CN1068155A - 改善了与基片的结合程度的金属箔以及制造这种金属箔的方法 - Google Patents

改善了与基片的结合程度的金属箔以及制造这种金属箔的方法 Download PDF

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Publication number
CN1068155A
CN1068155A CN92105142A CN92105142A CN1068155A CN 1068155 A CN1068155 A CN 1068155A CN 92105142 A CN92105142 A CN 92105142A CN 92105142 A CN92105142 A CN 92105142A CN 1068155 A CN1068155 A CN 1068155A
Authority
CN
China
Prior art keywords
metal
tinsel
rights
tree
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN92105142A
Other languages
English (en)
Chinese (zh)
Inventor
理查德·J·萨迪
丹尼斯·M·扎特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Inc
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of CN1068155A publication Critical patent/CN1068155A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
CN92105142A 1991-06-28 1992-06-27 改善了与基片的结合程度的金属箔以及制造这种金属箔的方法 Pending CN1068155A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72291391A 1991-06-28 1991-06-28
US07/722,913 1991-06-28

Publications (1)

Publication Number Publication Date
CN1068155A true CN1068155A (zh) 1993-01-20

Family

ID=24903951

Family Applications (1)

Application Number Title Priority Date Filing Date
CN92105142A Pending CN1068155A (zh) 1991-06-28 1992-06-27 改善了与基片的结合程度的金属箔以及制造这种金属箔的方法

Country Status (6)

Country Link
EP (1) EP0525956A2 (enExample)
JP (1) JPH06184784A (enExample)
KR (1) KR930000254A (enExample)
CN (1) CN1068155A (enExample)
CA (1) CA2070046A1 (enExample)
TW (1) TW220027B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548202A (zh) * 2010-12-08 2012-07-04 金居开发铜箔股份有限公司 经粗化处理的铜箔及其制造方法
CN102703941A (zh) * 2012-06-29 2012-10-03 东莞中探探针有限公司 一种电连接器用探针的电镀工艺

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
DE69427583T2 (de) * 1993-04-19 2001-10-04 Ga-Tek Inc, Eastlake Verfahren zur herstellung von kupfermetallpulver kupferoxide und kupferfolie
US6871396B2 (en) 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
US20060286400A1 (en) * 2005-06-17 2006-12-21 Jarden Zinc Products, Inc. Substrate with alloy finish and method of making
FR2894420A1 (fr) * 2005-12-05 2007-06-08 Inventel Sa Combine telephonique, base et methode associee pour mettre a jour le logiciel du combine
CN103249857B (zh) * 2010-11-17 2015-11-25 新日铁住金高新材料株式会社 基材用金属箔及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
GB8623252D0 (en) * 1986-09-26 1986-10-29 Cookson Group Plc Treatment of copper foil

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548202A (zh) * 2010-12-08 2012-07-04 金居开发铜箔股份有限公司 经粗化处理的铜箔及其制造方法
CN102548202B (zh) * 2010-12-08 2014-09-03 金居开发铜箔股份有限公司 经粗化处理的铜箔及其制造方法
CN102703941A (zh) * 2012-06-29 2012-10-03 东莞中探探针有限公司 一种电连接器用探针的电镀工艺
CN102703941B (zh) * 2012-06-29 2015-04-22 东莞中探探针有限公司 一种电连接器用探针的电镀工艺

Also Published As

Publication number Publication date
TW220027B (enExample) 1994-02-01
EP0525956A2 (en) 1993-02-03
KR930000254A (ko) 1993-01-15
EP0525956A3 (enExample) 1994-03-09
JPH06184784A (ja) 1994-07-05
CA2070046A1 (en) 1992-12-29

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication