CN106892226A - 互锁嵌套晶片保护器 - Google Patents
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Abstract
本发明涉及一种互锁嵌套晶片保护器。用于在集成电路晶片的船运期间减少颗粒的互锁环晶片分离器(308)具有:晶片架(312);互锁突片(314),其防止所述晶片的边缘接触晶片船运集装箱的内壁;及互锁槽(310),可将第二互锁环晶片分离器(307)的所述互锁突片(314)插入到所述互锁槽中,从而将所述两个互锁环晶片分离器一起锁定在硬币堆叠式晶片(404)中。
Description
技术领域
本发明大体上涉及用于船运半导体晶片的晶片载体或封装。更特定来说,本发明涉及一种保护性环分离器,其在晶片船运集装箱中以船送运送晶片期间用于硬币堆叠式晶片之间。
背景技术
一些集成电路制造商在一个位置生产半导体晶片,并以船运送所述晶片以用于在不同位置处进行切片及封装。在此类情况中,通常在被称为硬币堆叠船运集装箱的集装箱中以船运送晶片,在所述集装箱中所述晶片堆叠于彼此的顶部上。为防止在船运期间损坏,将保护性环分离器放置于每一晶片之间。保护性环分离器在船运期间防止一个晶片摩擦另一晶片。保护性环分离器100(图1A)是在中心敞开的环。
在图2A中说明此硬币堆叠船运集装箱200。晶片204被堆叠于硬币堆叠船运集装箱200中,其中保护性环分离器100位于每一晶片204之间。
在图1A中说明典型的保护性环分离器100的平面图。保护性环分离器100的圆周稍微小于晶片船运集装箱200(图2A)的内圆周,使得其舒适地配合于船运集装箱内同时在船运期间提供极少移动空间。
在图1B中展示保护性环分离器100的放大的横截面图108。沿着图1A中的插图104的切割线106获得此放大图108。保护性环分离器108通常是L形的,其中所述L的脊部面向晶片船运集装箱200的内表面,且所述L的足部111朝向晶片船运集装箱200的中心向内延伸。晶片面向下位于所述L的顶部(也被称为晶片架112)上。晶片架112充分高于保护性环分离器100上的足部111以使晶片204及环分离器108能够从晶片船运集装箱200自动装载及卸载。
如图2A中所展示,晶片204被硬币堆叠于晶片船运集装箱200中,其中环分离器108位于每一晶片204之间。
如图2B中所展示,每一晶片204面向下被装载于环分离器108的晶片架112上且被硬币堆叠于其下的晶片204上。环分离器108防止一个晶片204的前表面(其含有集成电路)摩擦硬币堆叠中位于其下方的晶片204的背侧而在船运期间引起对集成电路的损坏。
发明内容
一种用于在集成电路晶片的船运期间减少颗粒的互锁环晶片分离器具有:晶片架;互锁突片;其防止所述晶片的边缘接触晶片船运集装箱的内壁;及互锁槽,可将第二互锁环晶片分离器的互锁突片插入到所述互锁槽中,从而将所述两个互锁环晶片分离器一起锁定在硬币堆叠式晶片中。
附图说明
图1A是用于船运集成电路晶片的典型的环晶片分离器的平面图,且图1B是所述典型的环晶片分离器的横截面(现有技术)。
图2A及2B(现有技术)是晶片船运集装箱中的硬币堆叠式集成电路晶片及环晶片分离器的横截面。
图3A是根据本发明的实施例形成的互锁环晶片分离器的平面图。
图3B是根据本发明的实施例形成的互锁环晶片分离器中的表面张力释放槽的横截面。
图3C是根据本发明的实施例形成的互锁环晶片分离器的横截面。
图4A及4B是晶片船运集装箱中的硬币堆叠式集成电路晶片及根据本发明的实施例形成的互锁环晶片分离器的横截面。
图5是晶片船运集装箱中的具有根据本发明的实施例形成的互锁环晶片分离器的硬币堆叠式集成电路晶片的横截面。
具体实施方式
参考附图描述本发明。所述图式并非按比例绘制且其仅经提供以说明本发明。为说明,下文参考实例应用描述本发明的若干方面。应理解,陈述众多特定细节、关系及方法以提供对本发明的理解。然而,相关领域的技术人员应容易地认识到,可无需特定细节中的一或多者或运用其它方法实践本发明。在其它实例中,未详细展示众所周知的结构或操作以避免使本发明模糊。本发明不受所说明的动作或事件的定序限制,因为一些动作可以不同顺序发生及/或与其它动作或事件同时发生。此外,无需所说明的全部动作或事件来实施根据本发明的方法。
在图3A中以平面图说明互锁环分离器300,且在图3B及3C中以横截面图说明互锁环分离器300。互锁环分离器300具有以下特征:互锁突片341(图3B),其围绕互锁环分离器300的上外边缘的外圆周延伸;及互锁槽310,其围绕互锁环分离器300的下外边缘的外圆周延伸。表面张力释放槽302形成于围绕互锁环分离器300的各个位置处,以防止互锁环分离器在从船运集装箱移除时粘住晶片400。
如图3B中所展示,互锁突片314环绕晶片架312,且位于晶片404(图4A)的边缘与晶片船运集装箱400的内壁之间。互锁突片314的内直径稍微大于晶片404的直径。晶片404在船运期间面向下放置于晶片架312上(图4B)。互锁突片314防止晶片404的边缘接触船运集装箱400的壁及通过磨削所述壁产生颗粒。互锁突片314延伸超出晶片架312足够的高度以在晶片存在于晶片架312上时被插入到上覆互锁环分离器300上的互锁槽310中。这将所述两个互锁环分离器锁定在一起以进一步减少晶片在船运期间的相对运动且另外减少颗粒形成。
互锁槽310围绕环分离器300的下外圆周延伸,且位于互锁突片314的正下方。互锁槽310的宽度稍微大于互锁突片314的宽度,使得互锁突片314在无需粘合的情况下配合到互锁槽310中。互锁突片314从下互锁环分离器308配合到上互锁环分离器309的互锁槽310中。如在图4B中以插图418所展示,这将晶片404的硬币堆叠锁定在一起,从而防止一个晶片404相对于另一晶片404的独立运动。减少晶片404的独立运动及防止晶片404边缘接触晶片盒400的内侧壁在晶片404的船运期间显著减少颗粒产生。晶片404面向下位于晶片架312上。晶片架312的宽度通常是大约经处理的晶片404的外禁区的大小,使得其不接触有源裸片且不损坏有源裸片。通常,此宽度是大约3mm或更小。
足部311围绕互锁环分离器300的底部内圆周延伸。所述足部实现晶片404的自动装载及卸载及互锁环晶片分离器300从晶片船运集装箱400的自动装载及卸载。所述足部的宽度可取决于自动拾取和放置装载机及卸载机的要求。
晶片架312(图3B)在超出足部311的足够的高度处形成,以使拾取和放置机器能够自动装载及卸载晶片且能够从晶片船运集装箱400自动装载及卸载互锁环分离器300。晶片架312超出足部311的高度也足以防止可形成于上晶片404的顶部侧上的结构(例如,球形接合件)接触下伏晶片404的背侧。晶片架312超出足部311的高度可取决于晶片的表面上的高度特征,且可取决于拾取和放置机器的要求。
图3C展示互锁环分离器300中的表面张力释放槽302中的一者的横截面。所述表面张力释放槽允许空气在从晶片船运集装箱400移除晶片时进入于晶片404(图4B)与晶片架312之间。这防止晶片船运集装箱400中在其下方捕集有空气的其它晶片404在移除顶部晶片404时移动。在图3C中的横截面304中所描绘的表面张力释放槽302中,凹口形成于互锁突片314中,且还在围绕互锁环分离器300的圆周的各个点处形成于晶片架312中。通常,在4与8个之间的表面张力释放槽302形成于互锁环分离器300中。所述表面张力释放槽的尺寸通常在大约1到3mm之间但可更宽。图3C中的所述表面张力释放槽302设计说明实例实施方案。其它表面张力释放槽302设计也是可能的。
互锁环分离器300可具有多种设计。图3及4中的设计说明概念但不希望以任何方式具限制性。如所属领域的一般技术人员可了解,其它互锁突片及槽设计可用于以防止晶片的独立运动、防止晶片的边缘磨削晶片船运集装箱400的内侧壁且还实现晶片及互锁环分离器到晶片船运集装箱400中的自动拾取和放置装载及晶片及互锁环分离器从晶片船运集装箱400的自动拾取和放置卸载的方式将晶片硬币堆叠锁定在一起。
在图5中说明根据实施例形成的互锁环分离器608的替代设计。晶片604由互锁环分离器608以硬币堆叠支撑且被放置于晶片船运集装箱600中。此互锁环分离器608类似于图4B中的互锁环分离器308但被设计成不具有足部311。此互锁环分离器608可能需要真空环拾取和放置机器来适应不具有足部311的设计。
虽然上文已描述本发明的各种实施例,但应理解,所述实施例仅通过实例而非限制呈现。在不背离本发明的精神及范围的情况下,可根据本文中的本发明对所揭示的实施例做出众多改变。因此,本发明的广度及范围不应受上文所描述的实施例中的任何者限制。而是,本发明的范围应根据所附权利要求书及其等效物来界定。
