CN106905912B - 一种聚氨基甲酸酯粘合剂及其用途 - Google Patents
一种聚氨基甲酸酯粘合剂及其用途 Download PDFInfo
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- CN106905912B CN106905912B CN201611186681.0A CN201611186681A CN106905912B CN 106905912 B CN106905912 B CN 106905912B CN 201611186681 A CN201611186681 A CN 201611186681A CN 106905912 B CN106905912 B CN 106905912B
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- polyurethane
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- antistatic agent
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- 229920002635 polyurethane Polymers 0.000 title claims abstract description 76
- 239000004814 polyurethane Substances 0.000 title claims abstract description 76
- 239000000853 adhesive Substances 0.000 title claims abstract description 73
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 73
- -1 polysiloxane Polymers 0.000 claims abstract description 72
- 239000002216 antistatic agent Substances 0.000 claims abstract description 46
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 32
- 150000001875 compounds Chemical class 0.000 claims abstract description 31
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000000126 substance Substances 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims description 54
- 229920005862 polyol Polymers 0.000 claims description 35
- 150000003077 polyols Chemical class 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 24
- 229930195729 fatty acid Natural products 0.000 claims description 24
- 239000000194 fatty acid Substances 0.000 claims description 24
- 239000012948 isocyanate Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 17
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 15
- 229920000570 polyether Polymers 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 125000000129 anionic group Chemical group 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- XUGNVMKQXJXZCD-UHFFFAOYSA-N isopropyl palmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC(C)C XUGNVMKQXJXZCD-UHFFFAOYSA-N 0.000 claims description 9
- 229920001451 polypropylene glycol Polymers 0.000 claims description 9
- 125000002091 cationic group Chemical group 0.000 claims description 8
- 239000005056 polyisocyanate Substances 0.000 claims description 8
