CN106894075A - 金刚石表面磁性镀层及其镀覆方法 - Google Patents
金刚石表面磁性镀层及其镀覆方法 Download PDFInfo
- Publication number
- CN106894075A CN106894075A CN201710176265.0A CN201710176265A CN106894075A CN 106894075 A CN106894075 A CN 106894075A CN 201710176265 A CN201710176265 A CN 201710176265A CN 106894075 A CN106894075 A CN 106894075A
- Authority
- CN
- China
- Prior art keywords
- nickel
- coating
- phosphorus alloy
- diamond
- magnetic coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
- Hard Magnetic Materials (AREA)
Abstract
本发明属于金刚石表面处理技术领域,具体涉及一种金刚石表面磁性镀层及其镀覆方法。所述金刚石表面磁性镀层的镀覆方法包括如下步骤:步骤一、采用化学镀镍的方式,将纳米稀土材料随镍磷合金共沉积在金刚石表面形成所述纳米稀土‑镍磷合金复合磁性镀层;步骤二、采用化学镀镍的方式,将镍磷合金包覆于所述纳米稀土‑镍磷合金复合磁性镀层上形成所述镍磷合金保护镀层。通过本发明方法制备的金刚石颗粒,具有较高的磁性,同时也具有较高的耐腐蚀性。应用在电镀金刚线生产过程中,具有优良的上砂性和使用寿命。
Description
技术领域
本发明属于金刚石表面处理技术领域,具体涉及一种金刚石表面磁性镀层及其镀覆方法。
背景技术
在电镀金刚线行业,金刚线的上砂属于关键工序。此磁性上砂工序中,金刚石的磁性、耐电腐蚀性能,对上砂情况有着决定性的作用。
现有技术中,普通镀覆金刚石颗粒,磁性弱,耐点腐蚀性差,在电镀液中,上砂困难,并且很容易被腐蚀掉镀层,失去磁性,从而会影响金刚线的上砂效率,上砂成本也较高。
发明内容
为了解决上述技术问题,本发明的目的在于提供一种利于提高金刚石颗粒的磁性以及耐电腐蚀性能、使其具有优良的上砂性和使用寿命的金刚石表面磁性镀层。
为实现上述技术目的,本发明采用以下的技术方案:
金刚石表面磁性镀层,包括内层和外层,所述内层为纳米稀土-镍磷合金复合磁性镀层;所述外层为包覆于所述纳米稀土-镍磷合金复合磁性镀层上的镍磷合金保护镀层。
本发明还提供了如上所述的金刚石表面磁性镀层的镀覆方法,包括如下步骤:
步骤一、采用化学镀镍的方式,将纳米稀土材料随镍磷合金共沉积在金刚石表面形成所述纳米稀土-镍磷合金复合磁性镀层;
步骤二、采用化学镀镍的方式,将镍磷合金包覆于所述纳米稀土-镍磷合金复合磁性镀层上形成所述镍磷合金保护镀层。
其中,步骤一中,镀覆方法如下:
(a)活化液、第一镀液配置;
(b)金刚石活化:将金刚石加入活化液中,加热至80~85℃,搅拌至无气泡产生,活化停止;
(c)纳米稀土-镍磷合金复合磁性镀层镀覆:将活化后金刚砂加入一定体积纯水中,加入纳米稀土材料,加热至70~80℃,缓慢加入第一镀液,并保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(d)经沉淀、过滤、烘干,得到活化后金刚石颗粒;
其中,步骤二中,镀覆方法如下:
(a)第二镀液配置;
(b)镍磷合金保护镀层镀覆:将活化后金刚石颗粒加入一定体积纯水中,加热至70~80℃,缓慢加入第二镀液,实际镀液用量根据需要的镀层厚度调整,并保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(c)经沉淀、过滤、烘干,得到磁性镀层金刚石颗粒。
作为优选,所述活化液配方为:氯化钯0.1~0.3g/L,盐酸2~4mL/L,次磷酸钠100~150g/L,十二烷磺酸钠0.001~0.005g/L。
作为优选,所述第一镀液配方为:氨基磺酸镍25~40ml/L,次磷酸钠50~70g/L,丁二酸10~15g/L,苹果酸5~8g/L,乳酸2~4mL/L。
作为优选,所述第二镀液配方为:氨基磺酸镍25~40ml/L,次磷酸钠30~40g/L,丁二酸8~12g/L,苹果酸5~8g/L,乳酸2~4mL/L。
作为优选,步骤一或步骤二中,采用体积比为1:1氨水溶液保持pH。
由于采用上述技术方案,本发明具有至少以下有益效果:
(1)通过纳米稀土材料的加入,利用共沉积方法,使金刚石表面形成的镀层具有特殊的磁性,同样金刚石添加量的情况下,上砂率得到很大提高,这能够有效的提高金刚线的上砂效率,节约上砂成本,更能进一步提高电镀金刚线的生产效率。
(2)在特殊镀层表面镀覆保护层,可以避免纳米稀土材料与外部环境的直接接触,同时提高镀层的耐腐蚀性,大大提高了使用寿命。
通过上述方法制备的金刚石颗粒,具有较高的磁性,同时也具有较高的耐腐蚀性。应用在电镀金刚线生产过程中,具有优良的上砂性和使用寿命。
具体实施方式
下面结合实施例,进一步阐述本发明。在下面的详细描述中,只通过说明的方式描述了本发明的某些示范性实施例。毋庸置疑,本领域的普通技术人员可以认识到,在不偏离本发明的精神和范围的情况下,可以用各种不同的方式对所描述的实施例进行修正。因此,描述在本质上是说明性的,而不是用于限制权利要求的保护范围。
实施例1
金刚石表面磁性镀层,包括内层和外层,所述内层为纳米稀土-镍磷合金复合磁性镀层;所述外层为包覆于所述纳米稀土-镍磷合金复合磁性镀层上的镍磷合金保护镀层。
所述纳米稀土-镍磷合金复合磁性镀层的镀覆方法如下:
(a)活化液、第一镀液配置:
所述活化液配方为:氯化钯0.1g/L,盐酸2mL/L,次磷酸钠100g/L,十二烷磺酸钠0.001g/L;
所述第一镀液配方为:氨基磺酸镍25ml/L,次磷酸钠50g/L,丁二酸10g/L,苹果酸5g/L,乳酸2mL/L;
(b)金刚石活化:
将金刚石加入活化液中,加热至80~85℃,搅拌至无气泡产生,活化停止;
(c)纳米稀土-镍磷合金复合磁性镀层镀覆:
将活化后金刚砂500~600g加入1~2L纯水中,加入纳米稀土材料5~10g/L,加热至70~80℃,缓慢加入第一镀液2~2.5L,并采用1:1氨水溶液保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(d)经沉淀、过滤、烘干,得到活化后金刚石颗粒;
所述镍磷合金保护镀层的镀覆方法如下:
(a)第二镀液配置:
所述第二镀液配方为:氨基磺酸镍25ml/L,次磷酸钠30g/L,丁二酸8g/L,苹果酸5g/L,乳酸2mL/L;
(b)镍磷合金保护镀层镀覆:
将活化后金刚石颗粒500~600g加入2~4L纯水中,加热至70~80℃,缓慢加入第二镀液1.5~2.5L(实际镀液用量根据需要的镀层厚度调整),并采用1:1氨水溶液保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(c)经沉淀、过滤、烘干,得到磁性镀层金刚石颗粒。
实施例2
金刚石表面磁性镀层,包括内层和外层,所述内层为纳米稀土-镍磷合金复合磁性镀层;所述外层为包覆于所述纳米稀土-镍磷合金复合磁性镀层上的镍磷合金保护镀层。
所述纳米稀土-镍磷合金复合磁性镀层的镀覆方法如下:
(a)活化液、第一镀液配置:
所述活化液配方为:氯化钯0.3g/L,盐酸4mL/L,次磷酸钠150g/L,十二烷磺酸钠0.005g/L;
所述第一镀液配方为:氨基磺酸镍40ml/L,次磷酸钠70g/L,丁二酸15g/L,苹果酸8g/L,乳酸4mL/L;
(b)金刚石活化:
将金刚石加入活化液中,加热至80~85℃,搅拌至无气泡产生,活化停止;
(c)纳米稀土-镍磷合金复合磁性镀层镀覆:
将活化后金刚砂500~600g加入1~2L纯水中,加入纳米稀土材料5~10g/L,加热至70~80℃,缓慢加入第一镀液2~2.5L,并采用1:1氨水溶液保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(d)经沉淀、过滤、烘干,得到活化后金刚石颗粒;
所述镍磷合金保护镀层的镀覆方法如下:
(a)第二镀液配置:
所述第二镀液配方为:氨基磺酸镍40ml/L,次磷酸钠40g/L,丁二酸12g/L,苹果酸8g/L,乳酸4mL/L;
(b)镍磷合金保护镀层镀覆:
将活化后金刚石颗粒500~600g加入2~4L纯水中,加热至70~80℃,缓慢加入第二镀液1.5~2.5L(实际镀液用量根据需要的镀层厚度调整),并采用1:1氨水溶液保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(c)经沉淀、过滤、烘干,得到磁性镀层金刚石颗粒。
实验证明,通过上述方法制备的金刚石颗粒,具有较高的磁性,同时也具有较高的耐腐蚀性,应用在电镀金刚线生产过程中,具有优良的上砂性和使用寿命。
以上所述仅为本发明示意性的具体实施方式,并非用以限定本发明的范围。任何本领域内的技术人员,在不脱离本发明的构思和原则的前提下所作出的等同变化与修改,均应属于本发明保护的范围。
Claims (7)
1.金刚石表面磁性镀层,包括内层和外层,其特征在于:
所述内层为纳米稀土-镍磷合金复合磁性镀层;
所述外层为包覆于所述纳米稀土-镍磷合金复合磁性镀层上的镍磷合金保护镀层。
2.如权利要求1所述的金刚石表面磁性镀层的镀覆方法,其特征在于,包括如下步骤:
步骤一、采用化学镀镍的方式,将纳米稀土材料随镍磷合金共沉积在金刚石表面形成所述纳米稀土-镍磷合金复合磁性镀层;
步骤二、采用化学镀镍的方式,将镍磷合金包覆于所述纳米稀土-镍磷合金复合磁性镀层上形成所述镍磷合金保护镀层。
3.如权利要求2所述的金刚石表面磁性镀层的镀覆方法,其特征在于:
步骤一中,镀覆方法如下:
(a)活化液、第一镀液配置;
(b)金刚石活化:将金刚石加入活化液中,加热至80~85℃,搅拌至无气泡产生,活化停止;
(c)纳米稀土-镍磷合金复合磁性镀层镀覆:将活化后金刚砂加入纯水中,加入纳米稀土材料,加热至70~80℃,缓慢加入第一镀液,并保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(d)经沉淀、过滤、烘干,得到活化后金刚石颗粒;