Claims (15)
1.一种用于在晶片船运集装箱中以船运送集成电路晶片的互锁环晶片分离器,其包括:
晶片架,其是环形的;
互锁突片,其中所述互锁突片围绕所述晶片架的外圆周延伸,其中所述互锁突片延伸超出所述晶片架;及
互锁凹槽,其围绕所述互锁环晶片分离器的底部外圆周延伸,其中所述互锁凹槽的宽度稍微大于所述互锁突片的宽度,且被定位于所述互锁突片的正下方。
2.根据权利要求1所述的互锁环晶片分离器,其中所述晶片架的宽度小于大约3mm。
3.根据权利要求1所述的互锁环晶片分离器,其进一步包括足部,其中所述足部围绕所述互锁环晶片分离器的内底部圆周延伸,且其中所述足部朝向所述互锁环晶片分离器的中心向内延伸,且其中所述晶片架的顶部表面足够超出所述足部以允许自动拾取和放置装载机及卸载机装载及卸载所述晶片及所述互锁环晶片分离器。
4.根据权利要求1所述的互锁环晶片分离器,其进一步包括围绕所述互锁环晶片分离器的圆周以某一间隔定位的表面张力释放槽。
5.根据权利要求4所述的互锁环晶片分离器,其中每一表面张力释放槽的宽度在1mm与3mm之间。
6.根据权利要求4所述的互锁环晶片分离器,其中存在在4与10个之间的表面张力释放槽。
7.根据权利要求4所述的互锁环晶片分离器,其中每一表面张力释放槽包括所述互锁突片的所述圆周中的间隙,且包括所述晶片架的所述圆周中的间隙。
8.一种船运集装箱,其包括
侧壁;及
互锁环晶片分离器堆叠,其中每一互锁环晶片分离器包括:
晶片架,其是环形的;
互锁突片,其中所述互锁突片围绕所述晶片架的外圆周在所述晶片架与所述船运集装箱的所述侧壁之间延伸,其中所述互锁突片延伸超出所述晶片架;及
互锁凹槽,其围绕所述互锁环晶片分离器的底部外圆周延伸,其中所述互锁凹槽的宽度稍微大于所述互锁突片的宽度,且其中所述互锁凹槽被定位于所述互锁突片的正下方;
其中所述互锁环晶片分离器堆叠中的上互锁环晶片分离器的所述互锁突片延伸到所述互锁环晶片分离器堆叠中的下互锁环分离器的所述互锁凹槽中。
9.根据权利要求8所述的船运集装箱,其中所述晶片架的宽度小于大约3mm。
10.根据权利要求8所述的船运集装箱,其进一步包括足部,其中所述足部围绕所述互锁环晶片分离器的内底部圆周延伸,且其中所述足部朝向所述互锁环晶片分离器的中心向内延伸,且其中所述晶片架的顶部表面足够超出所述足部以允许自动拾取和放置装载机及卸载机装载及卸载所述晶片及所述互锁环晶片分离器。
11.根据权利要求8所述的船运集装箱,其进一步包括围绕所述互锁环晶片分离器的圆周以某一间隔定位的表面张力释放槽。
12.根据权利要求11所述的船运集装箱,其中每一表面张力释放槽的宽度在1mm与3mm之间。
13.根据权利要求11所述的船运集装箱,其中存在在4与10个之间的表面张力释放槽。
14.根据权利要求11所述的船运集装箱,其中每一表面张力释放槽包括所述互锁突片的所述圆周中的间隙,且包括所述晶片架的所述圆周中的间隙。
15.一种船运集装箱,其包括
侧壁;及
互锁环晶片分离器堆叠,其中每一互锁环晶片分离器包括:
晶片架,其是环形的;
互锁突片,其中所述互锁突片围绕所述晶片架的外圆周在所述晶片架与所述船运集装箱的所述侧壁之间延伸,其中所述互锁突片延伸超出所述晶片架;
足部,其中所述足部围绕所述互锁环晶片分离器的内底部圆周延伸,且其中所述足部朝向所述互锁环晶片分离器的中心向内延伸,且其中所述晶片架的顶部表面足够超出所述足部以允许自动拾取和放置装载机及卸载机装载及卸载所述晶片及所述互锁环晶片分离器;
互锁凹槽,其围绕所述互锁环晶片分离器的底部外圆周延伸,其中所述互锁凹槽的宽度稍微大于所述互锁突片的宽度,且其中所述互锁凹槽被定位于所述互锁突片的正下方;及
表面张力释放槽,其围绕所述互锁环晶片分离器的圆周以某一间隔定位,其中每一表面张力释放槽包括所述互锁突片的所述圆周中的间隙且包括所述晶片架的所述圆周中的间隙;
其中所述互锁环晶片分离器堆叠中的上互锁环晶片分离器的所述互锁突片延伸到所述互锁环晶片分离器堆叠中的下互锁环分离器的所述互锁凹槽中。
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