- 229920001228 polyisocyanate Polymers 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- HIQIXEFWDLTDED-UHFFFAOYSA-N 4-hydroxy-1-piperidin-4-ylpyrrolidin-2-one Chemical compound O=C1CC(O)CN1C1CCNCC1 HIQIXEFWDLTDED-UHFFFAOYSA-N 0.000 claims description 4
- HPEUJPJOZXNMSJ-UHFFFAOYSA-N Methyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC HPEUJPJOZXNMSJ-UHFFFAOYSA-N 0.000 claims description 4
- UQDUPQYQJKYHQI-UHFFFAOYSA-N methyl laurate Chemical compound CCCCCCCCCCCC(=O)OC UQDUPQYQJKYHQI-UHFFFAOYSA-N 0.000 claims description 4
- 239000003607 modifier Substances 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229920001748 polybutylene Polymers 0.000 claims description 3
- 229920005906 polyester polyol Polymers 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- OKMWKBLSFKFYGZ-UHFFFAOYSA-N 1-behenoylglycerol Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCC(O)CO OKMWKBLSFKFYGZ-UHFFFAOYSA-N 0.000 claims description 2
- SRBSSROHORQGBO-UHFFFAOYSA-N 11-methyldodecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCCCCCCCCC(C)C SRBSSROHORQGBO-UHFFFAOYSA-N 0.000 claims description 2
- WZUNUACWCJJERC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(CC)(CO)CO WZUNUACWCJJERC-UHFFFAOYSA-N 0.000 claims description 2
- OPJWPPVYCOPDCM-UHFFFAOYSA-N 2-ethylhexyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(CC)CCCC OPJWPPVYCOPDCM-UHFFFAOYSA-N 0.000 claims description 2
- AMEMLELAMQEAIA-UHFFFAOYSA-N 6-(tert-butyl)thieno[3,2-d]pyrimidin-4(3H)-one Chemical group N1C=NC(=O)C2=C1C=C(C(C)(C)C)S2 AMEMLELAMQEAIA-UHFFFAOYSA-N 0.000 claims description 2
- NDKYEUQMPZIGFN-UHFFFAOYSA-N Butyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCC NDKYEUQMPZIGFN-UHFFFAOYSA-N 0.000 claims description 2
- GWFGDXZQZYMSMJ-UHFFFAOYSA-N Octadecansaeure-heptadecylester Natural products CCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC GWFGDXZQZYMSMJ-UHFFFAOYSA-N 0.000 claims description 2
- QQVGEJLUEOSDBB-KTKRTIGZSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(CO)(CO)CO QQVGEJLUEOSDBB-KTKRTIGZSA-N 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 229940071160 cocoate Drugs 0.000 claims description 2
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 claims description 2
- CAMHHLOGFDZBBG-UHFFFAOYSA-N epoxidized methyl oleate Natural products CCCCCCCCC1OC1CCCCCCCC(=O)OC CAMHHLOGFDZBBG-UHFFFAOYSA-N 0.000 claims description 2
- 229940049654 glyceryl behenate Drugs 0.000 claims description 2
