CN106941125A - 用于背接触太阳能电池的导电电路的制作方法 - Google Patents
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Abstract
本发明公开一种用于背接触太阳能电池的导电电路的制作方法,包括阴极板制作、在阴极板上淀积导电电路、喷涂胶水固化成膜或成品胶膜热复合、剥离胶膜与导电电路几个步骤,本发明采用一次图案成型的制作方法,取代了现有的激光刻蚀方法或者掩模板镀膜成型方法,省去激光蚀刻工序和撕刻槽工序,直接从金属箔工序图案成型,减少生产工序,降低生产能耗,减少了导电电路装置的工序污染,提高了导电性能,针对不同工艺的背接触组件,导电电路的厚度可选参数多,减少了材料的浪费。
Description
技术领域
本发明涉及一种导电电路的制作方法,特别是一种用于背接触太阳能电池的导电电路的制作方法。
背景技术
随着光伏产业电池效率的快速提升,目前提升效率的方式有电池制备材料、工艺改进以提升电池效率和封装方式改进以提升组件效率等。
背接触太阳能电池封装方式为最可靠的提升组件效率的方式之一。之前阻碍背接触太阳能电池封装发展的主要是导电电路的成本居高不下,使得背接触组件成本无法和传统封装方式的太阳能电池组件竞争。近年来,出现了两种较为常见的导电电路制作方式:一种是金属箔和封装胶膜热压复合,然后激光刻划直接成槽或者刻划平行线撕去成槽,这种方法虽然可以降低生产成本,但设备投入较大。另一种是通过掩模板镀膜形成导电电路,这种方式经验证并不实用,不能满足太阳能电池组件的需要。
发明内容
本发明要解决的技术问题是克服现有技术的缺陷,提供一种用于背接触太阳能电池的导电电路的制作方法,采用一次图案成型的制作方法,省去激光蚀刻工序和撕刻槽工序,直接从金属箔工序图案成型,减少生产工序,降低生产能耗,提高了导电性能。
为解决上述技术问题,本发明提供了一种用于背接触太阳能电池的导电电路的制作方法,包括以下步骤:
(1)利用绝缘材料在阴极板上涂敷或印刷绝缘隔离槽图案,绝缘隔离槽图案的厚度为10 nm~5 mm,优选为10 μm~100 μm;绝缘隔离槽图案的宽度为0.1mm~5mm,优选为1 mm~3 mm;
(2)通过电铸法在阴极板上沉积导电材料形成导电电路,导电电路的厚度为1 μm~100μm,优选为30 μm~80 μm;
(3)在步骤(2)沉积的导电电路上喷涂、印刷、热压或涂敷胶水固化成胶膜,或者利用成品胶膜热复合,胶膜厚度为10 μm~1000 μm,优选为100 μm~500 μm;
(4)将胶膜和导电电路从阴极板上剥离,就完成了导电电路的制作。
步骤(2)所述的导电材料是铜、铝、镍或它们的合金。
本发明采用一次图案成型的制作方法,取代了现有的激光刻蚀方法或者掩模板镀膜成型方法,省去激光蚀刻工序和撕刻槽工序,直接从金属箔工序图案成型,减少生产工序,降低生产能耗,大大节约了设备成本和人工成本,效率也大大提高,减少了导电电路装置的工序污染,提高了导电性能。
具体实施方式
实施例一
用于背接触太阳能电池的导电电路的制作方法,包括以下步骤:
(1)利用陶瓷材料在阴极钛板上涂敷绝缘隔离槽图案,绝缘隔离槽图案的厚度为10nm;绝缘隔离槽图案的宽度为1.5 mm;
(2)通过电铸法在阴极钛板上沉积金属铜形成导电电路,导电电路的厚度为1 μm;
(3)在步骤(2)沉积的导电电路上喷涂胶水固化成胶膜,胶膜厚度为100 μm;
(4)将胶膜和导电电路从阴极板上剥离,就完成了导电电路的制作。
导电电路厚度为1 μm的导电背板可满足小电流(≤1 A)背接触组件的封装,相比于传统的激光刻蚀方法,导电材料厚度减少了约30 μm,导电背板的材料成本减少了80%,同时省去了激光刻蚀设备和人工,降低了成本。
实施例二
用于背接触太阳能电池的导电电路的制作方法,包括以下步骤:
(1)利用陶瓷材料在阴极钛板上印刷绝缘隔离槽图案,绝缘隔离槽图案的厚度为10 μm;绝缘隔离槽图案的宽度为2 mm;
(2)通过电铸法在阴极钛板上沉积金属镍形成导电电路,导电电路的厚度为30 μm;
(3)在步骤(2)沉积的导电电路上涂敷胶水固化成胶膜,胶膜厚度为200 μm;
(4)将胶膜和导电电路从阴极板上剥离,就完成了导电电路的制作。
本实施例制作的导电电路可直接替换传统方法制备的导电电路,导电电路厚度为30μm的导电背板可满足标准背接触组件的封装,相比于传统的激光刻蚀方法,节约了激光刻蚀设备和人工,设备折旧和人工成本减少20%,通过光伏组件的耐候测试,电性能和传统方法制备的导电电路一致。
实施例三
用于背接触太阳能电池的导电电路的制作方法,包括以下步骤:
(1)利用橡胶材料在阴极钛板上印刷绝缘隔离槽图案,绝缘隔离槽图案的厚度为100 μm;绝缘隔离槽图案的宽度为1 mm;