步骤二中,镀覆方法如下:
(a)第二镀液配置;
(b)镍磷合金保护镀层镀覆:将活化后金刚石颗粒加入纯水中,加热至70~80℃,缓慢加入第二镀液,并保持pH至4.0~4.4,至无气泡产生,镀覆停止;
(c)经沉淀、过滤、烘干,得到磁性镀层金刚石颗粒。
4.如权利要求3所述的金刚石表面磁性镀层的镀覆方法,其特征在于,所述活化液配方为:氯化钯0.1~0.3g/L,盐酸2~4mL/L,次磷酸钠100~150g/L,十二烷磺酸钠0.001~0.005g/L。
5.如权利要求3所述的金刚石表面磁性镀层的镀覆方法,其特征在于,所述第一镀液配方为:氨基磺酸镍25~40ml/L,次磷酸钠50~70g/L,丁二酸10~15g/L,苹果酸5~8g/L,乳酸2~4mL/L。
6.如权利要求3所述的金刚石表面磁性镀层的镀覆方法,其特征在于,所述第二镀液配方为:氨基磺酸镍25~40ml/L,次磷酸钠30~40g/L,丁二酸8~12g/L,苹果酸5~8g/L,乳酸2~4mL/L。
7.如权利要求3所述的金刚石表面磁性镀层的镀覆方法,其特征在于:步骤一或步骤二中,采用体积比为1:1氨水溶液保持pH。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710176265.0A CN106894075B (zh) | 2017-03-23 | 2017-03-23 | 金刚石表面磁性镀层及其镀覆方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710176265.0A CN106894075B (zh) | 2017-03-23 | 2017-03-23 | 金刚石表面磁性镀层及其镀覆方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106894075A true CN106894075A (zh) | 2017-06-27 |
CN106894075B CN106894075B (zh) | 2018-08-10 |
Family
ID=59193101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710176265.0A Active CN106894075B (zh) | 2017-03-23 | 2017-03-23 | 金刚石表面磁性镀层及其镀覆方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106894075B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110438539A (zh) * | 2019-09-24 | 2019-11-12 | 郎溪蓉承金属表面处理有限公司 | 具有耐腐蚀及导电率的锌合金基材的电镀工艺 |
CN112010300A (zh) * | 2019-05-31 | 2020-12-01 | 洛阳阿特斯光伏科技有限公司 | 一种处理含磨粒的废料的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102700014A (zh) * | 2012-06-11 | 2012-10-03 | 上海精研磨料磨具有限公司 | 金刚石微粉镀钛、镍磷和镍复合体金刚石线锯及制备方法 |
CN202615812U (zh) * | 2012-05-19 | 2012-12-19 | 深圳市诚威电线有限公司 | 稀土合金镀银铜线 |
CN103266341A (zh) * | 2013-05-17 | 2013-08-28 | 浙江工业大学 | 一种钢丝磁化生产金刚石切割线的制备方法 |
CN105177540A (zh) * | 2015-10-08 | 2015-12-23 | 山东建筑大学 | 一种应用于石材切割刀具的金刚石新型复合镀层 |
-
2017
- 2017-03-23 CN CN201710176265.0A patent/CN106894075B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202615812U (zh) * | 2012-05-19 | 2012-12-19 | 深圳市诚威电线有限公司 | 稀土合金镀银铜线 |
CN102700014A (zh) * | 2012-06-11 | 2012-10-03 | 上海精研磨料磨具有限公司 | 金刚石微粉镀钛、镍磷和镍复合体金刚石线锯及制备方法 |
CN103266341A (zh) * | 2013-05-17 | 2013-08-28 | 浙江工业大学 | 一种钢丝磁化生产金刚石切割线的制备方法 |
CN105177540A (zh) * | 2015-10-08 | 2015-12-23 | 山东建筑大学 | 一种应用于石材切割刀具的金刚石新型复合镀层 |
Non-Patent Citations (1)
Title |
---|
胡国荣 等: "金刚石表面化学复合镀Ni-Ti-RE", 《中南工业大学学报》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112010300A (zh) * | 2019-05-31 | 2020-12-01 | 洛阳阿特斯光伏科技有限公司 | 一种处理含磨粒的废料的方法 |
CN112010300B (zh) * | 2019-05-31 | 2022-05-20 | 洛阳阿特斯光伏科技有限公司 | 一种处理含磨粒的废料的方法 |
CN110438539A (zh) * | 2019-09-24 | 2019-11-12 | 郎溪蓉承金属表面处理有限公司 | 具有耐腐蚀及导电率的锌合金基材的电镀工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN106894075B (zh) | 2018-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5184612B2 (ja) | 導電性粉体、それを含む導電性材料及びその製造方法 | |
CN108384448A (zh) | 一种仿贝壳结构的复合纳米防腐涂层及其制备方法 | |
CN102747345B (zh) | 通过浸镍活化在pcb铜电路表面化学镀镍的方法 | |
CN103556136B (zh) | 一种石墨烯镍磷化学镀液及其制备方法和应用 | |
CN103531271B (zh) | 导电性粒子、导电性材料及导电性粒子的制造方法 | |
TWI492246B (zh) | The conductive powder, the conductive material containing the conductive powder, and the method for producing the conductive particles | |
CN106894075B (zh) | 金刚石表面磁性镀层及其镀覆方法 | |
CN204102589U (zh) | 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂膜以及连接结构体 | |
CN104947094B (zh) | 一种化学镀镍液及其在化学镀镍中的应用和一种线路板 | |
CN204966070U (zh) | 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂以及连接结构体 | |
JP2011509818A5 (zh) | ||
CN109137032A (zh) | 氢氧化镁超疏水膜层及其制备方法与应用 | |
TW201229327A (en) | Gold plating solution | |
CN100430527C (zh) | 碳纳米管镍基耐磨耐热复合镀层的制备工艺 | |
JPWO2006006687A1 (ja) | 導電性微粒子、導電性微粒子の製造方法、及び、異方性導電材料 | |
TW201249602A (en) | Electrodeposition liquid for fixed-abrasive saw wire | |
CN101600301A (zh) | 电路板及其制作方法 | |
CN104043826B (zh) | 一种铝粉表面水化处理方法及其在制备Al@Ag核壳复合粒子导电与电磁屏蔽填料中的应用 | |
TW201427900A (zh) | 二氧化矽溶膠,應用該二氧化矽溶膠對金屬基體進行表面處理的方法及其製品 | |
CN105296974A (zh) | 一种镀钯液及使用其在铜表面镀钯的方法 | |
CN107385891A (zh) | 一种三元合金耐腐蚀导电织物的制备方法 | |
CN107349908A (zh) | 一种氨基化石墨烯/Fe3O4磁性复合材料及其制备方法与应用 | |
CN107513858A (zh) | 一种Co‑Ni‑P‑Nd合金电磁屏蔽织物的制备方法 | |
JP2004197160A (ja) | 導電性無電解めっき粉体及びその製造方法 | |
JP2018523019A5 (zh) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230310 Address after: 212400 No. 66, Zhiyuan Road, Jurong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: JIANGSU SANCHAO DIAMOND TOOLS CO.,LTD. Address before: 211124 No. 77, Zecheng Road, Chunhua street, Nanjing, Jiangsu Patentee before: NANJING SANCHAO ADVANCED MATERIALS Co.,Ltd. |
|
TR01 | Transfer of patent right |