- XJNUECKWDBNFJV-UHFFFAOYSA-N hexadecyl 2-ethylhexanoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C(CC)CCCC XJNUECKWDBNFJV-UHFFFAOYSA-N 0.000 claims description 2
- 229940033357 isopropyl laurate Drugs 0.000 claims description 2
- NKBWPOSQERPBFI-UHFFFAOYSA-N octadecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC NKBWPOSQERPBFI-UHFFFAOYSA-N 0.000 claims description 2
- QTDSLDJPJJBBLE-PFONDFGASA-N octyl (z)-octadec-9-enoate Chemical compound CCCCCCCCOC(=O)CCCCCCC\C=C/CCCCCCCC QTDSLDJPJJBBLE-PFONDFGASA-N 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 239000003755 preservative agent Substances 0.000 claims description 2
- 230000002335 preservative effect Effects 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- 230000008719 thickening Effects 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 1
- 229940105132 myristate Drugs 0.000 claims 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 15
- 238000004383 yellowing Methods 0.000 abstract description 15
- 238000001035 drying Methods 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 5
- 230000000052 comparative effect Effects 0.000 description 26
- 238000000034 method Methods 0.000 description 18
- 238000012360 testing method Methods 0.000 description 17
- 229920005749 polyurethane resin Polymers 0.000 description 12
- 229920002545 silicone oil Polymers 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005886 esterification reaction Methods 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000002608 ionic liquid Substances 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical group Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Chemical group OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000003578 releasing effect Effects 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- BGRXBNZMPMGLQI-UHFFFAOYSA-N 2-octyldodecyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCC(CCCCCCCC)CCCCCCCCCC BGRXBNZMPMGLQI-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical group COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229940073665 octyldodecyl myristate Drugs 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/61—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/36—Hydroxylated esters of higher fatty acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
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Abstract
一种聚氨基甲酸酯粘合剂,由改性的聚氨基甲酸酯共聚物(A)、固化剂(B)与抗静电剂(C)调配而成,所述改性的聚氨基甲酸酯共聚物(A)具有将聚硅氧烷化合物接枝于聚氨基甲酸酯聚合物的化学结构,结果所制得的聚氨基甲酸酯粘合剂具有优秀的二次加工性、排气性、透明性、高温下不会留下残胶也不黄变,且烘干速度快,不但适用于构成表面保护膜的胶面,当粘附在光学或电子组件的表面时,既不会析出到表面也不会留下残胶污染光学或电子组件的表面。
Description
技术领域
本发明涉及一种聚氨基甲酸酯粘合剂,尤指关于使用聚硅氧烷化合物接枝改性的聚氨基甲酸酯粘合剂,其适合于制成表面保护膜的粘合层的用途,当粘附在光学或电子组件表面时不会造成污染。
背景技术
现有技术中,可剥离保护膜是一种兼具接着及防尘防刮功能的薄膜产品(以下简称表面保护膜),在加工、组装或输送光学或电子组件的过程中,经常用于保护光学或电子组件(以下简称被粘合组件)的表面。
所述表面保护膜的质量,需具备下列条件:
1、优异排气性:当将所述表面保护膜粘附于被粘合组件的表面时,要避免有气泡留存在所述表面保护膜与被粘合组件表面之间;及
2、不会析出残胶:当所述表面保护膜从被粘合组件的表面剥离时,要避免有残胶留下污染被粘合组件的表面。
所述表面保护膜的胶面,使用丙烯酸树脂构成时,其排气效果较差,当粘附于被粘合组件的表面,即使不会留下残胶,也会在所述表面保护膜与被粘合组件表面之间存在气泡。
而所述表面保护膜的胶面,使用未经过改性的聚氨基甲酸酯树脂构成时,其排气效果较差,当粘附于被粘合组件的表面,会有异物析出而污染被粘合组件的表面。此外,未经过改性的聚氨基甲酸酯树脂的表面干燥性差,有涂布加工速度慢的问题。
即使所述表面保护膜的胶面是使用未经过改性的聚氨基甲酸酯树脂掺混聚硅氧烷化合物构成,但未经过改性的聚氨基甲酸酯树脂,是在合成后,再进行掺混添加聚硅氧烷化合物,此添加方式属于掺混性质,聚硅氧烷化合物没有参与聚氨基甲酸酯树脂的合成反应,在干燥过程中,聚硅氧烷化合物与未经过改性的聚氨基甲酸酯树脂不能保证完全反应结合在一起,还存在着仍未结合接枝在一起的聚硅氧烷化合物。当这种表面保护膜粘附于被粘合组件的表面时,经历一段时间或高温后,聚硅氧烷化合物易迁移析出至被粘合组件的表面(以下简称移形性),进而污染被粘合组件的表面。
此外,所述表面保护膜的胶面,在现有技术中,经常使用抗静电剂来降低表面电阻值,但在高温下,所述表面保护膜的胶面容易发生黄变现象。
发明内容
为了解决现有技术中的表面保护膜的胶面需兼具优异排气性及不析出残胶的问题,本发明的聚氨基甲酸酯粘合剂,在组成成分中,包含一种经过聚硅氧烷化合物接枝改性的聚氨基甲酸酯共聚物(以下简称改性聚氨基甲酸酯共聚物(A)),与未经改性的聚氨基甲酸酯聚合物或在合成后再掺混聚硅氧烷化合物而制得的一般聚氨基甲酸酯粘合剂相比,在经历一段时间或高温后,所述改性聚氨基甲酸酯共聚物(A)成分中的聚硅氧烷化合物或其它异物,都不会从聚氨基甲酸酯聚合物中迁移析出,具有优异的不移形性。
本发明的主要目的在于公开一种聚氨基甲酸酯粘合剂,由改性聚氨基甲酸酯共聚物(A)、固化剂(B)与抗静电剂(C)调配而成,其中,合成所述改性聚氨基甲酸酯共聚物(A)的关键性技术,是在多元醇及异氰酸酯进行酯化反应的合成过程中,加入含有羟基(OH基)反应性官能团的聚硅氧烷化合物及适量脂肪酸酯参与酯化反应,结果所制得的改性聚氨基甲酸酯共聚物(A)具有将聚硅氧烷化合物完全接枝于聚氨基甲酸酯聚合物的化学结构,不但适用于调配成所述聚氨基甲酸酯粘合剂及进一步制成表面保护膜的胶面,并且可改善表面保护膜的胶面具优异的排气性、透明性、耐黄变性及不移形性。
本发明的改性聚氨基甲酸酯共聚物(A),由下列单体成分按照使用量经过酯化合成而制得,具优异的二次加工性、排气性、透明性及耐黄变性;所述各单体成分及使用量,如下:
a.多元醇为100wt%;选自具有2个或2个以上OH基、且数均分子量
Mn为1000~10000的多元醇;
b.基于所述多元醇的重量,含羟基的聚硅氧烷化合物为2~20wt%;且
具有下列化学结构式所示的结构:
其中,X与m为大于或等于0的正整数,可为相等或不相等的正整数;
R1选自聚环氧乙烷(EO)、聚环氧丙烷(PO)或聚环氧丁烷(BO);
R2选自甲基、乙基、丙基或苯基;
c.基于所述多元醇的重量,多官能异氰酸酯化合物为14~18wt%;
d.基于所述多元醇的重量,脂肪酸酯为14~16wt%。
本发明的聚氨基甲酸酯粘合剂,在成分中,包含改性聚氨基甲酸酯共聚物(A),固化剂(B)及抗静电剂(C),基于所述改性聚氨基甲酸酯共聚物(A)中的多元醇的重量,固化剂(B)的使用量为14~18wt%,抗静电剂(C)的使用量为0.05~5wt%。
本发明的聚氨基甲酸酯粘合剂,在成分中,包含抗静电剂(C)选自阳离子型抗静电剂或阴离子型抗静电剂中的一种或它们的组合,具有极佳抗静电效果,其表面电阻可达109Ω/□。
本发明的另一主要目的在于公开一种表面保护膜,其包括:基材层,厚度介于10~100μm;及粘合层,厚度介于l~50μm,且所述粘合层是使用本发明的聚氨基甲酸酯粘合剂为材料,且涂布在所述基材层上面经固化构成。
本发明的表面保护膜的胶面,对于玻璃板的粘着力介于1g/25mm~3g/25mm。
本发明的表面保护膜,具有以下有益效果:
1、本发明的聚氨基甲酸酯粘合剂及本发明的表面保护膜的胶面,使用特殊的改性聚氨基甲酸酯共聚物(A)制成,与一般未经过改性的聚氨基甲酸酯共聚物比较,可使所述聚氨基甲酸酯粘合剂及所述表面保护膜的胶面的成分之中的聚氨基甲酸酯聚合物更容易解纠缠,不但可改善聚氨基甲酸酯粘合剂与被涂布物体之间的浸湿(wetting)接着性,更促进所述聚氨基甲酸酯粘合剂及所述表面保护膜的胶面具有优异不移形性。
2、本发明的聚氨基甲酸酯粘合剂,具优异的二次加工性、排气性、透明性及耐黄变性,适用于制成所述表面保护膜的胶面。
3、本发明的表面保护膜的胶面,具优异的排气性、透明性、粘着力、耐黄变性及不移形性,适用于加工、组装或输送光学或电子组件的过程中,粘附在光学或电子组件表面,以保护光学或电子组件表面受到损伤。
附图说明
图1是本发明的聚氨基甲酸酯粘合剂适用于构成三层叠层表面保护膜的粘合层的说明图。
附图标记
10 保护膜
20 PET基材层
30 粘合层
40 离型膜
具体实施方式
本发明的聚氨基甲酸酯粘合剂,是由所述改性聚氨基甲酸酯共聚物(A)搭配固化剂(B)与抗静电剂(C)共同调配而成,具有优异的二次加工性、排气性、透明性、耐黄变性及不移形性。此外,本发明的聚氨基甲酸酯粘合剂,为了达成具有多元化的使用用途,其组成成分中,可选择性再添加其他改性剂(D)。
所述改性聚氨基甲酸酯共聚物(A)的制法,是将含有羟基(OH基)反应性官能团的聚硅氧烷化合物(以下简称含羟基的聚硅氧烷化合物)与多元醇、多官能异氰酸酯化合物及脂肪酸酯共同参与酯化合成反应而制得,且所制得的改性聚氨基甲酸酯共聚物(A)具有将聚硅氧烷化合物完全接枝于聚氨基甲酸酯聚合物的化学结构。
所述改性聚氨基甲酸酯共聚物(A)的单体成分,基于多元醇的重量,包括:
a.多元醇100wt%;
b.含羟基的聚硅氧烷化合物2~20wt%;优选为4~15wt%;最优选为6~10wt%;
c.多官能异氰酸酯化合物14~18wt%;
d.脂肪酸酯14~16wt%;优选为15wt%。
所述多元醇必须选自具有2个或2个以上羟基(OH基)而且其数均分子量(Mn)需介于1000~10000的多元醇,优选为数均分子量(Mn)介于1500~8000;最优选为数均分子量(Mn)介于2000~5000。
所述多元醇的具体例子为选自聚酯多元醇或聚醚多元醇。其中,所述聚酯多元醇可由多元醇成分(E1)与酸成分(E2)经过酯化反应而获得。
所述多元醇成分(E1)选自乙二醇、1,4-丁二醇、3-甲基-1,5-戊二醇、2,4-二乙基-l,5-戊二醇、1,6-己二醇、2-甲基-1,8-辛二醇中的一种或二种以上的组合。
所述酸成分(E2)选自己二酸、丁二酸、甲基丁二酸、庚二酸、壬二酸、癸二酸、对苯二甲酸、间苯二甲酸、邻苯二甲酸、间苯二甲酸或邻苯二甲酸中的一种或二种以上的组合。
此外,所述聚醚多元醇可由多元醇成分(E3)与环氧烷(E4)进行加成聚合而获得。所述多元醇成分(E3)选自聚乙二醇、聚丙二醇、聚1,4-丁二醇或聚1,6-己二醇中的一种或二种以上的组合。所述环氧烷(E4)选自环氧乙烷、环氧丙烷或环氧丁烷中的一种或二种以上的组合。
所述含羟基的聚硅氧烷化合物,具有下列化学结构式所示的结构:
其中,X与m为大于或等于0的正整数;
R1选自聚环氧乙烷(EO)、聚环氧丙烷(PO)或聚环氧丁烷(BO);
R2选自甲基、乙基、丙基或苯基;
所述多官能异氰酸酯化合物选自多官能脂肪族异氰酸酯化合物、多官能脂环族异氰酸酯化合物或多官能芳香族异氰酸酯化合物中的一种或二种以上的组合。
本发明的聚氨基甲酸酯共聚物(A),基于多元醇的重量,含有一种或一种以上脂肪酸酯达14~16wt%的目的,在于提高所述聚氨基甲酸酯共聚物(A)的排气速度。其中,脂肪酸酯的含量,如果低于14wt%时,则无法充分提高排气速度,如果高于16wt%,在高温下,则有析出于被接着体表面的问题,尤其是,使用过量的脂肪酸酯,会造成对涂布加工表面的干燥性较差,从而影响到涂布线速较慢。
所述脂肪酸酯选自月桂酸异丙酯、肉豆寇酸异丙酯、棕搁酸异丙酯、硬脂酸2-乙基己酯、二十二烷酸甘油单酯、2-乙基己酸十六烷基酯、甲基丙烯酸月桂酯、椰子油脂肪酸甲酯、肉豆寇酸辛基十二烷基酯、季戊四醇单油酸酯、季戊四醇单硬脂酸酯、硬脂酸十八烷基酯、月桂酸甲酯、硬脂酸甲酯、油酸辛酯、硬脂酸异十三烷基酯或月桂酸丁酯中的一种或二种以上的组合。
所述聚氨基甲酸酯共聚物(A)的具体制法,包括:将2官能团的多元醇、部分3官能团的多元醇、聚硅氧烷化合物、脂肪酸酯与部分溶剂放入反应器内,升温搅拌达50℃时加入部分异氰酸酯化合物,反应30分钟后,加入少量催化剂,反应30分钟后,加入其余的3官能团的多元醇,并升温达75℃,反应1.5小时后,补加其余异氰酸酯化合物,并保持温度反应4小时,取样检测NCO无残存并达到分子量后,加其余溶剂搅拌30分钟后完成。
本发明的聚氨基甲酸酯粘合剂,由所述聚氨基甲酸酯共聚物(A)搭配固化剂(B)与抗静电剂(C)共同调配而成时,只需搅拌均匀即可使用。本发明的聚氨基甲酸酯粘合剂,加入特别组合的抗静电剂,可以发挥抗静电效果,且表面电阻(Ω/□)可达109。
所述抗静电剂(C)的使用量,基于前面所述多元醇的重量,为0.05~5wt%。所述抗静电剂(C)选自阳离子型抗静电剂或阴离子型抗静电剂中的一种或它们的组合。其中,所述阳离子型抗静电剂具有下列化学结构式所示的结构:
(R)4NX或(R)nNY;
其中,n=1、2或3;
R表示烷基;X为卤素;Y为盐酸、甲酸或乙酸;N为氮。
