CN106896651B - 曝光方法 - Google Patents
曝光方法 Download PDFInfo
- Publication number
- CN106896651B CN106896651B CN201710045631.9A CN201710045631A CN106896651B CN 106896651 B CN106896651 B CN 106896651B CN 201710045631 A CN201710045631 A CN 201710045631A CN 106896651 B CN106896651 B CN 106896651B
- Authority
- CN
- China
- Prior art keywords
- substrate
- light shield
- exposure
- face
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-126150 | 2013-06-14 | ||
JP2013126150 | 2013-06-14 | ||
CN201480033588.9A CN105308507B (zh) | 2013-06-14 | 2014-05-02 | 基板处理装置以及器件制造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480033588.9A Division CN105308507B (zh) | 2013-06-14 | 2014-05-02 | 基板处理装置以及器件制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106896651A CN106896651A (zh) | 2017-06-27 |
CN106896651B true CN106896651B (zh) | 2018-06-12 |
Family
ID=52022046
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710045631.9A Active CN106896651B (zh) | 2013-06-14 | 2014-05-02 | 曝光方法 |
CN201810586865.9A Active CN108873613B (zh) | 2013-06-14 | 2014-05-02 | 扫描曝光装置以及扫描曝光方法 |
CN201811631647.9A Active CN110045580B (zh) | 2013-06-14 | 2014-05-02 | 扫描曝光装置 |
CN201480033588.9A Active CN105308507B (zh) | 2013-06-14 | 2014-05-02 | 基板处理装置以及器件制造方法 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810586865.9A Active CN108873613B (zh) | 2013-06-14 | 2014-05-02 | 扫描曝光装置以及扫描曝光方法 |
CN201811631647.9A Active CN110045580B (zh) | 2013-06-14 | 2014-05-02 | 扫描曝光装置 |
CN201480033588.9A Active CN105308507B (zh) | 2013-06-14 | 2014-05-02 | 基板处理装置以及器件制造方法 |
Country Status (6)
Country | Link |
---|---|
JP (4) | JP6344387B2 (ko) |
KR (4) | KR101988818B1 (ko) |
CN (4) | CN106896651B (ko) |
HK (2) | HK1257717A1 (ko) |
TW (4) | TWI646408B (ko) |
WO (1) | WO2014199744A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017151291A1 (en) | 2016-03-04 | 2017-09-08 | Applied Materials, Inc. | Wire grid polarizer manufacturing method |
JP7232586B2 (ja) * | 2018-07-31 | 2023-03-03 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1242104A (zh) * | 1996-11-28 | 2000-01-19 | 株式会社尼康 | 曝光装置以及曝光方法 |
CN103477286A (zh) * | 2011-09-07 | 2013-12-25 | 株式会社尼康 | 基板处理装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2830492B2 (ja) | 1991-03-06 | 1998-12-02 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
JP3724517B2 (ja) * | 1995-01-18 | 2005-12-07 | 株式会社ニコン | 露光装置 |
JPH08288203A (ja) * | 1995-04-11 | 1996-11-01 | Nikon Corp | 走査型露光装置 |
JPH08293461A (ja) * | 1995-04-21 | 1996-11-05 | Nikon Corp | 照明装置および該装置を備えた投影露光装置 |
JPH10256476A (ja) * | 1997-03-12 | 1998-09-25 | Canon Inc | 柱状デバイス及び露光装置及びデバイス製造方法 |
US6416908B1 (en) * | 2000-06-29 | 2002-07-09 | Anvik Corporation | Projection lithography on curved substrates |
JP2003178954A (ja) * | 2001-12-12 | 2003-06-27 | Canon Inc | 露光装置及びデバイスの製造方法 |
EP1646074A4 (en) * | 2003-07-09 | 2007-10-03 | Nikon Corp | EXPOSURE DEVICE AND METHOD OF MANUFACTURE |
JP2006235533A (ja) | 2005-02-28 | 2006-09-07 | Nikon Corp | 露光装置及びマイクロデバイスの製造方法 |
