the step to embed the cover plate 103 into the bowl 102, so that the height of the cover plate 103 is equal to the height of the bowl 102. In this embodiment, the lid 103 may be sealed to the bowl 102 by an adhesive, including but not limited to an organic glue or a metallic solder material, such as polydimethylsiloxane or Si02 based adhesive. In some embodiments, the length of the cover plate 103 may be slightly greater than or equal to the opening of the bowl 102, for example, as shown in fig. 4, the cover plate 103 is directly placed on the top of the bowl 102, the top of the bowl is a regular quadrilateral, the height of the cover plate 103 is greater than the height of the bowl 102, and the cover plate may be fixed to the top of the bowl by an adhesive.
It should be noted that the cover plate 103 in this embodiment includes a transparent or semitransparent glass cover plate, which has a focusing effect on light and is suitable for directional applications, wherein the cover plate 103 specifically includes a transparent or semitransparent organic glass cover plate, a transparent or semitransparent inorganic glass cover plate, or a transparent or semitransparent glass cover plate formed by combining organic and inorganic materials.
In the present embodiment, the flip-chip semiconductor chip 101 includes, but is not limited to, a semiconductor optoelectronic chip, and the semiconductor optoelectronic chip is composed of a chip substrate, a P-type semiconductor, an N-type semiconductor, and an electrode, and the semiconductor optoelectronic chip can absorb electrical energy and release optical energy and thermal energy to realize mutual conversion of electrical, optical, and thermal signals.
The embodiment provides a semiconductor packaging device, wherein a cover plate is fixedly connected to a bowl cup to form a closed sealed cavity, an inverted semiconductor chip is inversely installed on a bowl cup base in the sealed cavity, a conductive electrode of the inverted semiconductor chip is located at the bottom, the inverted semiconductor chip is fixed on the base in the bowl cup by using conductive adhesive, and the chip electrode is connected with the base through the conductive adhesive at the bottom of the chip in a metal manner to realize electric conduction; the inside of a sealed cavity formed by the cover plate and the bowl cup is a low-pressure rare gas environment consisting of 0 group of elements and having the pressure of 0-900pa, so that the device can be prevented from being damaged by gas expansion in the reflow soldering process, the influence of fillers or air holes on the device can be avoided, and the reliability of the device is improved.
Example two:
the present embodiment provides a concrete semiconductor package device, as shown in fig. 5, including: a bowl 102, a flip-chip semiconductor chip 101 flip-mounted on the bottom of the bowl 102, and a cover plate 103 fixedly connected to the top of the bowl 102 to form a sealed cavity 104, wherein the sealed cavity 104 is filled with a rare gas composed of group 0 elements, and specifically, the sealed cavity 104 only includes He2、Ne2、Ar2、Kr2、Xe2、Rn2The pressure of the sealing cavity 104 is 0-900pa, which is lower than the pressure of the external environment.
In this embodiment, the bowl 102 includes a base and a housing which are integrally formed, two metal pads 1021 are disposed on the base, the flip-chip semiconductor chip 101 includes a positive electrode 1011 and a negative electrode 1012 at the bottom, the positive electrode 1011 and the negative electrode 1012 are electrically connected to the metal pads 1021 through a conductive adhesive 105, and the conductive adhesive 105 is a conductive paste formed by combining metal and nonmetal.
In the embodiment, the cover plate 103 is a transparent glass cover plate 103 and is rectangular, and the shape of the cover plate 103 is consistent with the opening of the bowl 102; the length of the cover plate 103 is larger than the minimum length of the bowl 102 and smaller than the maximum length of the bowl 102, the height of the cover plate 103 is equal to that of the bowl 102, the top of the bowl 102 comprises an L-shaped step, so that the cover plate 103 is embedded into the bowl 102, and the cover plate 103 is sealed with the bowl 102 through polydimethylsiloxane or an adhesive taking Si02 as a main material; in some embodiments, the connection area between the cover plate 103 and the top of the bowl 102 is a rough surface, and the two end areas of the cover plate 103 and the corresponding "L" area on the top of the bowl 102 are roughened in advance, so that when the cover plate 103 is connected to the top of the bowl 102 through an adhesive, the bonding force between the adhesive and the cover plate 103 and the top of the bowl 102 is increased through the rough surface.
The embodiment provides a semiconductor packaging device, which comprises a flip-chip semiconductor chip, a bowl and a cover plate; the cover plate is fixedly connected with the bowl cup to form a closed sealed cavity, the inverted semiconductor chip is inversely arranged on a bowl cup base in the sealed cavity and is electrically connected with the base, rare gas consisting of group 0 elements is filled in the sealed cavity, the pressure of the sealed cavity is lower than the normal pressure, the conductor packaging device is internally sealed and is in a low-pressure rare gas environment consisting of the group 0 elements, the device can be prevented from being damaged by gas expansion in the reflow soldering process, and the influence of fillers or air holes on the device can also be avoided; meanwhile, the rare gas can effectively protect the internal elements of the packaging device.
It should be understood that the semiconductor package device provided in this embodiment can be applied to various light emitting fields, for example, it can be manufactured into a backlight module applied to a display backlight field (which can be a backlight module of a terminal such as a television, a display, a mobile phone, etc.). It can be applied to a backlight module at this time. The LED lamp can also be applied to the key backlight field, the shooting field, the household lighting field, the medical lighting field, the decoration field, the automobile field, the traffic field and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The applications described above are only a few of the applications exemplified by the present embodiment, and it should be understood that the applications of the semiconductor package device are not limited to the fields exemplified above.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (7)
1. A semiconductor package device, comprising: a semiconductor chip, a bowl and a cover plate are inverted;
the flip-chip semiconductor chip is electrically connected with the bottom of the bowl cup, the cover plate is fixedly connected with the top of the bowl cup to form a closed sealed cavity, only rare gas consisting of group 0 elements is filled in the sealed cavity, and the pressure of the sealed cavity is lower than the pressure of the external environment.
2. The semiconductor package device of claim 1, wherein a connection area of the cover plate and the top of the bowl is a rough surface to increase a bonding force of the cover plate and the top of the bowl.
3. The semiconductor package device of claim 2, wherein the bowl top includes an "L" shaped step, the lid mating with the step.
4. The semiconductor package device of claim 2, wherein the cover plate is disposed on top of the bowl and secured to the bowl by an adhesive.
5. The semiconductor package device of claim 4, wherein the adhesive comprises an organic glue or a metal solder material.
6. The semiconductor package device of any one of claims 1 to 5, wherein the rare gas consisting of a group 0 element includes at least one of helium, neon, argon, krypton, xenon, radon.
7. The semiconductor package device of claim 6, wherein the pressure of the sealed cavity comprises 0-900 pa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921351686.3U CN210429779U (en) | 2019-08-15 | 2019-08-15 | Semiconductor packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921351686.3U CN210429779U (en) | 2019-08-15 | 2019-08-15 | Semiconductor packaging device |
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| Publication Number | Publication Date |
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| CN210429779U true CN210429779U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921351686.3U Active CN210429779U (en) | 2019-08-15 | 2019-08-15 | Semiconductor packaging device |
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| CN (1) | CN210429779U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397459A (en) * | 2019-08-15 | 2021-02-23 | 深圳市聚飞光电股份有限公司 | Semiconductor packaging device and packaging method thereof |
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2019
- 2019-08-15 CN CN201921351686.3U patent/CN210429779U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112397459A (en) * | 2019-08-15 | 2021-02-23 | 深圳市聚飞光电股份有限公司 | Semiconductor packaging device and packaging method thereof |
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