所述阳离子型抗静电剂可选自季铵盐或胺盐的阳离子型抗静电剂,特性为极性高、抗静电效果优异、对高分子材料的附着力较强,但热稳定性较差。
所述阴阳离子型抗静电剂具有下列化学结构式所示的结构:
RCOO-M+、RSO3 -M+、ROSO3 -M+;
其中,M+为碱金属离子、铵或有机胺;
R为烷基。
所述阴离子型抗静电剂可选自烷基硫酸盐、硫酸盐、磷酸盐、高级脂肪酸盐、羧酸盐、二硫代氨基甲酸盐或聚合型的阴离子抗静电剂,特性为耐热性及抗静电性效果佳,和树脂的兼容性较差,对透明制品有不利的影响。
本发明的聚氨基甲酸酯粘合剂,选用阳离子型抗静电剂搭配混合阴离子型抗静电剂时,可达到高温耐黄变性、较低表面电阻及较佳兼容性。其中,阴离子抗静电剂相对于阳离子抗静电剂的优选的用量比例为4.5~5.5:1,最优选的用量比例为5~5.25:1。
所述固化剂(B)选自芳香族聚异氰酸酯类固化剂、脂肪族聚异氰酸酯类固化剂或脂环族聚异氰酸酯类固化剂中的一种或它们的组合,包括甲苯二异氰酸酯(TDI)或二苯甲烷二异氰酸酯(MDI)类的芳香族聚异氰酸酯固化剂,例如德国拜耳(Bayer)公司生产的Desmodur IL1351、IL1451或L75;或1,6-己二异氰酸酯(HDI)类的脂肪族聚异氰酸酯固化剂,例如德国拜耳公司生产的Desmodur N3300。所述固化剂(B)的使用量,基于前面所述多元醇的重量,为14~18wt%。
本发明的聚氨基甲酸酯粘合剂,在不损及基本效果下,可依据粘合剂使用时的特性需求,适量添加所述改性剂(D)。所述改性剂(D)选自紫外线吸收剂、抗氧化剂、防腐剂、防霉剂、增稠树脂、增塑剂、消泡剂或湿润剂中的一种或二种以上的组合。
如图1所示,本发明的聚氨基甲酸酯粘合剂,其使用用途为适用于制成表面保护膜10的粘合层30。所述表面保护膜10是用于粘附在光学或电子组件表面的可剥离保护膜,具有基材层20、粘合层30,涂布于所述基材层20上面、及离型膜40、以可剥离方式粘合在所述粘合层30上面。
所述表面保护膜10的基材层20,可选用PET基材制成,且所述基材层20的厚度为10~100μm,优选为15~75μm,最优选为20~50μm。
所述表面保护膜10的粘合层30,是使用本发明的聚氨基甲酸酯粘合剂构成,具有优异的二次加工性,可使得所述表面保护膜10的粘合层30平整均匀地涂布到所述基材层20的上面。所述粘合层30的厚度为l~50μm,优选为5~25μm,最优选为10~15μm。
所述表面保护膜10的离型膜40,其接触所述粘合层30的表面,有涂布聚硅氧离型剂,具不易粘附所述粘合层30的特性,且易与所述粘合层30剥离分开。所述离型膜40的厚度为10~100μm,优选为15~75μm,最优选为20~50μm。
所述表面保护膜10的粘合层30,使用本发明的聚氨基甲酸酯粘合剂构成,具有适度粘着性,对于玻璃板的粘着力,达到10g/25mm以下,优选为达到5g/25mm以下,最优选为达到1~3g/25mm。
所述表面保护膜10的粘合层30,使用本发明的聚氨基甲酸酯粘合剂构成,具有透明性,涂布于具有透光性的所述基材层20上面、可促进所述保护膜10的雾度达到4%以下,优选为达到3%以下,最优选为达到2.5%以下。
所述表面保护膜10的粘合层30,是使用本发明的聚氨基甲酸酯粘合剂构成,具排气性、耐黄变性及不移形性。将所述表面保护膜10粘附到光学或电子组件表面时,所述表面保护膜10的粘合层30,可以获得快速驱气、排气效果,进而平整地粘附于光学或电子组件表面上。而且,所述表面保护膜10的透明性较高,长久粘附到光学或电子组件表面时,仍保持高透明度不会变黄,可以准确检查光学或电子组件的表面是否有受损伤的瑕疵。即使经历一段时间后,从光学或电子组件表面将所述表面保护膜10剥离,所述表面保护膜10的粘合层30也不会析出粘合剂成分,对光学或电子组件表面更不会造成污染。
现在列举以下实施例及对比实施例来阐明本发明的效果,但本发明的权利要求保护范围不是仅限于实施例的范围。
各实施例及对比实施例所制得的表面保护膜,将切割成长度100mm×宽度25mm的测试样品,再根据下述方法进行性能评估:
1、排气性:
将测试样品的离型膜剥离,双手握持测试样品的宽度侧两端,使测试样品的中间部分先接触玻璃,其两端部则稍提起,然后双手开始放开测试样品;观测测试样品开始到完全服贴于玻璃的时间,时间越短表示排气效果越佳。
◎:表示排气时间<1秒;
○:表示排气时间1~1.5秒;
△:表示排气时间>2秒。
2、透明性:
将测试样品的离型膜剥离,以雾度仪器(厂牌TOKYO DENSHOKU(东京电色)型号TC-HⅢDPK)分析雾度与透光率。
◎:表示透明性佳;
○:表示透明性尚可;
△:表示透明性差。
3、高温黄变性:
在温度25℃、湿度50%RH气氛下,将测试样品的粘合层粘附到玻璃板上,再使用2kg辊轮往复压合一次,然后放置于150℃烘箱3小时后,取出静置30分钟,再观察测试样品的外观是否黄变,以及玻璃上是否有留下胶残。
◎:表示无黄变或残胶;
○:表示极轻微黄变或残胶;
△:表示有黄变与残胶。
4、粘着力:
在温度25℃、湿度50%RH气氛下,将测试样品的粘合层粘附到玻璃板上,再使用2kg辊轮往复压合一次。30分钟后,在剥离角度180度及拉伸速度300mm/min的剥离条件下,使用万能拉伸试验机对测试样品测量在这种剥离条件下的粘着力。
5、表面电阻:
对剥离了离型膜的测试样品,使用表面电阻测试仪器(厂牌ADVANTEST,型号R8340A(ULTRAHIGH RESISTANCE METER)高电阻计+TR 300C测试箱)测试其胶面的表面电阻值。
6、干燥速度:
以涂布刮刀将粘合剂涂布于PET基材,再放置于150℃烘箱1分钟后,干膜厚度为12~15μm,以指触比较干燥性。
◎:表示干燥性佳;
○:表示干燥性尚可;
△:表示干燥性差。
7、不移形性:
在温度25℃、湿度50%RH气氛下,将测试样品的粘合层粘附到玻璃板上,再使用2kg辊轮往复压合一次,然后放置于85℃烘箱500小时后,取出静放30分钟,再观察玻璃板上有无移形物。
◎:表示无移形物,不移形性佳;
○:表示极轻微移形物;
△:表示有移形物,不移形性差。
实施例1
如表1所示,将50重量份的含2个OH基官能团的多元醇DL3000(聚氧化丙烯二醇(polyoxypropylene glycol),简称PPG,Mn=3000)、30重量份的含2个OH基的多元醇的Kuraray Polyol P-5010(3-甲基-1,5-戊二醇是聚酯二醇(Poly[(3-methyl-1,5-pentanediol)-alt-(adipic acid)]),Mn=5000)、15重量份的含3个OH基的多元醇PC3000(聚碳酸酯多元醇,Mn=3000)、8重量份的含2个OH基的聚醚硅油SF 8427(DOW CORNING公司)、150重量份的乙酸乙酯作为稀释溶剂放入反应器内,并添加15重量份的脂肪酸酯(棕榈酸异丙酯,Mn=299),升温搅拌达50℃时加入11重量份的异氰酸酯化合物HDI(hexamethylene diisocyanate),反应30分钟后,加入少量催化剂,反应30分钟后,加入其余5重量份的含3官能团的多元醇,并升温达75℃,反应1.5小时后,补加其余2重量份的异氰酸酯化合物HDI,并保持温度反应4小时,取样检测NCO无残存并且达到分子量后,加其余溶剂搅拌30分钟后完成聚氨基甲酸酯树脂,接着加入16重量份的3官能团脂肪族固化剂Desmodur N3300(Bayer公司)及5重量份的抗静电剂,包括0.80重量的份离子液IL-P14(KOEI CHEMICAL广荣化学公司)及4.2重量份的阴离子型抗静电剂EF15(三菱化学公司),搅拌5分钟后完成聚氨基甲酸酯树脂粘合剂。
利用涂布刀将所制得聚氨基甲酸酯粘合剂涂布于PET基材膜(厚度38μm),在115℃温度下干燥(固化)3分钟后,形成涂布于PET基材膜上的粘合层,干燥后的厚度为12μm;再将厚度38μm且粘合面已涂布聚硅氧离型剂的PET离型膜粘合到粘合层上面,以制得一种表面保护膜。测试制得的表面保护膜的性能,结果如表1所示。
实施例2
同实施例1的制法,但将聚醚硅油改为使用聚醚硅油CS3505,脂肪酸酯改为肉荳蔻酸异丙酯,以及,抗静电剂的使用量,改为使用包括0.04重量份的离子液IL-P14及0.2重量份的阴离子型抗静电剂EF15。测试所制得的表面保护膜的性能,结果如表1所示。
实施例3
同实施例1的制法,但将聚醚硅油改为使用聚醚硅油KF-6001(信越公司),以及,抗静电剂的使用量,改为使用包括0.45重量份的离子液IL-P14及2.25重量份的阴离子型抗静电剂EF15。测试所制得的表面保护膜的性能,结果如表1所示。
实施例4
同实施例1的制法,但将脂肪酸酯(棕榈酸异丙酯,Mn=299)使用量降为14重量份,以及,抗静电剂的使用量,改为使用包括0.08重量份的离子液IL-P14及0.4重量份的阴离子型抗静电剂EF15。测试所制得的表面保护膜的性能,结果如表1所示。
实施例5
同实施例4的制法,但将聚醚硅油改为使用聚醚硅油KF-6001(信越公司),以及,将脂肪酸酯(棕榈酸异丙酯,Mn=299)使用量增加为16重量份。测试所制得的表面保护膜的性能,结果如表1所示。
实施例6
同实施例5的制法,但将脂肪酸酯(棕榈酸异丙酯,Mn=299)使用量降为15重量份。测试所制得的表面保护膜的性能,其结果如表1所示。
对比实施例1
同实施例1的制法,但排除使用聚硅氧烷化合物、脂肪酸酯及抗静电剂。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例2
同实施例1的制法,但排除使用聚硅氧烷化合物及抗静电剂。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例3
同对比实施例2的制法,但将脂肪酸酯(棕榈酸异丙酯,Mn=299)使用量增加为30重量份,且使用5.5重量份的抗静电剂,包括0.90重量份的离子液IL-P14及4.5重量份的EF15。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例4
同对比实施例2的制法,但将脂肪酸酯(棕榈酸异丙酯,Mn=299)使用量增加为17重量份,且使用0.24重量份的抗静电剂IL-P14。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例5
同对比实施例2的制法,但添加使用0.08重量份的抗静电剂IL-P14。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例6
同对比实施例2的制法,但添加使用0.08重量份的抗静电剂IL-P14及0.4重量份的抗静电剂EF15。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例7
同对比实施例2的制法,但添加使用聚硅氧烷化合物及抗静电剂,包括添加使用8重量份的聚醚硅油SF8427及0.24重量份的抗静电剂IL-P14。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例8