(2)通过电铸法在阴极钛板上沉积金属铝形成导电电路,导电电路的厚度为80 μm;
(3)在步骤(2)沉积的导电电路上热复合成品胶膜,胶膜厚度为500 μm;
(4)将胶膜和导电电路从阴极板上剥离,就完成了导电电路的制作。
本实施例在原材料成型上不同于激光刻蚀需要的铝箔,激光刻蚀使用的铝箔是压延成型,在生产过程中需要使用油性物质润滑,在后续使用中需要增加清洗设备去除这层油性物质,而本方法避开了压延成型的缺点,直接一次成型,节约成本20%
实施例四
用于背接触太阳能电池的导电电路的制作方法,包括以下步骤:
(1)利用橡胶材料在阴极钛板上涂敷绝缘隔离槽图案,绝缘隔离槽图案的厚度为100 μm;绝缘隔离槽图案的宽度为2 mm;
(2)通过电铸法在阴极钛板上沉积铜镍合金形成导电电路,导电电路的厚度为30 μm;
(3)在步骤(2)沉积的导电电路上印刷胶水固化成胶膜,胶膜厚度为200 μm;
(4)将胶膜和导电电路从阴极板上剥离,就完成了导电电路的制作。
本实施例使用铜镍合金进一步节约了材料成本,适合使用在效率较低背接触组件的封装。
本发明采用一次图案成型法,减少生产工序,降低生产能耗,减少了导电电路装置的工序污染,提高了导电性能,针对不同工艺的背接触组件,导电电路的厚度可选参数多,减少了材料的浪费。
Claims (5)
1.用于背接触太阳能电池的导电电路的制作方法,其特征在于,包括以下步骤:
(1)利用绝缘材料在阴极板上涂敷或印刷绝缘隔离槽图案,绝缘隔离槽图案的厚度为10 nm~5 mm,宽度为0.1mm~5mm;
(2)通过电铸法在阴极板上沉积导电材料形成导电电路,导电电路的厚度为1 μm~100μm;
(3)在步骤(2)沉积的导电电路上喷涂、印刷、热压或涂敷胶水固化成胶膜,或者利用成品胶膜热复合,胶膜厚度为10 μm~1000 μm;
(4)将胶膜和导电电路从阴极板上剥离,就完成了导电电路的制作。
2.如权利要求1所述的用于背接触太阳能电池的导电电路的制作方法,其特征在于:步骤(1)所述的绝缘隔离槽图案的厚度为10 μm~100 μm,宽度为1 mm~3 mm。
3.如权利要求1所述的用于背接触太阳能电池的导电电路的制作方法,其特征在于:步骤(2)所述的导电材料是铜、铝、镍或它们的合金。
4.如权利要求1或3所述的用于背接触太阳能电池的导电电路的制作方法,其特征在于:步骤(2)中导电电路的厚度为30 μm~80 μm。
5.如权利要求1所述的用于背接触太阳能电池的导电电路的制作方法,其特征在于:步骤(3)中胶膜厚度为100 μm~500 μm。
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CN109659393A (zh) * | 2018-12-11 | 2019-04-19 | 君泰创新(北京)科技有限公司 | 用于叠瓦组件的电池片的制备方法 |
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GB1062636A (en) * | 1962-11-29 | 1967-03-22 | Amphen Corp | Electronic circuit element and method of manufacture |
CN1039342A (zh) * | 1988-07-13 | 1990-01-31 | 徐承先 | 热压镶嵌法制造印刷电路板 |
CN1453610A (zh) * | 2002-04-23 | 2003-11-05 | 诠兴开发科技股份有限公司 | 导光板模具的制造方法 |
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GB1062636A (en) * | 1962-11-29 | 1967-03-22 | Amphen Corp | Electronic circuit element and method of manufacture |
CN1039342A (zh) * | 1988-07-13 | 1990-01-31 | 徐承先 | 热压镶嵌法制造印刷电路板 |
CN1453610A (zh) * | 2002-04-23 | 2003-11-05 | 诠兴开发科技股份有限公司 | 导光板模具的制造方法 |
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CN109659393A (zh) * | 2018-12-11 | 2019-04-19 | 君泰创新(北京)科技有限公司 | 用于叠瓦组件的电池片的制备方法 |
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