US20070084368A1 (en) * | 2005-10-13 | 2007-04-19 | Ryan Vest | Dynamic UV-exposure and thermal development of relief image printing elements |
JP2007227438A (ja) * | 2006-02-21 | 2007-09-06 | Nikon Corp | 露光装置及び方法並びに光露光用マスク |
JP2007227703A (ja) * | 2006-02-24 | 2007-09-06 | Seiko Epson Corp | 基板分割方法、基板分割装置、電気光学装置、電子機器 |
JP4984631B2 (ja) * | 2006-04-28 | 2012-07-25 | 株式会社ニコン | 露光装置及び方法、露光用マスク、並びにデバイス製造方法 |
WO2008029917A1 (fr) | 2006-09-08 | 2008-03-13 | Nikon Corporation | Masque, appareil d'exposition et procédé de fabrication du dispositif |
JP5104107B2 (ja) | 2007-08-02 | 2012-12-19 | ウシオ電機株式会社 | 帯状ワークの露光装置及び帯状ワークの露光装置におけるフォーカス調整方法 |
EP2048543B1 (en) * | 2007-10-09 | 2013-12-04 | ASML Netherlands B.V. | An optical focus sensor, an inspection apparatus and a lithographic apparatus |
US8264666B2 (en) * | 2009-03-13 | 2012-09-11 | Nikon Corporation | Exposure apparatus, exposure method, and method of manufacturing device |
US8625076B2 (en) * | 2010-02-09 | 2014-01-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer edge exposure module |
JP2011221536A (ja) * | 2010-04-13 | 2011-11-04 | Nikon Corp | マスク移動装置、露光装置、基板処理装置及びデバイス製造方法 |
CN102834778A (zh) * | 2010-04-13 | 2012-12-19 | 株式会社尼康 | 曝光装置、基板处理装置以及器件制造方法 |
JP5724564B2 (ja) * | 2010-04-13 | 2015-05-27 | 株式会社ニコン | マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法 |
KR101837917B1 (ko) * | 2011-04-25 | 2018-03-12 | 가부시키가이샤 니콘 | 기판처리장치 |
-
2014
- 2014-05-02 CN CN201710045631.9A patent/CN106896651B/zh active Active
- 2014-05-02 KR KR1020187034098A patent/KR101988818B1/ko active IP Right Grant
- 2014-05-02 CN CN201810586865.9A patent/CN108873613B/zh active Active
- 2014-05-02 CN CN201811631647.9A patent/CN110045580B/zh active Active
- 2014-05-02 CN CN201480033588.9A patent/CN105308507B/zh active Active
- 2014-05-02 KR KR1020207002516A patent/KR102178173B1/ko active IP Right Grant
- 2014-05-02 WO PCT/JP2014/062180 patent/WO2014199744A1/ja active Application Filing
- 2014-05-02 JP JP2015522646A patent/JP6344387B2/ja active Active
- 2014-05-02 KR KR1020167000474A patent/KR101924270B1/ko active IP Right Grant
- 2014-05-02 KR KR1020197016086A patent/KR102072956B1/ko active IP Right Grant
- 2014-06-06 TW TW106133163A patent/TWI646408B/zh active
- 2014-06-06 TW TW107140838A patent/TWI693480B/zh active
- 2014-06-06 TW TW103119689A patent/TWI604275B/zh active
- 2014-06-06 TW TW109113021A patent/TWI752469B/zh active
-
2016
- 2016-07-18 HK HK19100088.2A patent/HK1257717A1/zh unknown
- 2016-07-18 HK HK16108441.0A patent/HK1220513A1/zh not_active IP Right Cessation
-
2017
- 2017-12-26 JP JP2017250252A patent/JP6451826B2/ja active Active
-
2018
- 2018-12-06 JP JP2018228790A patent/JP6690695B2/ja active Active
-
2020
- 2020-04-08 JP JP2020070033A patent/JP7070598B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1242104A (zh) * | 1996-11-28 | 2000-01-19 | 株式会社尼康 | 曝光装置以及曝光方法 |
CN103477286A (zh) * | 2011-09-07 | 2013-12-25 | 株式会社尼康 | 基板处理装置 |
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