同对比实施例7的制法,但将聚醚硅油SF8427改为使用聚醚硅油KF6001。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例9
同对比实施例2的制法,脂肪酸酯维持使用棕榈酸异丙酯,而且,添加使用8重量份的聚醚硅油SF8427的时机,是在完成合成聚氨基甲酸酯树脂之后再加入。测试所制得的表面保护膜的性能,其结果如表2所示。
对比实施例10
同对比实施例2的制法,但脂肪酸酯改为使用肉荳蔻酸异丙酯,而且,添加使用8重量份的聚醚硅油CS3505的时机,是在完成合成聚氨基甲酸酯树脂之后再加入。测试所制得的表面保护膜的性能,其结果如表2所示。
结果:
1、根据表1及表2的测试结果,实施例1-6制成的聚氨基甲酸酯粘合剂,具有优异的二次加工性、排气性、透明性、耐黄变性及不移形性,且适用于制成表面保护膜的粘合层。因此,实施例1-6制成的表面保护膜,具有优异的排气性、透明性、粘着力及耐黄变性,且其粘合层的胶面亦具有优异的表面电阻及不移形性。
2、根据实施例4-6与对比实施例6的比对结果,实施例4-6制成的聚氨基甲酸酯粘合剂,在成分中包含聚硅氧烷化合物,确实可以促进实施例4-6制成的表面保护膜提高其排气性能、透明性、粘着力及不移形性。
3、根据对比实施例5与对比实施例6的比对结果,对比实施例6制成的聚氨基甲酸酯粘合剂,在成分中使用两种抗静电剂IL-P14与EF15,所制成的表面保护膜的胶面表面电阻(Ω/□),由1010降为109。
4、实施例1-6制成的聚氨基甲酸酯粘合剂,在成分中使用两种抗静电剂IL-P14与EF15,确实可以促进实施例1-6制成的表面保护膜的胶面表面电阻(Ω/□)降为109。
5、根据实施例1-2与对比实施例9-10的比对结果,实施例1-2的聚硅氧烷化合物,是在聚氨基甲酸酯树脂合成过程中加入且参与反应,对比实施例9-10的聚硅氧烷化合物,是在完成合成聚氨基甲酸酯树脂之后再加入,结果实施例1-2制成的表面保护膜具有优异的150℃高温耐黄变性,且粘附到玻璃板上不会留下残胶,具极佳不移形性。
表1
注:1.聚硅氧烷化合物采用聚醚硅油SF8427﹑CS3505﹑KF6001。
2.聚醚硅油CS3505为Momentive Performance Materials I公司制品,重均分子量(Mw)=2800。
表2
Claims (9)
1.一种聚氨基甲酸酯粘合剂,组分中包含改性的聚氨基甲酸酯共聚物(A)、固化剂(B)与抗静电剂(C),其特征为,
所述改性的聚氨基甲酸酯共聚物(A)由下列单体成分聚合而成,且具有将聚硅氧烷化合物接枝于聚氨基甲酸酯聚合物的化学结构:
a.多元醇为100wt%;选自具有至少2个羟基、且数均分子量Mn为1,000~10,000的聚酯多元醇或聚醚多元醇;
b.基于所述多元醇的重量,含羟基的聚硅氧烷化合物为2~20wt%,且具有下列化学结构式所示的结构:
其中,X与m为大于或等于0的正整数;
R1选自聚环氧乙烷(EO)、聚环氧丙烷(PO)或聚环氧丁烷(BO);
R2选自甲基、乙基、丙基或苯基;
c.基于所述多元醇的重量,多官能异氰酸酯化合物为14~18wt%;
d.基于所述多元醇的重量,脂肪酸酯为14~16wt%;
所述固化剂(B)选自芳香族聚异氰酸酯类固化剂、脂肪族聚异氰酸酯类固化剂或脂环族聚异氰酸酯类固化剂中的一种或二种以上的组合,且基于所述多元醇的重量,使用量为14~18wt%;及
所述抗静电剂(C)是由阴离子型抗静电剂和阳离子型抗静电剂所组成,且阴离子型抗静电剂:阳离子型抗静电剂的重量比例为4.5~5.5:1,且基于所述多元醇的重量,使用量为0.05~5wt%。
2.如权利要求1所述的聚氨基甲酸酯粘合剂,其中,所述含羟基的聚硅氧烷化合物的使用量为4~15wt%。
3.如权利要求1所述的聚氨基甲酸酯粘合剂,其中,所述脂肪酸酯的使用量为15wt%。
4.如权利要求1所述的聚氨基甲酸酯粘合剂,其中,所述多官能异氰酸酯化合物选自多官能脂肪族异氰酸酯化合物、多官能脂环族异氰酸酯化合物或多官能芳香族异氰酸酯化合物中的一种或二种以上的组合。
5.如权利要求1所述的聚氨基甲酸酯粘合剂,其中,所述脂肪酸酯选自月桂酸异丙酯、肉豆寇酸异丙酯、棕搁酸异丙酯、硬脂酸2-乙基己酯、二十二烷酸甘油单酯、2-乙基己酸十六烷基酯、甲基丙烯酸月桂酯、椰子油脂肪酸甲酯、肉豆寇酸辛基十二烷基酯、季戊四醇单油酸酯、季戊四醇单硬脂酸酯、硬脂酸十八烷基酯、月桂酸甲酯、硬脂酸甲酯、油酸辛酯、硬脂酸异十三烷基酯或月桂酸丁酯中的一种或二种以上的组合。
6.如权利要求1所述的聚氨基甲酸酯粘合剂,其中,所述聚氨基甲酸酯粘合剂的表面电阻达109Ω/□。
7.如权利要求1所述的聚氨基甲酸酯粘合剂,其中,所述聚氨基甲酸酯粘合剂进一步添加改性剂(D),且选自紫外线吸收剂、抗氧化剂、防腐剂、防霉剂、增稠树脂、增塑剂、消泡剂或湿润剂中的一种或二种以上的组合。
8.一种表面保护膜,其包括厚度介于10~100μm的基材层及厚度介于l~50μm的粘合层,其特征在于,所述粘合层使用权利要求1的聚氨基甲酸酯粘合剂为材料,且涂布在所述基材层上面经固化构成。
9.如权利要求8所述的表面保护膜,其中,所述粘合层对于玻璃板的粘着力介于1g/25mm~3g/25mm。
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